CN104010436A - Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology - Google Patents
Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology Download PDFInfo
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- CN104010436A CN104010436A CN201410258117.XA CN201410258117A CN104010436A CN 104010436 A CN104010436 A CN 104010436A CN 201410258117 A CN201410258117 A CN 201410258117A CN 104010436 A CN104010436 A CN 104010436A
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Abstract
The invention discloses a flexible metal-coated substrate with the electromagnetic shielding effect. The flexible metal-coated substrate comprises a macromolecule insulating film layer, a shielding metal layer is formed on one face of the macromolecule insulating film layer in a vacuum sputtering mode, an ink insulating layer is formed on the shielding metal layer in a coating mode, and a conductor metal layer is formed on the other face of the macromolecule insulating film layer. The invention further discloses a manufacturing technology of the substrate. The flexible metal-coated substrate and the manufacturing technology have the advantages that the flexible metal-coated substrate is good in flexibility and has the good electromagnetic shielding effect, the technological process of pasting a shielding film in the follow-up circuit board processing process is omitted, and then the production efficiency is improved; the manufacturing technology of the flexible metal-coated substrate is simple and easy to implement, and convenience is brought to industrial popularization.
Description
Technical field
The present invention relates to the flexibility that a kind of printed substrate with effectiveness uses and cover metal substrate and manufacturing process thereof; Belong to electronic product field.
Background technology
Printed substrate is material indispensable in electronic product, computer and ancillary equipment thereof, communication product and consumption electronic products etc. are at present widely used, and along with the sustainable growth of consumption electronic products demand, quantity demand for printed circuit board (PCB) is more and more, and quality requirement is also higher simultaneously.
Flexible copper clad foil substrate on existing market is mainly taking polyimides, polyester as base material, be compounded to form by adhesive and Copper Foil, it is three ply board, or directly polyamic acid is coated on Copper Foil, form through imidization, i.e. two laminates, such substrate is widely used in the consumption electronic products such as mobile phone, digital camera.But such substrate is simple wiring board material; do not there is effectiveness; along with the development of present smart machine; increasing electronic product requires to have electro-magnetic screen function in wiring board; at present; the realization of this function is mainly in manufacture process, to stick on shielding protection material at present, has increased procedure of processing and corresponding cost.
Summary of the invention
For solving the deficiencies in the prior art, the object of the present invention is to provide a kind of flexibility with effectiveness to cover metal substrate, the manufacturing process of this substrate is also provided simultaneously, can meet the high performance requirements of FPC industry.
In order to realize above-mentioned target, the present invention adopts following technical scheme:
The flexibility with effectiveness is covered a metal substrate, comprising: polymer insulating film layer; The one side of described polymer insulating film layer forms a shielded metal layer through vacuum sputtering, on described shielded metal layer, forms an ink insulating barrier through coating; The another side of described polymer insulating film layer is formed with conductor metal layer, and this metal substrate has four-layer structure, calls " four laminar substrates " in the following text.
Between aforementioned polymer insulating film layer and conductor metal layer, be also coated with an adhesive layer, so, this metal substrate just has five-layer structure, calls " five laminar substrates " in the following text.
Preferably, aforementioned polymer insulating film layer is high molecular polymer film, is made up of the one in PETG, polyimides, PEN, Merlon, polyamide, and thickness is 10-200 micron.
Preferably, aforementioned shielded metal layer is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 50-3000nm.
Preferably, aforementioned ink insulating barrier is one or more the mixture in epoxy resin, polyacrylic resin, phenolic resins, mylar, polyurethane resin, and thickness is 5-50 micron.
Preferably, aforementioned adhesive layer is one or more the mixture in polyacrylic resin, epoxy resin, mylar, phenolic resins, polyurethane resin, and thickness is 5-50 micron.
Preferably, aforementioned conductor metal layer is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 5-100 micron.
Manufacture aforesaid four laminar substrates, adopt following processing step:
A1, polymer insulating film layer is cleaned up, by vacuum sputtering technique, form a shielded metal layer in its one side;
A2, form conductor metal layer at the another side of polymer insulating film layer by vacuum sputtering technique;
A3, the mode being coated with by precision on shielded metal layer form ink insulating barrier, through baking oven baking-curing;
A4, rolling.
Manufacture aforesaid five laminar substrates, adopt following processing step:
B1, polymer insulating film layer is cleaned up, by vacuum sputtering technique, form a shielded metal layer in its one side;
B2, the mode being coated with by precision on shielded metal layer form ink insulating barrier, through baking oven baking-curing; B3, the another side of polymer insulating film layer is carried out to corona treatment, is then coated with one deck adhesive layer thereon, then on adhesive layer hot pressing laminating conductor metal layer;
B4, rolling, baking-curing.
Manufacture aforesaid five laminar substrates, can also adopt following processing step:
C1, polymer insulating film layer is cleaned up, by vacuum sputtering technique, form a shielded metal layer in its one side;
C2, the mode being coated with by precision on shielded metal layer form ink insulating barrier, through baking oven baking-curing; C3, on conductor metal layer glue coating adhensive layer, after coater oven preliminary drying with the another side hot pressing laminating of the polymer insulating film layer of step C2;
C4, rolling, baking-curing.
Usefulness of the present invention is: metal substrate pliability of the present invention is good, has good effectiveness, has saved the technical process of the subsides screened film in the follow-up wiring board course of processing, and then has improved production efficiency; And manufacturing process of the present invention be simple and easy to realize, facilitate industrialization promotion.
Brief description of the drawings
Fig. 1 is the structural representation of four laminar substrates of the present invention;
Fig. 2 is the structural representation of five laminar substrates of the present invention.
The implication of Reference numeral in figure: 1, polymer insulating film layer, 2, shielded metal layer, 3, ink insulating barrier, 4, conductor metal layer, 5, adhesive layer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is done to concrete introduction.
Referring to Fig. 1, a kind of flexibility with effectiveness of the present invention is covered metal substrate, comprise: polymer insulating film layer 1, form a shielded metal layer 2 in its one side through vacuum sputtering, then on shielded metal layer 2, form an ink insulating barrier 3 through coating, and be formed with conductor metal layer 4 at the another side of polymer insulating film layer 1, so, metal substrate total four-layer structure, i.e. " four laminar substrates " of preparation.Shielded metal layer 2 and conductor metal layer 4 can adopt identical material to make, and also can select different materials to make, as long as can realize goal of the invention.
Further, improve as one, as shown in Figure 2, be also coated with an adhesive layer 5 between polymer insulating film layer 1 and conductor metal layer 4, so, metal substrate just has five-layer structure, i.e. " five laminar substrates ".
Preferred as one, polymer insulating film layer 1 is high molecular polymer film, is made up of the one in PETG, polyimides, PEN, Merlon, polyamide, and thickness is 10-200 micron.
Preferred as one, shielded metal layer 2 is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 50-3000nm.
Preferred as one, ink insulating barrier 3 is one or more the mixture in epoxy resin, polyacrylic resin, phenolic resins, mylar, polyurethane resin, and thickness is 5-50 micron.
Preferred as one, adhesive layer 5 is one or more the mixture in polyacrylic resin, epoxy resin, mylar, phenolic resins, polyurethane resin, and thickness is 5-50 micron.
Preferred as one, conductor metal layer 4 is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 5-100 micron.
Metal substrate pliability of the present invention is good, there is good effectiveness, save the technical process of the subsides screened film in the follow-up wiring board course of processing, and then improve production efficiency, by choose reasonable and the collocation of layers of material and thickness, its performance can be guaranteed, the effectiveness that it is good can be ensured again.
In order to apply better the present invention, below the preparation technology of metal substrate of the present invention is briefly introduced.
Adopt following processing step: A1, polymer insulating film layer 1 is cleaned up for four laminates, by vacuum sputtering technique, form a shielded metal layer 2 in its one side; A2, form conductor metal layer 4 at the another side of polymer insulating film layer 1 by vacuum sputtering technique; A3, the mode being coated with by precision on shielded metal layer 2 form ink insulating barrier 3, through baking oven baking-curing; A4, rolling.
For five laminates, there are two kinds of processing steps to realize, wherein, the first processing step is: B1, polymer insulating film layer 1 is cleaned up, by vacuum sputtering technique, form a shielded metal layer 2 in its one side; B2, the mode being coated with by precision on shielded metal layer 2 form ink insulating barrier 3, through baking oven baking-curing; B3, the another side of polymer insulating film layer 1 is carried out to corona treatment, is then coated with one deck adhesive layer 5 thereon, then on adhesive layer 5 hot pressing laminating conductor metal layer 4; B4, rolling, baking-curing.The second processing step is: C1, polymer insulating film layer 1 is cleaned up, by vacuum sputtering technique, form a shielded metal layer 2 in its one side; C2, the mode being coated with by precision on shielded metal layer 2 form ink insulating barrier 3, through baking oven baking-curing; C3, on conductor metal layer 4 glue coating adhensive layer 5, after coater oven preliminary drying with the another side hot pressing laminating of the polymer insulating film layer 1 of step C2; C4, rolling, baking-curing.
As can be seen here, the processing step of making metal substrate of the present invention is simple and easy to realize, and cost is low, can apply industrial.
More than show and described general principle of the present invention, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the present invention in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops in protection scope of the present invention.
Claims (10)
1. the flexibility with effectiveness is covered a metal substrate, it is characterized in that, comprising: polymer insulating film layer; The one side of described polymer insulating film layer forms a shielded metal layer through vacuum sputtering, on described shielded metal layer, forms an ink insulating barrier through coating; The another side of described polymer insulating film layer is formed with conductor metal layer.
2. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, between described polymer insulating film layer and conductor metal layer, is also coated with an adhesive layer.
3. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, described polymer insulating film layer is high molecular polymer film, be made up of the one in PETG, polyimides, PEN, Merlon, polyamide, thickness is 10-200 micron.
4. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, described shielded metal layer is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 50-3000nm.
5. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, described ink insulating barrier is one or more the mixture in epoxy resin, polyacrylic resin, phenolic resins, mylar, polyurethane resin, and thickness is 5-50 micron.
6. a kind of flexibility with effectiveness according to claim 2 is covered metal substrate, it is characterized in that, described adhesive layer is one or more the mixture in polyacrylic resin, epoxy resin, mylar, phenolic resins, polyurethane resin, and thickness is 5-50 micron.
7. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, described conductor metal layer is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 5-100 micron.
8. a kind of flexibility with effectiveness as claimed in claim 1 is covered the manufacturing process of metal substrate, it is characterized in that, comprises the steps:
A1, polymer insulating film layer is cleaned up, by vacuum sputtering technique, form a shielded metal layer in its one side;
A2, form conductor metal layer at the another side of polymer insulating film layer by vacuum sputtering technique;
A3, the mode being coated with by precision on shielded metal layer form ink insulating barrier, through baking oven baking-curing;
A4, rolling.
9. a kind of flexibility with effectiveness as claimed in claim 2 is covered the manufacturing process of metal substrate, it is characterized in that, comprises the steps:
B1, polymer insulating film layer is cleaned up, by vacuum sputtering technique, form a shielded metal layer in its one side;
B2, the mode being coated with by precision on shielded metal layer form ink insulating barrier, through baking oven baking-curing; B3, the another side of polymer insulating film layer is carried out to corona treatment, is then coated with one deck adhesive layer thereon, then on adhesive layer hot pressing laminating conductor metal layer;
B4, rolling, baking-curing.
10. a kind of flexibility with effectiveness as claimed in claim 2 is covered the manufacturing process of metal substrate, it is characterized in that, comprises the steps:
C1, polymer insulating film layer is cleaned up, by vacuum sputtering technique, form a shielded metal layer in its one side;
C2, the mode being coated with by precision on shielded metal layer form ink insulating barrier, through baking oven baking-curing; C3, on conductor metal layer glue coating adhensive layer, after coater oven preliminary drying with the another side hot pressing laminating of the polymer insulating film layer of step C2;
C4, rolling, baking-curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410258117.XA CN104010436A (en) | 2014-06-12 | 2014-06-12 | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410258117.XA CN104010436A (en) | 2014-06-12 | 2014-06-12 | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology |
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| CN104010436A true CN104010436A (en) | 2014-08-27 |
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| CN201410258117.XA Pending CN104010436A (en) | 2014-06-12 | 2014-06-12 | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507301A (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
| CN106102323A (en) * | 2016-05-31 | 2016-11-09 | 王定锋 | Aluminum-based circuit board and the manufacture method of PET is pressed from both sides in the middle of a kind of |
| CN111076108A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
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| CN102837470A (en) * | 2011-06-22 | 2012-12-26 | 住友化学株式会社 | Laminate |
| US20130056258A1 (en) * | 2010-05-14 | 2013-03-07 | 3M Innovative Properties Company | Electromagnetic shielding adhesive tape |
| CN103144376A (en) * | 2013-03-15 | 2013-06-12 | 松扬电子材料(昆山)有限公司 | Composite copper clad laminate with electromagnetic shielding effect and manufacture method thereof |
| CN203492324U (en) * | 2013-09-29 | 2014-03-19 | 新高电子材料（中山）有限公司 | Flexible cover film structure with electromagnetic shielding function |
| CN204014268U (en) * | 2014-06-12 | 2014-12-10 | 苏州城邦达力材料科技有限公司 | A kind of flexibility with effectiveness is covered metal substrate |
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2014
- 2014-06-12 CN CN201410258117.XA patent/CN104010436A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130056258A1 (en) * | 2010-05-14 | 2013-03-07 | 3M Innovative Properties Company | Electromagnetic shielding adhesive tape |
| CN102837470A (en) * | 2011-06-22 | 2012-12-26 | 住友化学株式会社 | Laminate |
| CN103144376A (en) * | 2013-03-15 | 2013-06-12 | 松扬电子材料(昆山)有限公司 | Composite copper clad laminate with electromagnetic shielding effect and manufacture method thereof |
| CN203492324U (en) * | 2013-09-29 | 2014-03-19 | 新高电子材料（中山）有限公司 | Flexible cover film structure with electromagnetic shielding function |
| CN204014268U (en) * | 2014-06-12 | 2014-12-10 | 苏州城邦达力材料科技有限公司 | A kind of flexibility with effectiveness is covered metal substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104507301A (en) * | 2014-12-16 | 2015-04-08 | 苏州城邦达力材料科技有限公司 | Electromagnetic shielding film with metal coating and manufacturing technique of electromagnetic shielding film |
| CN106102323A (en) * | 2016-05-31 | 2016-11-09 | 王定锋 | Aluminum-based circuit board and the manufacture method of PET is pressed from both sides in the middle of a kind of |
| CN111076108A (en) * | 2019-09-06 | 2020-04-28 | 深圳科诺桥科技股份有限公司 | Light reflecting structure and preparation method thereof |
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Application publication date: 20140827 |
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