CN111642065A - Novel multilayer structure high-shielding electromagnetic shielding film for flexible circuit board - Google Patents
Novel multilayer structure high-shielding electromagnetic shielding film for flexible circuit board Download PDFInfo
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- CN111642065A CN111642065A CN202010527111.3A CN202010527111A CN111642065A CN 111642065 A CN111642065 A CN 111642065A CN 202010527111 A CN202010527111 A CN 202010527111A CN 111642065 A CN111642065 A CN 111642065A
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- 239000010410 layer Substances 0.000 claims abstract description 166
- 239000012790 adhesive layer Substances 0.000 claims abstract description 51
- 229910052751 metal Inorganic materials 0.000 claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000002245 particle Substances 0.000 claims description 18
- 239000002356 single layer Substances 0.000 claims description 18
- 239000000126 substance Substances 0.000 claims description 15
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 12
- 239000000758 substrate Substances 0.000 claims description 11
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004642 Polyimide Substances 0.000 claims description 9
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000000843 powder Substances 0.000 claims description 9
- 239000006247 magnetic powder Substances 0.000 claims description 8
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 6
- 229920002313 fluoropolymer Polymers 0.000 claims description 6
- 238000000053 physical method Methods 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 239000004408 titanium dioxide Substances 0.000 claims description 6
- 238000010023 transfer printing Methods 0.000 claims description 6
- 239000004925 Acrylic resin Substances 0.000 claims description 4
- 229920000178 Acrylic resin Polymers 0.000 claims description 4
- 239000003822 epoxy resin Substances 0.000 claims description 4
- 238000009413 insulation Methods 0.000 claims description 4
- -1 iron silicon aluminum Chemical compound 0.000 claims description 4
- 239000003921 oil Substances 0.000 claims description 4
- 229920000647 polyepoxide Polymers 0.000 claims description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 3
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000002019 doping agent Substances 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 239000000835 fiber Substances 0.000 claims description 3
- 229910052742 iron Inorganic materials 0.000 claims description 3
- 238000010030 laminating Methods 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- 238000002360 preparation method Methods 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 230000003746 surface roughness Effects 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 2
- 229920002545 silicone oil Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 9
- 238000012360 testing method Methods 0.000 abstract description 7
- 230000008569 process Effects 0.000 abstract description 6
- 238000004088 simulation Methods 0.000 abstract description 6
- 238000012545 processing Methods 0.000 abstract description 3
- 239000011889 copper foil Substances 0.000 abstract 1
- 239000010408 film Substances 0.000 description 75
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 5
- 230000005855 radiation Effects 0.000 description 4
- 238000004891 communication Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008033 biological extinction Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004880 explosion Methods 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000009863 impact test Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920000052 poly(p-xylylene) Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
- H05K1/0227—Split or nearly split shielding or ground planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
- H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
A novel multilayer structure high-shielding electromagnetic shielding film for a flexible circuit board comprises an insulating layer, a conductive shielding layer, a metal layer and a conductive adhesive layer; the lower surface of the insulating layer is connected with the conductive shielding layer, the lower surface of the conductive shielding layer is connected with the metal layer, and the lower surface of the metal layer is connected with the conductive adhesive layer; wherein the total thickness of the shielding film is 10-70 μm, preferably 13-38 μm; the shielding film is prepared by processing copper foil through multiple apertures; the thickness of the insulating layer is 3-25 μm, preferably 5-15 μm; the thickness of the conductive shielding layer is 3-10 μm, preferably 3-5 μm; the thickness of the metal layer is 0.1-1 μm, preferably 0.2-0.5 μm; the thickness of the conductive adhesive layer is 5-20 μm, preferably 10-15 μm. The invention has excellent electromagnetic shielding performance, and the SMT simulation test and the post-SMT conduction resistance and heat resistance of the client are superior to those of the common shielding film, thereby effectively meeting the special condition requirements of the client process and having excellent use effect.
Description
Technical Field
The invention relates to the technical field of shielding films, in particular to a novel multilayer-structure high-shielding electromagnetic shielding film for a flexible circuit board.
