CN108541204A - High shielding slimming emi shielding film of combined type and preparation method thereof - Google Patents
High shielding slimming emi shielding film of combined type and preparation method thereof Download PDFInfo
- Publication number
- CN108541204A CN108541204A CN201710115287.6A CN201710115287A CN108541204A CN 108541204 A CN108541204 A CN 108541204A CN 201710115287 A CN201710115287 A CN 201710115287A CN 108541204 A CN108541204 A CN 108541204A
- Authority
- CN
- China
- Prior art keywords
- layer
- insulating layer
- release
- film
- metal layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a kind of high shieldings of combined type to be thinned emi shielding film, including black composite insulation layer, metal layer and conductive adhesive layer, and metal layer is between black composite insulation layer and conductive adhesive layer；Black composite insulation layer includes the first insulating layer and second insulating layer, and second insulating layer, between the first insulating layer and the metal layer, the first insulating layer glossiness is 0 60% (60 °), and black composite insulation layer hardness is HB 5H；The one side that second insulating layer is contacted with metal layer is rough surface and Rz is 0.01 0.5 (being free of 0.5) μm.The present invention has the characteristics such as electrical characteristic is good, chemical resistance is good, shielding properties is high, Bonding strength is good, transmission loss is few, transmission quality is high, water absorption rate is low, reliability is good, there is higher reliability and operability and the gloss value that can adjust surface compared to general electromagnetic shielding film, to replace general barrier film material.
Description
Technical field
It is the present invention relates to FPC (flexible circuit board) slimming screened film and its preparing technical field, more particularly to a kind of
The high shielding of combined type is thinned emi shielding film.
Background technology
Under the market demand that electronics and communication product tend to multi-functional complication, the construction of circuit board need it is lighter,
It is thin, short, small；And functionally, then need powerful and high-speed signal to transmit.Therefore, line density certainly will improve, support plate circuit it
Between distance from increasingly closer and working frequency towards high broadband, if along with configuration, wiring do not conform to
Reason, electromagnetic interference (Electromagnetic Interference, EMI) situation are increasingly severe, it is therefore necessary to effectively management
Electromagnetic compatibility (Electromagnetic Compatibility, EMC), to maintain the normal signal of electronic product to transmit
And improve reliability.Characteristic that is frivolous and being arbitrarily bent so that soft board is moving towards demand portable information and communication electronics
Occupy very important status in the development of industry.
Since electronic communication product more attains small trend, drive soft board that must carry more strong big function, on the other hand by
Microminiature is moved towards in portable electronic product, the high demand of high density soft board technology is also and then driven, functionally then requires strong
Under the case where big and high frequency, high density, graph thinning, had been introduced currently on the market for film-type flexible printed wiring board
(FPC) screened film is widely adopted in the small-sized electronic products such as mobile phone, digital camera, digital camera.
Emi shielding film water absorption rate on the market is up to 1.0-1.5%, and can cause to have in the case of high temperature and humidity can
Risk on degree；Screened film outer layer is difficult to remove release film as another, causes operability bad；In addition current screened film is general
It may require that the product appearance of low gloss (low-luster) value of delustring form, and its gloss (glossiness) value is generally higher.
In order to solve above-mentioned the technical issues of encountering and demand, the present invention provides a kind of following solutions.
Invention content
The invention mainly solves the technical problem of providing a kind of high shieldings of combined type to be thinned emi shielding film,
The present invention is with electrical characteristic is good, chemical resistance is good, shielding properties is high, Bonding strength is good, transmission loss is few, transmission quality is high, inhales
The characteristics such as water rate is low, reliability is good have higher reliability and operability compared to general electromagnetic shielding film and can adjust
The gloss value on whole surface, to replace general barrier film material.
In order to solve the above technical problems, one aspect of the present invention is：A kind of high shielding of combined type is provided
It is thinned emi shielding film, including black composite insulation layer, metal layer and conductive adhesive layer, the metal layer is located at described black
Between color composite insulation layer and the conductive adhesive layer；
The black composite insulation layer includes the first insulating layer and second insulating layer, and the second insulating layer is positioned at described
Between first insulating layer and the metal layer；
The hardness of the black composite insulation layer is HB-5H；
The glossiness of first insulating layer is 0-60% (60 °)；
The one side that the second insulating layer is contacted with the metal layer is rough surface and Rz values are 0.01-0.5 (being free of 0.5)
μm；
The overall thickness of the emi shielding film is 6.01-57 μm, wherein the thickness of first insulating layer is 2-12
μm；The thickness of the second insulating layer is 2-12 μm；The thickness of the metal layer is 0.01-8 μm；The thickness of the conductive adhesive layer
It is 2-25 μm.
Preferably, the screened film is when being more thinned, and the thickness of the metal layer is 0.01-2 μm.
Preferably, when the screened film shielding is preferable, the thickness of the metal layer is 2-6 μm.
Preferably, the glossiness of first insulating layer is 0-30% (60 °), and the hardness of the black composite insulation layer is
2H-5H, the one side Rz that the second insulating layer is contacted with the metal layer are 0.08-0.5 (being free of 0.5) μm.
It further says, first insulating layer is the insulating layer containing matte powder, and the grain size of the matte powder is 2-
12 μm, the weight ratio of the matte powder and resin is 0.2-15%.
It further says, the matte powder in first insulating layer is mineral powder silica, titanium dioxide
At least one of titanium, aluminium oxide, aluminium hydroxide and calcium carbonate, or contain at least one of halogen, phosphorus system, nitrogen and boron system
Has the compound of anti-flammability.
Further say, from cost consideration, when more demanding hardness, the matte powder in first insulating layer
It is preferred that at least one of titanium dioxide and silica, when considering higher flame resistance, preferably aluminium hydroxide, aluminium oxide,
At least one of the fire retardant of calcium carbonate and phosphorous system.
It further says, the metal layer is one kind in following two kinds of structures：
One, the metal layer is single layer structure；
Two, the metal layer is the double-layer structure being made of two metal layers, the metal layer on successively surface successively
It is formed.
It further says, the one side that the metal layer is contacted with conductive adhesive layer is the uneven whole face with peak valley.
It further says, the material of the metal layer is copper, silver, nickel, tin, gold, palladium, aluminium, chromium, titanium or zinc, or packet
Containing metal alloy more than any one in above-mentioned metal.
It further says, the conductive adhesive layer is one kind in both following structures：
One, the conductive adhesive layer is the single layer of conductive glue-line with conducting particles；
Two, the conductive adhesive layer is double-layer structure, and the conductive adhesive layer is by one layer of adhesion coating without conducting particles
It overlaps and constitutes with one layer of conductive adhesion coating with conducting particles, wherein be adhered to the metal without the adhesion coating of conducting particles
Between layer and the conductive adhesion coating with conducting particles.
It further says, the conducting particles of the conductive adhesive layer is copper, silver, nickel, tin, gold, palladium, aluminium, chromium, titanium, zinc and carbon
At least one of or at least one of nickel gold, gold and silver, cupro-nickel, copper silver, nickeline and cupro-nickel gold.
Preferably, the conducting particles of the conductive adhesive layer is at least one of gold, silver, gold and silver, nickel gold and copper silver.
It further says, the surface of the black composite insulation layer is formed with delustring release film layer, and the delustring is release
The one side that film layer is contacted with the black composite insulation layer is rough surface and Rz values are 0.2-5 μm.
It further says, it is one in following two kinds of structures that, which there are release layer, the release layer in the surface of the conductive adhesive layer,
Kind：
One, the release layer be release film, 25-100 μm of the thickness of the release film, the release film be PET fluorine mould from
At least one of type film, PET silicate-containing oils release film, PET matts release film and PE release films；
Two, the release layer is release paper, and the thickness of the release paper is 25-130 μm, and the release paper is PE laminations
Paper；
Three, the release layer is low adhesion carrier film, and the thickness of the low adhesion carrier film is 25-100 μm.
It further says, a kind of preparation method of the high shielding slimming emi shielding film of the combined type, institute
It is one kind in following method to state preparation method:
Method one：It carries out in accordance with the following steps：
Step 1：It is coated with the first insulating layer in release film surface；
Step 2：It is coated with second insulating layer in the first surface of insulating layer, forms black composite insulation layer；
Step 3：Winding, baking-curing；
Step 4：In black composite insulation layer forming metal layer on surface；
Step 5：In layer on surface of metal applying conductive glue-line, it is then bonded release layer.
Method two：It carries out in accordance with the following steps：
Step 1：It is coated with the first insulating layer in release film surface；
Step 2：It is coated with second insulating layer in the first surface of insulating layer, forms black composite insulation layer；
Step 3：Winding, baking-curing；
Step 4：The first metal layer is formed in black compound inslation layer surface；
Step 5：Second metal layer is formed on the first metal layer surface；
Step 6：In second metal layer surface applying conductive glue-line, it is then bonded release layer.
It further says, the resin material of first insulating layer and the second insulating layer is all epoxy resin, propylene
Acid system resin, silicon rubber system resin, gathers to ring diformazan benzene series resin, bismaleimide amine system resin amido formate system resin
At least one of with polyimide resin.
It further says, the resin material of the conductive adhesive layer is epoxy resin, acrylic resin, amido formate system
Resin, silicon rubber system resin, it is poly- in ring diformazan benzene series resin, bismaleimide amine system resin and polyimide resin at least
It is a kind of.
Further say, the generation type of the metal layer be vacuum splashing and plating, vacuum evaporation, chemical vapor deposition (CVD),
Metalorganic chemical vapor deposition (MOCVD), electron beam evaporation plating or electrolysis plating.
It further says, the conductive adhesive layer contains mineral powder silica, titanium dioxide, aluminium oxide, hydroxide
At least one of aluminium and calcium carbonate.
It further says, the water absorption rate of the conductive adhesive layer is between 0.01%-0.9%.
It further says, the grain size of conducting particles is 3-12 μm in the conductive adhesive layer, and conducting particles accounts for conductive adhesive layer
Total solid content weight percent be 5-50%.
The beneficial effects of the invention are as follows：Therefore the present invention has at least the following advantages：
One, its surface gloss of black composite insulation layer of the invention is 0-60% (60 °), can preferably reach 30% with
Under, and hardness is HB-5H, can preferably reach 2H-5H, therefore, the present invention not only has black cloudy surface characteristic, but also it is high hard
Degree can prevent surface scratches, and be not easy by the chemical reagent corrosion in the processing procedure of downstream, and weatherability is good；
Two, the lower surface of second insulating layer of the invention is rough surface and Rz (roughness) value is that 0.01-0.5 (is free of
0.5) μm, this structure provides good adhesion and filling area for metal layer；
Three, the compound composition composite insulation layer of the first insulating layer and second insulating layer of the invention, makes screened film finished product have
Good hardness, mechanical strength, resistance to flexing performance, the in addition design of this double layer of insulation can improve processing procedure crawling and make
At surface p in hole (pin hole) problem；
Four, the lower surface of metal layer of the invention can be the uneven whole face for having peak valley, not only can increase it and lead
The adhesion of electric glue-line, and when conductive adhesive layer is relatively thin, the lower surface of metal layer are grounded after can directly piercing through conductive adhesive layer, increase
Strong shielding properties；And and the design can reduce the thickness of conductive adhesive layer, can be further ensured that lower water absorption rate, improve shielding
The stability of film；
Five, the first insulating layer of the invention contains matte powder, and coating film forming is adjusted using control diameter of particle size
Surface dulling degree, for size controlling at 2-12 μm, matte powder grain size is smaller, and surface gloss (glossiness) value is bigger, i.e.,
Configuration of surface is brighter, by adjusting grain size, the type and content etc. of matte powder, can obtain required (such as glossiness, resistance to combustion
Property, hardness or cost etc.) product, and the matte powder being added can further improve the hardness of black composite insulation layer, make
This product has more mechanical performance, electric property and operating performance etc.；
Six, it is 0.2-5 μm that black compound inslation layer surface of the invention, which uses delustring release film layer, surface Rz, is penetrated
This form keeps the black composite insulation layer of screened film and release film layer more easily separated, operable to substantially increase downstream endpoint
Property, at the same the delustring release film layer make screened film it is fast it is molded after, after tearing release film layer off, contribute to black composite insulation layer table
Face form is delustring form；
Seven, metal layer of the invention uses single layer or double-layer structure, can effectively promote oxidation resistance and conductibility, can be with
It improves reliability and shielding properties can reach the screening rate of 60-70dB when metal layer thickness reaches 0.1-1 μm, when thickness reaches
To 1 μm or more, the screening rate of 70dB or more can be reached, the screening rate of 80dB can be reached when thickness is 2 μm；
Eight, conductive adhesive layer of the invention can be without the adhesion coating of conducting particles and one layer by one layer with conducting particles
The double-layer structure that conductive adhesion coating overlapping is constituted, adhesion coating can increase between metal layer and conductive adhesion coating with conducting particles
Binding force；More preferably, after in downstream, processing procedure is pressed on FPC, conducting particles because resin material is by hot pressing pierce through it is thinning
Adhesion coating is directly connected with metal layer so that metal layer is in direct contact conducting with the ground connection cabling on printed circuit board, and then soft
Ground connection cabling on plate forms turning circuit, via a period of time so that conductive adhesive layer reaches fully crosslinked solidification to remain good
Good electrical and mechanical properties so that soft board impedance ground value lowers, and achievees the purpose that reduce Electromagnetic Interference；
Nine, it in conductive adhesive layer of the invention, can be obtained required by controlling grain size, the type and content of conducting particles
Product, for example, cost is lower, conduction more preferably, process operation more preferably etc.；
Ten, due to containing mineral powder silica, titanium dioxide, aluminium oxide, hydrogen-oxygen in the conductive adhesive layer of the present invention
Change at least one of aluminium and calcium carbonate, so there is extremely low water absorption rate, it can be down to 0.01-0.9%, in high temperature and humidity feelings
There is higher reliability under condition.
Above description of the invention is only the general introduction of technical solution of the present invention, in order to better understand the skill of the present invention
Art means, and being implemented in accordance with the contents of the specification with presently preferred embodiments of the present invention and coordinate attached drawing specifically below
It is bright as after.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of the present invention (metal layer is single layer structure)；
Fig. 2 is another structural schematic diagram of the present invention (metal layer is double-layer structure)；
Each section label is as follows in attached drawing：
100- delustrings release film layer, 200- black composite insulation layer, the first insulating layers of 201-, 202- second insulating layers,
300- metal layers, 301- the first metal layers, 302- second metal layers, 400- conductive adhesive layers, the first conductive adhesive layers of 401-, 402-
Two conductive adhesive layers and 500- release layers.
Specific implementation mode
Illustrate that the specific implementation mode of the present invention, those skilled in the art can be by these below by way of particular specific embodiment
The revealed content of specification understands advantages of the present invention and effect easily.The present invention can also other different modes give
Implement, that is, under the scope of without departing substantially from disclosed, different modification and change can be given.
Embodiment：A kind of high shielding slimming emi shielding film of combined type, as depicted in figs. 1 and 2, including black
Composite insulation layer 200, metal layer 300 and conductive adhesive layer 400, the metal layer position 300 is in 200 He of black composite insulation layer
Between the conductive adhesive layer 400；
The black composite insulation layer 200 includes the first insulating layer 201 and second insulating layer 202, and described second insulate
Layer 202 is between first insulating layer 201 and the metal layer 300；
The hardness of the black composite insulation layer 200 is HB-5H；
The glossiness of first insulating layer 201 is 0-60% (60 °)；
The one side that the second insulating layer 202 is contacted with the metal layer 300 be rough surface and Rz values be 0.01-0.5 (no
0.5) μm containing；
The overall thickness of the emi shielding film is 6.01-57 μm, wherein the thickness of first insulating layer 201 is
2-12μm；The thickness of the second insulating layer 202 is 2-12 μm；The thickness of the metal layer 300 is 0.01-8 μm；The conduction
The thickness of glue-line 400 is 2-25 μm.
The one side that the metal layer 300 is contacted with the conductive adhesive layer 400 is the uneven whole face with peak valley.The injustice
Leveling face is formed using process of surface treatment physically or chemically after metal layer is formed.
In the present embodiment, it is preferred that the screened film is when being more thinned, and the thickness of the metal layer is 0.01-2 μm；
When the screened film shielding is preferable, the thickness of the metal layer is 2-6 μm.
In the present embodiment, it is preferred that the glossiness of first insulating layer is 0-30% (60 °), and the black is compound absolutely
The hardness of edge layer is 2H-5H, and the one side Rz values that the second insulating layer is contacted with the metal layer are 0.08-0.5 (being free of 0.5)
μm。
First insulating layer 201 is the insulating layer containing matte powder, and the grain size of the matte powder is 2-12 μm, described
The weight ratio of matte powder and resin is 0.2-15%.
The matte powder in first insulating layer 201 is mineral powder silica, titanium dioxide, oxidation
At least one of aluminium, aluminium hydroxide and calcium carbonate, or the tool containing at least one of halogen, phosphorus system, nitrogen and boron system are fire-retardant
The compound of property.
From cost consideration, when more demanding hardness, the preferred dioxy of the matte powder in first insulating layer 201
Change at least one of titanium and silica, when considering higher flame resistance, preferably aluminium hydroxide, aluminium oxide, calcium carbonate and
At least one of the fire retardant of phosphorous system.
The metal layer 300 is one kind in following two kinds of structures：
One, the metal layer is single layer structure；
Two, the metal layer is the double-layer structure being made of two metal layers, and respectively the first metal layer 301 and second
Metal layer 302, the metal layer sequentially form on successively surface.
The one side that the metal layer 300 is contacted with conductive adhesive layer 400 is the uneven whole face with peak valley.
The material of the metal layer 300 is copper, silver, nickel, tin, gold, palladium, aluminium, chromium, titanium or zinc, or includes above-mentioned gold
Metal alloy more than any one in category.
The conductive adhesive layer 400 is one kind in both following structures：
One, the conductive adhesive layer 400 is the single layer of conductive glue-line with conducting particles；
Two, the conductive adhesive layer 400 is double-layer structure, and the conductive adhesive layer is by one layer of adhesion without conducting particles
Layer (i.e. the first conductive adhesive layer 401) and one layer of conductive adhesion coating overlapping with conducting particles constitute (i.e. the first conductive adhesive layer 402),
Wherein, it is adhered between the metal layer and the conductive adhesion coating with conducting particles without the adhesion coating of conducting particles.
But as the deformation and replacement of the present invention, the conductive adhesive layer can be the single layer adhesion coating without conducting particles.
The conducting particles of the conductive adhesive layer is at least one in copper, silver, nickel, tin, gold, palladium, aluminium, chromium, titanium, zinc and carbon
At least one of kind or nickel gold, gold and silver, cupro-nickel, copper silver, nickeline and cupro-nickel gold.
Preferably, the conducting particles of the conductive adhesive layer is at least one of gold, silver, gold and silver, nickel gold and copper silver.
The surface of the black composite insulation layer 200 is formed with delustring release film layer 100, and the delustring release film layer
100 one sides contacted with the black composite insulation layer 200 are rough surface and Rz values are 0.2-5 μm.
It is one kind in following two kinds of structures that, which there are release layer 500, the release layer in the surface of the conductive adhesive layer 400,：
One, the release layer is release film, and 25-100 μm of the thickness of the release film, the release film is PET (poly- to benzene
Naphthalate) fluorine modeling release film, PET (polyethylene terephthalate) silicate-containing oils release film, PET be (poly- to benzene two
Formic acid glycol ester) at least one of matt release film and PE (polyethylene) release film；
Two, the release layer is release paper, and the thickness of the release paper is 25-130 μm, and the release paper is PE laminations
Paper；
Three, the release layer is low adhesion carrier film, and the thickness of the low adhesion carrier film is 25-100 μm.
A kind of preparation method of the high shielding slimming emi shielding film of the combined type, the preparation method is that
One kind in following method:
Method one：It carries out in accordance with the following steps：
Step 1：It is coated with the first insulating layer in release film surface；
Step 2：It is coated with second insulating layer in the first surface of insulating layer, forms black composite insulation layer；
Step 3：Winding, baking-curing；
Step 4：In black composite insulation layer forming metal layer on surface；
Step 5：In layer on surface of metal applying conductive glue-line, it is then bonded release layer.
Method two：It carries out in accordance with the following steps：
Step 1：It is coated with the first insulating layer in release film surface；
Step 2：It is coated with second insulating layer in the first surface of insulating layer, forms black composite insulation layer；
Step 3：Winding, baking-curing；
Step 4：The first metal layer is formed in black compound inslation layer surface；
Step 5：Second metal layer is formed on the first metal layer surface；
Step 6：In second metal layer surface applying conductive glue-line, it is then bonded release layer.
First insulating layer 201 and the resin material of the second insulating layer 202 are all epoxy resin, acrylic acid series tree
Fat, silicon rubber system resin, gathers to ring diformazan benzene series resin, bismaleimide amine system resin and polyamides amido formate system resin
At least one of imide resin.
The resin material of the conductive adhesive layer 400 is epoxy resin, acrylic resin, amido formate system resin, silicon
Rubber series resin gathers at least one of ring diformazan benzene series resin, bismaleimide amine system resin and polyimide resin.
The generation type of the metal layer 300 is vacuum splashing and plating, vacuum evaporation, chemical vapor deposition (CVD), organic metal
Chemical vapor deposition (MOCVD), electron beam evaporation plating or electrolysis plating.
The conductive adhesive layer 400 contains mineral powder silica, titanium dioxide, aluminium oxide, aluminium hydroxide and carbonic acid
At least one of calcium.
The water absorption rate of the conductive adhesive layer 400 is between 0.01%-0.9%.
The grain size of conducting particles is 3-12 μm in the conductive adhesive layer, and conducting particles accounts for the total solid content of conductive adhesive layer
Weight percent is 5-50%.
