CN105398135A - PI type ultra-thin double-sided copper foil substrate and manufacturing method thereof - Google Patents
PI type ultra-thin double-sided copper foil substrate and manufacturing method thereof Download PDFInfo
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- CN105398135A CN105398135A CN201410471614.8A CN201410471614A CN105398135A CN 105398135 A CN105398135 A CN 105398135A CN 201410471614 A CN201410471614 A CN 201410471614A CN 105398135 A CN105398135 A CN 105398135A
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- polyimide layer
- thermoset polyimide
- copper foil
- clad laminate
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Abstract
The present invention discloses a PI type ultra-thin double-sided copper foil substrate, which comprises a first copper foil, a first thermosetting polyimide layer, a commercial thermosetting polyimide layer, a second thermosetting polyimide layer and a second copper foil, wherein the total thickness of the first thermosetting polyimide layer, the second thermosetting polyimide layer and the commercial thermosetting polyimide layer is 10-60 [mu]m, and the thicknesses of the first copper foil and the second foil are 0.25-5 [mu]m. According to the present invention, the PI type ultra-thin double-sided copper foil substrate has characteristics of excellent ion migration property, excellent dimensional stability, excellent chemical resistance, excellent heat resistance, excellent adhesion, excellent dielectric property, thin product structure, high performance price ratio and excellent characteristics, meets the process technology of the semi-addition method, is suitable for the thin and high-density line requirement, and is the leading product in the industry; and according to the manufacturing method, the thermosetting polyimide layer is coated on the commercial thermosetting polyimide layer or the carrier copper foil, the direct pressing is performed on the line, and the 50-150 DEG C low-temperature pressing process and the polymerization curing temperature of less than or equal to 200 DEG C are used, such that the advantages of energy saving, simple process and high yield are provided.
Description
Technical field
The present invention relates to a kind of Double-sided copper clad laminate, particularly one has low Dk, Df characteristic and ultra-slim features, and is applicable to the high chi peace of semi-additive process, low bounce, the PI type Double-sided copper clad laminate that easy to operate, Ion transfer type is good.
Background technology
Under electronics and the multi-functional complicated market demand of communication product trend, the structure dress of circuit substrate needs lighter, thin, short, little; And functionally, then need the transmission of powerful and high-speed signal.Therefore, line density certainly will improve, and the distance to each other between support plate circuit is more and more nearer, and operating frequency is broadband towards height.Frivolous and the characteristic that can arbitrarily bend, makes soft board occupy very important status in the development moving towards demand portable information and communication electronic industry.
Because telecommunications product more attains little trend, order about soft board and must carry more strong large function, on the other hand because portable electronic product moves towards microminiature, also the high demand of high density soft board technology is and then driven, functionally then require powerful and under the situation of high frequency, high density, graph thinning, be proposed the screen for film-type flexible printed wiring board (FPC) in the market, be widely adopted in the small-sized electronic products such as mobile phone, numerical digit camera, digit camera.
In view of this, a kind of material for slim high-density line is urgently developed.
Summary of the invention
In order to solve the problem, the invention provides a kind of PI type ultrathin double-face copper clad laminate and manufacture method thereof, this PI type ultrathin double-face copper clad laminate has extremely low Dk, Df characteristic, there is splendid ion transport, endurance, heat resistance and dimensional stability, in operability, the technology of high chi peace characteristic conforms semi-additive process forms the requirement of fine-line, this PI type ultrathin double-face copper clad laminate is better than traditional GENERAL TYPE Double-sided copper clad laminate in characteristic and operability, be specially adapted to the slim high-density line of high-quality transmission demand, the PI type ultrathin double-face copper clad laminate cost performance that the present invention produces is high, characteristic is good, be in leading ranks in the industry.
The present invention in order to the technical scheme solving its technical problem and adopt is:
A kind of PI type ultrathin double-face copper clad laminate, by the first Copper Foil, first thermoset polyimide layer, commercialization thermoset polyimide layer, second thermoset polyimide layer and the second Copper Foil are formed, described commercialization thermoset polyimide layer is between described first thermoset polyimide layer and described second thermoset polyimide layer, described first thermoset polyimide layer is between described first Copper Foil and described commercialization thermoset polyimide layer, described second thermoset polyimide layer is between described commercialization thermoset polyimide layer and described second Copper Foil, wherein, described first thermoset polyimide layer, the thickness summation of commercialization thermoset polyimide layer and the second thermoset polyimide layer three is 10-60 micron, the thickness of described first Copper Foil and described second Copper Foil is 0.25-5 micron separately.