Background
In the market demand for electronic and communication products to be multifunctional and complicated, the circuit substrate needs to be lighter, thinner, shorter, and smaller in construction, while functionally, strong and high-speed signal transmission is required. Therefore, the circuit density is increased, the distance between the carrier circuits is closer and closer, the operating frequency is toward a high bandwidth, and the electromagnetic interference is more and more serious if the circuit layout and wiring are not reasonable, so that the electromagnetic compatibility must be effectively managed, thereby maintaining the normal signal transmission of the electronic product and improving the reliability. The characteristics of lightness, thinness and random bending enable the soft board to play a significant role in the development of the portable information and communication electronic industry;
as electronic communication products are getting smaller, the flexible printed circuit board is driven to bear more and stronger functions, and on the other hand, as portable electronic products are moving to microminiature, and the high demand of high-density flexible printed circuit board technology is also driven, under the condition that the functions are required to be powerful, high-frequency, high-density and thin-line, shielding films for thin film type flexible printed circuit boards (FPCs) are proposed in the market at present, and are widely adopted in small electronic products such as mobile phones, digital cameras and the like;
with the coming of the 5G era, the requirements of terminal products on the electromagnetic shielding film are higher and higher, and the electromagnetic shielding film has good application prospects in high-end manufacturing fields of mobile communication, medical display, military electronics and the like in the future; with the increasing demand of electromagnetic shielding performance of the electromagnetic shielding film, the thickness of the shielding layer will also increase, and the drawbacks will also be revealed, wherein especially the soldering heat resistance of the shielding film and the SMT process test of the simulation client are obvious, for example, the large-area panel explosion of the shielding film after SMT is tested by tin dipping after the curing process in normal state, or the conduction resistance between the SMT circuits will rise obviously, and meanwhile, the shielding metal layer with higher thickness is matched with the insulating layer with thinner thickness and the conductive adhesive contact layer, which may cause a series of weather resistance problems, such as the obvious conduction resistance rise under the high temperature and high humidity or cold and hot impact test conditions, and the defects of reduced adhesion and even delamination of the shielding layer, etc., are to be improved.
Disclosure of Invention
Objects of the invention
In order to solve the technical problems in the background art, the invention provides a novel multilayer-structure high-shielding electromagnetic shielding film for a flexible circuit board, which has excellent electromagnetic shielding performance, and the SMT simulation test and the post-SMT conduction resistance and heat resistance of a client are superior to those of a common shielding film, so that the requirements of special conditions of the client process can be effectively met, and the using effect is excellent.
(II) technical scheme
The invention provides a novel multilayer structure high-shielding electromagnetic shielding film for a flexible circuit board, which comprises an insulating layer, a conductive shielding layer, a metal layer and a conductive adhesive layer;
the lower surface of the insulating layer is connected with the conductive shielding layer, the lower surface of the conductive shielding layer is connected with the metal layer, and the lower surface of the metal layer is connected with the conductive adhesive layer;
wherein the total thickness of the shielding film is 10-70 μm, preferably 13-38 μm;
the thickness of the insulating layer is 3-25 μm, preferably 5-15 μm;
the thickness of the conductive shielding layer is 3-10 μm, preferably 3-5 μm;
the thickness of the metal layer is 0.1-1 μm, preferably 0.2-0.5 μm;
the thickness of the conductive adhesive layer is 5-20 μm, preferably 10-15 μm.
Preferably, the insulating layer is a black insulating layer, and the insulating layer is of a double-layer structure or a single-layer structure;
when the insulating layer is of a double-layer structure, the insulating layer consists of a black polyimide layer and a black ink layer; when the insulating layer is a single-layer structure, it is a black polyimide layer or a black ink layer.
Preferably, the upper surface of the insulating layer is covered with a first film layer, the first film layer is a release film or a carrier film, and the thickness of the first film layer is 25-100 μm;
the release film is one or more of a PET fluoroplastic release film, a PET silicon-oil-containing release film, a PET matte release film and a PE release film, and the carrier film is a low-adhesion carrier film.
