CN203105046U - Structure for inhibition of electromagnetic wave interference, and flexible printed circuit comprising the same - Google Patents
Structure for inhibition of electromagnetic wave interference, and flexible printed circuit comprising the same Download PDFInfo
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- CN203105046U CN203105046U CN 201320010884 CN201320010884U CN203105046U CN 203105046 U CN203105046 U CN 203105046U CN 201320010884 CN201320010884 CN 201320010884 CN 201320010884 U CN201320010884 U CN 201320010884U CN 203105046 U CN203105046 U CN 203105046U
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- electromagnetic wave
- inhibition
- electromagnetic interference
- interference structure
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Abstract
The utility model discloses a structure for inhibition of electromagnetic wave interference, and a flexible printed circuit comprising the same. The structure for inhibition of electromagnetic wave interference is composed of an insulating layer, an electromagnetic wave absorbing layer, an electromagnetic wave shielding layer and a conductive adhesion layer. The electromagnetic wave shielding layer has a top surface and a bottom surface that are opposite to each other. The electromagnetic wave absorbing layer is formed on the top surface of the electromagnetic wave shielding layer. The insulating layer is formed on the top of the electromagnetic wave absorbing layer. The conductive adhesion layer is formed on the bottom surface of the electromagnetic wave shielding layer. The structure for inhibition of electromagnetic wave interference has electromagnetic wave interference shielding and absorbing functions, exhibits excellent softness and flexibility and is especially suitable for being applied to electronic communication products.
Description
Technical field
The utility model relates to a kind of inhibition Electromagnetic Interference structure, specifically about a kind of inhibition Electromagnetic Interference structure that is used for flexible printed wiring board.
Background technology
For in response to the personal computer and the multi-functional market demand of Mobile Communications product, and flexible printed wiring board (Flexible Printed Circuit, structure FPC) needs lighter, thin, short, little; And on function, then need powerful and the transmission of high speed signal.Because distance is more and more nearer between the soft support plate signal transmission line road, add that the electronic product of communication such as intelligent mobile phone, flat computer in recent years operating frequency is broadband towards height, operating frequency causes from external electromagnetic radiation or internal noise (noise) electromagnetic interference (Electromagnetic Interference each other across between the GHz of several MHz tremendously high frequencies of low frequency between each radio communication mold block assembly; EMI) situation is serious day by day.Therefore, in the problem that constantly when multifunction reaches under the high-speedization development, must overcome various Electromagnetic Interference.
Moreover, in the Electromagnetic Interference problem that solves soft board in the past except by a whole set of complete routing path design, just be to use tool conductivity electromagnetic shielding film (EMI Shielding Film), be widely used in the small-sized electronic products such as intelligent mobile phone, flat computer, digital camera, digital camera at present.For example, the electromagnetic wave shielding membrane structure of 2007-294-918 Japanese patent laid-open publication gazette, disclose a kind of electromagnetic shielding film that the thin silverskin of evaporation one deck is arranged in pairs or groups and the conduction adhesion layer is used as soft board on dielectric film, use the conductivity electromagnetic shielding material can effectively isolate soft board and have problems because of the electromagnetic wave external disturbance.This measure is the present the most frequently used frequency electromagnetic waves problem means that solve, but, still can't solve soft board because of the original paper equipment such as electronics, communication and computer of inside because of reflection, be full of the influence of Electromagnetic Interference, as because of CPU, LSI(Large-scale integration between the line of the coupling in magnetic field, near region, contiguous FPC to inside; Large scale integrated circuit) coupling between electronic building brick inside such as causes the problem of FPC Electromagnetic Interference.Especially in highly dense, the highly integrated FPC plate, can intersect with low frequency electromagnetic and interfere with each other under the environment because of being in high frequency for a long time, produce serious electromagnetic wave noise between each system and disturb, and these interference sources are difficult to only depend on grounding technology or use the conductivity electromagnetic shielding material to be blocked isolation.
The utility model content
In order to overcome above-mentioned defective, the utility model provides a kind of flexible printed wiring board that suppresses the Electromagnetic Interference structure and have this structure, inhibition Electromagnetic Interference structure of the present utility model has Electromagnetic Interference function of shielding and Electromagnetic Interference absorption function concurrently, and have excellent flexibility and pliability, be particularly suitable in the telecommunications product.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of inhibition Electromagnetic Interference structure, constitute by insulating barrier, electromagnetic wave absorbing layer, electromagnetic wave shielding and conduction adhesion layer, described electromagnetic wave shielding has relative end face and bottom surface, described electromagnetic wave absorbing layer is formed on the end face of described electron waves screen, described insulating barrier is formed on the end face of described electromagnetic wave absorbing layer, and described conduction adhesion layer is formed on the bottom surface of the broken screen of described electromagnetism.
