KR20170016265A - Fingerprint sensor package and method for manufacturing the same - Google Patents

Abstract

The present invention relates to a fingerprint sensor package and a manufacturing method thereof to maintain uniform surface quality, manage thickness easily, reduce a process time and use a raw material. The fingerprint sensor package according to an embodiment of the present invention comprises a fingerprint sensor, a substrate, a cohesive conduction part, and a film part. The fingerprint sensor has a sensing part formed by using a conductor. The fingerprint sensor is mounted on the substrate. The cohesive conduction part is provided between the fingerprint sensor and the substrate to attach the fingerprint sensor and the substrate and to electrically connect the fingerprint sensor and the substrate. The film part is provided on the upper side of the fingerprint sensor and implements at least one of color and a pattern.

Description

[0001] FINGERPRINT SENSOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME [0002]

The present invention relates to a fingerprint sensor package and a manufacturing method thereof, and more particularly, to a fingerprint sensor package capable of uniformly maintaining surface quality, easily managing thickness, reducing process time, and utilizing raw materials. will be.

Semiconductor chip, which is an integrated circuit composed of semiconductors, is a basic device used in various electronic devices and is packaged in a series of processes such as chip on board (COB), wafer level package (WLP) and quad flat package (QFP).

Such a semiconductor chip is becoming thin and structurally simple due to the development of semiconductor packaging technology and the like, and the semiconductor chip has been gradually mounted on the outside of the electronic device.

For example, a semiconductor chip is used as a fingerprint sensor in electronic devices such as a mobile terminal, a PDA, and a tablet PC. Recently, fingerprint sensors are increasingly required as input device technology.

The fingerprint sensor can be manufactured in the form of a module including peripheral components or structures, and thus can be effectively mounted on various electronic devices. Fingerprint sensors of capacitance type, optical type, ultrasonic type, heat sensing type, non-contact type, etc., which are excellent in sensitivity, robust against external environment change and excellent in compatibility with electronic devices, .

On the other hand, in electronic devices, a navigation function for performing operation of a pointer such as a cursor is incorporated in a fingerprint sensor. Such a fingerprint sensor is called a biometric track pad (BTP). In addition, a switching function that receives information from a user may be incorporated into the fingerprint sensor.

In recent years, studies on the upgrading of a fingerprint sensor package have been made in accordance with a high-level strategy of a portable electronic device to satisfy consumer's preference, and for example, color is implemented in a fingerprint sensor package.

FIG. 1 is an exemplary view schematically showing an electronic device having a conventional fingerprint sensor package, and FIG. 2 is a cross-sectional view illustrating a configuration of a conventional fingerprint sensor package.

As shown in FIGS. 1 and 2, the fingerprint sensor package 20 in the electronic device 10 is disposed at a portion outside the region where the display portion 30 is provided.

The fingerprint sensor package 20 may include a sensor portion 22 provided on the base substrate 21 and a sealing portion 23 formed to cover the surface of the base substrate 21 and the sensor portion 22 have. An electrode (not shown) of the sensor unit 22 and an electrode (not shown) on the base substrate 21 may be electrically connected by a bonding wire 24.

A sensing pixel (not shown) included in the sensor unit 22 can find a difference in capacitance due to a height difference due to a ridge and a ridge of the user's finger, thereby generating a fingerprint image.

A primer layer 25 serving as an adhesive, a color layer 26 performing a color-fulfilling function, and a protective layer 27 are provided on the upper surface of the encapsulation portion 23. The protective layer 27 is formed by applying a protective layer solution by spraying or the like and then curing. However, since the flatness of the top surface is lowered, a polishing process for increasing the top surface flatness is accompanied.

On the other hand, since the fingerprint sensor package 20 recognizes the fingerprint by shaping the intensity of the electric field between the user's finger and the sensor portion 22, the strength of the electric field has a great influence on the performance of the fingerprint sensor . Therefore, the interval between the fingerprint of the user's finger and the sensing pixel, that is, the sensing clearance, can be an important factor for determining the sensing performance.

However, when the color is realized and the protective layer is provided by the conventional method as described above, there arises a restriction that the interlayer structure and the thickness are properly ensured. That is, when the coating film is not formed to have a sufficient thickness, it is not only difficult to implement the color, but also increases the possibility of causing surface contamination, scratches, scratches, and the like on the fingerprint sensor. These damages adversely affect the image of the fingerprint that is sensed by the fingerprint sensor.

Particularly, in the case of the electrostatic-type fingerprint sensor, as described above, there is a change in the operation according to the sensing clearance. That is, since the sensing response characteristic of the fingerprint sensor deteriorates as the coating film becomes thicker, the thickness of the coating film is limited.

As described above, when the thickness of the coating film of the fingerprint sensor package is insufficient, damage such as surface contamination, scratching, shot or the like occurs on the fingerprint sensor, and on the contrary, damage such as surface contamination, scratching, If a thick film is formed so as not to occur, there is a problem that the sensitivity of the fingerprint sensing is lowered. Further, since the step of forming the coating film is performed by a spraying method such as spraying, the amount of the raw material liquid to be consumed is increased, and each step needs to be carried out for each coating film.

It is also possible to separate the base substrate 21 and the main substrate 28 on which the base substrate 21 is mounted and the separation of the sealing portion 23 and the layers 25, It is difficult to prevent the loss of the sensor section 22 and the main board 28. [

Therefore, there is a need for a technique of manufacturing a fingerprint sensor package having a sufficient strength and a simple process while making the fingerprint sensor package compact by keeping the thickness of the film thin and uniform so as not to affect the fingerprint sensing sensitivity. In addition, there is a need for a method for enabling a fingerprint sensor package to have a high-quality texture in accordance with the trend of high-end portable electronic devices. In addition, packaging technology which can prevent re- Is required.

In order to solve the above problems, the present invention provides a fingerprint sensor package capable of uniformly maintaining surface quality, easily managing thickness, reducing process time, and utilizing raw materials, and a method of manufacturing the fingerprint sensor package will be.

According to an aspect of the present invention, there is provided a fingerprint sensor comprising: a fingerprint sensor having a sensing unit formed using a conductive material; A substrate on which the fingerprint sensor is mounted; A sticky conductive part provided between the fingerprint sensor and the substrate for attaching the fingerprint sensor and the substrate, and electrically connecting the fingerprint sensor and the substrate; And a film portion provided on an upper surface of the fingerprint sensor, wherein the film portion implements at least one of a color and a pattern.

In one embodiment of the present invention, the film portion includes a base film of a flexible material, a hard coating layer provided on one surface of the base film, and a printing layer provided on the other surface of the base film, And an adhesive layer provided on the print layer and adhered to the upper surface of the fingerprint sensor.

In one embodiment of the present invention, the film portion may be formed to cover at least a part of the upper surface of the substrate and the fingerprint sensor.

According to an embodiment of the present invention, the film unit may be a transfer layer provided entirely on the upper surface of the fingerprint sensor.

In one embodiment of the present invention, the viscous conductive part may be provided on the entire lower surface of the fingerprint sensor.

According to another aspect of the present invention, there is provided a fingerprint sensor comprising: a) a fingerprint sensor having a fingerprint sensor disposed on a first jig, Attaching the fingerprint sensor to the substrate and electrically connecting the fingerprint sensor to the substrate; b) providing a film portion that implements at least one of a color, a pattern, and positioning the film portion on an upper core; And c) secondly packaging the first jig and the upper core by thermocompression so that the film is provided on the upper surface of the first package fingerprint sensor.

In one embodiment of the present invention, in the step (a), the primary packaging is performed by thermally compressing the first and second jigs in a state where the fingerprint sensor is seated in the seating groove formed in the second jig The fingerprint sensor may be attached to the viscous conductive part.

In one embodiment of the present invention, the viscous conductive part may be provided to be adhered to the entire lower surface of the fingerprint sensor.

In one embodiment of the present invention, in the step c), a lower core to be thermally compressed with the upper core may be further provided, and the first jig may be provided to the lower core.

In one embodiment of the present invention, in the step b), the film portion includes a base film of a flexible material, a hard coating layer provided on one surface of the base film, and a hard coating layer provided on the other surface of the base film, Or more, and an adhesive layer provided on the print layer.

In one embodiment of the present invention, in the step b), the adhesive layer may be adhered to the upper surface of the fingerprint sensor.

In one embodiment of the present invention, the film portion may be formed to cover at least a part of the upper surface of the substrate and the fingerprint sensor.

In one embodiment of the present invention, the film portion comprises a transfer layer which embodies at least one of a hue and a pattern, and a peeling layer is attached to the film portion, and in the step c) And then the peeling layer can be peeled off from the film portion.

According to an embodiment of the present invention, a film portion is provided on the upper surface of the fingerprint sensor, and a design effect such as color and pattern can be realized through the film portion. Particularly, the film portion can express various effects without spraying a separate paint to express color and the like, and the process can be simplified because of easy attachment to the fingerprint sensor.

Further, according to one embodiment of the present invention, due to the uniformity of the surface quality of the film portion itself, the conventional polishing process can be omitted. In addition, since the thickness of the film portion can be easily controlled, the thickness of the film portion can be made thin within an allowable range, thereby reducing the sensing clearance and improving the sensing performance.

Further, according to the embodiment of the present invention, since the fingerprint sensor and the substrate are connected to each other by the tacky conductive portion, and the fingerprint sensor is attached to the adhesive film portion, reworking is possible when a defect occurs. In other words, since the film portion and the adhesive conductive portion are removed, the fingerprint sensor and the substrate can be separated without breakage, thereby providing an advantage of being recyclable.

It should be understood that the effects of the present invention are not limited to the above effects and include all effects that can be deduced from the detailed description of the present invention or the configuration of the invention described in the claims.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exemplary view schematically showing an electronic device having a conventional fingerprint sensor package; FIG.
FIG. 2 is a cross-sectional view illustrating a configuration of a conventional fingerprint sensor package. FIG.
3 is a perspective view illustrating a fingerprint sensor package according to a first embodiment of the present invention.
4 is a cross-sectional view illustrating a fingerprint sensor package according to a first embodiment of the present invention.
5 is a flowchart illustrating a method of manufacturing the fingerprint sensor package according to the first embodiment of the present invention.
6 to 10 are views illustrating a manufacturing process of the fingerprint sensor package according to the first embodiment of the present invention.
11 is a perspective view showing a fingerprint sensor package according to a second embodiment of the present invention.
12 is a cross-sectional view illustrating a fingerprint sensor package according to a second embodiment of the present invention.
13 and 14 are views showing an example of a manufacturing process of the fingerprint sensor package according to the second embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the accompanying drawings. The present invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. In order to clearly illustrate the present invention, parts not related to the description are omitted, and similar parts are denoted by like reference characters throughout the specification.

Throughout the specification, when a part is referred to as being "connected" to another part, it includes not only "directly connected" but also "indirectly connected" . Also, when an element is referred to as "comprising ", it means that it can include other elements, not excluding other elements unless specifically stated otherwise.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

FIG. 3 is a perspective view of a fingerprint sensor package according to a first embodiment of the present invention, and FIG. 4 is a cross-sectional view illustrating a fingerprint sensor package according to the first embodiment of the present invention.

3 and 4, the fingerprint sensor package 100 according to the first embodiment of the present invention includes a fingerprint sensor 200, a substrate 300, a sticky conductive part 400, and a film part 500 .

The fingerprint sensor 200 may have a sensing unit 210.

Various types of fingerprint sensor 200 according to the present invention can be applied. For example, the fingerprint sensor 200 may be a capacitive type, an optical type, an ultrasonic type, a heat sensing type, or a non-contact type. Hereinafter, for convenience of explanation, the fingerprint sensor 200 will be described in a capacitive manner.