Say further, the thickness of described commercialization thermoset polyimide layer is 5-38 micron.
Say further, described first thermoset polyimide layer and described second thermoset polyimide layer are Thermocurable polyimide solid coating separately.
Say further, described first thermoset polyimide layer and described second thermoset polyimide layer are 2-6 micron separately.
Say further, described first Copper Foil and described second Copper Foil are carrier copper foil separately.Furthermore, the thickness of described first Copper Foil and described second Copper Foil is 1-2 micron separately.
Present invention also offers a kind of manufacture method of above-mentioned PI type ultrathin double-face copper clad laminate, carry out in the steps below:
Step one: be coated with the first thermoset polyimide layer and the second thermoset polyimide layer respectively on the upper and lower surface of commercialization thermoset polyimide layer, and with pressing mode direct on line pressing carrier copper foil on the first thermoset polyimide layer and the second thermoset polyimide layer, form the semi-finished product Double-sided copper clad laminate that the first thermoset polyimide layer and the second thermoset polyimide layer are in half polymerization semi-cured state;
Step 2: toast described semi-finished product Double-sided copper clad laminate, obtains the Double-sided copper clad laminate after the first thermoset polyimide layer and the second thermoset polyimide layer polymerizing curable;
Step 3: the carrier layer peeling off carrier copper foil, obtained PI type ultrathin double-face copper clad laminate finished product of the present invention.
Say further, in said method, in step one, adopt 50-150 DEG C of low temperature pressing, adopt in step 2 and be less than 200 DEG C of polymerizing curable temperature.
Present invention also offers the manufacture method of another kind of above-mentioned PI type ultrathin double-face copper clad laminate, carry out in the steps below:
Step one: be coated with thermoset polyimide layer on the Copper Foil of carrier copper foil, and with pressing mode direct on line, the first carrier copper foil being coated with the first thermoset polyimide layer and the Second support Copper Foil that is coated with the second thermoset polyimide layer are pressed on respectively the upper and lower surface of commercialization thermoset polyimide layer, form the semi-finished product Double-sided copper clad laminate that the first thermoset polyimide layer and the second thermoset polyimide layer are in half polymerization semi-cured state;
Step 2: toast described semi-finished product Double-sided copper clad laminate, obtains the Double-sided copper clad laminate after the first thermoset polyimide layer and the second thermoset polyimide layer polymerizing curable;
Step 3: peel off the first carrier copper foil and Second support Copper Foil carrier layer separately, obtained PI type ultrathin double-face copper clad laminate finished product of the present invention.
Say further, in said method, in step one, adopt 50-150 DEG C of low temperature pressing, adopt in step 2 and be less than 200 DEG C of polymerizing curable temperature.
The invention has the beneficial effects as follows: PI type ultrathin double-face copper clad laminate of the present invention is by the first Copper Foil, first thermoset polyimide layer, commercialization thermoset polyimide layer, second thermoset polyimide layer and the second Copper Foil are formed, wherein, described first thermoset polyimide layer, the thickness summation of commercialization thermoset polyimide layer and the second thermoset polyimide layer three is 10-60 micron, the thickness of described first Copper Foil and described second Copper Foil is 0.25-5 micron separately, this PI type ultrathin double-face copper clad laminate is a kind of ultrathin double-face copper clad laminate of full PI (Thermocurable polyimide) type, there is splendid ion transport, dimensional stability is good, resistance to chemical reagents and heat resistance, there is splendid heat-resisting quantity and adhesion, splendid dielectric property, thinner product structure, the technology meeting semi-additive process is more suitable for slim highdensity line requirements, cost performance is high, characteristic is good, be in leading ranks in the industry, and this PI type ultrathin double-face copper foil base plate making method is by being coated with thermoset polyimide layer on commercialization thermoset polyimide layer or carrier copper foil, and be directly pressed into half polymerization semi-cured state Double-sided copper clad laminate on line, the Copper Foil of institute's pressing is carrier copper foil, and adopt the low temperature process for pressing of 50-150 DEG C and the polymerizing curable temperature of less than 200 DEG C, not only energy-conservation, and operation is easy, yield is high.
Accompanying drawing explanation
Fig. 1 is PI type ultrathin double-face copper foil baseplate structure schematic diagram of the present invention.
Detailed description of the invention
Below by way of specific instantiation, the specific embodiment of the present invention is described, those skilled in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented in further, different ways, that is, not departing under disclosed category, can give different modifications and change.
Embodiment: a kind of PI type ultrathin double-face copper clad laminate, by the first Copper Foil 1, first thermoset polyimide layer 2, commercialization thermoset polyimide layer 3, second thermoset polyimide layer 4 and the second Copper Foil 5 are formed, described commercialization thermoset polyimide layer 3 is between described first thermoset polyimide layer 2 and described second thermoset polyimide layer 4, described first thermoset polyimide layer 2 is between described first Copper Foil 1 and described commercialization thermoset polyimide layer 3, described second thermoset polyimide layer 4 is between described commercialization thermoset polyimide layer 3 and described second Copper Foil 5, wherein, described first thermoset polyimide layer 2, the thickness summation of commercialization thermoset polyimide layer 3 and the second thermoset polyimide layer 4 three is 10-60 micron, the thickness of described first Copper Foil 1 and described second Copper Foil 5 is 0.25-5 micron separately.
Described commercialization thermoset polyimide layer can be general merchandise PI (namely having cured Thermocurable polyimide that is shaping and that sell), and as Du-pontENTypePI, the thickness of this commercialization thermoset polyimide layer is 5-38 micron.It is stable etc. that this commercialization thermoset polyimide layer is beneficial to the attachment of product in successive process, insulation, size.
Described first thermoset polyimide layer and described second thermoset polyimide layer are Thermocurable polyimide solid coating separately, such as refined gloomy self-control PI solid, code name HFCL-N-001C.Described first thermoset polyimide layer and described second thermoset polyimide layer are 2-6 micron separately.First and second thermoset polyimide layer described have low Dk Df, meet in follow-up product product high-speed and high-efficiency transmission requirement.
Described first Copper Foil and described second Copper Foil are carrier copper foil separately, and thickness is 0.25-5 micron, preferably 1-2 micron separately.Adopt more general method for making (adopting the mode of plating to electroplate last layer Copper Foil after the polyimide surface process) copper foil layer of carrier copper foil evenly circuit and signal better control, and adopt the thickness of 1-2 micron, superior dimensional stability can be had.Current copper clad laminate copper thickness is generally at 9-12 micron, and copper foil layer thickness of the present invention is at 1-2 micron, has less stress and shrinks, coordinate the technique of low temperature pressing, make the present invention meet the requirement of slim high-density line to dimensional stability in processing procedure.
The manufacture method of above-mentioned PI type ultrathin double-face copper clad laminate a: Du-pontENTypePI or carrier copper foil are provided, at the refined gloomy self-control PI solid HFCL-N-001C of upper and lower surface coating of Du-pontENTypePI, and with pressing mode pressing carrier copper foil, by the pressure that the gap between roller and roller give, make above-mentioned each layer close adhesion, form half polymerization semi-cured state Double-sided copper clad laminate; Also can be coated with refined gloomy self-control PI solid HFCL-N-001C on carrier copper foil, and be pressed on the upper and lower surface of Du-pontENTypePI with pressing mode, form half polymerization semi-cured state Double-sided copper clad laminate; Toast this Double-sided copper clad laminate, adhesion agent layer is solidified, obtain the PI type Double-sided copper clad laminate after polymerizing curable; Finally, peel off the carrier layer of carrier copper foil, to complete PI type ultrathin double-face copper clad laminate finished product of the present invention, carry out relevant sale by overcuring, itemize, inspection, packaging warehouse-in.
The PI type ultrathin double-face copper clad laminate of this example has following characteristic compared to the Double-sided copper clad laminate that Plating (plating), Sputtering (sputter), TPICasting (coating thermoplastic polyimides) and TPILamination (laminated thermoplastic polyimides) mode are obtained: have that splendid ion transport, dimensional stability are good, resistance to chemical reagents and a heat resistance; There is splendid heat-resisting quantity and adhesion, splendid dielectric property; Thinner product structure, meets the more applicable and slim highdensity line requirements of technology of semi-additive process, and the PI type ultrathin copper-clad laminate cost performance that the design produces is high, characteristic is good, is in leading ranks in the industry.
PI type ultrathin double-face copper clad laminate of the present invention compared to the Performance comparision of Plating, Sputtering, TPICasting and TPILamination as following table 1:
Table 1:
Zero: excellent; △: good; ×: not good.
Claims (10)
1. a PI type ultrathin double-face copper clad laminate, it is characterized in that: by the first Copper Foil (1), first thermoset polyimide layer (2), commercialization thermoset polyimide layer (3), second thermoset polyimide layer (4) and the second Copper Foil (5) are formed, described commercialization thermoset polyimide layer (3) is positioned between described first thermoset polyimide layer (2) and described second thermoset polyimide layer (4), described first thermoset polyimide layer (2) is positioned between described first Copper Foil (1) and described commercialization thermoset polyimide layer (3), described second thermoset polyimide layer (4) is positioned between described commercialization thermoset polyimide layer (3) and described second Copper Foil (5), wherein, described first thermoset polyimide layer (2), the thickness summation of commercialization thermoset polyimide layer (3) and the second thermoset polyimide layer (4) three is 10-60 micron, the thickness of described first Copper Foil (1) and described second Copper Foil (5) is 0.25-5 micron separately.
2. PI type ultrathin double-face copper clad laminate as claimed in claim 1, is characterized in that: the thickness of described commercialization thermoset polyimide layer is 5-38 micron.
3. PI type ultrathin double-face copper clad laminate as claimed in claim 1, is characterized in that: described first thermoset polyimide layer and described second thermoset polyimide layer are Thermocurable polyimide solid coating separately.
4. PI type ultrathin double-face copper clad laminate as claimed in claim 1, is characterized in that: described first thermoset polyimide layer and described second thermoset polyimide layer are 2-6 micron separately.
5. PI type ultrathin double-face copper clad laminate as claimed in claim 1, is characterized in that: described first Copper Foil and described second Copper Foil are carrier copper foil separately.
6. PI type ultrathin double-face copper clad laminate as claimed in claim 5, is characterized in that: the thickness of described first Copper Foil and described second Copper Foil is 1-2 micron separately.
7. a manufacture method for the PI type ultrathin double-face copper clad laminate according to any one of claim 1 to 6, is characterized in that: carry out in the steps below:
Step one: be coated with the first thermoset polyimide layer and the second thermoset polyimide layer respectively on the upper and lower surface of commercialization thermoset polyimide layer, and with pressing mode direct on line pressing carrier copper foil on the first thermoset polyimide layer and the second thermoset polyimide layer, form the semi-finished product Double-sided copper clad laminate that the first thermoset polyimide layer and the second thermoset polyimide layer are in half polymerization semi-cured state;
Step 2: toast described semi-finished product Double-sided copper clad laminate, obtains the Double-sided copper clad laminate after the first thermoset polyimide layer and the second thermoset polyimide layer polymerizing curable;
Step 3: the carrier layer peeling off carrier copper foil, obtained PI type ultrathin double-face copper clad laminate finished product of the present invention.
8. the manufacture method of PI type ultrathin double-face copper clad laminate as claimed in claim 7, is characterized in that: adopt 50-150 DEG C of low temperature pressing in step one, adopts and be less than 200 DEG C of polymerizing curable temperature in step 2.
9. a manufacture method for the PI type ultrathin double-face copper clad laminate according to any one of claim 1 to 6, is characterized in that: carry out in the steps below:
Step one: be coated with thermoset polyimide layer on the Copper Foil of carrier copper foil, and with pressing mode direct on line, the first carrier copper foil being coated with the first thermoset polyimide layer and the Second support Copper Foil that is coated with the second thermoset polyimide layer are pressed on respectively the upper and lower surface of commercialization thermoset polyimide layer, form the semi-finished product Double-sided copper clad laminate that the first thermoset polyimide layer and the second thermoset polyimide layer are in half polymerization semi-cured state;
Step 2: toast described semi-finished product Double-sided copper clad laminate, obtains the Double-sided copper clad laminate after the first thermoset polyimide layer and the second thermoset polyimide layer polymerizing curable;
Step 3: peel off the first carrier copper foil and Second support Copper Foil carrier layer separately, obtained PI type ultrathin double-face copper clad laminate finished product of the present invention.
10. the manufacture method of PI type ultrathin double-face copper clad laminate as claimed in claim 9, is characterized in that: adopt 50-150 DEG C of low temperature pressing in step one, adopts and be less than 200 DEG C of polymerizing curable temperature in step 2.
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| CN201410471614.8A CN105398135A (en) | 2014-09-16 | 2014-09-16 | PI type ultra-thin double-sided copper foil substrate and manufacturing method thereof |
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| CN201410471614.8A CN105398135A (en) | 2014-09-16 | 2014-09-16 | PI type ultra-thin double-sided copper foil substrate and manufacturing method thereof |
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Cited By (3)
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| CN108621513A (en) * | 2017-03-22 | 2018-10-09 | 昆山雅森电子材料科技有限公司 | Nano metal substrate and manufacturing method for ultra fine-line FPC and COF material |
| CN110366330A (en) * | 2018-04-11 | 2019-10-22 | 昆山雅森电子材料科技有限公司 | FPC multi-layer board and technique based on high frequency FRCC Yu high frequency dual platen |
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Application publication date: 20160316 |