Say that further described electromagnetic wave absorbing layer is the electromagnetic wave absorbing layer that contains soft magnetic material.
Wherein, described soft magnetic material is the soft magnetism powder of at least a formation in ferrite, sendust, permalloy, the iron silicochromium nickel alloy.
Say that further described electromagnetic wave shielding is the copper layer.
Be preferably, the thickness of described electromagnetic wave absorbing layer is 12 to 35 microns.
Be preferably, the thickness of described electromagnetic wave shielding is 3 to 5 microns.
Be preferably, the thickness of described insulating barrier is 5 to 10 microns.
Be preferably, the thickness of described conduction adhesion layer is 8 to 30 microns.
The invention also discloses a kind of flexible printed wiring board with above-mentioned inhibition Electromagnetic Interference structure, described inhibition Electromagnetic Interference structure is covered on the printed circuit board (PCB) body layer in its conduction adhesion layer place.
Be preferably, the gross thickness of described inhibition Electromagnetic Interference structure is 28 to 80 microns.
The beneficial effects of the utility model are: because Electromagnetic Interference generates is because of due to electric field and the magnetic field reciprocation, therefore, the utility model utilization inhibition Electromagnetic Interference structure is isolated the Electromagnetic Interference source and is suppressed, inhibition Electromagnetic Interference structure of the present utility model mainly is to utilize the electromagnetic wave absorbing layer that contains soft magnetic material, inner incident low-frequency disturbance electromagnetic wave to suppress the form that absorption pattern converts heat energy to, is weakened the interference source purpose and reach; Utilize electromagnetic wave shielding simultaneously as ultra-thin conductive copper layer and so on, the frequency electromagnetic waves interference source covered form with reflection and reach block the interference source purpose, therefore, inhibition Electromagnetic Interference structure of the present utility model has the functional and Electromagnetic Interference absorption function of electromagnetic interference shielding concurrently, is particularly suitable in the telecommunications product; In addition, inhibition Electromagnetic Interference structure of the present utility model has preferable flexibility and pliability.
Description of drawings
Fig. 1 is the cross-sectional view of inhibition Electromagnetic Interference structure of the present utility model;
Fig. 2 is the cross-sectional view with the flexible printed wiring board that suppresses the Electromagnetic Interference structure of the present utility model.
Embodiment
Below in conjunction with accompanying drawing preferred embodiment of the present utility model is described in detail, thereby protection range of the present utility model is made more explicit defining so that advantage of the present utility model and feature can be easier to be it will be appreciated by those skilled in the art that.
Embodiment: as shown in Figure 1, be inhibition Electromagnetic Interference structure 100 of the present utility model, constitute by insulating barrier 111, electromagnetic wave absorbing layer 112, electromagnetic wave shielding 113 and conduction adhesion layer 114, described electromagnetic wave shielding 113 has relative end face and bottom surface, described electromagnetic wave absorbing layer 112 is formed on the end face of described electron waves screen 113, described insulating barrier 111 is formed on the end face of described electromagnetic wave absorbing layer 112, and described conduction adhesion layer 114 is formed on the bottom surface of the broken screen 113 of described electromagnetism.Wherein, described electromagnetic wave absorbing layer 112 contains soft magnetic material; The broken screen 113 of this electromagnetism is copper layers, and the example of this copper layer comprises cathode copper, calendering copper etc.
As shown in Figure 2, be the flexible printed wiring board with above-mentioned inhibition Electromagnetic Interference structure 100 of the present utility model, described inhibition Electromagnetic Interference structure 100 is covered on the printed circuit board (PCB) body layer 200 in its conduction adhesion layer 114 places, and this body layer 200 has line construction (not shown).Wherein, the gross thickness of described inhibition Electromagnetic Interference structure is 28 to 80 microns.
In inhibition Electromagnetic Interference structure of the present utility model, this thickness that contains the electromagnetic wave absorbing layer of soft magnetic material is 12 to 35 microns, and the material of this soft magnetic material can be the soft magnetism powder of ferrite (Ferrite), sendust (SENDUST), permalloy (PERMALLOY) or iron silicochromium nickel alloy etc.Above-mentioned soft magnetism powder can use or make up two or more uses separately, and the shape of this soft magnetism powder can be ball-type or flat, is preferably the flat powder, and wherein, the average grain diameter of this soft magnetism powder is 1 to 35 micron, is preferably 2 to 20 microns.In an instantiation, electromagnetic wave absorbing layer of the present utility model can disperse to form by above-mentioned soft magnetism powder is mixed with thermosetting resin.
Conduction adhesion layer of the present utility model can contain the conducting metal powder, and this conducting metal powder can be silver powder, copper powder, nickel powder, silver-coated copper powder or silver-colored nickel coat powder, and preferable system uses silver-coated copper powder.This kind conducting metal powder can use or make up two or more uses separately, and wherein, the average grain diameter of this conducting metal powder is between 1 to 20 micron, is preferably 3 to 15 microns.
In the inhibition Electromagnetic Interference structure of the present utility model, because the thermal stability height of epoxy resin or polyimide resin, and have excellent insulating properties, mechanical strength, reach resistance to chemical corrosion, so can be used in insulating barrier, and the thickness of this insulating barrier is generally 5 to 10 microns, is more preferred from 5 to 8 microns.
In the inhibition Electromagnetic Interference structure of the present utility model, be to use the copper layer, and this thickness as the copper layer of electromagnetic shielding material is between 3 to 5 microns as electromagnetic wave shielding.Usually, the electromagnetic wave shielding layer material can takeup type transmission technology (Roll To Roll) carry out producing fast continuously.
In the inhibition Electromagnetic Interference structure of the present utility model, the thickness of this conduction adhesion layer is 8 to 30 microns.
The utility model is to utilize to contain the electromagnetic wave absorbing layer of soft magnetic material as electromagnetic wave inhibiting material, because incident electromagnetic wave and magnetic material produce electrical interaction, electromagnetic wave is consumed with the form of heat absorption, avoid the disturbing effect that electromagnetic wave produced that overflow reason inside, reach and weaken the Electromagnetic Interference purpose; And, incident electromagnetic wave is reached the interference source effect of blocking with reflected version by using super thin copper layer as electromagnetic shielding material, effectively reduce and isolating electromagnetic external disturbance problem.Therefore, inhibition Electromagnetic Interference structure of the present utility model can shield inner in the electronic product equipment and the outside electromagnetic interference that produces, and this inhibition Electromagnetic Interference structure also has good flexibility and pliability, thus be applicable to renovate, in slide phone and the flattening electronic product.
Inhibition Electromagnetic Interference structure of the present utility model, can make through the following steps: at first, permalloy soft magnetism powder with 30 mass parts thermosetting epoxy resin mixtures, 70 mass parts, the mixed solvent that adds propylene glycol monomethyl ether and methylethylketone (PGME/MEK=1/1) is diluted to the electro-magnetic wave absorption cold coating that solid shape is divided into 50 weight ratios, coat thickness and be on 3 microns the copper foil base material, place the baking oven heat drying to form the electromagnetic wave absorbing layer of 12 microns of thickness as electromagnetic wave shielding with supporter.Afterwards, on this electromagnetic wave absorbing layer, be coated with for example insulating barrier of epoxy resin of material.Further, in order to make this inhibition Electromagnetic Interference structure can be attached on the flexible printed wiring board of having finished configuration or other pressure programmings uses, another side coating or applying conductive adhesive layer in above-mentioned copper foil base material, suppress the Electromagnetic Interference structure sample to form, shown in the 1st figure.
In view of the above, the utility model is to utilize the electromagnetic wave absorbing layer contain soft magnetic material as electromagnetic wave inhibiting material and use the extra thin copper foil metal level as electromagnetic wave shielding (isolations) layer, this this structure can the usable reflection radiation the Electromagnetic Interference noise, reach shielding and block the interference source purpose; Utilize the electromagnetic wave absorbing layer of tool soft magnetism to suppress interference source simultaneously, this structure can effectively block and weaken the advantage of Electromagnetic Interference noise, this electromagnetic wave suppresses structure and can possess good flexibility simultaneously, is applicable in the consumption electronic products such as personal computer and Mobile Communications.
Prepare the inhibition Electromagnetic Interference structure of the utility model embodiment 1 to 5 according to the data in the following table 1, and prepare comparative example 1 and 2.
Table 1
Test: respectively the circuit board sample of the foregoing description 1 to embodiment 5 and comparative example 1,2 made different-thickness is cut into the test sample of suitable size, carry out electromagnetic wave shielding performance, electro-magnetic wave absorption property testing.
One, electromagnetic wave shielding performance:
Prepare the round inhibition Electromagnetic Interference of 13cm structure sample, carry out the electromagnetic shielding efficiency test according to the ASTM4935 method.Test result is recorded in table 1.
Two, electromagnetic wave absorbability:
Prepare the inhibition Electromagnetic Interference structure sample of 5 cm x, 10 cm sizes, measure according to microstrip line test I EC-62333 law regulation.Test result is recorded in table 1.
Can confirm that by table 1 the electromagnetism wave-wave shielding of embodiment 1 to 5 of the present utility model is higher than more than the 62dB at least, and electromagnetic wave absorbability has in this test more than the 3 dB values, have good electromagnetic wave rejection.
