CN108541204B - Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof - Google Patents
Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof Download PDFInfo
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- CN108541204B CN108541204B CN201710115287.6A CN201710115287A CN108541204B CN 108541204 B CN108541204 B CN 108541204B CN 201710115287 A CN201710115287 A CN 201710115287A CN 108541204 B CN108541204 B CN 108541204B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
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Abstract
The invention discloses a composite high-shielding thin electromagnetic interference shielding film, which comprises a black composite insulating layer, a metal layer and a conductive adhesive layer, wherein the metal layer is positioned between the black composite insulating layer and the conductive adhesive layer; the black composite insulating layer comprises a first insulating layer and a second insulating layer, the second insulating layer is positioned between the first insulating layer and the metal layer, the glossiness of the first insulating layer is 0-60% (60 degrees), and the hardness of the black composite insulating layer is HB-5H; the surface of the second insulating layer in contact with the metal layer is a rough surface and Rz is 0.01 to 0.5 (0.5 excluded) μm. The invention has the characteristics of good electrical property, good chemical resistance, high shielding performance, good adhesion strength, less transmission loss, high transmission quality, low water absorption, good reliability and the like, has higher reliability and operability compared with the common electromagnetic shielding film, and can adjust the surface gloss value, thereby replacing the common electromagnetic shielding film material.
Description
Technical Field
The invention relates to a thinned shielding film for an FPC (flexible printed circuit) and the technical field of preparation thereof, in particular to a composite high-shielding thinned electromagnetic interference shielding film.
Background
In the market demand that electronic and communication products tend to be multifunctional and complicated, the circuit substrate needs to be lighter, thinner, shorter, and smaller in construction; functionally, powerful and high-speed signal transmission is required. Therefore, the circuit density is increased, the distance between the carrier circuits is closer, the operating frequency is higher and wider, and if the circuit layout and the wiring are not reasonable, the Electromagnetic Interference (EMI) is more and more serious, so the Electromagnetic Compatibility (EMC) must be effectively managed to maintain the normal signal transmission of the electronic product and to improve the reliability. The characteristics of lightness, thinness and free bending make the soft board have a great significance in the development of the portable information and communication electronic industry.
As electronic communication products are getting smaller, the flexible printed circuit board is driven to have more and more powerful functions, and on the other hand, as portable electronic products are moving to microminiature, and the demand of high-density flexible printed circuit board technology is also driven, under the condition that the function is required to be powerful, high-frequency, high-density and thin-line, shielding films for thin film type flexible printed circuit boards (FPCs) are proposed in the market at present, and are widely used in small electronic products such as mobile phones, digital cameras and digital cameras.
The water absorption rate of the electromagnetic interference shielding film on the market is as high as 1.0-1.5%, so that the electromagnetic interference shielding film has a risk on reliability under the conditions of high temperature and high humidity; the outer layer of the common shielding film is difficult to peel off the release film, so that the operability is poor; furthermore, current barrier films typically require a matte finish with a low gloss value for product appearance, which is generally high. In order to solve the above-mentioned technical problems and needs, the present invention provides a solution as follows.
Disclosure of Invention
The invention mainly solves the technical problem of providing a composite high-shielding thin electromagnetic interference shielding film, which has the characteristics of good electrical property, good chemical resistance, high shielding property, good bonding strength, less transmission loss, high transmission quality, low water absorption, good reliability and the like, has higher reliability and operability compared with the common electromagnetic shielding film, and can adjust the surface gloss value, thereby replacing the common shielding film material.
In order to solve the technical problems, the invention adopts a technical scheme that: the composite high-shielding thin electromagnetic interference shielding film comprises a black composite insulating layer, a metal layer and a conductive adhesive layer, wherein the metal layer is positioned between the black composite insulating layer and the conductive adhesive layer;
the black composite insulating layer comprises a first insulating layer and a second insulating layer, and the second insulating layer is positioned between the first insulating layer and the metal layer;
the hardness of the black composite insulating layer is HB-5H;
the first insulating layer has a glossiness of 0 to 60% (60 °);
the surface of the second insulating layer, which is in contact with the metal layer, is a rough surface, and the Rz value is 0.01-0.5 (0.5 is not included);
the total thickness of the electromagnetic interference shielding film is 6.01-57 μm, wherein the thickness of the first insulating layer is 2-12 μm; the thickness of the second insulating layer is 2-12 μm; the thickness of the metal layer is 0.01-8 μm; the thickness of the conductive adhesive layer is 2-25 μm.
Preferably, when the shielding film is made thinner, the thickness of the metal layer is 0.01 to 2 μm.
Preferably, when the shielding film has a better shielding property, the thickness of the metal layer is 2 to 6 μm.
Preferably, the first insulating layer has a glossiness of 0 to 30% (60 °), the black composite insulating layer has a hardness of 2H to 5H, and the surface Rz of the second insulating layer in contact with the metal layer is 0.08 to 0.5 (excluding 0.5) μm.
The first insulating layer is an insulating layer containing extinction powder, the particle size of the extinction powder is 2-12 mu m, and the weight ratio of the extinction powder to the resin is 0.2-15%.
Further, the matting powder in the first insulating layer is at least one of inorganic substance powders of silicon dioxide, titanium dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate, or a compound having flame retardancy containing at least one of halogen, phosphorus, nitrogen and boron.
Further, from the viewpoint of cost, when a high hardness is required, at least one of titanium dioxide and silica is preferable as the matting powder in the first insulating layer, and when a high flame resistance is considered, at least one of aluminum hydroxide, alumina, calcium carbonate, and a phosphorus-containing flame retardant is preferable.
Further, the metal layer is one of the following two structures:
firstly, the metal layer is of a single-layer structure;
and secondly, the metal layer is of a double-layer structure consisting of two metal layers, and the metal layers are sequentially formed on the surface layer by layer.
Furthermore, one surface of the metal layer, which is in contact with the conductive adhesive layer, is an uneven surface with peaks and valleys.
The metal layer is made of copper, silver, nickel, tin, gold, palladium, aluminum, chromium, titanium, or zinc, or a metal alloy containing at least one of the metals.
Further, the conductive adhesive layer is one of the following two structures:
the conductive adhesive layer is a single-layer conductive adhesive layer with conductive particles;
the conductive adhesive layer is of a double-layer structure and is formed by laminating an adhesive layer without conductive particles and a conductive adhesive layer with conductive particles, wherein the adhesive layer without conductive particles is adhered between the metal layer and the conductive adhesive layer with conductive particles.
Further, the conductive particles of the conductive adhesive layer are at least one of copper, silver, nickel, tin, gold, palladium, aluminum, chromium, titanium, zinc and carbon, or at least one of nickel gold, gold and silver, copper nickel, copper silver, nickel silver and copper nickel gold.
Preferably, the conductive particles of the conductive adhesive layer are at least one of gold, silver, gold and silver, nickel and gold, and copper and silver.
Further, a matte release film layer is formed on the surface of the black composite insulating layer, one surface of the matte release film layer, which is in contact with the black composite insulating layer, is a rough surface, and the Rz value is 0.2-5 μm.
Further, the surface of the conductive adhesive layer is provided with a release layer, and the release layer is one of the following two structures:
the release layer is a release film, the thickness of the release film is 25-100 mu m, and the release film is at least one of a PET fluoroplastic release film, a PET silicone-containing release film, a PET matte release film and a PE release film;
secondly, the release layer is release paper, the thickness of the release paper is 25-130 mu m, and the release paper is PE laminating paper;
and thirdly, the release layer is a low-adhesion carrier film, and the thickness of the low-adhesion carrier film is 25-100 μm.
Further, a preparation method of the composite high-shielding thin electromagnetic interference shielding film is one of the following methods:
the method comprises the following steps: the method comprises the following steps:
the method comprises the following steps: coating a first insulating layer on the surface of the release film;
step two: coating a second insulating layer on the surface of the first insulating layer to form a black composite insulating layer;
step three: rolling, baking and curing;
step four: forming a metal layer on the surface of the black composite insulating layer;
step five: and coating a conductive adhesive layer on the surface of the metal layer, and then attaching a release layer.
The second method comprises the following steps: the method comprises the following steps:
the method comprises the following steps: coating a first insulating layer on the surface of the release film;
step two: coating a second insulating layer on the surface of the first insulating layer to form a black composite insulating layer;
step three: rolling, baking and curing;
step four: forming a first metal layer on the surface of the black composite insulating layer;
step five: forming a second metal layer on the surface of the first metal layer;
step six: and coating a conductive adhesive layer on the surface of the second metal layer, and then attaching the release layer.
Further, the resin material of the first insulating layer and the second insulating layer is at least one of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, parylene resin, bismaleimide resin, and polyimide resin.
The resin material of the conductive adhesive layer is at least one of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin and polyimide resin.
Further, the metal layer is formed by vacuum sputtering, vacuum evaporation, Chemical Vapor Deposition (CVD), Metal Organic Chemical Vapor Deposition (MOCVD), electron beam evaporation, or electrolytic plating.
The conductive adhesive layer further comprises at least one of inorganic substance powder silicon dioxide, titanium dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate.
Furthermore, the water absorption of the conductive adhesive layer is between 0.01% and 0.9%.
Furthermore, the particle size of the conductive particles in the conductive adhesive layer is 3-12 μm, and the weight percentage of the conductive particles in the total solid content of the conductive adhesive layer is 5-50%.
The invention has the beneficial effects that: therefore, the invention has at least the following advantages:
the surface glossiness of the black composite insulating layer is 0-60% (60 ℃), preferably can reach below 30%, and the hardness is HB-5H, preferably can reach 2H-5H, so that the black composite insulating layer not only has the black matte characteristic, but also has high hardness, can prevent surface scratch, is not easy to corrode by chemical reagents in downstream processing procedures, and has good weather resistance;
secondly, the lower surface of the second insulating layer is a rough surface, and the Rz (roughness) value is 0.01-0.5 (0.5 is not included), so that the structure provides good adhesion and filling area for the metal layer;
thirdly, the first insulating layer and the second insulating layer are compounded to form the composite insulating layer, so that a shielding film finished product has good hardness, mechanical strength and flexing resistance, and the design of the double-layer insulating layer can solve the problem of pin holes on the surface caused by uneven coating in the manufacturing process;
the lower surface of the metal layer can be an uneven surface with peaks and valleys, so that the adhesive force between the metal layer and the conductive adhesive layer can be increased, and when the conductive adhesive layer is thin, the lower surface of the metal layer can be directly penetrated through the conductive adhesive layer and then grounded, so that the shielding performance is enhanced; the design can reduce the thickness of the conductive adhesive layer, further ensure lower water absorption rate and improve the stability of the shielding film;
the first insulating layer contains extinction powder, the extinction degree of the surface of a coating film is adjusted by controlling the particle size of the powder, the particle size is controlled to be 2-12 mu m, the smaller the particle size of the extinction powder is, the larger the gloss (glossiness) value of the surface of the extinction powder is, namely, the brighter the surface form is, a required product (such as glossiness, flame resistance, hardness or cost and the like) can be obtained by adjusting the particle size, the type, the content and the like of the extinction powder, and the added extinction powder can further improve the hardness of the black composite insulating layer, so that the product has higher mechanical property, electrical property, operability and the like;
sixthly, the surface of the black composite insulating layer uses the extinction release film layer, the surface Rz of the black composite insulating layer is 0.2-5 mu m, the black composite insulating layer of the shielding film and the release film layer are easy to separate through the shape, so that the operability of a downstream terminal is greatly improved, and the extinction release film layer is beneficial to the extinction shape of the surface shape of the black composite insulating layer after the shielding film is subjected to rapid press molding and the release film layer is torn off;
seventhly, the metal layer of the invention adopts a single-layer or double-layer structure, so that the oxidation resistance and the conductivity can be effectively improved, the reliability and the shielding performance can be improved, when the thickness of the metal layer reaches 0.1-1 mu m, the shielding rate of 60-70dB can be achieved, when the thickness reaches more than 1 mu m, the shielding rate of more than 70dB can be achieved, and when the thickness is 2 mu m, the shielding rate of 80dB can be achieved;
the conductive adhesive layer can be a double-layer structure formed by laminating a layer of adhesive layer without conductive particles and a layer of conductive adhesive layer with conductive particles, and the adhesive layer can increase the binding force between the metal layer and the conductive adhesive layer with conductive particles; preferably, after the flexible printed circuit board is laminated on the FPC in the downstream process, the conductive particles pierce the thinned adhesive layer due to the hot pressing of the resin material and are directly conducted with the metal layer, so that the metal layer is directly contacted and conducted with the grounding wire on the printed circuit board, and the grounding wire on the flexible printed circuit board forms a conducting circuit;
ninth, in the conductive adhesive layer of the invention, the required products can be obtained by controlling the particle size, the type and the content of the conductive particles, such as lower cost, better conductivity, better processing operability and the like;
the conductive adhesive layer of the invention contains at least one of inorganic substance powder silicon dioxide, titanium dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate, thus having extremely low water absorption rate which can be as low as 0.01-0.9 percent and higher reliability under the conditions of high temperature and high humidity.
The foregoing description of the present invention is only an overview of the technical solutions of the present invention, and in order to make the technical solutions of the present invention more clear and clear, and to implement the technical solutions according to the content of the description, the following detailed description of the preferred embodiments of the present invention is provided with the accompanying drawings.
Drawings
FIG. 1 is a schematic view of a structure of the present invention (the metal layer has a single-layer structure);
FIG. 2 is a schematic view of another structure of the present invention (the metal layer has a double-layer structure);
the parts in the drawings are marked as follows:
100-extinction release film layer, 200-black composite insulating layer, 201-first insulating layer, 202-second insulating layer, 300-metal layer, 301-first metal layer, 302-second metal layer, 400-conductive adhesive layer, 401-first conductive adhesive layer, 402-second conductive adhesive layer and 500-release layer.
Detailed Description
The following description of the embodiments of the present invention is provided for illustrative purposes, and the present invention will be described in detail with reference to the accompanying drawings. The invention may be embodied in other different forms, i.e. it is capable of various modifications and changes without departing from the scope of the invention as disclosed.
Example (b): a composite high-shielding thin electromagnetic interference shielding film, as shown in fig. 1 and fig. 2, comprising a black composite insulating layer 200, a metal layer 300 and a conductive adhesive layer 400, wherein the metal layer 300 is located between the black composite insulating layer 200 and the conductive adhesive layer 400;
the black composite insulating layer 200 includes a first insulating layer 201 and a second insulating layer 202, and the second insulating layer 202 is located between the first insulating layer 201 and the metal layer 300;
the hardness of the black composite insulating layer 200 is HB-5H;
the first insulating layer 201 has a glossiness of 0 to 60% (60 °);
the surface of the second insulating layer 202 in contact with the metal layer 300 is a rough surface and Rz value is 0.01-0.5 (0.5 excluded) μm;
the total thickness of the electromagnetic interference shielding film is 6.01-57 μm, wherein the thickness of the first insulating layer 201 is 2-12 μm; the thickness of the second insulating layer 202 is 2-12 μm; the thickness of the metal layer 300 is 0.01-8 μm; the thickness of the conductive adhesive layer 400 is 2-25 μm.
The surface of the metal layer 300 contacting the conductive adhesive layer 400 is an uneven surface having peaks and valleys. The uneven plane is formed after the metal layer is formed and then is subjected to a physical or chemical surface treatment process.
In this embodiment, it is preferable that the thickness of the metal layer is 0.01 to 2 μm when the shielding film is made thinner; when the shielding film has better shielding property, the thickness of the metal layer is 2-6 μm.
In this embodiment, it is preferable that the first insulating layer has a glossiness of 0 to 30% (60 °), the black composite insulating layer has a hardness of 2H to 5H, and a surface Rz value of the second insulating layer in contact with the metal layer is 0.08 to 0.5 (excluding 0.5) μm.
The first insulating layer 201 is an insulating layer containing extinction powder, the particle size of the extinction powder is 2-12 mu m, and the weight ratio of the extinction powder to the resin is 0.2-15%.
The matting powder in the first insulating layer 201 is at least one of inorganic substance powders of silicon dioxide, titanium dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate, or a compound having flame retardancy containing at least one of halogen, phosphorus, nitrogen and boron.
In view of cost, the matting powder in the first insulating layer 201 is preferably at least one of titanium dioxide and silicon dioxide when a high hardness is required, and is preferably at least one of aluminum hydroxide, aluminum oxide, calcium carbonate and a phosphorus-containing flame retardant when a high flame resistance is considered.
The metal layer 300 is one of the following two structures:
firstly, the metal layer is of a single-layer structure;
and secondly, the metal layers are of a double-layer structure consisting of two metal layers, namely a first metal layer 301 and a second metal layer 302, and the metal layers are sequentially formed on the surface layer by layer.
The contact surface of the metal layer 300 and the conductive adhesive layer 400 is an uneven surface having peaks and valleys.
The metal layer 300 is made of copper, silver, nickel, tin, gold, palladium, aluminum, chromium, titanium, or zinc, or a metal alloy containing any one or more of the above metals.
The conductive adhesive layer 400 has one of the following two structures:
the conductive adhesive layer 400 is a single-layer conductive adhesive layer with conductive particles;
the conductive adhesive layer 400 has a double-layer structure, and is formed by laminating an adhesive layer without conductive particles (i.e., the first conductive adhesive layer 401) and a conductive adhesive layer with conductive particles (i.e., the first conductive adhesive layer 402), wherein the adhesive layer without conductive particles is adhered between the metal layer and the conductive adhesive layer with conductive particles.
However, as a variation and alternative of the present invention, the conductive adhesive layer may be a single adhesive layer containing no conductive particles.
The conductive particles of the conductive adhesive layer are at least one of copper, silver, nickel, tin, gold, palladium, aluminum, chromium, titanium, zinc and carbon, or at least one of nickel gold, gold and silver, copper nickel, copper silver, nickel silver and copper nickel gold.
Preferably, the conductive particles of the conductive adhesive layer are at least one of gold, silver, gold and silver, nickel and gold, and copper and silver.
The surface of the black composite insulating layer 200 is formed with a matte release film layer 100, and the surface of the matte release film layer 100 contacting the black composite insulating layer 200 is a rough surface and Rz value is 0.2-5 μm.
The surface of the conductive adhesive layer 400 is provided with a release layer 500, which is one of the following two structures:
the release layer is a release film, the thickness of the release film is 25-100 mu m, and the release film is at least one of a PET (polyethylene terephthalate) fluoroplastic release film, a PET (polyethylene terephthalate) silicone oil-containing release film, a PET (polyethylene terephthalate) matte release film and a PE (polyethylene) release film;
secondly, the release layer is release paper, the thickness of the release paper is 25-130 mu m, and the release paper is PE laminating paper;
and thirdly, the release layer is a low-adhesion carrier film, and the thickness of the low-adhesion carrier film is 25-100 μm.
A preparation method of the composite high-shielding thin electromagnetic interference shielding film is one of the following methods:
the method comprises the following steps: the method comprises the following steps:
the method comprises the following steps: coating a first insulating layer on the surface of the release film;
step two: coating a second insulating layer on the surface of the first insulating layer to form a black composite insulating layer;
step three: rolling, baking and curing;
step four: forming a metal layer on the surface of the black composite insulating layer;
step five: and coating a conductive adhesive layer on the surface of the metal layer, and then attaching a release layer.
The second method comprises the following steps: the method comprises the following steps:
the method comprises the following steps: coating a first insulating layer on the surface of the release film;
step two: coating a second insulating layer on the surface of the first insulating layer to form a black composite insulating layer;
step three: rolling, baking and curing;
step four: forming a first metal layer on the surface of the black composite insulating layer;
step five: forming a second metal layer on the surface of the first metal layer;
step six: and coating a conductive adhesive layer on the surface of the second metal layer, and then attaching the release layer.
The resin material of the first insulating layer 201 and the second insulating layer 202 is at least one of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin, and polyimide resin.
The resin material of the conductive adhesive layer 400 is at least one of epoxy resin, acrylic resin, urethane resin, silicone rubber resin, poly-p-xylylene resin, bismaleimide resin, and polyimide resin.
The metal layer 300 is formed by vacuum sputtering, vacuum evaporation, Chemical Vapor Deposition (CVD), Metal Organic Chemical Vapor Deposition (MOCVD), electron beam evaporation, or electrolytic plating.
The conductive adhesive layer 400 contains at least one of inorganic substance powder silicon dioxide, titanium dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate.
The water absorption of the conductive adhesive layer 400 is between 0.01% and 0.9%.
The particle size of the conductive particles in the conductive adhesive layer is 3-12 μm, and the weight percentage of the conductive particles in the total solid content of the conductive adhesive layer is 5-50%.
The metal layers of examples 1, 2 and 5 are single-layer structures, and are respectively a copper foil layer, a silver foil layer and an aluminum foil layer, and are manufactured by the first method; the metal layers of examples 3, 4, 6, and 7 are of a double-layer structure, and are a silver foil layer and a copper foil layer, an aluminum foil layer and a nickel foil layer, and a copper foil layer and an aluminum foil layer, respectively, in this order, and are manufactured by the second method.
In the case of the matting powder added to the first insulating layer, in example 1, silica and titania were used in a weight ratio of 1:1, and the particle diameter was 4 to 8 μm (D90); example 2 is alumina, aluminum hydroxide and calcium carbonate, wherein the weight ratio of alumina to aluminum hydroxide is 1: 2-1:1, wherein the weight ratio of the aluminum hydroxide to the calcium carbonate is 1: 3-1: 2; example 3 is aluminum hydroxide, particle size 2-4 μm (D90); example 4 is calcium carbonate, particle size 6-10 μm (D90); example 5 is a halogen compound and a boron-based compound in a weight ratio of 2:3, with a particle size of 4-10 μm (D90); example 6 is silica, particle size 10-12 μm (D90), and weight ratio of silica to resin 0.2% -10%; example 7 is a phosphorus-based compound containing 24% phosphorus, and the particle size of the phosphorus-based compound was controlled to 2 to 10 μm (D90), and the weight ratio of the phosphorus-based compound to the resin was 5 to 10%.
To facilitate understanding of the advantages of the present invention, table 1 shows the results of comparing the performance indexes of the examples and comparative examples of the present invention in the resistance value, peel strength, and shielding property tests.
Table 1:
the embodiment shows that the shielding rate can reach 60-70dB when the metal layer is 0.2-0.5 μm, and even 80-100dB when the thickness of the metal layer is increased to 3-6 μm, and the on-resistance can still maintain the shielding performance extremely low under the harsh environment, with excellent reliability.
In a severe environment, particularly in a high-temperature and high-humidity environment under the condition of double 85, the high-temperature and high-humidity shielding film has great superiority in reliability compared with the shielding film (comparative example) with higher water absorption rate in the market, and can maintain a low resistance value so that the shielding function does not fail.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structures made by using the contents of the specification and the drawings of the present invention or directly or indirectly applied to other related technical fields are included in the scope of the present invention.
Claims (7)
1. A thin electromagnetic interference shielding film with high shielding performance of a composite type is characterized in that:
the conductive adhesive layer is arranged between the black composite insulating layer and the conductive adhesive layer;
the black composite insulating layer comprises a first insulating layer and a second insulating layer, and the second insulating layer is positioned between the first insulating layer and the metal layer;
the hardness of the black composite insulating layer is HB-5H;
the glossiness of the first insulating layer is 0-60%;
one surface of the second insulating layer, which is in contact with the metal layer, is a rough surface, and the Rz value is 0.01-0.5 μm and is not limited to 0.5 μm;
the total thickness of the electromagnetic interference shielding film is 6.01-57 μm, wherein the thickness of the first insulating layer is 2-12 μm; the thickness of the second insulating layer is 2-12 μm; the thickness of the metal layer is 0.01-8 μm; the thickness of the conductive adhesive layer is 2-25 μm;
the first insulating layer is an insulating layer containing extinction powder, and the particle size of the extinction powder is 2-12 mu m;
a matte release film layer is formed on the surface of the black composite insulating layer, one surface of the matte release film layer, which is in contact with the black composite insulating layer, is a rough surface, and the Rz value is 0.2-5 mu m;
one surface of the metal layer, which is in contact with the conductive adhesive layer, is an uneven surface with peaks and valleys;
the conductive adhesive layer contains at least one of inorganic substance powder silicon dioxide, titanium dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate;
the water absorption of the conductive adhesive layer is between 0.01 and 0.9 percent;
the particle size of the conductive particles in the conductive adhesive layer is 3-12 μm, and the weight percentage of the conductive particles in the total solid content of the conductive adhesive layer is 5-50%.
2. The composite high-shielding thin electromagnetic interference shielding film according to claim 1, wherein: the extinction powder in the first insulating layer is at least one of inorganic substance powder silicon dioxide, titanium dioxide, aluminum oxide, aluminum hydroxide and calcium carbonate, or a compound with flame retardance containing at least one of halogen, phosphorus, nitrogen and boron.
3. The composite high-shielding thin electromagnetic interference shielding film according to claim 1, wherein: the metal layer is one of the following two structures:
firstly, the metal layer is of a single-layer structure;
and secondly, the metal layer is of a double-layer structure consisting of two metal layers, and the metal layers are sequentially formed on the surface layer by layer.
4. The composite high-shielding thin electromagnetic interference shielding film according to claim 1, wherein: the conductive adhesive layer is one of the following two structures:
the conductive adhesive layer is a single-layer conductive adhesive layer with conductive particles;
the conductive adhesive layer is of a double-layer structure and is formed by laminating an adhesive layer without conductive particles and a conductive adhesive layer with conductive particles, wherein the adhesive layer without conductive particles is adhered between the metal layer and the conductive adhesive layer with conductive particles.
5. The composite high-shielding thin electromagnetic interference shielding film according to claim 4, wherein: the conductive particles of the conductive adhesive layer are at least one of copper, silver, nickel, tin, gold, palladium, aluminum, chromium, titanium, zinc and carbon, or at least one of nickel gold, gold and silver, copper nickel, copper silver, nickel silver and copper nickel gold.
6. The composite high-shielding thin electromagnetic interference shielding film according to claim 1, wherein: the surface of the conductive adhesive layer is provided with a release layer, and the release layer is one of the following two structures:
the release layer is a release film, the thickness of the release film is 25-100 mu m, and the release film is at least one of a PET fluoroplastic release film, a PET silicone-containing release film, a PET matte release film and a PE release film;
secondly, the release layer is release paper, the thickness of the release paper is 25-130 mu m, and the release paper is PE laminating paper;
and thirdly, the release layer is a low-adhesion carrier film, and the thickness of the low-adhesion carrier film is 25-100 μm.
7. The method for preparing the composite high-shielding thin electromagnetic interference shielding film according to claim 1, wherein the method comprises the following steps: the preparation method is one of the following methods:
the method comprises the following steps: the method comprises the following steps:
the method comprises the following steps: coating a first insulating layer on the surface of the release film;
step two: coating a second insulating layer on the surface of the first insulating layer to form a black composite insulating layer;
step three: rolling, baking and curing;
step four: forming a metal layer on the surface of the black composite insulating layer;
step five: coating a conductive adhesive layer on the surface of the metal layer, and then attaching a release layer;
the second method comprises the following steps: the method comprises the following steps:
the method comprises the following steps: coating a first insulating layer on the surface of the release film;
step two: coating a second insulating layer on the surface of the first insulating layer to form a black composite insulating layer;
step three: rolling, baking and curing;
step four: forming a first metal layer on the surface of the black composite insulating layer;
step five: forming a second metal layer on the surface of the first metal layer;
step six: and coating a conductive adhesive layer on the surface of the second metal layer, and then attaching the release layer.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710115287.6A CN108541204B (en) | 2017-03-01 | 2017-03-01 | Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof |
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| CN201710115287.6A CN108541204B (en) | 2017-03-01 | 2017-03-01 | Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof |
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| CN108541204A CN108541204A (en) | 2018-09-14 |
| CN108541204B true CN108541204B (en) | 2020-11-17 |
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| CN109831904A (en) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film and preparation method thereof |
| CN110012655A (en) * | 2019-04-28 | 2019-07-12 | 昆山雅森电子材料科技有限公司 | Slimming cover film with EMI function |
| CN110351998A (en) * | 2019-09-06 | 2019-10-18 | 深圳科诺桥科技股份有限公司 | The production method and electromagnetic shielding film of millimeter wave electromagnetic shielding film |
| TW202204552A (en) * | 2020-07-23 | 2022-02-01 | 位元奈米科技股份有限公司 | Emi shielding film and method of manufacturing the same |
| CN115515406A (en) * | 2021-06-07 | 2022-12-23 | 昆山雅森电子材料科技有限公司 | Matte electromagnetic interference shielding film with bearing film and preparation method thereof |
| TWI847259B (en) * | 2022-09-07 | 2024-07-01 | 亞洲電材股份有限公司 | Matte type electromagnetic interference shielding film comprising bio-based component and preparation method thereof |
| CN115696893B (en) * | 2022-10-18 | 2023-12-08 | 昆山雅森电子材料科技有限公司 | High-shielding PI type electromagnetic interference shielding film and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886357A (en) * | 2010-07-02 | 2010-11-17 | 中国乐凯胶片集团公司 | Matt release paper for synthetic leather |
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
| CN205430884U (en) * | 2016-03-05 | 2016-08-03 | 保定乐凯新材料股份有限公司 | Electromagnetic shielding film |
| CN205864954U (en) * | 2016-07-26 | 2017-01-04 | 昆山雅森电子材料科技有限公司 | The emi shielding film of high-transmission height shield effectiveness |
-
2017
- 2017-03-01 CN CN201710115287.6A patent/CN108541204B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886357A (en) * | 2010-07-02 | 2010-11-17 | 中国乐凯胶片集团公司 | Matt release paper for synthetic leather |
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN205430884U (en) * | 2016-03-05 | 2016-08-03 | 保定乐凯新材料股份有限公司 | Electromagnetic shielding film |
| CN205864954U (en) * | 2016-07-26 | 2017-01-04 | 昆山雅森电子材料科技有限公司 | The emi shielding film of high-transmission height shield effectiveness |
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