CN202121866U

CN202121866U - Copper foil substrate of flexible circuit board

Info

Publication number: CN202121866U
Application number: CN2011202047413U
Authority: CN
Inventors: 王勇
Original assignee: HUBEI YOUBANG ELECTRONIC MATERIAL CO Ltd
Current assignee: HUBEI YOUBANG ELECTRONIC MATERIAL CO Ltd
Priority date: 2011-06-17
Filing date: 2011-06-17
Publication date: 2012-01-18
Anticipated expiration: 2021-06-17

Abstract

A copper foil substrate of a flexible circuit board relates to the field of flexible circuit boards. The copper foil substrate, from bottom to top, comprises an insulating base, a copper foil and a protective film, wherein the copper foil is bonded on a surface of the insulating base, the protective film is coated on the copper foil, and a plurality of grooves are arranged along a deflection direction on the other surface of the polyimide base. The structure increases strength of the flexible circuit board. The insulating base and the grooves enhance flexibility of the flexible circuit board. The protective film protects the copper foil conductive line. Enhanced flexibility and strength enable that the flexible circuit board can satisfy need of high performance products. With reduced manufacturing cost, the copper foil substrate is easy to promote.

Description

A kind of flexible PCB copper clad laminate

Technical field

The utility model relates to flexible PCB, refers in particular to a kind of flexible PCB copper clad laminate.

Background technology

General printed circuit board (PCB) is because therefore the many electronic component of top carrying and must being fixedly mounted in the equipment, must have certain thickness and mechanical strength.Flexible PCB (being FPC) is the printed circuit board (PCB) of processing with flexible insulating substrate.It can bending, coiling etc., can not belong to the limitation of installing space with installing space flexible topology, thereby it is integrated to realize that the electronic devices and components assembling is connected with lead, has broken through the limitation of traditional interconnection technique.Also have characteristics in light weight, that volume is little, thermal diffusivity is good.

The application of flexible PCB constantly enlarges; The existing application widely in fields such as camera, minicom, household appliances and communications; At aspects such as notebook computer, LCD, digital camera, mobile phones, the application prospect of flexible PCB is very greatly very big especially.

Requirement to copper clad laminate in the flexible PCB is very high.Along with the high performance of electronic product, to the copper clad laminate of flexible PCB require increasingly high.In the prior art, the substrate of Copper Foil is double-deck flexible base plate, and cost of manufacture is high, and intensity and precision can not satisfy the needs of premium quality product.

Summary of the invention

The utility model is intended to overcome the above-mentioned deficiency of prior art, and a kind of flexible PCB copper clad laminate is provided.Can improve the pliability of flexible PCB, intensity also improves, and intensity and precision can satisfy the needs of premium quality product.

For this reason, the technical scheme of a kind of flexible PCB copper clad laminate of the utility model is following:

A kind of flexible PCB copper clad laminate of structure the utility model; Comprise insulated substrate, Copper Foil and diaphragm from bottom to top successively, Copper Foil is adhered on the surface of insulated substrate, and diaphragm is coated on the Copper Foil; And, on another surface of insulated substrate, be shaped on many grooves along the deflection direction.

Technique scheme is further set forth:

Insulated substrate is a polyimide layer.

Diaphragm is the PE film.

A kind of flexible PCB copper clad laminate of the utility model is compared with prior art, and its beneficial effect is: one of which, be followed successively by the structure of insulated substrate, Copper Foil and diaphragm from bottom to top, and the intensity of flexible PCB is increased.Its two, the existence of insulated substrate, and on another surface of insulated substrate, be shaped on many grooves along the deflection direction makes the flexible enhancing of flexible PCB.Its three, diaphragm shields to the Copper Foil conducting wire.Its four, the raising of pliability and intensity makes it can satisfy the needs of premium quality product.Its five, cost of manufacture reduces, and is beneficial to popularization.

Description of drawings

Fig. 1 is the utility model sketch map;

Fig. 2 is the utility model sketch map (the levels position reversed in order of Fig. 2 and Fig. 1).

Among the figure: 1, insulated substrate; 2, Copper Foil; 3, diaphragm; 4, groove.

Embodiment

Below, in conjunction with accompanying drawing, introduce the embodiment of the utility model.

As shown in Figure 1; A kind of flexible PCB copper clad laminate of the utility model; Comprise insulated substrate 1, Copper Foil 2 and diaphragm 3 from bottom to top successively, Copper Foil 2 is adhered on the surface of insulated substrate 1, and diaphragm 3 is coated on the Copper Foil 2; And, on another surface of insulated substrate 1, be shaped on many grooves 4 along the deflection direction.

In Fig. 2, showing has many said grooves 4.

Insulated substrate is a polyimide layer, and polyimides is usually said polyimide resin.

Diaphragm is the PE film.

The above only is the preferred embodiment of the utility model, is not the technical scope of the utility model is done any restriction.The technical staff of the industry; Under the inspiration of present technique scheme; Can make some distortion and revise, every technical spirit according to the utility model all still belongs in the scope of the utility model technical scheme above any modification, equivalent variations and modification that embodiment did.

Claims

1. flexible PCB copper clad laminate; It is characterized in that: comprise successively that from bottom to top insulated substrate, Copper Foil and diaphragm, Copper Foil are adhered on the surface of insulated substrate, diaphragm is coated on the Copper Foil; And, on another surface of insulated substrate, be shaped on many grooves along the deflection direction.