By the test data of embodiment 5 and comparative example 1 as can be known, the inhibition Electromagnetic Interference structure sample of comparative example 1 is insulating barrier, copper foil layer and conduction adhesion layer only, there is no the electromagnetic wave absorbing layer of filling the soft magnetism powder, though the electromagnetic wave shielding performance of comparative example 1 can also can't absorb and disturb electromagnetic wave greater than more than the 50dB.
By the test data of embodiment 2 and comparative example 2 as can be known, the inhibition Electromagnetic Interference structure sample of comparative example 2 is insulating barrier, electromagnetic wave absorbing layer and conduction adhesion layer only, when there is no the copper foil layer of electromagnetic shielding, though the electro-magnetic wave absorption performance of comparative example 2 can also can't reach effective shielding electromagnetic wave jamming performance greater than more than 3 dB.
In sum, inhibition Electromagnetic Interference structure of the present utility model can block and weaken the Electromagnetic Interference noise, therefore is applicable to the EMI shielding material in the electronic product.
The foregoing description is illustrative principle of the present utility model and effect thereof only, but not is used to limit the utility model.Protection range of the present utility model should be listed as claims.
Claims (9)
1. one kind is suppressed the Electromagnetic Interference structure, it is characterized in that: constitute by insulating barrier, electromagnetic wave absorbing layer, electromagnetic wave shielding and conduction adhesion layer, described electromagnetic wave shielding has relative end face and bottom surface, described electromagnetic wave absorbing layer is formed on the end face of described electron waves screen, described insulating barrier is formed on the end face of described electromagnetic wave absorbing layer, and described conduction adhesion layer is formed on the bottom surface of the broken screen of described electromagnetism.
2. inhibition Electromagnetic Interference structure as claimed in claim 1 is characterized in that: described electromagnetic wave absorbing layer is the electromagnetic wave absorbing layer that contains soft magnetic material.
3. inhibition Electromagnetic Interference structure as claimed in claim 1 is characterized in that: described electromagnetic wave shielding is the copper layer.
4. inhibition Electromagnetic Interference structure as claimed in claim 1 is characterized in that: the thickness of described electromagnetic wave absorbing layer is 12 to 35 microns.
5. inhibition Electromagnetic Interference structure as claimed in claim 1 is characterized in that: the thickness of described electromagnetic wave shielding is 3 to 5 microns.
6. inhibition Electromagnetic Interference structure as claimed in claim 1 is characterized in that: the thickness of described insulating barrier is 5 to 10 microns.
7. inhibition Electromagnetic Interference structure as claimed in claim 1 is characterized in that: the thickness of described conduction adhesion layer is 8 to 30 microns.
8. flexible printed wiring board that has as each described inhibition Electromagnetic Interference structure in the claim 1 to 7 is characterized in that: described inhibition Electromagnetic Interference structure is covered on the printed circuit board (PCB) body layer in its conduction adhesion layer place.
9. the flexible printed wiring board with inhibition Electromagnetic Interference structure as claimed in claim 8, it is characterized in that: the gross thickness of described inhibition Electromagnetic Interference structure is 28 to 80 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320010884 CN203105046U (en) | 2013-01-10 | 2013-01-10 | Structure for inhibition of electromagnetic wave interference, and flexible printed circuit comprising the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201320010884 CN203105046U (en) | 2013-01-10 | 2013-01-10 | Structure for inhibition of electromagnetic wave interference, and flexible printed circuit comprising the same |
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| CN203105046U true CN203105046U (en) | 2013-07-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN 201320010884 Expired - Lifetime CN203105046U (en) | 2013-01-10 | 2013-01-10 | Structure for inhibition of electromagnetic wave interference, and flexible printed circuit comprising the same |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103929933A (en) * | 2013-01-10 | 2014-07-16 | 昆山雅森电子材料科技有限公司 | Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same |
| CN105283056A (en) * | 2014-07-15 | 2016-01-27 | 联茂电子股份有限公司 | Electromagnetic wave interference shielding film |
| CN105578851A (en) * | 2014-10-15 | 2016-05-11 | 昆山雅森电子材料科技有限公司 | Thin-type high-transmission electromagnetic-absorbing screened film and manufacturing method thereof |
-
2013
- 2013-01-10 CN CN 201320010884 patent/CN203105046U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103929933A (en) * | 2013-01-10 | 2014-07-16 | 昆山雅森电子材料科技有限公司 | Structure for inhibition of electromagnetic wave interference and flexible printed circuit comprising same |
| CN105283056A (en) * | 2014-07-15 | 2016-01-27 | 联茂电子股份有限公司 | Electromagnetic wave interference shielding film |
| CN105578851A (en) * | 2014-10-15 | 2016-05-11 | 昆山雅森电子材料科技有限公司 | Thin-type high-transmission electromagnetic-absorbing screened film and manufacturing method thereof |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130731 |
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| CX01 | Expiry of patent term |