The metal layer of embodiment 1,2 and 5 is single layer structure, and respectively copper foil layer, silver foil layer and aluminium foil layer, using method
One makes；The metal layer of embodiment 3,4,6 and 7 is double-layer structure, and respectively is silver foil layer and copper foil layer, silver foil layer and copper
Layers of foil, aluminium foil layer and nickel foil layer and copper foil layer and aluminium foil layer are made of method two.
The matte powder situation added in first insulating layer, embodiment 1 are silica and titanium dioxide, weight ratio 1:
1, grain size is 4-8 μm (D90)；Embodiment 2 is aluminium oxide, aluminium hydroxide and calcium carbonate, the wherein weight of aluminium oxide and aluminium hydroxide
Amount is than being 1：2-1:1, the weight ratio of aluminium hydroxide and calcium carbonate is 1：3-1:2；Embodiment 3 is aluminium hydroxide, 2-4 μm of grain size
(D90)；Embodiment 4 is calcium carbonate, 6-10 μm of grain size (D90)；Embodiment 5 is halogen compounds and borate compounds, weight ratio
It is 2:3,4-10 μm of grain size (D90)；Embodiment 6 is silica, and grain size is 10-12 μm (D90), and silica and resin
Weight ratio is 0.2%-10%；Embodiment 7 is the phosphorus series compound of phosphorus content 24%, and the size controlling of phosphorus series compound is in 2-
10 μm (D90), phosphorus series compound are 5-10% with weight resin ratio.
For convenience of the superiority of the understanding present invention, table 1 is the embodiment of the present invention and comparative example in resistance value, peel strength
With the comparison result in terms of performance indicators such as shielding test.
Table 1：
By embodiment it is found that when metal layer is at 0.2-0.5 μm, so that it may to reach the high screening rate of 60-70dB, and when gold
When category layer thickness increases to 3-6 μm, it might even be possible to reach 80-100dB, and it is connected resistance value and can still be kept under harsh environment
Extremely low its shielding properties of maintenance has splendid reliability.
Hot and humid environment under harsh environment, especially double 85 is higher compared with market water absorption rate in terms of reliability
Screened film (comparative example) has great superiority, is able to maintain that low resistance makes function of shielding not fail.
Example the above is only the implementation of the present invention is not intended to limit the scope of the invention, every to utilize this hair
Equivalent structure made by bright specification and accompanying drawing content is applied directly or indirectly in other relevant technical fields, similarly
It is included within the scope of the present invention.
Claims (10)
1. a kind of high shielding of combined type is thinned emi shielding film, it is characterised in that：
Including black composite insulation layer, metal layer and conductive adhesive layer, the metal layer is located at the black composite insulation layer and institute
It states between conductive adhesive layer；
The black composite insulation layer includes the first insulating layer and second insulating layer, and the second insulating layer is located at described first
Between insulating layer and the metal layer；
The hardness of the black composite insulation layer is HB-5H；
The glossiness of first insulating layer is 0-60% (60 °)；
The one side that the second insulating layer is contacted with the metal layer is rough surface and Rz values are 0.01-0.5 (being free of 0.5) μm；
The overall thickness of the emi shielding film is 6.01-57 μm, wherein the thickness of first insulating layer is 2-12 μm；
The thickness of the second insulating layer is 2-12 μm；The thickness of the metal layer is 0.01-8 μm；The thickness of the conductive adhesive layer is
2-25μm。
2. the high shielding of combined type according to claim 1 is thinned emi shielding film, it is characterised in that：Described
One insulating layer is the insulating layer containing matte powder, and the grain size of the matte powder is 2-12 μm.
3. the high shielding of combined type according to claim 2 is thinned emi shielding film, it is characterised in that：Described
The matte powder in one insulating layer is mineral powder silica, titanium dioxide, aluminium oxide, aluminium hydroxide and calcium carbonate
At least one of, or the tool anti-flammability containing at least one of halogen, phosphorus system, nitrogen and boron system compound.
4. the high shielding of combined type according to claim 1 is thinned emi shielding film, it is characterised in that：The gold
It is one kind in following two kinds of structures to belong to layer：
One, the metal layer is single layer structure；
Two, the metal layer is the double-layer structure being made of two metal layers, and the metal layer sequentially forms on successively surface.
5. the high shielding of combined type according to claim 1 is thinned emi shielding film, it is characterised in that：The gold
It is the uneven whole face with peak valley to belong to the one side that layer is contacted with the conductive adhesive layer.
6. the high shielding of combined type according to claim 1 is thinned emi shielding film, it is characterised in that：It is described to lead
Electric glue-line is one kind in both following structures：
One, the conductive adhesive layer is the single layer of conductive glue-line with conducting particles；
Two, the conductive adhesive layer is double-layer structure, and the conductive adhesive layer is by one layer without the adhesion coating of conducting particles and one
Layer with conducting particles conductive adhesion coating overlapping constitute, wherein without conducting particles adhesion coating be adhered to the metal layer and
Between the conductive adhesion coating with conducting particles.
7. the high shielding of combined type according to claim 6 is thinned emi shielding film, it is characterised in that：It is described to lead
The conducting particles of electric glue-line is at least one of copper, silver, nickel, tin, gold, palladium, aluminium, chromium, titanium, zinc and carbon or nickel gold, gold
At least one of silver, cupro-nickel, copper silver, nickeline and cupro-nickel gold.
8. the high shielding of combined type according to claim 1 is thinned emi shielding film, it is characterised in that：It is described black
The surface of color composite insulation layer is formed with delustring release film layer, and the delustring release film layer connects with the black composite insulation layer
Tactile one side is rough surface and Rz values are 0.2-5 μm.
9. the high shielding of combined type according to claim 1 is thinned emi shielding film, it is characterised in that：It is described to lead
It is one kind in following two kinds of structures that, which there are release layer, the release layer in the surface of electric glue-line,：
One, the release layer be release film, 25-100 μm of the thickness of the release film, the release film be PET fluorine mould release film,
At least one of PET silicate-containing oils release film, PET matts release film and PE release films；
Two, the release layer is release paper, and the thickness of the release paper is 25-130 μm, and the release paper is PE leaching membrane papers；
Three, the release layer is low adhesion carrier film, and the thickness of the low adhesion carrier film is 25-100 μm.
10. a kind of preparation method of the high shielding slimming emi shielding film of combined type according to claim 1,
It is characterized in that：The preparation method is that one kind in following method:
Method one：It carries out in accordance with the following steps：
Step 1：It is coated with the first insulating layer in release film surface；
Step 2：It is coated with second insulating layer in the first surface of insulating layer, forms black composite insulation layer；
Step 3：Winding, baking-curing；
Step 4：In black composite insulation layer forming metal layer on surface；
Step 5：In layer on surface of metal applying conductive glue-line, it is then bonded release layer.
Method two：It carries out in accordance with the following steps：
Step 1：It is coated with the first insulating layer in release film surface；
Step 2：It is coated with second insulating layer in the first surface of insulating layer, forms black composite insulation layer；
Step 3：Winding, baking-curing；
Step 4：The first metal layer is formed in black compound inslation layer surface；
Step 5：Second metal layer is formed on the first metal layer surface；
Step 6：In second metal layer surface applying conductive glue-line, it is then bonded release layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710115287.6A CN108541204B (en) | 2017-03-01 | 2017-03-01 | Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710115287.6A CN108541204B (en) | 2017-03-01 | 2017-03-01 | Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108541204A true CN108541204A (en) | 2018-09-14 |
| CN108541204B CN108541204B (en) | 2020-11-17 |
Family
ID=63488332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710115287.6A Active CN108541204B (en) | 2017-03-01 | 2017-03-01 | Composite high-shielding thin electromagnetic interference shielding film and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108541204B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109831904A (en) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film and preparation method thereof |
| CN110012655A (en) * | 2019-04-28 | 2019-07-12 | 昆山雅森电子材料科技有限公司 | Slimming cover film with EMI function |
| CN110351998A (en) * | 2019-09-06 | 2019-10-18 | 深圳科诺桥科技股份有限公司 | The production method and electromagnetic shielding film of millimeter wave electromagnetic shielding film |
| CN115696893A (en) * | 2022-10-18 | 2023-02-03 | 昆山雅森电子材料科技有限公司 | High-shielding PI type electromagnetic interference shielding film and preparation method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886357A (en) * | 2010-07-02 | 2010-11-17 | 中国乐凯胶片集团公司 | Matt release paper for synthetic leather |
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
| CN205430884U (en) * | 2016-03-05 | 2016-08-03 | 保定乐凯新材料股份有限公司 | Electromagnetic shielding film |
| CN205864954U (en) * | 2016-07-26 | 2017-01-04 | 昆山雅森电子材料科技有限公司 | The emi shielding film of high-transmission height shield effectiveness |
-
2017
- 2017-03-01 CN CN201710115287.6A patent/CN108541204B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101886357A (en) * | 2010-07-02 | 2010-11-17 | 中国乐凯胶片集团公司 | Matt release paper for synthetic leather |
| CN102711428A (en) * | 2012-06-21 | 2012-10-03 | 广州方邦电子有限公司 | Ultrathin shielding film with high shielding efficiency and production method thereof |
| CN103625036A (en) * | 2012-08-28 | 2014-03-12 | 昆山雅森电子材料科技有限公司 | Composite-structure copper foil substrate and making method thereof |
| CN203194086U (en) * | 2013-04-02 | 2013-09-11 | 昆山雅森电子材料科技有限公司 | Thin-type colorful electromagnetic interference shielding film |
| CN205430884U (en) * | 2016-03-05 | 2016-08-03 | 保定乐凯新材料股份有限公司 | Electromagnetic shielding film |
| CN205864954U (en) * | 2016-07-26 | 2017-01-04 | 昆山雅森电子材料科技有限公司 | The emi shielding film of high-transmission height shield effectiveness |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109831904A (en) * | 2019-03-07 | 2019-05-31 | 昆山雅森电子材料科技有限公司 | High shielding emi shielding film and preparation method thereof |
| CN110012655A (en) * | 2019-04-28 | 2019-07-12 | 昆山雅森电子材料科技有限公司 | Slimming cover film with EMI function |
| TWI754842B (en) * | 2019-04-28 | 2022-02-11 | 亞洲電材股份有限公司 | Cover film with emi shielding function and methods for preparing the same |
| CN110351998A (en) * | 2019-09-06 | 2019-10-18 | 深圳科诺桥科技股份有限公司 | The production method and electromagnetic shielding film of millimeter wave electromagnetic shielding film |
| CN115696893A (en) * | 2022-10-18 | 2023-02-03 | 昆山雅森电子材料科技有限公司 | High-shielding PI type electromagnetic interference shielding film and preparation method thereof |
| CN115696893B (en) * | 2022-10-18 | 2023-12-08 | 昆山雅森电子材料科技有限公司 | High-shielding PI type electromagnetic interference shielding film and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108541204B (en) | 2020-11-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206650912U (en) | High shielding EMI screened films | |
| CN104332217B (en) | Free ground film and preparation method thereof, shielded line plate and earthing method comprising free ground film | |
| CN108913057B (en) | Multilayer anisotropic conductive cloth adhesive and manufacturing method thereof | |
| CN108541204A (en) | High shielding slimming emi shielding film of combined type and preparation method thereof | |
| WO2019174065A1 (en) | Electromagnetic shielding film, circuit board and electromagnetic shielding film preparation method | |
| TWI608791B (en) | Electromagnetic wave shield material for fpc | |
| CN108323143B (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| JP6435540B2 (en) | Electromagnetic wave shielding film, flexible printed wiring board with electromagnetic wave shielding film, and manufacturing method thereof | |
| CN107791641A (en) | High shielding emi shielding film with double-level-metal layer and preparation method thereof | |
| TWI706864B (en) | Electromagnetic interference shielding film having conductive fiber and the methods for preparing the same | |
| CN112533353B (en) | High-frequency covering film with high electromagnetic shielding function and preparation method thereof | |
| CN103228437A (en) | Laminate comprising epoxy resin having superior formability, and method for producing same | |
| KR20190073037A (en) | Electromagnetic wave shield film, manufacturing method for printed circuit board and manufacturing method for electromagnetic wave shield film | |
| TWI444132B (en) | Electromagnetic wave shielding composited films and flexible printed circuit boards with the composite film | |
| CN108513521A (en) | Have the high shielding EMI screened films and preparation method thereof of black polyamide thin film | |
| CN211982440U (en) | Electromagnetic shielding film and circuit board | |
| CN210275019U (en) | High-shielding electromagnetic interference shielding film | |
| CN112437598B (en) | High-shielding electromagnetic interference shielding film of multi-aperture copper foil and preparation method thereof | |
| CN213694723U (en) | Electromagnetic shielding film and circuit board containing same | |
| CN211702875U (en) | Electromagnetic shielding film and circuit board | |
| CN116997978A (en) | Conductive adhesive layer | |
| CN112351665A (en) | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film | |
| CN212013450U (en) | Electromagnetic shielding film and circuit board | |
| CN206765475U (en) | A kind of thin-type flexible copper-clad plate | |
| CN211702874U (en) | Electromagnetic shielding film and circuit board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |