CN111818750B - Functional module and electronic equipment - Google Patents
Functional module and electronic equipment Download PDFInfo
- Publication number
- CN111818750B CN111818750B CN202010478615.0A CN202010478615A CN111818750B CN 111818750 B CN111818750 B CN 111818750B CN 202010478615 A CN202010478615 A CN 202010478615A CN 111818750 B CN111818750 B CN 111818750B
- Authority
- CN
- China
- Prior art keywords
- groove
- circuit board
- flexible circuit
- functional
- accommodating groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
Abstract
The application discloses function module and electronic equipment belongs to electronic equipment technical field. The function module may specifically include: the flexible circuit board comprises a functional part, a flexible circuit board and a bracket; the bracket is provided with an accommodating groove, and the bottom of the accommodating groove is provided with a through hole; the flexible circuit board is arranged in the accommodating groove and is respectively connected with the side wall of the accommodating groove and the groove bottom of the accommodating groove in an adhesive manner; the functional part is embedded in the through hole and is electrically connected with the flexible circuit board. In the functional module provided by the embodiment of the invention, the bonding area between the flexible circuit board and the bracket can be obviously increased, so that the sealing property between the flexible circuit board and the bracket can be effectively improved, and the risk of glue overflow is effectively reduced.
Description
Technical Field
The application belongs to the technical field of electronic equipment, and particularly relates to a functional module and electronic equipment.
Background
With the rapid development of the electronic industry, the functions of electronic devices are becoming more and more powerful. In order to improve the intelligence of electronic devices, fingerprint recognition technology has been widely applied to electronic devices in recent years.
In practical application, when the fingerprint module set up on electronic equipment, inside avoiding impurity such as water, dust to enter into electronic equipment through the fingerprint module, can do waterproof structural design to the fingerprint module usually. The fingerprint module generally includes: a chip, a decorative ring, and a Flexible Circuit board (FPC); the chip is arranged on the flexible circuit board and is electrically connected with the flexible circuit board; the decorative ring is provided with a through hole, and an adhesive lip edge is arranged along the circumferential direction of the through hole; the chip is embedded in the through hole, and the bonding lip edge is connected with the flexible circuit board in a bonding mode. Thus, even if water, dust or other impurities enter the through hole, they do not enter the electronic device through the gap between the bonding lip and the flexible circuit board.
In the prior art, in order to reduce the area of the electronic device occupied by the fingerprint module, the bonding lip edge is usually designed to be narrower. However, this results in a reduced bonding area between the flexible circuit board and the bonding lip, which in turn results in a reduced sealing performance and an increased risk of flash.
Disclosure of Invention
The embodiment of the application aims to provide a functional module and electronic equipment, and the problems of low sealing performance and easiness in glue overflow when the flexible circuit board is connected with a support in the functional module in a bonding mode can be solved.
In order to solve the technical problem, the present application is implemented as follows:
in a first aspect, an embodiment of the present application provides a functional module, where the functional module includes: the flexible circuit board comprises a functional part, a flexible circuit board and a bracket;
the bracket is provided with an accommodating groove, and the bottom of the accommodating groove is provided with a through hole;
the flexible circuit board is arranged in the accommodating groove and is respectively connected with the side wall of the accommodating groove and the groove bottom of the accommodating groove in an adhering manner;
the functional part is embedded in the through hole and electrically connected with the flexible circuit board.
In a second aspect, an embodiment of the present application provides an electronic device, including: the functional module is provided.
In this application embodiment, because flexible circuit board sets up in the holding tank, and can respectively with the lateral wall of holding tank bond connection between the tank bottom of holding tank, like this, just can increase bonding area between flexible circuit board and the support, and then effectively promote the leakproofness of functional module, reduce the excessive risk of gluing.
Drawings
Fig. 1 is a schematic structural diagram of a functional module according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the functional module shown in FIG. 1;
FIG. 3 is an enlarged schematic view of the position C in FIG. 2;
FIG. 4 is a second schematic structural diagram of a functional module according to an embodiment of the present invention;
FIG. 5 is an enlarged schematic view of the position D in FIG. 4;
FIG. 6 is a third schematic structural diagram of a functional module according to the present invention;
FIG. 7 is an enlarged schematic view of the F position of FIG. 6;
fig. 8 is a schematic structural diagram of a flexible circuit board provided in an embodiment of the present invention;
FIG. 9 is a flowchart illustrating steps of a method for processing a functional module according to an embodiment of the present invention;
fig. 10 is a schematic diagram of a transfer function module according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it should be understood that the described embodiments are some, but not all embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any inventive effort, shall fall within the scope of protection of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application are capable of operation in sequences other than those illustrated or described herein. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The functional module, the processing method of the functional module, and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings.
The fingerprint module include but not limited to electric capacity fingerprint module, this application embodiment only exemplifies with electric capacity fingerprint module, other refer to the execution can.
Among the prior art, the decoration circle in the electric capacity fingerprint module encircles fingerprint chip setting usually for play protect, decorate, the effect that static dredged fingerprint chip. In order to reduce the volume of the electronic device occupied by the fingerprint module, the bonding lip of the bezel is usually designed to be narrower. However, this results in a reduced bonding area between the bonding lip and the flexible circuit board, which in turn results in a reduced sealing performance and an increased risk of glue flash.
In practical application, the flexible circuit board and the reinforcing steel sheet are welded together through hot melt adhesive connection between the bonding lip edge and the flexible circuit board and laser spot welding, so that the sealing performance between the bonding lip edge and the flexible circuit board is improved. However, not only the decorative ring and the reinforced steel sheet are limited to be made of metal materials, but also additional dispensing and pressure maintaining curing equipment is required due to the characteristics of the hot melt adhesive, so that the dispensing steps are increased, and the time is long. Moreover, since the glue overflowing effect is difficult to control, glue overflowing is easy to occur, manual glue wiping is needed, and the glue dispensing cost is obviously increased.
Based on the above problem, this application embodiment provides a functional module, functional module includes: the flexible circuit board comprises a functional part, a flexible circuit board and a bracket; the bracket is provided with an accommodating groove, and the bottom of the accommodating groove is provided with a through hole; the flexible circuit board is arranged in the accommodating groove and is respectively connected with the side wall of the accommodating groove and the groove bottom of the accommodating groove in an adhering manner; the functional part is embedded in the through hole and electrically connected with the flexible circuit board.
In the embodiment of this application, because flexible circuit board set up in the holding tank, just flexible circuit board can respectively with bonding connection between the lateral wall of holding tank, the tank bottom of holding tank, like this, just can effectively increase flexible circuit board with bonding area between the holding tank, and then the leakproofness of effective lifting function module reduces the excessive risk of gluing.
The functional module include but not limited to the fingerprint module, still can be for infrared sensor module, flash light module, camera module etc. this application embodiment only uses the fingerprint module to explain as the example, other reference executions can.
Referring to fig. 1, a schematic structural diagram of a functional module according to an embodiment of the present invention is shown. Referring to fig. 2, a schematic cross-sectional structure diagram of the functional module shown in fig. 1 is shown. Referring to fig. 3, an enlarged structural view of the C position in fig. 2 is shown. The function module 2 may specifically include: a functional member 20, a flexible circuit board 21, and a support 22; the bracket 22 is provided with a receiving groove 221, and a through hole 222 is formed in the groove bottom 2211 of the receiving groove 221; the flexible circuit board 21 is disposed in the accommodating groove 221, and the flexible circuit board 21 is respectively bonded to the side wall 2212 of the accommodating groove 221 and the groove bottom 2211 of the accommodating groove 221; the functional element 20 is embedded in the through hole 222, and the functional element 20 is electrically connected with the flexible circuit board 21. In the functional module 2 according to the embodiment of the present invention, the bonding area between the flexible circuit board 21 and the bracket 22 can be significantly increased, so that the sealing performance between the flexible circuit board 21 and the bracket 22 can be effectively improved, and the risk of glue overflow can be effectively reduced.
In this embodiment of the application, the flexible circuit board 21 may be respectively bonded to the side walls 2212 of the accommodating grooves 221 and the groove bottoms 2211 of the accommodating grooves 221 by structural adhesives. In practical application, because the structural adhesive dispensing step is simple and convenient, structural adhesive can be dispensed on the side surface of the flexible circuit board 21 close to the groove bottom 2211 during dispensing, and when the flexible circuit board 21 is bonded with the groove bottom 2211, redundant structural adhesive can overflow between the side surface of the flexible circuit board 21 and the side wall 2212 of the accommodating groove 221, so that the side surface of the flexible circuit board 21 and the side wall 2212 of the accommodating groove 221 are bonded through the structural adhesive. Therefore, the bonding area between the flexible circuit board 21 and the support 22 can be increased, the sealing performance can be improved, the excessive structural adhesive can be prevented from overflowing out of the accommodating groove 221, the adhesive overflowing is reduced, and the cost is reduced. Moreover, in the embodiment of the application, the glue dispensing process of the structural glue is simple, the steps are few, glue overflow can be effectively reduced, and the processing cost is further saved.
As shown in fig. 1-3, in the embodiment of the present application, the shape of the flexible circuit board 21 matches the shape and size of the receiving groove 221, so that the flexible circuit board 21 can be disposed in the receiving groove 221 to be adhesively connected therebetween, thereby increasing the adhesive area, improving the sealing performance, and reducing the adhesive overflow.
In the embodiment of the present application, the sealing performance between the flexible circuit board 21 and the support 22 can be improved by increasing the glue storage amount of the structural glue between the flexible circuit board 21 and the support 22. Specifically, a glue storage groove may be formed between the groove bottom 2211 of the accommodating groove 221 and the flexible circuit board 21; the glue reservoir extends circumferentially of the through hole 222. The glue storage amount of the structural glue is increased through the glue storage groove, and the bonding strength and the sealing property between the flexible circuit board 21 and the support 22 are further improved.
In practical application, a glue storage groove extending along the circumferential direction of the through hole 222 is formed between the groove bottom 2211 and the flexible circuit board 21, so that the problem that when the flexible circuit board 21 is arranged at the groove bottom 2211, due to the fact that a large amount of structural glue is extruded due to extrusion, the sealing performance is poor due to the fact that the glue storage amount between the flexible circuit board 21 and the groove bottom 2211 is small can be solved. In the embodiment of the application, the glue capacity can be effectively improved through the glue storage groove, and then the bonding strength and the sealing property between the flexible circuit board 21 and the support 22 can be effectively improved.
In the embodiment of the present application, the bracket 22 includes but is not limited to a decorative ring, and the embodiment of the present application is only explained by taking the decorative ring as an example, and other references may be implemented.
In practical application, decorate the circle and can be materials such as metal or conductive silica gel, will decorate the circle and encircle function piece 20 setting, on being connected to electronic equipment's mainboard through the cotton function part 20 that plays protection, decorates, dredge the effect of static to function piece 20.
Optionally, the glue storage tank may include: the first groove 231; the first groove 231 is provided on the groove bottom 2211 at a position where it is bonded to the flexible circuit board 21.
Referring to fig. 4, a second schematic structural diagram of the functional module according to the embodiment of the invention is shown. Referring to fig. 5, an enlarged schematic view of the D position of fig. 4 is shown. In this embodiment of the application, the first groove 231 is disposed at the bonding position of the groove bottom 2211 and the flexible circuit board 21, so that the glue storage amount of the structural glue can be effectively increased, and the sealing performance between the functional component 20 and the bracket 22 can be further increased.
As shown in fig. 4-5, in the case that the first groove 231 is disposed on the groove bottom 2211, since the first groove 231 can effectively increase the glue storage amount of the structural glue, and further increase the bonding strength and the sealing property between the flexible circuit board 21 and the bracket 22, the side wall 2212 of the accommodating groove 221 can be removed, so that the shape and the size of the flexible circuit board 21 are not limited by the accommodating groove 221, thereby improving the compatibility of the functional module. However, it is understood that, in the case that the first groove 231 is disposed on the groove bottom 2211, the side wall 2212 of the accommodating groove 221 may also be disposed as shown in fig. 1 and fig. 3, and this embodiment of the present application is only given by way of illustration, and those skilled in the art may perform the combination arrangement according to practical situations, and this embodiment of the present application is not limited thereto.
