CN204014268U - A kind of flexibility with effectiveness is covered metal substrate - Google Patents
A kind of flexibility with effectiveness is covered metal substrate Download PDFInfo
- Publication number
- CN204014268U CN204014268U CN201420309604.XU CN201420309604U CN204014268U CN 204014268 U CN204014268 U CN 204014268U CN 201420309604 U CN201420309604 U CN 201420309604U CN 204014268 U CN204014268 U CN 204014268U
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- CN
- China
- Prior art keywords
- flexibility
- metal substrate
- layer
- insulating film
- effectiveness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 46
- 239000002184 metal Substances 0.000 title claims abstract description 46
- 239000000758 substrate Substances 0.000 title claims abstract description 32
- 229920000642 polymer Polymers 0.000 claims abstract description 18
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 230000004888 barrier function Effects 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 238000004544 sputter deposition Methods 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 42
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 12
- 239000000203 mixture Substances 0.000 claims description 10
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 7
- 239000010949 copper Substances 0.000 claims description 7
- 229910052802 copper Inorganic materials 0.000 claims description 7
- 239000004925 Acrylic resin Substances 0.000 claims description 6
- 229920002799 BoPET Polymers 0.000 claims description 6
- 239000005041 Mylar™ Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 6
- 239000004411 aluminium Substances 0.000 claims description 6
- 229910052782 aluminium Inorganic materials 0.000 claims description 6
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 6
- 239000003822 epoxy resin Substances 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 6
- 229920001568 phenolic resin Polymers 0.000 claims description 6
- 239000005011 phenolic resin Substances 0.000 claims description 6
- 229920000647 polyepoxide Polymers 0.000 claims description 6
- 229920005749 polyurethane resin Polymers 0.000 claims description 6
- 239000004332 silver Substances 0.000 claims description 6
- 229910052709 silver Inorganic materials 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 4
- 229920001721 polyimide Polymers 0.000 claims description 4
- -1 Merlon Polymers 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 3
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 3
- 229920002647 polyamide Polymers 0.000 claims description 3
- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 claims description 3
- 229920006254 polymer film Polymers 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 230000008569 process Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 7
- 239000011889 copper foil Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The utility model discloses a kind of flexibility with effectiveness and cover metal substrate, comprising: polymer insulating film layer; The one side of described polymer insulating film layer forms a shielded metal layer through vacuum sputtering, on described shielded metal layer, through coating, forms an ink insulating barrier; The another side of described polymer insulating film layer is formed with conductor metal layer.Usefulness is: metal substrate pliability of the present utility model is good, has good effectiveness, has saved the technical process of the subsides screened film in the follow-up wiring board course of processing, and then has improved production efficiency.
Description
Technical field
The utility model relates to the flexibility that a kind of printed substrate with effectiveness uses and covers metal substrate; Belong to electronic product field.
Background technology
Printed substrate is material indispensable in electronic product, computer and ancillary equipment thereof, communication product and consumption electronic products etc. are at present widely used, and along with the sustainable growth of consumption electronic products demand, quantity demand for printed circuit board (PCB) is more and more, and quality requirement is also higher simultaneously.
It is base material that flexible copper clad foil substrate on existing market mainly be take polyimides, polyester, by adhesive and Copper Foil, be compounded to form, it is three ply board, or directly polyamic acid is coated on Copper Foil, through imidization, form, i.e. two laminates, such substrate is widely used in the consumption electronic products such as mobile phone, digital camera.But such substrate is simple wiring board material; do not there is effectiveness; development along with present smart machine; increasing electronic product requires to have electro-magnetic screen function in wiring board; at present; the realization of this function is mainly in manufacture process, to stick on shielding protection material at present, has increased procedure of processing and corresponding cost.
Utility model content
For solving the deficiencies in the prior art, the purpose of this utility model is to provide a kind of flexibility with effectiveness to cover metal substrate, can meet the high performance requirements of FPC industry.
In order to realize above-mentioned target, the utility model adopts following technical scheme:
The flexibility with effectiveness is covered a metal substrate, comprising: polymer insulating film layer; The one side of described polymer insulating film layer forms a shielded metal layer through vacuum sputtering, on described shielded metal layer, through coating, forms an ink insulating barrier; The another side of described polymer insulating film layer is formed with conductor metal layer, and this metal substrate has four-layer structure, calls " four laminar substrates " in the following text.
Between aforementioned polymer insulating film layer and conductor metal layer, be also coated with an adhesive layer, so, this metal substrate just has five-layer structure, calls " five laminar substrates " in the following text.
Preferably, aforementioned polymer insulating film layer is high molecular polymer film, a kind of the making in PETG, polyimides, PEN, Merlon, polyamide, and thickness is 10-200 micron.
Preferably, aforementioned shielded metal layer is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 50-3000nm.
Preferably, aforementioned ink insulating barrier is one or more the mixture in epoxy resin, polyacrylic resin, phenolic resins, mylar, polyurethane resin, and thickness is 5-50 micron.
Preferably, aforementioned adhesive layer is one or more the mixture in polyacrylic resin, epoxy resin, mylar, phenolic resins, polyurethane resin, and thickness is 5-50 micron.
Preferably, aforementioned conductor metal layer is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 5-100 micron.
Usefulness of the present utility model is: metal substrate pliability of the present utility model is good, has good effectiveness, has saved the technical process of the subsides screened film in the follow-up wiring board course of processing, and then has improved production efficiency.
Accompanying drawing explanation
Fig. 1 is the structural representation of four laminar substrates of the present utility model;
Fig. 2 is the structural representation of five laminar substrates of the present utility model.
The implication of Reference numeral in figure: 1, polymer insulating film layer, 2, shielded metal layer, 3, ink insulating barrier, 4, conductor metal layer, 5, adhesive layer.
Embodiment
Below in conjunction with the drawings and specific embodiments, the utility model is done to concrete introduction.
Referring to Fig. 1, a kind of flexibility with effectiveness of the present utility model is covered metal substrate, comprise: polymer insulating film layer 1, in its one side, through vacuum sputtering, form a shielded metal layer 2, then on shielded metal layer 2, through coating, form an ink insulating barrier 3, and be formed with conductor metal layer 4 at the another side of polymer insulating film layer 1, so, metal substrate total four-layer structure, i.e. " four laminar substrates " of preparation.Shielded metal layer 2 and conductor metal layer 4 can adopt identical material to make, and also can select different materials to make, as long as can realize utility model object.
Further, as a kind of improvement, as shown in Figure 2, be also coated with an adhesive layer 5 between polymer insulating film layer 1 and conductor metal layer 4, so, metal substrate just has five-layer structure, i.e. " five laminar substrates ".
As a kind of preferred, polymer insulating film layer 1 is high molecular polymer film, a kind of the making in PETG, polyimides, PEN, Merlon, polyamide, and thickness is 10-200 micron.
Preferably shielded metal layer 2 is one or more the mixture in silver, copper, aluminium, nickel as a kind of, and thickness is 50-3000nm.
Preferably ink insulating barrier 3 is one or more the mixture in epoxy resin, polyacrylic resin, phenolic resins, mylar, polyurethane resin as a kind of, and thickness is 5-50 micron.
Preferably adhesive layer 5 is one or more the mixture in polyacrylic resin, epoxy resin, mylar, phenolic resins, polyurethane resin as a kind of, and thickness is 5-50 micron.
Preferably conductor metal layer 4 is one or more the mixture in silver, copper, aluminium, nickel as a kind of, and thickness is 5-100 micron.
Metal substrate pliability of the present utility model is good, there is good effectiveness, saved the technical process of the subsides screened film in the follow-up wiring board course of processing, and then improved production efficiency, by choose reasonable and the collocation of layers of material and thickness, its performance can be guaranteed, the effectiveness that it is good can be guaranteed again.
More than show and described basic principle of the present utility model, principal character and advantage.The technical staff of the industry should understand, and above-described embodiment does not limit the utility model in any form, and all employings are equal to replaces or technical scheme that the mode of equivalent transformation obtains, all drops in protection range of the present utility model.
Claims (7)
1. the flexibility with effectiveness is covered a metal substrate, it is characterized in that, comprising: polymer insulating film layer; The one side of described polymer insulating film layer forms a shielded metal layer through vacuum sputtering, on described shielded metal layer, through coating, forms an ink insulating barrier; The another side of described polymer insulating film layer is formed with conductor metal layer.
2. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, between described polymer insulating film layer and conductor metal layer, is also coated with an adhesive layer.
3. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, described polymer insulating film layer is high molecular polymer film, a kind of making in PETG, polyimides, PEN, Merlon, polyamide, thickness is 10-200 micron.
4. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, described shielded metal layer is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 50-3000nm.
5. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, a kind of make of described ink insulating barrier in epoxy resin, polyacrylic resin, phenolic resins, mylar, polyurethane resin, thickness is 5-50 micron.
6. a kind of flexibility with effectiveness according to claim 2 is covered metal substrate, it is characterized in that, a kind of make of described adhesive layer in polyacrylic resin, epoxy resin, mylar, phenolic resins, polyurethane resin, thickness is 5-50 micron.
7. a kind of flexibility with effectiveness according to claim 1 is covered metal substrate, it is characterized in that, described conductor metal layer is one or more the mixture in silver, copper, aluminium, nickel, and thickness is 5-100 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420309604.XU CN204014268U (en) | 2014-06-12 | 2014-06-12 | A kind of flexibility with effectiveness is covered metal substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420309604.XU CN204014268U (en) | 2014-06-12 | 2014-06-12 | A kind of flexibility with effectiveness is covered metal substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204014268U true CN204014268U (en) | 2014-12-10 |
Family
ID=52054203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420309604.XU Expired - Fee Related CN204014268U (en) | 2014-06-12 | 2014-06-12 | A kind of flexibility with effectiveness is covered metal substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204014268U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104010436A (en) * | 2014-06-12 | 2014-08-27 | 苏州城邦达力材料科技有限公司 | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology |
-
2014
- 2014-06-12 CN CN201420309604.XU patent/CN204014268U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104010436A (en) * | 2014-06-12 | 2014-08-27 | 苏州城邦达力材料科技有限公司 | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee after: Suzhou Chengbang Dayi Material Technology Co.,Ltd. Address before: 215300 the southern side of Yingbin West Road, Ba Town, Kunshan City, Suzhou, Jiangsu Patentee before: SUZHOU CHENGBANGDALI MATERIAL TECHNOLOGY Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20141210 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |