CN206765475U - A kind of thin-type flexible copper-clad plate - Google Patents
A kind of thin-type flexible copper-clad plate Download PDFInfo
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- CN206765475U CN206765475U CN201720270888.XU CN201720270888U CN206765475U CN 206765475 U CN206765475 U CN 206765475U CN 201720270888 U CN201720270888 U CN 201720270888U CN 206765475 U CN206765475 U CN 206765475U
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- copper foil
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- clad plate
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Abstract
It the utility model is related to flex circuit application field, more particularly to a kind of thin-type flexible copper-clad plate.Its technical scheme is：A kind of thin-type flexible copper-clad plate, including set gradually from top to bottom upper copper foil, for magnetic conduction and prevent the EMI films of electromagnetic interference, lower copper foil, upper copper foil, EMI films, lower copper foil are rolling, adhesive is coated between EMI films and upper copper foil between EMI films and lower copper foil, adhesive is any one in epoxy glue, acroleic acid hot melt glue, thermoplasticity PI resins.The utility model provides the pliability copper-clad plate that a kind of thickness using rolling production is thinner, pressing is more uniform, magnetic conduction or shielding uniformity are high, solves the problems, such as that existing copper-clad plate magnetic conduction or shielding lack of homogeneity, thickness are thicker.
Description
Technical field
It the utility model is related to flex circuit application field, more particularly to a kind of thin-type flexible copper-clad plate.
Background technology
Flexible printed circuit board (FPC) has many advantages compared with traditional rigid printed board (PCB)：1) have
There is very thin insulation thickness；2) package dimension and encapsulation weight can be substantially reduced, current electronic product it is light, thin, short,
Small trend in the groove, various portable type electronic products miniaturization requirement, if without flexible printed circuit almost without
Method connects up, such as camera, video camera, mobile phone, notebook computer, LCD TV；3) it is very easy to realize three dimensional wiring,
Effectively reduce the space-consuming of wiring；4) assembly cost is substantially reduced；5) easily realize the densification of electronic circuit, become more meticulous
And functionalization；6) particularly needed repeatedly with higher reliability and mobility when small space largely connect up
The occasion of bending, flexible printed circuit board have longer flex life.
Flexible printed circuit board (FPC), no matter it is respectively provided with extensively in civilian technology product or in military technology product
Application field, as mobile phone, camera, video camera, LCD TV, telephone set, facsimile machine, duplicator, printer, palm electricity
It is brain, CD-audio player, notebook computer, floppy disk, hard disk drive, artificial satellite, guided missile, jet fighter, fighter plane, pre-
Alert machine etc..Generally, flexible printed circuit board (FPC) is to pass through adhesives pressure by dielectric film and conductive metal foil
Close what the composite membrane formed was process through special process such as over etching, cleanings.Therefore, flexible copper clad foil plate (FCCL) is FPC
The product of preceding working procedure.
Under normal circumstances, FCCL is made up of basement membrane, adhesive and conductive metal foil.Basement membrane is often polyester film or gathered
Imide membrane；Adhesive is often epoxy resin or acrylate adhesive；Conductive metal foil is often copper foil or aluminium
Paper tinsel.Existing flexible copper clad foil plate (FCCL) processes for chip, i.e., basement membrane, conductive metal foil is first cut into piece, then pass through
Adhesive carries out fitting compacting.Existing flexible copper clad foil plate (FCCL) mainly has following several structure types：1)EMI+BS+
Basic FCCL+BS+EMI；2) EMI+BS+CVL+ bases FCCL+CVL+BS+EMI；3) FRCC+TPI adhesive films+EMI+TPI glue
Film layer+FRCC；4) CU+TPI adhesive films+EMI+TPI adhesive films+CU:；5)FRCC+EMI+FRCC；6)CU+BS+EMI+BS+CU；
7) CU+BS+EMI+TPI adhesive films+EMI+BS+CU；8) FRCC+EMI+TPI adhesive films+EMI+FRCC.Eight kinds of structures of the above are equal
Produced for chip, wherein TPI adhesive films are coated with are formed successively by TPI glue, PI, TPI glue.
When carrying out the processing of flexible copper clad foil plate using chip mode, it is difficult to which layers of material to be pressed to uniform, thickness gauge
Very little tolerance is only capable of accomplishing ± 5 μm, causes shielding or the magnetic conduction lack of homogeneity of flexible copper clad foil plate.In order to ensure chip processing flexibility
The performance of copper coated foil plate, can only increase the thickness of each material layer of product, and the thickness ability of each material layer is as follows：EMI thickness degree energy
Power：Min 20um；BS thickness degree abilities：Min 10um；Copper foil/metal layer thickness ability：Min 9um；TPI adhesive film thickness energy
Power：Min 20um, gluing oxidant layer Min6um, PI layers Min8um；FRCC thickness abilities：Min 19um, gluing oxidant layer Min
10um, Cu layer Min 9um；Basic FCCL thickness ability：Min 30um, adhesive+PI layers Min12um, Cu Min 9um.More than
Thickness is thicker so that the minimum thickness of the product after processing is only capable of reaching 58 μm, is unfavorable for the slimming requirement of product.Chip
TPI adhesive films during production are coated with are formed successively by TPI glue, PI, TPI glue, and can not only be applicable TPI glue, so corresponding increase
The thickness of product, add the possibility of pressing inhomogeneities.
Utility model content
The utility model overcomes the deficiencies in the prior art, there is provided a kind of thickness using rolling production is thinner, presses more
Add uniform, magnetic conduction or shield the high pliability copper-clad plate of uniformity, solve existing copper-clad plate magnetic conduction or shielding lack of homogeneity, thickness
The problem of degree is thicker, complex manufacturing.
To solve above-mentioned technical problem, the utility model uses following technical scheme：
A kind of thin-type flexible copper-clad plate, including set gradually from top to bottom upper copper foil, for magnetic conduction and prevent electromagnetism
EMI films, the lower copper foil of interference, upper copper foil, EMI films, lower copper foil are rolling, and between EMI films and upper copper foil and EMI is thin
Adhesive is coated between film and lower copper foil, adhesive is any in epoxy glue, acroleic acid hot melt glue, thermoplasticity PI resins
It is a kind of.
As preferred scheme of the present utility model, the thickness ability of the upper copper foil and lower copper foil be it is most thin 6 μm, i.e.,
The minimum thickness of upper copper foil and lower copper foil can reach 6 μm；The thickness ability of the adhesive is most thin 3 μm；The EMI films
Thickness ability to be most thin 5 μm, i.e. the minimum thickness of EMI films can reach 5 μm.
As preferred scheme of the present utility model, the EMI films are any in conductive adhesive film, high resistance body, metal foil
It is a kind of.
As preferred scheme of the present utility model, the adhesive is thermoplasticity PI resins.
Compared with prior art, the beneficial effects of the utility model are：
1st, copper foil and EMI film of the present utility model is rolling, and when converted products, material is produced from reel,
In material surface coating binder or each material layer of pressing.When this mode produces, dynamics, the uniformity of pressing are all higher, from
And the thickness that can accordingly reduce each layer also can guarantee that the performance of product；Adhesive need to only use individual layer, without using by
The TPI adhesive films that TPI glue, PI, TPI glue are coated with successively, further reduce the thickness of product, and product of the present utility model is minimum
Thickness can reach 23 μm.The utility model is thinner compared with conventional flex copper-clad plate product thickness, and accordingly enables thickness uniform, thick
Degree uniformity can reach ± 2 μm, so that the shielding of product or magnetic conduction uniformity are more preferably.
2nd, the minimum thickness of copper foil can reach 6 μm, and the minimum thickness of EMI films can reach 5 μm, and the thickness of each material subtracts
It is small so that the integral thickness of product accordingly reduces, and complies with electronic product slimming development trend.
3rd, EMI films are any one in conductive adhesive film, high resistance body, metal foil so that EMI films, which can have, well leads
Magnetic function and shield effectiveness.Adhesive is thermoplasticity PI resins so that product heat resistance is more preferable, and flatness is higher.
Brief description of the drawings
Fig. 1 is structural representation of the present utility model.
In figure, the upper copper foils of 1-, 2-EMI films, copper foil under 3-, 4- adhesive.
Embodiment
Below in conjunction with the accompanying drawings, the utility model is described in detail.
In order that the purpose of this utility model, technical scheme and advantage are more clearly understood, below in conjunction with accompanying drawing and implementation
Example, the utility model is further elaborated.It should be appreciated that specific embodiment described herein is only explaining this
Utility model, it is not used to limit the utility model.
Embodiment one
As shown in figure 1, the utility model include setting gradually from top to bottom upper copper foil 1, for magnetic conduction and prevent electromagnetism
EMI films 2, the lower copper foil 3 of interference, upper copper foil 1, EMI films 2, lower copper foil 3 are rolling, EMI films 2 and upper copper foil 1 it
Between be coated with adhesive 4 between EMI films 2 and lower copper foil 3, adhesive 4 is epoxy glue, acroleic acid hot melt glue, thermoplasticity
Any one in PI resins.Copper foil and EMI film 2 of the present utility model is rolling, when converted products, by material from volume
Produced on cylinder, in material surface coating binder 4 or each material layer of pressing.When this mode produces, dynamics, the uniformity of pressing
It is all higher, so as to accordingly reduce the performance that the thickness of each layer also can guarantee that product；Adhesive 4 need to use individual layer, without
Need to use the TPI adhesive films being coated with successively by TPI glue, PI, TPI glue, further reduce the thickness of product, the utility model
Product minimum thickness can reach 23 μm.The utility model is thinner compared with conventional flex copper-clad plate product thickness, and accordingly causes thickness
Degree can uniformly, and thickness evenness can reach ± 2 μm, so that the shielding of product or magnetic conduction uniformity are more preferably.
Embodiment two
On the basis of embodiment one, the thickness ability of the upper copper foil 1 and lower copper foil 3 is most thin 6 μm；It is described gluing
The thickness ability of agent 4 is most thin 3 μm；The thickness ability of the EMI films 2 is most thin 5 μm.The minimum thickness of copper foil can reach 6 μ
The minimum thickness of m, EMI film 2 can reach 5 μm, and the thickness of each material reduces so that the integral thickness of product accordingly reduces, suitable
Electronic product is answered to be thinned development trend.
Embodiment three
On the basis of embodiment one or two, the EMI films 2 are any one in conductive adhesive film, high resistance body, metal foil
Kind so that EMI films 2 can have good magnetic conduction function and shield effectiveness.The adhesive 4 is thermoplasticity PI resins so that production
Product heat resistance is more preferable, and flatness is higher.
Claims (4)
- A kind of 1. thin-type flexible copper-clad plate, it is characterised in that including set gradually from top to bottom upper copper foil (1), for leading Magnetic and EMI films (2), the lower copper foil (3) for preventing electromagnetic interference, upper copper foil (1), EMI films (2), lower copper foil (3) are volume Formula, adhesive (4) is coated between EMI films (2) and upper copper foil (1) between EMI films (2) and lower copper foil (3), it is gluing Agent (4) is any one in epoxy glue, acroleic acid hot melt glue, thermoplasticity PI resins.
- 2. a kind of thin-type flexible copper-clad plate according to claim 1, it is characterised in that the upper copper foil (1) and lower copper The thickness ability of paper tinsel (3) is most thin 6 μm；The thickness ability of the adhesive (4) is most thin 3 μm；The EMI films (2) Thickness ability is most thin 5 μm.
- 3. a kind of thin-type flexible copper-clad plate according to claim 1 or 2, it is characterised in that the EMI films (2) are Any one in conductive adhesive film, high resistance body, metal foil.
- 4. a kind of thin-type flexible copper-clad plate according to claim 1 or 2, it is characterised in that the adhesive (4) is heat Plasticity PI resins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720270888.XU CN206765475U (en) | 2017-03-20 | 2017-03-20 | A kind of thin-type flexible copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720270888.XU CN206765475U (en) | 2017-03-20 | 2017-03-20 | A kind of thin-type flexible copper-clad plate |
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| Publication Number | Publication Date |
|---|---|
| CN206765475U true CN206765475U (en) | 2017-12-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720270888.XU Active CN206765475U (en) | 2017-03-20 | 2017-03-20 | A kind of thin-type flexible copper-clad plate |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106827716A (en) * | 2017-03-20 | 2017-06-13 | 成都三益新材料有限公司 | A kind of thin-type flexible copper-clad plate and preparation method thereof |
-
2017
- 2017-03-20 CN CN201720270888.XU patent/CN206765475U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106827716A (en) * | 2017-03-20 | 2017-06-13 | 成都三益新材料有限公司 | A kind of thin-type flexible copper-clad plate and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20211111 Address after: 620000 East Zone, Meishan Economic Development Zone, Dongpo District, Meishan City, Sichuan Province Patentee after: Sichuan Sanyi electronic new material Co., Ltd Address before: 611434 east of freight Avenue, new material industry functional zone, Xinjin Industrial Park, Chengdu, Sichuan Patentee before: Chengdu Sanyi New Material Co., Ltd |
|
| TR01 | Transfer of patent right |