The sensing unit 210 may have various forms. For example, the sensing unit 210 may be formed using a conductive material, and may be formed of an array of sensing pixels having a sensing area. In addition, the sensing unit 210 may include a plurality of line-type driving electrodes and receiving electrodes. In addition, the sensing unit 210 may be an AREA type having a plurality of image receiving units. The sensing unit 210 can find a difference in capacitance due to a height difference according to the shape of the mountain and the valley of the fingerprint of the user's finger and can scan the image of the fingerprint to produce a fingerprint image. In addition, the sensing unit 210 may have a fingerprint sensing function and a pointer manipulation function for sensing a fingerprint, so that the fingerprint sensor 200 can be implemented as a biometric trackpad (BTP).

The fingerprint sensor 200 has various types such as a wafer level package (WLP), a chip on board (COB), a quad flat package (QFP), and a ball grid array (BGA) Via), a method using a bonding wire, or the like.

The substrate 300 may be an FPCB (Flexible Printed Circuit Board).

The adhesive conductive part 400 may be provided between the fingerprint sensor 200 and the substrate 300 to attach the fingerprint sensor 200 and the substrate 300. The fingerprint sensor 200 and the substrate 300 So that they can be electrically connected.

To this end, the viscous conductive part 400 may have both tackiness and conductivity. As the adhesive conductive part 400, for example, an anisotropic conductive film (ACF) or the like may be used, but it is not limited thereto.

The adhesive conductive portion 400 may be provided on the entire lower surface of the fingerprint sensor 200. The adhesive conductive part 400 has a function of attaching the fingerprint sensor 200 and the substrate 300 to each other and electrically connecting the fingerprint sensor 200 and the substrate 300 to each other, 300 may be hermetically sealed to prevent moisture from entering the outside.

In addition, although not shown, the viscous conductive portion 400 may be provided larger than the area of the fingerprint sensor 200. [ That is, the adhesive conductive portion 400 may be entirely provided on one surface of the substrate 300, or may be provided partially. In this case, the adhesive conductive portion 400 may function to adhere to the film portion 500 to be described later.

The film part 500 may be provided on the upper surface of the fingerprint sensor 200, and the film part 500 may embody one or more of color and pattern.

In this embodiment, the film part 500 may have a base film 510, a hard coating layer 520, a print layer 530 and an adhesive layer 540. The film part 500 may include a fingerprint sensor 200 and / And may be formed to cover at least a part of the upper surface of the substrate 300.

First, the base film 510 may be a film of a flexible material. The base film 510 may be, for example, a PU (polyurethane) film, but is not limited thereto.

The hard coating layer 520 may be provided on one side of the base film 510 and the hard coating layer 520 may have a hardness of 2 to 4H, for example. The hard coat layer 520 provides sufficient hardness so that damage from external scratches, scratches, and the like can be prevented. The hard coating layer 520 may be a PET (polyethyleneterephthalate) film, a PC (polycarbonate) film, or the like.

Further, the print layer 530 may be provided on the other surface of the base film 510. The print layer 530 may embody one or more of color, pattern. Specifically, the print layer 530 can express a high-quality texture such as a color, a hair line, a pattern, a spin, a glossiness effect, a matte effect, and a metal texture. The print layer 530 may be formed by a method such as silk printing or the like, so that it is possible to express a design that is difficult to express using conventional coating techniques.

The base film 510 and the hard coat layer 520 may be transparent materials so that the color, pattern, etc. of the print layer 530 can be seen through the base film 510 and the hard coat layer 520 outward .

The adhesive layer 540 may be provided on the print layer 530 and may provide an adhesive force to be adhered to the upper surface of the fingerprint sensor 200. The adhesive layer 540 may be provided by a method such as thermosetting binder printing.

In this way, the film portion 500 covers and protects the upper surface of the fingerprint sensor 200 and the substrate 300.

The adhesive layer 540 may be provided not only on the upper surface of the fingerprint sensor 200 but also on the side surface of the fingerprint sensor 200 and the upper surface of the substrate 300, And can be further firmly coupled to the fingerprint sensor 200 and the substrate 300.

According to the present embodiment, the film portion 500 can express various surface effects on the print layer 530 without spraying a separate paint for expressing colors, patterns, and the like. And, due to the uniformity of the surface quality of the film portion 500 itself, the conventional polishing process can be omitted. In addition, since the thickness of the film part 500 can be easily managed, the thickness of the film part 500 can be made thin within an allowable range, whereby the sensing performance can be improved by reducing the sensing clearance .

FIG. 5 is a flowchart illustrating a method of manufacturing a fingerprint sensor package according to a first embodiment of the present invention, and FIGS. 6 to 10 illustrate a manufacturing process of a fingerprint sensor package according to the first embodiment of the present invention.

5 to 10, the method for manufacturing a fingerprint sensor package according to the present embodiment includes the steps of providing a tacky conductive portion on a substrate placed in a first jig, and attaching a fingerprint sensor having a sensing portion located in the second jig to a tacky conductive And a step (S610) of firstly packaging the fingerprint sensor to be electrically connected to the substrate by attaching the fingerprint sensor to the substrate.

In the step S610, the substrate 300 may be provided on the first jig 700. The substrate 300 may be provided with the adhesive conductive part 400 on the first jig 700, Can be seated. The adhesive conductive portion 400 may be formed to have a size that can be adhered to the entire lower surface of the fingerprint sensor 200.

The first jig 700 may be provided with a first guide pin 701 so that the substrate 300 can be seated in the first position of the first jig 700.

A fingerprint sensor 200 may be mounted on the second jig 710 and a seating groove 711 may be formed on the second jig 710 to allow the fingerprint sensor 200 to be mounted thereon. The first jig 700 and the second jig 710 may then be thermocompression bonded and the fingerprint sensor 200 and the substrate 300 may be attached to and electrically connected to the adhesive conductive portion 400.

The first jig 700 is provided with a second guide pin 702 and the second jig 710 is provided with a guide hole 712 for the matching of the first jig 700 and the second jig 710 .

The first jig 700 and the second jig 710 may be formed of a material capable of thermocompression bonding, for example, stainless steel (STS) may be used.

The primary packaging is performed in a state where the substrate 300 is provided in the first jig 700 and the fingerprint sensor 200 is seated in the seating groove 711 formed in the second jig 710, 2, the fingerprint sensor 200 and the substrate 300 are coupled to each other by thermocompression bonding of the two jigs 710 (see FIG. 7).

The jig may be divided into the first jig and the second jig for convenience of explanation, and the substrate 300 may be provided on the second jig and the fingerprint sensor 200 may be provided on the first jig.

The method of fabricating the fingerprint sensor package according to the present exemplary embodiment may include providing a film portion that implements at least one of hue and pattern, and positioning the film portion on the upper core (S620).

In the step S620, the film unit 500 includes a base film 510 of a flexible material, a hard coating layer 520 provided on one side of the base film 510, A printing layer 530 that implements at least one of a color, a pattern, and an adhesive layer 540 that is provided on the printing layer 530. When the film unit 500 is manufactured, the process may be performed in units of sheets.

The film unit 500 may be positioned on the upper core 810 such that the adhesive layer 540 faces the sensing unit 210 (see FIG. 4) of the fingerprint sensor 200.

The upper core 810 may be provided with a third guide pin 811 for fixing the film unit 500 in a fixed position.

In addition, the upper core 810 may be formed with an insertion groove 812 into which the fingerprint sensor 200 can be inserted. When the first jig 700 and the upper core 810 are compressed, the upper surface and the side wrapping part of the fingerprint sensor 200 can be inserted into the insertion groove 812 from the fingerprint sensor 200 and the film part 500 have.

The method of manufacturing a fingerprint sensor package according to the present embodiment may include a step (S630) of secondly packaging the first jig and the upper core by thermocompression bonding so that the film portion is provided on the upper surface of the first fingerprint sensor packaged have.

In the step S630, the first jig 700 and the upper core 810 may be thermally pressed. The adhesive layer 540 may be formed on the upper surface of the fingerprint sensor 200 when the first jig 700 and the upper core 810 are thermally compressed. And the film portion 500 may be deformed to cover the fingerprint sensor 200 and may be formed to cover at least a part of the upper surface of the substrate 300. [ At this time, the fingerprint sensor 200 is inserted into the insertion groove 812 of the upper core 810 to prevent breakage (refer to FIG. 8).

In addition, in step S630, the upper core 810 and the lower core 820 that can be thermally compressed may be further provided. The first jig 700 may be thermally press-bonded to the lower core 820. In addition, in step S630, the first packaged fingerprint sensor may be provided directly on the lower core 820 without the first jig 700, and may be thermocompression-bonded.

According to the present invention, since the substrate 300 and the fingerprint sensor 200 are combined using the adhesive conductive part 400 and the film part 500 is provided on the upper surface of the fingerprint sensor 200, When it occurs, rework is possible. That is, if the substrate 300 and the fingerprint sensor 200 are separated from the adhesive conductive portion 400 and the film portion 500 is removed, the substrate 300 and the fingerprint sensor 200 can be recovered without any damage, This can provide a possible advantage. In addition, since the fingerprint sensor 200 is packaged with the film portion 500 using the mold, the process is easy.

Meanwhile, the manufacturing method of the fingerprint sensor package according to the present embodiment may further include separating the fingerprint sensor package from the first jig and processing the outer shape of the film portion (S640). In this case, when the fingerprint sensor having the first packaging process is firstly packaged directly on the lower core without the first jig and then thermocompression is performed, the fingerprint sensor package is separated from the lower core, Can be processed.

In the step S640, the protruding portion 570 of the substrate 300 from the film portion 500 may be removed. The removal of the protruding portion 570 may be performed by applying a numerical control (NC) machining or a punching mold or the like (see FIG. 9).

Here, in order to prevent breakage of the extended portion 310 of the substrate 300 during the outer process of the film portion 500, the outer process may be performed by bending the extended portion 310 of the substrate 300 (See Fig. 10).

The cut shape of the film portion 500 may be programmed so as to include the extended portion 310 of the substrate 300 or the punch mold may be formed to include the extended portion 310 of the substrate 300 In this case, the enclosure process can be performed without bending the extension 310 of the substrate 300.

The outer shape of the film part 500 may correspond to the outer periphery of the substrate 300 or may be located inside the substrate 300 after the foaming molding process In this case, the step S640 may be omitted.

Although the fabrication method of the fingerprint sensor package 100 has been described for the sake of convenience in the foregoing, the process may be performed in units of sheets at the time of fabrication.

FIG. 11 is a perspective view illustrating a fingerprint sensor package according to a second embodiment of the present invention, FIG. 12 is a cross-sectional view illustrating a fingerprint sensor package according to a second embodiment of the present invention, FIGS. 13 and 14 are cross- FIG. 5 is a view illustrating a manufacturing process of a fingerprint sensor package according to a second embodiment of the present invention. The configuration of the film portion of the fingerprint sensor package according to the present embodiment may be different, and the rest of the configuration is the same as that of the first embodiment, so the description is omitted.

11 and 12, the film part 1500 of the fingerprint sensor package 1100 according to the present embodiment may be provided on the entire upper surface of the fingerprint sensor 1200, And may be a transcription layer.

In addition, the film unit 1500 may be formed to have at least one of hue and pattern, and the film unit 1500 may be formed of a PET film.

Referring to FIG. 13, in the manufacturing process of the fingerprint sensor package according to the present embodiment, the peeling layer 1510 may be attached to the film portion 1500.

In the manufacturing process of the fingerprint sensor package according to the present embodiment, the film portion 500 of the first embodiment described above with reference to FIGS. 8 to 10 is replaced with the film portion 1500 according to the second embodiment, But the other processes can proceed in the same way.

That is, according to the present embodiment, the upper portion of the upper core 1810 may be positioned with the film portion 1500 facing the upper surface of the fingerprint sensor 1200, and the first jig 1700 and the upper core 1810 may be thermally compressed The film unit 1500 can be provided entirely on the upper surface of the fingerprint sensor 1200 by a transferring method using a fingerprint sensor.

14 (a), after the first jig 1700 and the upper core 1810 are separated from each other, the film portion 1500 and the peeling layer 1510 are both provided on the fingerprint sensor 1200 It can be in a state of being. 14B, the peeling layer 1510 may be peeled off from the film part 1500 so that only the film part 1500 may remain on the upper surface of the fingerprint sensor 1200. [

According to the present embodiment, since the film portion 1500 is formed on the upper surface of the fingerprint sensor 1200 by the transfer method, the process can be further simplified. In addition, by providing the film portion 1500 only on the upper surface of the fingerprint sensor 1200, the outer processing process of the film portion as in the first embodiment can be omitted.

It will be understood by those skilled in the art that the foregoing description of the present invention is for illustrative purposes only and that those of ordinary skill in the art can readily understand that various changes and modifications may be made without departing from the spirit or essential characteristics of the present invention. will be. It is therefore to be understood that the above-described embodiments are illustrative in all aspects and not restrictive. For example, each component described as a single entity may be distributed and implemented, and components described as being distributed may also be implemented in a combined form.

The scope of the present invention is defined by the appended claims, and all changes or modifications derived from the meaning and scope of the claims and their equivalents should be construed as being included within the scope of the present invention.

100, 1100: fingerprint sensor package 200, 1200: fingerprint sensor
300: substrate 400: viscous conductive part
500, 1500: film part 510: base film
520: hard coat layer 530: print layer
540: adhesive layer 700, 1700: first jig
710: second jig 711: seat groove
810, 1810: upper core 812: insertion groove
820: Lower core

Claims (13)

A fingerprint sensor having a sensing unit;
A substrate on which the fingerprint sensor is mounted;
A sticky conductive part provided between the fingerprint sensor and the substrate for attaching the fingerprint sensor and the substrate, and electrically connecting the fingerprint sensor and the substrate; And
And a film portion provided on an upper surface of the fingerprint sensor,
Wherein the film portion implements at least one of a color, a pattern. The method according to claim 1,
The film portion
A flexible base film,
A hard coating layer provided on one surface of the base film,
A printing layer provided on the other surface of the base film and embodying at least one of a hue and a pattern,
And a bonding layer provided on the print layer and adhered to an upper surface of the fingerprint sensor. 3. The method of claim 2,
Wherein the film portion is formed to cover at least a part of the upper surface of the substrate and the fingerprint sensor. The method according to claim 1,
Wherein the film portion is composed of a transfer layer provided entirely on an upper surface of the fingerprint sensor. The method according to claim 1,
Wherein the viscous conductive portion is provided on the entire lower surface of the fingerprint sensor. a) a tacky conductive part is provided on a substrate placed in the first jig, and a fingerprint sensor having a sensing part located in the second jig is attached to the tacky conductive part so that the fingerprint sensor is firstly packaged so as to be electrically connected to the substrate step;
b) providing a film portion that implements at least one of a color, a pattern, and positioning the film portion on an upper core; And
c) thermally compressing the first jig and the upper core to secondary-package the film so that the film is provided on the upper surface of the first-packaged fingerprint sensor. The method according to claim 6,
In the step a), the primary packaging is performed by thermocompression bonding of the first jig and the second jig in a state in which the fingerprint sensor is seated in the seating groove formed in the second jig, Wherein the fingerprint sensor package is attached to the fingerprint sensor package. The method according to claim 6,
Wherein the tacky conductive portion is provided to adhere to the entire lower surface of the fingerprint sensor. The method according to claim 6,
Wherein the upper core is further provided with a lower core thermocompression-bonded to the upper core, and the first jig is provided to the lower core in the step (c). The method according to claim 6,
In the step b), the film part may include a base film of a flexible material, a hard coating layer provided on one side of the base film, a print layer provided on the other side of the base film and embodying at least one of a hue and a pattern, Wherein the adhesive layer is provided on the print layer. 11. The method of claim 10,
Wherein in the step (c), the adhesive layer is adhered to the upper surface of the fingerprint sensor. 11. The method of claim 10,
Wherein the film portion is formed to cover at least a part of the upper surface of the substrate and the fingerprint sensor. The method according to claim 6,
Wherein the film portion comprises a transfer layer which embodies at least one of a color and a pattern, a peeling layer is attached to the film portion,
Wherein in the step c), the film portion is entirely adhered to the upper surface of the fingerprint sensor by a transfer method, and then the peeling layer is peeled off from the film portion.

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