CN112533353B - High-frequency covering film with high electromagnetic shielding function and preparation method thereof - Google Patents
High-frequency covering film with high electromagnetic shielding function and preparation method thereof Download PDFInfo
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- CN112533353B CN112533353B CN202010088387.6A CN202010088387A CN112533353B CN 112533353 B CN112533353 B CN 112533353B CN 202010088387 A CN202010088387 A CN 202010088387A CN 112533353 B CN112533353 B CN 112533353B
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- 238000002360 preparation method Methods 0.000 title claims abstract description 9
- 239000010410 layer Substances 0.000 claims abstract description 206
- 239000012790 adhesive layer Substances 0.000 claims abstract description 63
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 57
- 239000011889 copper foil Substances 0.000 claims abstract description 41
- 229920005989 resin Polymers 0.000 claims abstract description 40
- 239000011347 resin Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000010521 absorption reaction Methods 0.000 claims abstract description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000010408 film Substances 0.000 claims description 68
- 239000011248 coating agent Substances 0.000 claims description 21
- 238000000576 coating method Methods 0.000 claims description 21
- 239000000843 powder Substances 0.000 claims description 21
- 239000013039 cover film Substances 0.000 claims description 20
- -1 polybutylene Polymers 0.000 claims description 18
- 229920001721 polyimide Polymers 0.000 claims description 17
- 229910052802 copper Inorganic materials 0.000 claims description 16
- 239000010949 copper Substances 0.000 claims description 16
- 239000004642 Polyimide Substances 0.000 claims description 12
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 12
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 12
- 239000004925 Acrylic resin Substances 0.000 claims description 9
- 229920000178 Acrylic resin Polymers 0.000 claims description 9
- 239000004698 Polyethylene Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 9
- 230000008033 biological extinction Effects 0.000 claims description 9
- 239000003822 epoxy resin Substances 0.000 claims description 9
- 238000010030 laminating Methods 0.000 claims description 9
- 229920000647 polyepoxide Polymers 0.000 claims description 9
- 238000004519 manufacturing process Methods 0.000 claims description 7
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 6
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 claims description 6
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 6
- 229920000052 poly(p-xylylene) Polymers 0.000 claims description 6
- 229920002530 polyetherether ketone Polymers 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 6
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 6
- 229920002379 silicone rubber Polymers 0.000 claims description 6
- 239000004945 silicone rubber Substances 0.000 claims description 6
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims description 5
- 229910052731 fluorine Inorganic materials 0.000 claims description 5
- 239000011737 fluorine Substances 0.000 claims description 5
- 239000009719 polyimide resin Substances 0.000 claims description 5
- 229920001187 thermosetting polymer Polymers 0.000 claims description 5
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 4
- 239000003063 flame retardant Substances 0.000 claims description 4
- 229910052698 phosphorus Inorganic materials 0.000 claims description 4
- 239000011574 phosphorus Substances 0.000 claims description 4
- GVNWZKBFMFUVNX-UHFFFAOYSA-N Adipamide Chemical compound NC(=O)CCCCC(N)=O GVNWZKBFMFUVNX-UHFFFAOYSA-N 0.000 claims description 3
- 229910052582 BN Inorganic materials 0.000 claims description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 claims description 3
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000004962 Polyamide-imide Substances 0.000 claims description 3
- 239000004695 Polyether sulfone Substances 0.000 claims description 3
- 239000004697 Polyetherimide Substances 0.000 claims description 3
- 239000004721 Polyphenylene oxide Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 239000004793 Polystyrene Substances 0.000 claims description 3
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 claims description 3
- 239000005083 Zinc sulfide Substances 0.000 claims description 3
- NXDJCCBHUGWQPG-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol;terephthalic acid Chemical compound OCC1CCC(CO)CC1.OC(=O)C1=CC=C(C(O)=O)C=C1 NXDJCCBHUGWQPG-UHFFFAOYSA-N 0.000 claims description 3
- 229910052796 boron Inorganic materials 0.000 claims description 3
- 229910000019 calcium carbonate Inorganic materials 0.000 claims description 3
- 239000006229 carbon black Substances 0.000 claims description 3
- 239000004927 clay Substances 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 3
- FPAFDBFIGPHWGO-UHFFFAOYSA-N dioxosilane;oxomagnesium;hydrate Chemical compound O.[Mg]=O.[Mg]=O.[Mg]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O FPAFDBFIGPHWGO-UHFFFAOYSA-N 0.000 claims description 3
- 229920002313 fluoropolymer Polymers 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229910052736 halogen Inorganic materials 0.000 claims description 3
- 150000002367 halogens Chemical class 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 3
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920002492 poly(sulfone) Polymers 0.000 claims description 3
- 229920002312 polyamide-imide Polymers 0.000 claims description 3
- 229920001748 polybutylene Polymers 0.000 claims description 3
- 229920000515 polycarbonate Polymers 0.000 claims description 3
- 239000004417 polycarbonate Substances 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920006393 polyether sulfone Polymers 0.000 claims description 3
- 229920001601 polyetherimide Polymers 0.000 claims description 3
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 3
- 229920000098 polyolefin Polymers 0.000 claims description 3
- 229920006380 polyphenylene oxide Polymers 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920002223 polystyrene Polymers 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 239000010453 quartz Substances 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 239000000377 silicon dioxide Substances 0.000 claims description 3
- 229920002545 silicone oil Polymers 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 229910052984 zinc sulfide Inorganic materials 0.000 claims description 3
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims description 3
- 229910001928 zirconium oxide Inorganic materials 0.000 claims description 3
- 238000013461 design Methods 0.000 abstract description 12
- 238000004880 explosion Methods 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 abstract description 6
- 230000008054 signal transmission Effects 0.000 abstract description 5
- 238000005553 drilling Methods 0.000 abstract description 4
- 238000012545 processing Methods 0.000 abstract description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005476 soldering Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 12
- 230000005540 biological transmission Effects 0.000 description 8
- 238000009413 insulation Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 238000012360 testing method Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000012787 coverlay film Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/29—Laminated material
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02A—TECHNOLOGIES FOR ADAPTATION TO CLIMATE CHANGE
- Y02A30/00—Adapting or protecting infrastructure or their operation
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a high-frequency covering film with a high electromagnetic shielding function and a preparation method thereof, wherein the high-frequency covering film sequentially comprises an insulating layer, an adhesive layer, a copper foil layer, a first high-frequency adhesive layer, a high-frequency insulating layer and a second high-frequency adhesive layer from top to bottom; the high-frequency insulating layer is an insulating layer with a dielectric coefficient lower than 4.0 and a dielectric loss lower than 0.015 (at 10 GHz); the first high-frequency bonding layer and the second high-frequency bonding layer are resin adhesive layers with dielectric coefficients lower than 4.0, dielectric losses of 0.002-0.010 (at 10 GHz) and water absorption of 0.001-0.5%. The shielding rate of the invention can reach more than 100dB at the highest; the dielectric property is good, the dielectric loss is 0.003-0.010 at 10GHz, and the dielectric coefficient is lower than 4.0; the mechanical property is good, and the processing procedures such as drilling, hole filling and the like can be dealt with; the thick dielectric layer can be designed to be large in thickness range, so that signal transmission loss under high frequency can be reduced; the soldering tin has good heat resistance, does not generate explosion plate through FPC and PCB assembly processes, and can be beneficial to escaping gas through drilling, hole filling and other process designs without generating explosion plate.
Description
Technical Field
The invention belongs to the technical field of cover films for printed circuit boards, and particularly relates to a high-frequency cover film with a high electromagnetic shielding function, which is suitable for a high-frequency high-speed transmission circuit board.
Background
Under the market demand that electronic and communication products tend to be multifunctional and complicated, the package of the circuit substrate needs to be lighter, thinner, shorter and smaller; functionally, powerful and high-speed signal transmission is required. Therefore, the circuit density tends to increase, the distance between the carrier circuits is more and more close, the operating frequency is more and more increased, and the electromagnetic interference (Electromagnetic Interference, EMI) is more and more serious if the circuit layout and wiring are not reasonable, so that the electromagnetic compatibility (Electromagnetic Compatibility, EMC) needs to be effectively managed, thereby maintaining the normal signal transmission of the electronic product and improving the reliability.
With the advent of the 5G age, the requirements of terminal products on the electromagnetic shielding film are higher and higher, and the electromagnetic shielding film has good application prospects in the high-end manufacturing fields such as mobile communication, medical display, military electronics and the like. The requirement of high frequency coverlay films also creates a need in electronic circuit board design, which is often applied in some multi-layer board designs to reduce the cost and difficulty of the manufacturing process, requiring thicker thickness and good dielectric properties, generally requiring dielectric losses of less than 0.010, even less than 0.005 at 10GHz, and electrical stability after moisture absorption.
Conventional EMI shielding films typically have a shielding rate on the order of 55dB, which is difficult to achieve 70dB. With the requirement of even higher shielding effect in 5G high frequency application, in the 5G application scenario that the shielding rate is required to be greater than 75dB, 80dB or even 100dB, the existing EMI shielding film on the market is more difficult to achieve, and in the EMI shielding film, the thickness of the metal layer and the thickness of the conductive adhesive are increased as much as possible to meet the performance requirement of high shielding rate, but the problem of explosion in the process is encountered.
The use of the EMI shielding film is quite complicated in a plurality of processes in the processing of an FPC board factory, and the EMI shielding film needs to be attached to the opening after the circuit is attached with the cover film for use, because the conventional cover film only has an insulating effect and does not have the effect of electromagnetic shielding after the EMI shielding film is conducted.
Therefore, a coverlay product with EMI shielding capability is highly desirable, while a high frequency coverlay with EMI shielding capability can be a great benefit to current multi-layer board designs. Particularly in a 5G application scene, the product with the shielding rate exceeding 80dB is urgently required to be developed.
For example, CN 205112572U, CN 207014920U and CN 105282959B disclose a high-frequency cover film, M555982 and CN 206067098U disclose a high shielding EMI shielding film using a metal layer.
Disclosure of Invention
The invention mainly solves the technical problem of providing a high-frequency covering film with a high electromagnetic shielding function and a preparation method thereof, wherein the high-frequency covering film is suitable for a 5G high-frequency high-speed transmission circuit board, and particularly can greatly reduce the problems of working procedures and manufacturing processes in a multilayer board. The shielding rate of the high-frequency covering film can reach more than 100dB at the highest; the dielectric property is good, the dielectric loss is 0.003-0.010 at 10GHz, and the dielectric coefficient is lower than 4.0; the mechanical property is good, and the processing procedures such as drilling, hole filling and the like can be dealt with; the thick dielectric layer can be designed to be large in thickness range, so that signal transmission loss under high frequency can be reduced; the soldering tin has good heat resistance, does not generate explosion plate through FPC and PCB assembly processes, and can be beneficial to escaping gas through drilling, hole filling and other process designs without generating explosion plate.
In order to solve the technical problems, the invention adopts a technical scheme that: the high-frequency covering film with the high electromagnetic shielding function comprises an insulating layer, an adhesive layer, a copper foil layer, a first high-frequency adhesive layer, a high-frequency insulating layer and a second high-frequency adhesive layer from top to bottom in sequence;
the high-frequency insulating layer is an insulating layer with a dielectric coefficient lower than 4.0 and a dielectric loss lower than 0.015 (at 10 GHz);
the first high-frequency bonding layer and the second high-frequency bonding layer are resin adhesive layers with dielectric coefficients lower than 4.0, dielectric losses of 0.002-0.010 (at 10 GHz) and water absorption of 0.001-0.5%;
the surface hardness of the insulating layer is more than 4H;
the total thickness of the high-frequency covering film with the high electromagnetic shielding function is 37um-350um; wherein the thickness of the insulating layer is 5um-25um; the thickness of the adhesive layer is 5um-20um; the thickness of the copper foil layer is 2um-105um; the thickness of the first high-frequency bonding layer and the thickness of the second high-frequency bonding layer are respectively 8um-50um; the thickness of the high-frequency insulating layer is 7.5um-100um.
Further, the first high-frequency adhesive layer and the second high-frequency adhesive layer each include at least one of a fluorine-based resin, an epoxy resin, an acrylic resin, a urethane-based resin, a silicone rubber-based resin, a parylene-based resin, a bismaleimide-based resin, and a thermosetting polyimide-based resin.
Further, the high-frequency insulating layer includes at least one of polyolefin, polyphenylene oxide, polyphenylene sulfide, polyimide, and polyether ether ketone.
Further, the copper foil layer is one of the following structures:
first kind: the copper foil layer is thin copper or carrier copper with the thickness of 2-18 mu m;
second kind: the copper foil layer is a thick copper layer with a thickness of 105 μm.
Further, the insulating layer is one of the following two structures:
first kind: the insulating layer is a non-ink layer and comprises at least one of epoxy resin, acrylic resin, polyester, polyimide, polyamide imide, polyether ether ketone, polysulfone, polybutylene adipamide, 1, 4-cyclohexanedimethanol terephthalate, polyurethane, polyphenylene sulfide, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyether imide, polypropylene, polystyrene and polycarbonate;
second kind: the insulating layer is an ink layer containing extinction powder, and the weight percentage of the extinction powder is 5-20%.
Further, the extinction powder is at least one inorganic powder selected from calcium sulfate, carbon black, silicon dioxide, titanium dioxide, zinc sulfide, zirconium oxide, calcium carbonate, silicon carbide, boron nitride, aluminum oxide, talcum powder, aluminum nitride, glass powder, quartz powder, silicon carbide and clay, or polyimide organic powder, or a flame-retardant compound containing at least one of halogen, phosphorus, nitrogen and boron.
Further, the adhesive layer includes at least one of an acryl resin, an epoxy resin, an acrylic resin, a vinyl acetate resin, a urethane resin, a silicone rubber resin, a parylene resin, a bismaleimide resin, and a polyimide resin.
Further, the insulation layer comprises a release layer, the release layer comprises an upper release layer and a lower release layer, the upper release layer is positioned on the upper surface of the insulation layer, the lower release layer is positioned on the lower surface of the second high-frequency bonding layer, and the thickness of the upper release layer and the thickness of the lower release layer are respectively 25-100 um.
Further, the release layer is one of the following two structures:
1. the release layer is a release film, the thickness of the release film is 25-100 mu m, and the release film is at least one of a PET fluoroplastic release film, a PET silicone oil-containing release film, a PET matte release film and a PE release film;
2. the release layer is release paper, the thickness of the release paper is 25-130 mu m, and the release paper is single-sided release PE coated paper or double-sided release PE coated paper.
The invention adopts the further technical scheme for solving the technical problems that:
the preparation method of the high-frequency covering film with the high electromagnetic shielding function comprises two preparation methods:
first (the insulating layer is an ink layer): the method comprises the following steps:
s1, coating an insulating layer on an upper release layer, and rolling for standby;
s2, coating a high-frequency insulating layer on the first high-frequency adhesive layer, and laminating a copper foil layer;
s3, coating the finished product obtained in the S2 with a second high-frequency adhesive layer, and attaching a release layer;
s4, coating the finished product obtained in the S3 on a copper foil layer, taking out the finished product obtained in the S1, pressing the finished product on the copper foil layer, and curing the finished product to obtain the high-frequency covering film with the high electromagnetic shielding function;
second (the insulating layer is a non-ink layer): the method comprises the following steps:
s1, coating a high-frequency insulating layer on a first high-frequency adhesive layer, and laminating a copper foil layer;
s2, coating a second high-frequency adhesive layer on the finished product obtained in the S1, and attaching a release layer;
s3, coating the finished product obtained in the S2 on a copper foil layer, laminating an insulating layer and curing to obtain the high-frequency covering film with the high electromagnetic shielding function.
The invention has the beneficial effects that:
the high-frequency covering film with the high electromagnetic shielding function has the function of insulating the covering film from the electronic circuit surface and also plays a role in shielding transmission signals; in the process, the cover film and the shielding film are combined into a whole, so that the process steps are reduced on the basis of not influencing the functions of the product, and the manufacturing cost is reduced; the surface of the product has higher hardness (more than or equal to 4H)), good mechanical property, extremely low dielectric loss, excellent heat resistance and good shielding effect (more than or equal to 80 dB); in the post-storage, since the present invention is to include EMI in the cover film, the storage manner can be stored in a conventional high-frequency cover film manner.
The method comprises the following steps:
1. the high-frequency covering film with the high electromagnetic shielding function has extremely high electromagnetic shielding effect, can reach more than 100dB at most, and can meet the requirement of 80dB of shielding rate of the high-frequency EMI shielding film;
2. the covering film provided by the invention has excellent mechanical property and electrical property, is suitable for being used as a thick dielectric layer for transmitting signals in a high-frequency high-speed transmission circuit board, and simultaneously meets the effect of protecting the circuit of the covering film;
3. the high-frequency covering film with the high electromagnetic shielding function, provided by the invention, combines the functions of the EMI shielding film, greatly reduces the processing steps and the manufacturing cost, and the combined use mode reduces the total stacking thickness of the circuit board under the condition of ensuring the low transmission loss of the circuit board, thereby being beneficial to high-density assembly and increasing the design space of the multilayer board;
4. in order to solve the high performance requirement of electromagnetic shielding, the thickness of the conductive adhesive and the thickness of the metal layer are increased to cause explosion, and the conduction of the invention is not finished by the conductivity of the colloid, so that the explosion problem of the common high-frequency EMI shielding film is avoided;
5. the high-frequency EMI shielding film is matched with a thick plate design of 5G design or has the problem of reliability and conductivity caused by high level difference, and the technical path of the invention has no level difference problem;
6. when the copper foil layer is thick copper with the thickness of more than 35 mu m, the metal holes conducted along with the design have good heat conduction and heat dissipation effects, and the heating problem under the 5G high transmission can be improved.
Drawings
FIG. 1 is a schematic diagram of a cover film of the present invention (the insulating layer is an ink layer);
FIG. 2 is a schematic diagram of a structure of a cover film of the present invention (the insulating layer is a non-ink layer);
fig. 3 is a schematic structural view of a prior art high frequency EMI shielding film;
fig. 4 is a schematic structural view of a high-frequency cover film of the prior art;
the parts in the drawings are marked as follows:
high-frequency cover film 100
An insulating layer 101, an adhesive layer 102, a copper foil layer 103, a first high-frequency adhesive layer 104, a high-frequency insulating layer 105, a second high-frequency adhesive layer 106, an upper release layer 107, and a lower release layer 108;
high-frequency EMI shielding film 200
An insulating layer 201, an adhesive layer 202, a copper foil layer 203, a conductive adhesive layer 204, an upper release layer 205 and a lower release layer 206;
high-frequency cover film 300
A high-frequency insulating layer 301, a high-frequency adhesive layer 302, and a release layer 303.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
Examples: the high-frequency covering film with high electromagnetic shielding function comprises an insulating layer 101, an adhesive layer 102, a copper foil layer 103, a first high-frequency adhesive layer 104, a high-frequency insulating layer 105 and a second high-frequency adhesive layer 106 from top to bottom as shown in fig. 1-2; the insulating layer and the adhesive layer are used as the protective layer at the outermost side of the invention, are in a matt black color to shield the circuit design and are attractive, and the upper release layer is beneficial to the winding, can provide stiffness and is beneficial to the manufacturing process when the FPC is processed and used, and the release layer, the insulating layer and the adhesive layer do not influence the signal transmission and the shielding effect.
The high-frequency insulating layer is an insulating layer with a dielectric coefficient lower than 4.0 and a dielectric loss lower than 0.015 (at 10 GHz); the dielectric loss of the high-frequency insulating layer is preferably 0.003-0.010 (@ 10 GHz).
The first high-frequency bonding layer and the second high-frequency bonding layer are resin adhesive layers with dielectric coefficients lower than 4.0, dielectric losses of 0.002-0.010 (at 10 GHz) and water absorption of 0.001-0.5%; the dielectric loss of the first high-frequency adhesive layer and the second high-frequency adhesive layer is preferably 0.002 to 0.005 (@ 10 GHz);
the surface hardness of the insulating layer is more than 4H;
the total thickness of the high-frequency covering film with the high electromagnetic shielding function is 37um-350um; wherein the thickness of the insulating layer is 5um-25um; the thickness of the adhesive layer is 5um-20um; the thickness of the copper foil layer is 2um-105um; the thickness of the first high-frequency bonding layer and the thickness of the second high-frequency bonding layer are respectively 8um-50um; the thickness of the high-frequency insulating layer is 7.5um to 100um, preferably 12.5um to 50um.
The first high-frequency adhesive layer and the second high-frequency adhesive layer are each at least one of fluorine-based resin, epoxy resin, acrylic resin, urethane-based resin, silicone rubber-based resin, parylene-based resin, bismaleimide-based resin, and thermosetting polyimide-based resin. The first high-frequency adhesive layer and the second high-frequency adhesive layer are both preferably thermosetting polyimide resin, the content of the thermosetting polyimide resin is 40 to 80% by weight, and the first high-frequency adhesive layer and the second high-frequency adhesive layer may be fluorine resin containing phosphorus resin (flame retardant) and the content of the fluorine resin is 8 to 50% by weight.
The high-frequency insulating layer includes at least one of polyolefin, polyphenylene oxide, polyphenylene sulfide, polyimide, and polyether ether ketone.
The copper foil layer is one of the following structures:
first kind: the copper foil layer is thin copper or carrier copper with the thickness of 2-18 mu m; the copper foil layer is preferably thin copper or carrier copper with the thickness of 2-9 mu m;
second kind: the copper foil layer is a thick copper layer with a thickness of 105 μm.
The insulating layer is one of the following two structures:
first kind: the insulating layer is a non-ink layer and comprises at least one of epoxy resin, acrylic resin, polyester, polyimide, polyamide imide, polyether ether ketone, polysulfone, polybutylene adipamide, 1, 4-cyclohexanedimethanol terephthalate, polyurethane, polyphenylene sulfide, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyether imide, polypropylene, polystyrene and polycarbonate;
second kind: the insulating layer is an ink layer containing extinction powder, and the weight percentage of the extinction powder is 5-20%. The purpose of improving the gloss value and hardness of the insulating layer can be achieved, and meanwhile, the ink layer has flame retardance, heat dissipation property is improved, a hazy effect is achieved, and extremely low glossiness is achieved.
The extinction powder is inorganic powder of at least one of calcium sulfate, carbon black, silicon dioxide, titanium dioxide, zinc sulfide, zirconium oxide, calcium carbonate, silicon carbide, boron nitride, aluminum oxide, talcum powder, aluminum nitride, glass powder, quartz powder, silicon carbide and clay, or polyimide organic powder, or flame-retardant compound containing at least one of halogen, phosphorus, nitrogen and boron.
The adhesive layer includes at least one of an acryl resin, an epoxy resin, an acrylic resin, a vinyl acetate resin, a urethane resin, a silicone rubber resin, a parylene resin, a bismaleimide resin, and a polyimide resin.
The insulation layer is characterized by further comprising a release layer, the release layer comprises an upper release layer 107 and a lower release layer 108, the upper release layer is positioned on the upper surface of the insulation layer, the lower release layer is positioned on the lower surface of the second high-frequency bonding layer, and the thickness of the upper release layer and the thickness of the lower release layer are respectively 25-100 um.
The release layer is one of the following two structures:
1. the release layer is a release film, the thickness of the release film is 25-100 mu m, and the release film is at least one of a PET fluoroplastic release film, a PET silicone oil-containing release film, a PET matte release film and a PE release film;
2. the release layer is release paper, the thickness of the release paper is 25-130 mu m, and the release paper is single-sided release PE coated paper or double-sided release PE coated paper.
The preparation method of the high-frequency covering film with the high electromagnetic shielding function comprises two preparation methods:
first (the insulating layer is an ink layer): the method comprises the following steps:
s1, coating an insulating layer on an upper release layer, and rolling for standby;
s2, coating a high-frequency insulating layer on the first high-frequency adhesive layer, and laminating a copper foil layer (containing carrier copper);
s3, coating the finished product obtained in the S2 with a second high-frequency adhesive layer, and attaching a release layer;
s4, coating the finished product obtained in the S3 (after removing carrier copper on the copper foil layer) on the copper foil layer, taking out the finished product obtained in the S1, pressing the finished product on the copper foil layer, and curing the finished product to obtain the high-frequency covering film with the high electromagnetic shielding function;
second (the insulating layer is a non-ink layer): the method comprises the following steps:
s1, coating a high-frequency insulating layer on a first high-frequency adhesive layer, and laminating a copper foil layer (containing carrier copper);
s2, coating a second high-frequency adhesive layer on the finished product obtained in the S1, and attaching a release layer;
s3, coating an adhesive layer on the copper foil layer of the finished product obtained in the S2 (after removing carrier copper on the copper foil layer), laminating an insulating layer and curing to obtain the high-frequency covering film with the high electromagnetic shielding function.
To facilitate understanding of the superiority of the present invention, the present application prepares each specific comparative example (as shown in fig. 4, the high-frequency coverlay 300 includes a high-frequency insulating layer 301, a high-frequency adhesive layer 302, and a release layer 303 in this order from top to bottom, as shown in fig. 3, the high-frequency EMI shielding film 200 includes an upper release layer 205, an insulating layer 201, an adhesive layer 202, a copper foil layer 203, a conductive adhesive layer 204, and a lower release layer 206 in this order from top to bottom, the high-frequency coverlay of comparative examples 1 to 2 includes only a high-frequency insulating layer and a high-frequency adhesive layer, the high-frequency EMI shielding films of comparative examples 3 to 5 include only a copper foil layer and a conductive adhesive layer), the examples are prepared with the insulating layer, the adhesive layer portions removed (i.e., the examples include only a copper foil layer, a first high-frequency adhesive layer, a high-frequency insulating layer, and a second high-frequency adhesive layer), and tests are performed on the total thickness after lamination, the resistance value, peel strength, and shielding property, dielectric property, and solder heat resistance of the specific examples and comparative examples, test results are described in table 1.
Table 1:
it can be seen from table 1 that the composition of the present invention can easily achieve a thicker thickness, and has desirable dielectric properties while meeting the requirements for a thick dielectric layer in the high frequency and high speed transmission field. The invention has high shielding performance, has good shielding effect in the constitution of thicker copper foil layers, can reach 80 to 100dB@1GHz, can keep good shielding effect at 85 ℃/85% for 100hr, and has excellent reliability. And because the technical path is different from the common EMI shielding film, the soldering tin has good heat resistance, and can solve the problems of plate explosion and high level difference in the processes of circuit assembly of circuit board manufacturers and the like. As can be seen from the test results in Table 1, the invention can meet the design requirement of low transmission loss, has the function of insulation protection of the circuit surface, has excellent electromagnetic shielding effect, can reduce the procedures by combining the high-frequency covering film with the high-frequency EMI shielding film, and can be used as a design scheme for replacing the high-frequency covering film matched with the high-frequency EMI shielding film on the market.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the present invention and the accompanying drawings, or direct or indirect application in other related technical fields, are included in the scope of the present invention.
Claims (8)
1. A high-frequency cover film with high electromagnetic shielding function, characterized in that: the device comprises an upper release layer, an insulating layer, an adhesive layer, a copper foil layer, a first high-frequency adhesive layer, a high-frequency insulating layer, a second high-frequency adhesive layer and a lower release layer from top to bottom in sequence;
the high-frequency insulating layer is an insulating layer with a dielectric coefficient lower than 4.0 and a dielectric loss lower than 0.015 (at 10 GHz);
the first high-frequency bonding layer and the second high-frequency bonding layer are resin adhesive layers with dielectric coefficients lower than 4.0, dielectric losses of 0.002-0.010 (at 10 GHz) and water absorption of 0.001-0.5%;
the surface hardness of the insulating layer is more than 4H;
the total thickness of the high-frequency covering film with the high electromagnetic shielding function is 37um-350um; wherein the thickness of the insulating layer is 5um-25um; the thickness of the adhesive layer is 5um-20um; the thickness of the copper foil layer is 2um-105um; the thickness of the first high-frequency bonding layer and the thickness of the second high-frequency bonding layer are respectively 8um-50um; the thickness of the high-frequency insulating layer is 7.5-um-100 um;
the copper foil layer is one of the following structures:
first kind: the copper foil layer is thin copper or carrier copper with the thickness of 2-18 mu m;
second kind: the copper foil layer is a thick copper layer with the thickness of 105 mu m;
the first high-frequency adhesive layer and the second high-frequency adhesive layer are each at least one of fluorine-based resin, epoxy resin, acrylic resin, urethane-based resin, silicone rubber-based resin, parylene-based resin, bismaleimide-based resin, and thermosetting polyimide-based resin.
2. A high-frequency cover film having a high electromagnetic shielding function according to claim 1, characterized in that: the high-frequency insulating layer includes at least one of polyolefin, polyphenylene oxide, polyphenylene sulfide, polyimide, and polyether ether ketone.
3. A high-frequency cover film having a high electromagnetic shielding function according to claim 1, characterized in that: the insulating layer is one of the following two structures:
first kind: the insulating layer is a non-ink layer and comprises at least one of epoxy resin, acrylic resin, polyester, polyimide, polyamide imide, polyether ether ketone, polysulfone, polybutylene adipamide, 1, 4-cyclohexanedimethanol terephthalate, polyurethane, polyphenylene sulfide, polyethylene terephthalate, polyethylene naphthalate, polyether sulfone, polyether imide, polypropylene, polystyrene and polycarbonate;
second kind: the insulating layer is an ink layer containing extinction powder, and the weight percentage of the extinction powder is 5-20%.
4. A high-frequency cover film having a high electromagnetic shielding function according to claim 3, characterized in that: the extinction powder is inorganic powder of at least one of calcium sulfate, carbon black, silicon dioxide, titanium dioxide, zinc sulfide, zirconium oxide, calcium carbonate, silicon carbide, boron nitride, aluminum oxide, talcum powder, aluminum nitride, glass powder, quartz powder, silicon carbide and clay, or polyimide organic powder, or flame-retardant compound containing at least one of halogen, phosphorus, nitrogen and boron.
5. A high-frequency cover film having a high electromagnetic shielding function according to claim 1, characterized in that: the adhesive layer includes at least one of an acryl resin, an epoxy resin, an acrylic resin, a vinyl acetate resin, a urethane resin, a silicone rubber resin, a parylene resin, a bismaleimide resin, and a polyimide resin.
6. A high-frequency cover film having a high electromagnetic shielding function according to claim 1, characterized in that: the thickness of the upper release layer and the thickness of the lower release layer are respectively 25um-100um.
7. The high-frequency cover film with high electromagnetic shielding function according to claim 6, wherein: the release layer is one of the following two structures:
1. the release layer is a release film, the thickness of the release film is 25-100 mu m, and the release film is at least one of a PET fluoroplastic release film, a PET silicone oil-containing release film, a PET matte release film and a PE release film;
2. the release layer is release paper, the thickness of the release paper is 25-130 mu m, and the release paper is single-sided release PE coated paper or double-sided release PE coated paper.
8. A method for producing a high-frequency cover film having a high electromagnetic shielding function according to claim 1, characterized by: has two preparation methods:
the insulating layer of the first method is an ink layer: the method comprises the following steps:
s1, coating an insulating layer on an upper release layer, and rolling for standby;
s2, coating a high-frequency insulating layer on the first high-frequency adhesive layer, and laminating a copper foil layer;
s3, coating the finished product obtained in the S2 with a second high-frequency adhesive layer, and attaching a release layer;
s4, coating the finished product obtained in the S3 on a copper foil layer, taking out the finished product obtained in the S1, pressing the finished product on the copper foil layer, and curing the finished product to obtain the high-frequency covering film with the high electromagnetic shielding function;
the insulating layer of the second method is a non-ink layer: the method comprises the following steps:
s1, coating a high-frequency insulating layer on a first high-frequency adhesive layer, and laminating a copper foil layer;
s2, coating a second high-frequency adhesive layer on the finished product obtained in the S1, and attaching a release layer;
s3, coating the finished product obtained in the S2 on a copper foil layer, laminating an insulating layer and curing to obtain the high-frequency covering film with the high electromagnetic shielding function.
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| CN113555747A (en) * | 2021-09-22 | 2021-10-26 | 四川赛狄信息技术股份公司 | Heterogeneous connector |
| CN114340161B (en) * | 2021-12-20 | 2024-03-29 | 安捷利电子科技（苏州）有限公司 | 5G high-frequency multilayer FPC and preparation method thereof |
| CN115584216A (en) * | 2022-11-02 | 2023-01-10 | 江苏伊诺尔新材料科技有限公司 | Copper-plastic composite adhesive tape suitable for flexible circuit board |
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| TWI765306B (en) | 2022-05-21 |
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