Preferably, the gloss value of the insulating layer is controlled by physical methods or chemical methods, and the physical methods comprise physical sanding and wet coating of the sanded layer;
the physical sanding comprises the following specific operation steps: the surface roughness of the release film is improved by physically sanding the release film substrate, so that the requirement of the gloss value of the ink surface of the insulation layer after transfer printing is met;
the specific operation steps of the wet coating frosting layer are as follows: adding silicon dioxide or titanium dioxide inorganic powder into glue by a chemical glue preparation mode, and then coating the glue on the surface of a release film substrate to form a low-roughness layer on the surface of the substrate, so that the requirement of the gloss value of the ink surface after transfer printing is met;
the operation steps of the chemical method are as follows: at least one of dopants such as titanium dioxide, silicon dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate inorganic substances is added in the ink to improve the gloss value of the surface of the insulating layer.
The conductive shielding layer is a reflection and absorption layer formed by mixing epoxy resin, acrylic resin, magnetic powder and superfine metal powder;
wherein, the magnetic powder is one or more of iron oxide, iron silicon aluminum and polycrystalline iron fiber, and the superfine metal powder is one or more of nickel powder, silver-coated copper powder, copper powder and silver powder.
Preferably, the conductive adhesive layer has a double-layer structure or a single-layer structure.
Preferably, when the conductive adhesive layer has a double-layer structure, the conductive adhesive layer is composed of an adhesive layer without conductive particles and a conductive adhesive layer with conductive particles, and the adhesive layer without conductive particles is adhered between the conductive cloth layer and the conductive adhesive layer with conductive particles.
Preferably, when the conductive adhesive layer has a single-layer structure, the conductive adhesive layer has a single-layer conductive adhesive layer containing conductive particles or a single-layer conductive adhesive layer containing no conductive particles.
Preferably, the lower surface of the conductive adhesive layer is provided with a second film layer, and the second film layer is a release film, release paper or a low-adhesion carrier film.
Preferably, the thickness of the release film is 25-100 μm, and the release film is one or more of a PET fluoroplastic release film, a PET silicone oil-containing release film, a PET matte release film and a PE release film; the thickness of the release paper is 25-130 mu m, and the release paper is PE laminating paper capable of being released from two sides; the thickness of the low adhesion carrier film is 25 to 100 μm.
The technical scheme of the invention has the following beneficial technical effects:
the insulating layer plays an insulating role, the insulating effect is good, the conductive shielding layer adopts a reflection absorption layer formed by magnetic powder of superfine metal bodies and iron oxide bodies, the performance is improved, most of radio frequency and microwave energy are reflected by the metal layer, the transmission component is extremely small, so that great shielding attenuation is obtained, the pollution of environmental electromagnetic wave radiation can be obviously eliminated, the conductive adhesive layer plays a role of forming a conducting circuit with the grounding wire on the soft board, and the resin achieves complete cross-linking curing to maintain good electrical property and mechanical property after a period of time, so that the grounding impedance value of the soft board is reduced, and the aim of reducing electromagnetic wave interference is achieved;
the invention has excellent electromagnetic shielding performance, and the SMT simulation test and the post-SMT conduction resistance and heat resistance of the client are superior to those of the common shielding film, thereby effectively meeting the special condition requirements of the client process and having excellent use effect.
Drawings
Fig. 1 is a schematic structural diagram of a multilayer high-shielding electromagnetic shielding film for a flexible printed circuit board according to the present invention.
Reference numerals: 1. an insulating layer; 2. a conductive shielding layer; 3. a metal layer; 4. a conductive adhesive layer; 5. a first film layer; 6. a second film layer.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail with reference to the accompanying drawings in conjunction with the following detailed description. It should be understood that the description is intended to be exemplary only, and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
Referring to fig. 1, the novel multilayer high-shielding electromagnetic shielding film for a flexible printed circuit board provided by the invention comprises an insulating layer 1, a conductive shielding layer 2, a metal layer 3 and a conductive adhesive layer 4;
the lower surface of the insulating layer 1 is connected with the conductive shielding layer 2, the lower surface of the conductive shielding layer 2 is connected with the metal layer 3, and the lower surface of the metal layer 3 is connected with the conductive adhesive layer 4;
wherein the total thickness of the shielding film is 10-70 μm, preferably 13-38 μm;
the thickness of the insulating layer 1 is 3-25 μm, preferably 5-15 μm; the surface of the insulating layer 1 and the primer layer are collectively referred to as an insulating layer, and the insulating layer and the primer layer can be the same or different material layers;
the thickness of the conductive shielding layer 2 is 3-10 μm, preferably 3-5 μm;
the thickness of the metal layer 3 is 0.1-1 μm, preferably 0.2-0.5 μm; the microwave radiation shielding device can reflect most of radio frequency and microwave energy, has extremely small transmission component, thereby obtaining great shielding attenuation and obviously eliminating the pollution of environmental electromagnetic wave radiation;
the thickness of the conductive adhesive layer 4 is 5-20 μm, preferably 10-15 μm, which is used to form a conductive circuit with the grounding trace on the flexible printed circuit board, and the resin is completely cross-linked and cured for a period of time to maintain good electrical and mechanical properties, so that the grounding impedance of the flexible printed circuit board is reduced to reduce the electromagnetic interference.
In an alternative embodiment, the insulating layer 1 is a black insulating layer, and the insulating layer 1 has a double-layer structure or a single-layer structure; when the insulating layer 1 is of a double-layer structure, the insulating layer is composed of a black polyimide layer and a black ink layer, and the black polyimide layer and the black ink layer are not specifically set in an upper-lower structure; the black polyimide layer has extremely low water absorption rate, is not easy to invade by water vapor, has excellent reliability under the high-temperature and high-humidity environment, and has the characteristics of good electrical property, good chemical resistance, high shielding performance, less transmission loss, high transmission quality, excellent reliability and the like; when the insulating layer 1 is a single-layer structure, it is a black polyimide layer or a black ink layer. The main function of the black insulating layer 1 is insulation, so that the thickness of the insulating layer is reduced as much as possible when the thickness of the insulating layer reaches a certain thickness and the insulating effect is achieved, thereby saving the cost and enabling the product to achieve a certain thinning advantage.
In an alternative embodiment, the black insulating layer 1 is at least one of epoxy resin, polyimide, acrylic resin, urethane resin, silicone rubber resin, parylene resin, and bismaleimide resin; when the requirement of higher flame resistance exists, at least one of halogen, phosphorus, nitrogen or boron series compounds can be added to solve the problems of flame resistance and flame retardance by increasing the flame resistance.
In an optional embodiment, the upper surface of the insulating layer 1 is covered with a first film layer 5, the first film layer 5 is a release film or a carrier film, and the thickness of the first film layer 5 is 25 to 100 μm; the release film is one or more of a PET fluoroplastic release film, a PET silicon-oil-containing release film, a PET matte release film and a PE release film, and the carrier film is a low-adhesion carrier film.
In an alternative embodiment, the gloss value of the insulating layer 1 is controlled by a physical method or a chemical method, and the two methods can control the gloss value to be 0-60 (60 DEG angle) or higher; the physical method comprises two modes of physical sanding and wet coating of a sanding layer;
the physical sanding comprises the following specific operation steps: the surface roughness of the release film is improved by physically sanding the release film substrate, so that the requirement of the gloss value of the ink surface of the insulation layer 1 after transfer printing is met;
the specific operation steps of the wet coating frosting layer are as follows: adding silicon dioxide or titanium dioxide inorganic powder into glue by a chemical glue preparation mode, and then coating the glue on the surface of a release film substrate to form a low-roughness layer on the surface of the substrate, so that the requirement of the gloss value of the ink surface after transfer printing is met;
the operation steps of the chemical method are as follows: the ink is added with at least one of dopants such as titanium dioxide, silicon dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate inorganic substances to improve the gloss value of the surface of the insulating layer, and the primer layer is doped with a plurality of inorganic substances, so that the primer layer has good mechanical properties, friction resistance, aging resistance and chemical resistance as the exposed surface of a product; meanwhile, the surface gloss value is reduced, good scattering and extinction effects can be achieved, light penetration is reduced, and products are protected.
In an alternative embodiment, the conductive shielding layer 2 is made of epoxy resin, acrylic resin, and a reflective absorption layer mixed with magnetic powder and ultra-fine metal powder; wherein, the magnetic powder is one or more of iron oxide, iron silicon aluminum and polycrystalline iron fiber, and the superfine metal powder is one or more of nickel powder, silver-coated copper powder, copper powder and silver powder.
In an alternative embodiment, the conductive adhesive layer 4 has a double-layer structure or a single-layer structure; when the conductive adhesive layer 4 is a double-layer structure, the conductive adhesive layer is composed of an adhesive layer without conductive particles and a conductive adhesive layer with conductive particles, and the adhesive layer without conductive particles is adhered between the conductive cloth layer and the conductive adhesive layer with conductive particles; when the conductive adhesive layer 4 has a single-layer structure, it is a single-layer conductive adhesive layer containing conductive particles or a single-layer conductive adhesive layer containing no conductive particles.
In an optional embodiment, the lower surface of the conductive adhesive layer 4 is provided with a second film layer 6, the second film layer 6 is a release film, release paper or a low-adhesion carrier film, and is used for protecting the adhesive layer from being contaminated by dirt and is not adhered to a release layer surface when being rolled, the product is adhered to the substrate, and the carrier layer is peeled off, and the carrier layer is mainly made of release paper or a carrier film; the thickness of the release film is 25-100 mu m, and the release film is one or more of a PET fluoroplastic release film, a PET silicon-containing oil release film, a PET matte release film and a PE release film; the thickness of the release paper is 25-130 mu m, and the release paper is PE laminating paper capable of being released from two sides; the thickness of the low adhesion carrier film is 25 to 100 μm.
In the invention, the insulating layer 1 plays an insulating role, the insulating effect is good, the conductive shielding layer 2 adopts a reflection absorption layer formed by magnetic powder of an ultrafine metal body and an iron oxide body, the performance is improved, most of radio frequency and microwave energy is reflected by the metal layer 3, the transmission component is extremely small, so that great shielding attenuation is obtained, the pollution of environmental electromagnetic wave radiation can be obviously eliminated, the conductive adhesive layer 4 plays a role of forming a conducting circuit with a grounding wire on a soft board, and the resin achieves complete cross-linking and curing to maintain good electrical property and mechanical physical property after a period of time, so that the grounding impedance value of the soft board is reduced to achieve the aim of reducing electromagnetic wave interference;
the invention has excellent electromagnetic shielding performance, and the SMT simulation test and the post-SMT conduction resistance and weather resistance of the client are superior to those of the common shielding film, thereby effectively meeting the special condition requirements of the client process and having excellent use effect.
To facilitate understanding of the superiority of the present invention, a number of experiments were conducted and compared to the prior art, and the following table shows the results of the experiments of the present invention with respect to resistance, peel strength and shielding:
in order to highlight the reliability and reliability of the ink type product of the invention compared with the prior art, a plurality of groups of experiments are specially carried out, and the experimental results are as follows:
from the experimental test comparison results, the shielding film with multi-aperture processing has the relevant characteristics, especially the electromagnetic shielding performance, the SMT simulation test and the post-SMT conduction resistance value of the client, the heat resistance and the like which are superior to those of the common high shielding film, and can effectively meet the special condition requirements of the client processing procedure.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (10)
1. A novel multilayer structure high-shielding electromagnetic shielding film for a flexible circuit board is characterized by comprising an insulating layer (1), a conductive shielding layer (2), a metal layer (3) and a conductive adhesive layer (4);
the lower surface of the insulating layer (1) is connected with the conductive shielding layer (2), the lower surface of the conductive shielding layer (2) is connected with the metal layer (3), and the lower surface of the metal layer (3) is connected with the conductive adhesive layer (4);
wherein the total thickness of the shielding film is 10-70 μm, preferably 13-38 μm;
the thickness of the insulating layer (1) is 3-25 μm, preferably 5-15 μm;
the thickness of the conductive shielding layer (2) is 3-10 μm, preferably 3-5 μm;
the thickness of the metal layer (3) is 0.1-1 μm, preferably 0.2-0.5 μm;
the thickness of the conductive adhesive layer (4) is 5-20 μm, preferably 10-15 μm.
2. The novel multilayer structure high shielding electromagnetic shielding film for the flexible circuit board according to claim 1, wherein the insulating layer (1) is a black insulating layer, and the insulating layer (1) has a double-layer structure or a single-layer structure;
when the insulating layer (1) is of a double-layer structure, the insulating layer is composed of a black polyimide layer and a black ink layer; when the insulating layer (1) is a single-layer structure, it is a black polyimide layer or a black ink layer.
3. The novel multilayer structure high-shielding electromagnetic shielding film for the flexible circuit board as claimed in claim 1, wherein the upper surface of the insulating layer (1) is covered with a first film layer (5), the first film layer (5) is a release film or a carrier film, and the thickness of the first film layer (5) is 25-100 μm;
the release film is one or more of a PET fluoroplastic release film, a PET silicon-oil-containing release film, a PET matte release film and a PE release film, and the carrier film is a low-adhesion carrier film.
4. The novel multilayer structure high-shielding electromagnetic shielding film for the flexible circuit board as claimed in claim 1, wherein the gloss value of the insulating layer (1) is controlled by a physical method or a chemical method, and the physical method comprises two modes of physical sanding and wet-coating sanding;
the physical sanding comprises the following specific operation steps: the surface roughness of the release film is improved by physically sanding the release film substrate, so that the requirement of the gloss value of the ink surface of the insulation layer 1 after transfer printing is met;
the specific operation steps of the wet coating frosting layer are as follows: adding silicon dioxide or titanium dioxide inorganic powder into glue by a chemical glue preparation mode, and then coating the glue on the surface of a release film substrate to form a low-roughness layer on the surface of the substrate, so that the requirement of the gloss value of the ink surface after transfer printing is met;
the operation steps of the chemical method are as follows: at least one of dopants such as titanium dioxide, silicon dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate inorganic substances is added in the ink to improve the gloss value of the surface of the insulating layer.
5. The novel multilayer structure high shielding electromagnetic shielding film for the flexible circuit board as claimed in claim 1, wherein the conductive shielding layer (2) is a reflection absorption layer formed by mixing epoxy resin, acrylic resin, magnetic powder and ultrafine metal powder;
wherein, the magnetic powder is one or more of iron oxide, iron silicon aluminum and polycrystalline iron fiber, and the superfine metal powder is one or more of nickel powder, silver-coated copper powder, copper powder and silver powder.
6. The novel multilayer structure high shielding electromagnetic shielding film for the flexible circuit board as claimed in claim 1, wherein the conductive adhesive layer (4) has a double-layer structure or a single-layer structure.
7. The novel multilayer high-shielding electromagnetic shielding film for the flexible printed circuit board as claimed in claim 6, wherein when the conductive adhesive layer (4) has a double-layer structure, the adhesive layer is composed of an adhesive layer without conductive particles and a conductive adhesive layer with conductive particles, and the adhesive layer without conductive particles is adhered between the conductive cloth layer and the conductive adhesive layer with conductive particles.
8. The novel multilayer structure high-shielding electromagnetic shielding film for the flexible printed circuit board as claimed in claim 6, wherein when the conductive adhesive layer (4) is a single-layer structure, the conductive adhesive layer is a single-layer conductive adhesive layer containing conductive particles or a single-layer conductive adhesive layer containing no conductive particles.
9. The novel multilayer structure high shielding electromagnetic shielding film for the flexible circuit board as claimed in claim 1, wherein the lower surface of the conductive adhesive layer (4) is provided with a second film layer (6), and the second film layer (6) is a release film, release paper or low adhesion carrier film.
10. The novel multilayer structure high shielding electromagnetic shielding film for the flexible circuit board as claimed in claim 9, wherein the thickness of the release film is 25-100 μm, and the release film is one or more of a PET fluoroplastic release film, a PET silicone oil-containing release film, a PET matte release film and a PE release film; the thickness of the release paper is 25-130 mu m, and the release paper is PE laminating paper capable of being released from two sides; the thickness of the low adhesion carrier film is 25 to 100 μm.
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| CN202010527111.3A CN111642065A (en) | 2020-06-11 | 2020-06-11 | Novel multilayer structure high-shielding electromagnetic shielding film for flexible circuit board |
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| CN113613482A (en) * | 2021-08-06 | 2021-11-05 | 保定乐凯新材料股份有限公司 | Electromagnetic wave shielding film suitable for grounding of extremely-small grounding hole, preparation method and application |
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