Specifically, the number of the first grooves 231 may be one or more (at least two); when the number of the first grooves 231 is one, one first groove 231 extends in the circumferential direction of the through-hole 222; when the number of the first grooves 231 is plural, the sizes of the plural first grooves 231 are the same or different.
In practical application, when the number of the first grooves 231 is one, the processing difficulty of the first grooves 231 can be effectively reduced, and the processing cost is reduced. When the number of the first grooves 231 is plural (at least two), the plural first grooves 231 having the same size or different sizes may be formed by laser on the laser texture formed on the groove bottom 2211, so that the laser texture may increase the glue storage amount, thereby increasing the sealing property between the bracket 22 and the flexible circuit board 21. It is understood that the shape and/or size of the at least two first grooves 231 formed by laser may be the same or different, and those skilled in the art can design them according to actual needs.
In the embodiment of the present application, a plurality of first grooves 231 having the same or different shapes and/or sizes may also be formed by providing a roughened structure (or a concave-convex structure) on the groove bottom 2211, so that the glue storage amount may also be effectively increased, and the sealing property between the bracket 22 and the flexible circuit board 21 may also be increased. It is understood that, a person skilled in the art may set the number, shape, size, etc. of the first grooves 231 according to practical situations, and the embodiment of the present application is not particularly limited thereto.
In practical applications, the first groove 231 may be further disposed on the sidewall 2212 of the accommodating groove 221, which is equivalent to forming a glue overflow groove on the sidewall 2212 of the accommodating groove 221, so as to increase the glue storage amount of the glue to enhance the sealing property and the bonding strength, and store the excess glue to prevent the glue from overflowing.
Optionally, the glue storage tank may further include: a second groove 232; the second groove 232 is disposed on the flexible circuit board 21 at a position adhered to the groove bottom 2211.
Referring to fig. 6, a third schematic structural diagram of the functional module according to the present invention is shown. Referring to fig. 7, an enlarged structural view of the position F in fig. 6 is shown. In this application embodiment, can also store glue in second recess 232 through set up second recess 232 on flexible circuit board 21 with the bonding position of tank bottom 2211 to increase glue and store up gluey volume, promote the leakproofness of flexible circuit board 21 and support 22.
As shown in fig. 6-7, in the case that the second groove 232 is disposed on the flexible circuit board 21, since the second groove 232 is used to increase the glue storage amount of the structural glue, and further, the bonding strength and the sealing property between the flexible circuit board 21 and the bracket 22 are improved, the side wall 2212 of the accommodating groove 221 can be removed, and thus, the shape and the size of the flexible circuit board 21 are not limited by the accommodating groove 221, and the compatibility of the functional module is improved. Of course, it is understood that, in the case that the second groove 232 is disposed on the flexible circuit board 21, the side wall 2212 of the receiving groove 221 may also be disposed as shown in fig. 1 to 3, and this embodiment of the present application only provides an illustrative description, and a person skilled in the art may perform the combination arrangement according to practical situations, and this embodiment of the present application is not limited thereto.
Referring to fig. 8, a schematic structural diagram of a flexible circuit board provided in an embodiment of the present invention is shown. The flexible circuit board 21 may include a substrate 211, and protective films 212 respectively disposed on both sides of the substrate 211; the second groove 232 is provided on the protective film 212 near the functional part 20, and the notch of the second groove 232 faces the groove bottom 2211 of the accommodating groove 221.
In the embodiment of the present application, the second groove 232 is disposed on the protective film 212 close to the functional component 20, so that the trace and performance of the substrate 211 on the flexible circuit board 21 are not affected, the second groove 232 for storing glue can be formed, and the second groove 232 can be processed more simply and at a lower cost.
In practical applications, the substrate 211 may include a PI Film 2111 (Polyimide Film) in the middle, and wiring layers 2112 (copper foil wires, etc.) respectively disposed on two sides of the PI Film.
Optionally, in a direction away from the through hole 222, the first width of the second groove 232 is smaller than the second width between the inner wall of the through hole 222 to the side wall 2212 of the receiving groove 221.
In the embodiment of the present application, in order to make the bonding strength between the bracket 22 and the flexible circuit board 21 higher and the structure more stable, the first width of the second groove 232 is generally set smaller than the second width between the inner wall of the through hole 222 and the side wall 2212 of the receiving groove 221.
In this application embodiment, store up gluey groove and can include simultaneously: a first groove 231 and a second groove 232; or the glue storage tank includes any one of the first groove 231 and the second groove 232, which can be set by a person skilled in the art according to practical situations, and the embodiment of the present application does not limit this.
Optionally, the functional module 2 further includes a reinforcing plate 24; the reinforcing plate 24 is attached to the protective film 212 far away from the functional element 20, and the side of the reinforcing plate 24 far away from the protective film 212 is flush with the notch of the receiving groove 221.
In the embodiment of the present application, the reinforcing plate 24 is attached to the protective film 212 far away from the functional element 20, so that the structural stability and strength of the flexible circuit board 21 can be enhanced. In practical applications, the reinforcing plate 24 may be a hard material with conductivity, such as a steel plate, a conductive plastic, etc. In this way, the reinforcing plate 24 can support and protect the functional element 20 and the FPC, and can be connected to a ground of the electronic device (for example, a ground of a main control board inside the electronic device) so as to be used for discharging static electricity.
Optionally, an opening is further formed on the side wall 2212 of the receiving groove 221, and one end of the flexible circuit board 21 protrudes through the opening.
In practical applications, the flexible circuit board 21 protrudes through an opening formed in the side wall 2212 of the receiving groove 221, so that the flexible circuit board can be connected to a main control board of an electronic device.
Optionally, the functional element 20 may specifically include: at least one of a fingerprint sensor, an image sensor, an infrared sensor.
In the embodiment of the present application, the functional component 20 may specifically be a fingerprint sensor, and the functional module is equivalent to a fingerprint module; the functional component 20 is an image sensor, and the functional module is equivalent to a camera module; the functional element 20 is an infrared sensor, and the functional module is equivalent to an infrared module. Of course, it is understood that the functional component 20 includes, but is not limited to, the above fingerprint sensor, image sensor, infrared sensor, and those skilled in the art can select the corresponding component according to the actual situation, and the embodiment of the present application is not limited thereto.
Optionally, the function module may further include: a cover plate 25; the cover plate 25 is attached to the side of the functional element 20 remote from the flexible circuit board 21.
In practical applications, the cover plate 25 is used for protecting the functional element 20, and usually, the cover plate 25 and the functional element 20 can be adhesively connected by an adhesive (structural adhesive or the like). The cover plate 25 can be made of glass, ceramic, sapphire and the like, so that the functional piece 20 can be protected, and the appearance attractiveness of the functional module can be improved.
To sum up, the functional module according to the embodiment of the present invention at least has the following advantages:
in the embodiment of this application, because the flexible circuit board among the functional module sets up in the holding tank, just flexible circuit board can respectively with the lateral wall of holding tank bond joint between the tank bottom of holding tank, like this, just can effectively increase flexible circuit board with bonding area between the holding tank effectively promotes the leakproofness of functional module, reduces the excessive risk of gluing.
The embodiment of the application also provides a processing method of the functional module. Referring to fig. 9, a flow chart of steps of a method for processing a functional module according to the present invention is shown. The method may specifically comprise the steps of:
step 101: and electrically connecting the functional part with the flexible circuit board to form the functional assembly.
In the embodiment of the application, the functional part can be firstly welded on the flexible circuit board to form the functional assembly, so that the transfer is convenient, and the turnover can be rapidly carried out.
Step 102: and bonding the functional assembly on the carrier plate to form the transfer functional assembly.
Referring to fig. 10, a schematic diagram of a transfer function assembly of an embodiment of the present invention is shown. As shown in fig. 10, the functional device 2 can be bonded to the carrier 30 by the carrier tape 31, which can prevent the functional device 2 from falling off or deviating during the transfer process and reduce the transfer cost.
In practical applications, a plurality of functional modules may be arranged on the carrier plate according to a preset arrangement form (for example, a form of multiple rows and multiple columns which are uniformly arranged), so that the plurality of functional modules can be transferred through one carrier plate, and the transfer is more efficient.
Step 103: dispensing in the dispensing area of the transfer functional assembly to form a functional assembly with glue; the dispensing area is an area extending along the circumferential direction of the functional piece on the flexible circuit board.
In practical application, the functional element may be disposed at a central position of the flexible circuit board, and a dispensing area along a circumferential direction of the functional element is reserved on the flexible circuit board. The dispensing region in the embodiments of the present application may be a region extending along the circumferential direction of the functional element.
In the embodiment of the application, the structure of the dispensing area is dispensed to form the functional assembly with the adhesive, so that the dispensing process is simpler and faster, and the dispensing cost can be effectively reduced.
Step 104: sleeving a support on the functional component with the adhesive and removing the support plate to form a functional module; the flexible circuit board is arranged in the accommodating groove of the support, and the functional piece is embedded in the through hole of the support.
In this application embodiment, directly overlap the support and locate on the function block is glued in the area, make flexible circuit board hold in the holding tank, and the function piece inlays in the through-hole of locating the support, like this, because some structure of some glue region is glued, consequently, just can glue the bonding through the structure between the tank bottom of flexible circuit board and holding tank.
In practical application, due to the flowability of the structural adhesive, when the flexible circuit board is bonded with the bottom of the accommodating groove, the redundant structural adhesive overflows between the side walls of the flexible circuit board and the accommodating groove, so that the side walls of the flexible circuit board and the accommodating groove can be bonded through the overflowing structural adhesive. Moreover, because the carrier plate adhesive tape has the functions of adhesion and blocking, the structural adhesive can be fully filled between the flexible circuit board and the side wall of the accommodating groove without overflowing, and therefore, the functional module is transferred through the carrier plate adhesive tape, the sealing performance and the waterproof performance of the functional module can be improved, and the processing cost of the functional module can be saved.
In summary, the processing method according to the embodiment of the present invention at least includes the following advantages:
in the embodiment of this application, bond the functional unit on the support plate through the support plate sticky tape and transport to can transport the functional unit in batches, and because the bonding of support plate sticky tape and block the effect, both can make the structure glue fully fill between the lateral wall of flexible circuit board and holding tank, improve the bonding area between flexible circuit board and the support, promote the leakproofness, can avoid the structure glue again excessive, save the processing cost of function module.
An embodiment of the present application further provides an electronic device, where the electronic device specifically includes: the functional module is provided.
The electronic device according to the embodiment of the application can be a smart phone, a computer, a multimedia player, an electronic reader, a wearable device and the like.
In practical application, the function module includes but not limited to the fingerprint module, still can be infrared sensor module, flash light module, camera module etc.. The number of the function modules may be one or more, for example, the electronic device may include both the fingerprint module and the camera module, and a person skilled in the art may set the function modules according to actual situations, which is not specifically limited in this embodiment of the present application.
In the embodiment of the application, because the flexible circuit board among the functional module sets up in the holding tank, and the flexible circuit board can respectively with the lateral wall of holding tank, the bonding connection between the tank bottom of holding tank, like this, just can effectively increase the bonding area between flexible circuit board and the holding tank, effectively promote the leakproofness of functional module, reduce the excessive risk of gluing, and then promote electronic equipment's complete machine waterproof performance and reduce electronic equipment's processing manufacturing cost.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the scope of the invention as defined by the appended claims.
Claims (7)
1. The utility model provides a function module which characterized in that, function module includes: the flexible circuit board comprises a functional part, a flexible circuit board and a bracket;
the bracket is provided with an accommodating groove, and the bottom of the accommodating groove is provided with a through hole;
the flexible circuit board is arranged in the accommodating groove and is respectively connected with the side wall of the accommodating groove and the groove bottom of the accommodating groove in an adhering manner;
the functional part is embedded in the through hole and is electrically connected with the flexible circuit board;
a glue storage groove is formed between the groove bottom and the flexible circuit board;
the glue storage groove extends along the circumferential direction of the through hole;
store up gluey groove and include: a second groove;
the second groove is arranged on the flexible circuit board and is bonded with the bottom of the groove;
the flexible circuit board comprises a substrate and protective films arranged on two sides of the substrate respectively;
the second groove is arranged on the protective film close to the functional piece, and the notch of the second groove faces to the bottom of the accommodating groove;
store up gluey groove and include: a first groove;
the first groove is arranged at the position, bonded with the flexible circuit board, on the groove bottom.
2. The functional module according to claim 1, characterized in that a first width of the second recess in a direction away from the through-hole is smaller than a second width between an inner wall of the through-hole and a side wall of the receiving groove.
3. The functional module of claim 1, further comprising a reinforcement plate;
the reinforcing plate is attached to the protective film far away from the functional piece, and the side face, far away from the protective film, of the reinforcing plate is flush with the notch of the accommodating groove.
4. The functional module according to claim 1, wherein the number of the first grooves is at least two;
the shapes of at least two first grooves are the same or different.
5. The functional module according to claim 1, wherein an opening is further formed on a side wall of the receiving groove, and one end of the flexible circuit board protrudes through the opening.
6. The function module of claim 1, wherein the function comprises: at least one of a fingerprint sensor, an image sensor, an infrared sensor.
7. An electronic device, characterized in that the electronic device comprises: the functional module of any of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010478615.0A CN111818750B (en) | 2020-05-29 | 2020-05-29 | Functional module and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010478615.0A CN111818750B (en) | 2020-05-29 | 2020-05-29 | Functional module and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111818750A CN111818750A (en) | 2020-10-23 |
| CN111818750B true CN111818750B (en) | 2022-01-28 |
Family
ID=72848398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010478615.0A Active CN111818750B (en) | 2020-05-29 | 2020-05-29 | Functional module and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111818750B (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202121866U (en) * | 2011-06-17 | 2012-01-18 | 湖北友邦电子材料有限公司 | Copper foil substrate of flexible circuit board |
| CN105825165A (en) * | 2015-11-20 | 2016-08-03 | 维沃移动通信有限公司 | Fingerprint identification module, terminal device and assembling method |
| CN105939567A (en) * | 2016-06-13 | 2016-09-14 | 东莞舒铂迈特精工实业有限公司 | Fingerprint identification FPC reinforcing steel sheet and material strip capable of solving adhesive overflow and processing method |
| CN106127195A (en) * | 2016-08-30 | 2016-11-16 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module manufacture method and mobile terminal |
| CN106446853A (en) * | 2016-09-30 | 2017-02-22 | 维沃移动通信有限公司 | Fingerprint module assembly structure and mobile terminal |
| CN107613704A (en) * | 2017-08-28 | 2018-01-19 | 维沃移动通信有限公司 | A kind of fingerprint module and mobile terminal |
| CN207352632U (en) * | 2017-09-18 | 2018-05-11 | 维沃移动通信有限公司 | Fingerprint module decoration, fingerprint module assembly and electronic equipment |
| CN207799700U (en) * | 2017-10-26 | 2018-08-31 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and electronic equipment equipped with fingerprint module |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202495212U (en) * | 2012-03-22 | 2012-10-17 | 北京壹人壹本信息科技有限公司 | Display module and electronic device |
| TWI536273B (en) * | 2014-08-26 | 2016-06-01 | Gingy Technology Inc | Photoelectric fingerprint identification device |
| CN106061113A (en) * | 2016-06-20 | 2016-10-26 | 南昌欧菲生物识别技术有限公司 | Fingerprint identification module and flexible circuit board thereof |
| CN106128827B (en) * | 2016-07-08 | 2017-11-24 | 广东欧珀移动通信有限公司 | Side key structure and mobile terminal |
| US10663782B2 (en) * | 2017-01-20 | 2020-05-26 | Wuhan China Star Optoelectronics Technology Co., Ltd | Liquid crystal panel and thin film transistor array substrate thereof |
| CN106909200B (en) * | 2017-02-28 | 2018-09-04 | 维沃移动通信有限公司 | A kind of assembling structure and mobile terminal of fingerprint module |
| CN108428777A (en) * | 2018-03-02 | 2018-08-21 | 陈慧仪 | LEDCOB packaged light sources |
| CN208538144U (en) * | 2018-06-11 | 2019-02-22 | 昆山丘钛微电子科技有限公司 | Fingerprint mould group waterproof construction, waterproof fingerprint mould group and fingerprint recognition mobile terminal |
| CN208638583U (en) * | 2018-08-01 | 2019-03-22 | 瑞声科技(新加坡)有限公司 | Loudspeaker |
-
2020
- 2020-05-29 CN CN202010478615.0A patent/CN111818750B/en active Active
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202121866U (en) * | 2011-06-17 | 2012-01-18 | 湖北友邦电子材料有限公司 | Copper foil substrate of flexible circuit board |
| CN105825165A (en) * | 2015-11-20 | 2016-08-03 | 维沃移动通信有限公司 | Fingerprint identification module, terminal device and assembling method |
| CN105939567A (en) * | 2016-06-13 | 2016-09-14 | 东莞舒铂迈特精工实业有限公司 | Fingerprint identification FPC reinforcing steel sheet and material strip capable of solving adhesive overflow and processing method |
| CN106127195A (en) * | 2016-08-30 | 2016-11-16 | 广东欧珀移动通信有限公司 | Fingerprint module, fingerprint module manufacture method and mobile terminal |
| CN106446853A (en) * | 2016-09-30 | 2017-02-22 | 维沃移动通信有限公司 | Fingerprint module assembly structure and mobile terminal |
| CN107613704A (en) * | 2017-08-28 | 2018-01-19 | 维沃移动通信有限公司 | A kind of fingerprint module and mobile terminal |
| CN207352632U (en) * | 2017-09-18 | 2018-05-11 | 维沃移动通信有限公司 | Fingerprint module decoration, fingerprint module assembly and electronic equipment |
| CN207799700U (en) * | 2017-10-26 | 2018-08-31 | 南昌欧菲生物识别技术有限公司 | Fingerprint module and electronic equipment equipped with fingerprint module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111818750A (en) | 2020-10-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109215511B (en) | Preparation method of flexible display panel, flexible display panel and display device | |
| CN110491883B (en) | Display panel, manufacturing method thereof and display device | |
| CN105825773B (en) | Display device and method for manufacturing the same | |
| CN107728348B (en) | Manufacturing method of array substrate, array substrate and display panel | |
| US20100110282A1 (en) | Camera lens module and manufacturing method thereof | |
| EP3602236A1 (en) | Shielding a bending portion of a flexible display | |
| US20060220201A1 (en) | Structure of memory card packaging and method of forming the same | |
| CN212322555U (en) | Display assembly and display device | |
| US20110242448A1 (en) | Liquid crystal display device | |
| CN206820789U (en) | Mobile terminal device and its camera device, camera Lens assembly | |
| CN111638604B (en) | Liquid crystal display panel, liquid crystal display device and manufacturing method | |
| US20160179237A1 (en) | Touch panels and fabrication methods thereof | |
| CN111047980B (en) | Flexible display panel and terminal equipment | |
| KR20170016265A (en) | Fingerprint sensor package and method for manufacturing the same | |
| CN107770310B (en) | Mobile terminal | |
| CN111818750B (en) | Functional module and electronic equipment | |
| US11710721B2 (en) | Display device and manufacturing method thereof | |
| CN105989364A (en) | Method for manufacturing sensing device | |
| CN114690461B (en) | Display panel and preparation method thereof | |
| CN108773152B (en) | Acid-resistant film, display assembly and chemical strengthening and thermosetting screen printing process of display assembly | |
| CN109061962B (en) | Display panel, manufacturing method thereof and display device | |
| CN110335543B (en) | Flexible display panel, manufacturing method thereof and flexible display device | |
| CN108957840B (en) | Display module, display device, polarizer and preparation method thereof | |
| CN212569354U (en) | Display device | |
| CN112562524B (en) | Display panel and display panel manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |