CN205255668U - Low dielectricity glued membrane - Google Patents
Low dielectricity glued membrane Download PDFInfo
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- CN205255668U CN205255668U CN201520807430.4U CN201520807430U CN205255668U CN 205255668 U CN205255668 U CN 205255668U CN 201520807430 U CN201520807430 U CN 201520807430U CN 205255668 U CN205255668 U CN 205255668U
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Abstract
The utility model discloses a low dielectricity glued membrane, including sandwich layer, low dielectric glue film with from the type layer, the sandwich layer has a relative upper and lower surface, and low dielectric glue film has two -layerly and is low dielectric glue film and low dielectric glue film down respectively, upward low dielectric glue film and lower low dielectric glue film respectively formed at the upper and lower surface of sandwich layer, from the type layer have two -layerly and be respectively from the type layer with lower from the type layer, upward leave the type layer formed at the surface of last low dielectric glue film, lower surface of hanging down the dielectric glue film under formed at from the type layer. The utility model discloses a low dielectricity glued membrane not only electrical property is good, and good, the resistant solderability of compliance is high moreover, intensity is good after that, the operability is good to can carry out the pressfitting at low temperature, can use fast pressure equipment, and can make FPC have splendid evenness behind the pressfitting.
Description
Technical field
The utility model belongs to use in printed circuit board film technologies field, and particularly onePlant the glue-line with low-dielectric matter, be applicable to the interlaminar bonding of high frequency substrate product.
Background technology
Printed circuit board (PCB) is material indispensable in electronic product, and along with consumerElectronic product demand growth, also grows with each passing day for the demand of printed circuit board (PCB). ByHave flexible in flexible printed wiring board (FPC, FlexiblePrintedCircuit)Song and can three-dimensional space distribution etc. characteristic, electronic product is in compact and actionizationTrend trend under, slimming, structure dress densification, high speed, high heat conduction, touch-controlAnd energy-conservation be all action electronic product demand. And Netcom market is flourish, justRequire substrate high-frequency high-speed, driven the overall development of high frequency substrate material. OrderBefore be widely used computer and ancillary equipment, communication product and consumer electronicsProduct etc.
In high frequency field, radio infrastructure need to provide enough low Insertion Loss, abilityEffectively improve energy utilization rate. Along with 4G business is arrived, radio frequency products need to provideWider bandwidth, and backward compatible 3G, 2G business. Meanwhile, base station becomes moreCome littlely, more and more lighter, and be installed on tower top, this also just impels circuitPlate develops toward miniaturization.
Aspect the handheld devices such as panel computer, sky is being sought to allow by many manufacturersThe material of line miniaturization. In handheld device, comprised a lot of antennas (bluetooth, Wi-Fi,Cellular communication and GPS etc.), these antenna is arranged in very little space, and mutuallyMutually, can not disturb. Meanwhile, the Antenna Design of every company is all different, needsPossesses flexibility. This has just proposed very high requirement to circuit board material. In addition, whenMain the used high frequency film of front industry is LCP film, and it is comparatively expensive, and mustNeed just can operate at higher temperature, can not use again fast press apparatus, cause processingDifficulty. And although other resinae glued membrane does not have the problems referred to above, face electrically not good,The problems such as the too weak or mechanical strength of adhesion is bad.
Utility model content
In order to solve the problems of the technologies described above, the utility model provides a kind of low-dielectricGlued membrane, the low-dielectric glued membrane that the utility model makes is not only electrically good, Er QiekeFlexible good, soldering resistance is high, Bonding strength is good, operability is good, and can beLow temperature carries out pressing, can use to be installed with soon standbyly, and after pressing, can make FPC haveSplendid flatness.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of low-dielectric glued membrane, comprises sandwich layer, low dielectric glue-line and release layer. InstituteState sandwich layer and there is relative upper and lower surface; Described low dielectric glue-line has two-layer and dividesNot for to go up low dielectric glue-line and to bend down dielectric glue-line, described low dielectric glue-line and bending downDielectric glue-line is formed at respectively the upper and lower surface of described sandwich layer; Described release layer hasTwo-layer and be respectively release layer and lower release layer, described in described upper release layer is formed atThe surface of upper low dielectric glue-line, bends down dielectric glue-line described in described lower release layer is formed atSurface.
Low dielectric glue-line described in the utility model refer to Dk value < 2.3 (10GHz) andThe glue-line of Df value < 0.002 (10GHz).
The further technical side that the utility model adopts in order to solve its technical problemCase is:
Say further, the thickness of described sandwich layer is 5-50 μ m.
Say further, the thickness of every layer of described low dielectric glue-line is 10-75 μ m.
Say further described low dielectric glue-line, sandwich layer and bend down dielectric glue-line threeThe gross thickness of layer is 25-200 μ m.
Say further, sandwich layer is polyimide film.
Say further, described low dielectric glue-line is that heat curing-type polyimides is glue-line.
The beneficial effects of the utility model are: low-dielectric glued membrane master of the present utility modelIf be formed with respectively low dielectric glue-line on the upper and lower surface of sandwich layer, of the present invention lowDielectricity glued membrane is not only electrically good, and pliability is good, soldering resistance is high, thenIntensity is good, operability is good, and can carry out pressing at low temperature, can use fastBe installed with standbyly, and after pressing, can make FPC have splendid flatness.
Brief description of the drawings
Fig. 1 is the structural representation of low-dielectric glued membrane of the present utility model.
Detailed description of the invention
By specific instantiation, specific embodiment party of the present utility model is described belowFormula, those skilled in the art can understand this easily by content disclosed in the present specificationThe advantage of utility model and effect. The utility model also can other different mode giveTo implement, that is, under the category not disclosing departing from the utility model, can give differenceModification and change.
A kind of low-dielectric glued membrane, as shown in Figure 1, by sandwich layer 10, low dielectric glueLayer and release layer form, and described sandwich layer has relative upper and lower surface, described low JieElectricity glue-line has two-layer and is respectively low dielectric glue-line 21 and bends down dielectric glue-line22, described low dielectric glue-line 21 and bending down described in dielectric glue-line 22 is formed at respectivelyThe upper and lower surface of sandwich layer 10, described release layer has two-layer and is respectively releaseLayer 31 and lower release layer 32, described upper release layer 31 is formed at described low dielectricThe surface of glue-line 21, bends down dielectric glue-line described in described lower release layer 32 is formed at22 surface.
In the utility model, described low dielectric glue-line refers to Dk value < 2.3 (10GHz)And the glue-line of Df value < 0.002 (10GHz).
The thickness of described sandwich layer is 5-50 μ m.
The thickness of every layer of described low dielectric glue-line is 10-75 μ m.
Described low dielectric glue-line, sandwich layer and the gross thickness that bends down three layers of dielectric glue-lines are25-200μm。
Described sandwich layer is polyimide film.
Described low dielectric glue-line is that heat curing-type polyimides is glue-line.
Low-dielectric glued membrane of the present utility model can be applicable to ROLLTOROLL and puts downDesk-top board (consecutive production), also can be applicable in sheet work production. Can makeAlso can use traditional pressing with quick pressing, specific as follows:
1, press soon: pressing-in temp is 150 DEG C-180 DEG C, the fast time of pressing is60-180sec, pressing pressure is 80-100kgf;
Slaking: 150 DEG C-180 DEG C of temperature, time 1hr-2hr;
2, traditional pressing: pressing-in temp is 150 DEG C-180 DEG C, and pressing pressure is2.0-4.0Mpa, the time is 1hr-2hr.
The general BondPly of low-dielectric glued membrane of the present utility model and prior art,General BondingSheet and LCP carry out physical property comparison, and result is as following table 1Shown in.
Table 1:
As shown in Table 1, low-dielectric glued membrane of the present utility model is not only electrically good,And pliability is good, soldering resistance is high, Bonding strength is good, operability is good, andCan carry out pressing at low temperature, can use be installed with soon standby.
The general BondPly of low-dielectric glued membrane of the present utility model and prior art,General BondingSheet carries out downstream process comparison, and result is as shown in table 2 below.
Table 2:
As shown in Table 2, low-dielectric glued membrane of the present utility model has good processingCharacteristic, downstream process performance is good, can make FPC have splendid flatness after pressing.
Above-mentioned description and embodiment are only exemplary illustration principle of the present utility modelAnd effect, be not to restriction of the present utility model. Any the utility model that falls intoCreation within the scope of claim all belongs to the scope that the utility model is protected.
Claims (6)
1. a low-dielectric glued membrane, is characterized in that: comprising:
Sandwich layer (10), described sandwich layer has relative upper and lower surface;
Low dielectric glue-line, described low dielectric glue-line has two-layer and is respectively low dielectric glue-line (21) and bends down dielectric glue-line (22), described low dielectric glue-line (21) and bend down dielectric glue-line (22) and be formed at respectively the upper and lower surface of described sandwich layer (10);
Release layer, described release layer has two-layer and is respectively release layer (31) and lower release layer (32), described upper release layer (31) is formed at the surface of described low dielectric glue-line (21), bends down the surface of dielectric glue-line (22) described in described lower release layer (32) is formed at.
2. low-dielectric glued membrane as claimed in claim 1, is characterized in that: the thickness of described sandwich layer is 5-50 μ m.
3. low-dielectric glued membrane as claimed in claim 1, is characterized in that: the thickness of every layer of described low dielectric glue-line is 10-75 μ m.
4. low-dielectric glued membrane as claimed in claim 1, is characterized in that: described low dielectric glue-line, sandwich layer and the gross thickness that bends down three layers of dielectric glue-lines are 25-200 μ m.
5. low-dielectric glued membrane as claimed in claim 1, is characterized in that: described sandwich layer is polyimide film.
6. low-dielectric glued membrane as claimed in claim 1, is characterized in that: described low dielectric glue-line is that heat curing-type polyimides is glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520807430.4U CN205255668U (en) | 2015-10-19 | 2015-10-19 | Low dielectricity glued membrane |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520807430.4U CN205255668U (en) | 2015-10-19 | 2015-10-19 | Low dielectricity glued membrane |
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| Publication Number | Publication Date |
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| CN205255668U true CN205255668U (en) | 2016-05-25 |
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| CN201520807430.4U Active CN205255668U (en) | 2015-10-19 | 2015-10-19 | Low dielectricity glued membrane |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108307579A (en) * | 2017-01-11 | 2018-07-20 | 昆山雅森电子材料科技有限公司 | The low-dielectric loss FRCC substrates and preparation method thereof of structure are folded with combined type |
| CN108454192A (en) * | 2017-02-17 | 2018-08-28 | 昆山雅森电子材料科技有限公司 | PI type high-frequency high-speed transmission Double-sided copper clad laminates and preparation method thereof |
| CN108859316A (en) * | 2017-05-10 | 2018-11-23 | 昆山雅森电子材料科技有限公司 | Combined type LCP high-frequency high-speed Double-sided copper clad laminate and preparation method thereof |
| CN110876231A (en) * | 2018-09-03 | 2020-03-10 | 昆山雅森电子材料科技有限公司 | High-adhesion-strength LCP substrate and preparation method thereof |
-
2015
- 2015-10-19 CN CN201520807430.4U patent/CN205255668U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108307579A (en) * | 2017-01-11 | 2018-07-20 | 昆山雅森电子材料科技有限公司 | The low-dielectric loss FRCC substrates and preparation method thereof of structure are folded with combined type |
| CN108454192A (en) * | 2017-02-17 | 2018-08-28 | 昆山雅森电子材料科技有限公司 | PI type high-frequency high-speed transmission Double-sided copper clad laminates and preparation method thereof |
| CN108454192B (en) * | 2017-02-17 | 2020-01-14 | 昆山雅森电子材料科技有限公司 | Double-sided copper foil substrate for PI type high-frequency high-speed transmission and preparation method thereof |
| CN108859316A (en) * | 2017-05-10 | 2018-11-23 | 昆山雅森电子材料科技有限公司 | Combined type LCP high-frequency high-speed Double-sided copper clad laminate and preparation method thereof |
| CN108859316B (en) * | 2017-05-10 | 2020-02-21 | 昆山雅森电子材料科技有限公司 | Composite LCP high-frequency high-speed double-sided copper foil substrate and preparation method thereof |
| CN110876231A (en) * | 2018-09-03 | 2020-03-10 | 昆山雅森电子材料科技有限公司 | High-adhesion-strength LCP substrate and preparation method thereof |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |