CN111638604B - Liquid crystal display panel, liquid crystal display device and manufacturing method - Google Patents
Liquid crystal display panel, liquid crystal display device and manufacturing method Download PDFInfo
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- CN111638604B CN111638604B CN202010614756.0A CN202010614756A CN111638604B CN 111638604 B CN111638604 B CN 111638604B CN 202010614756 A CN202010614756 A CN 202010614756A CN 111638604 B CN111638604 B CN 111638604B
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/133351—Manufacturing of individual cells out of a plurality of cells, e.g. by dicing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
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- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
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- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
The invention provides a liquid crystal display panel, a liquid crystal display device and a manufacturing method, wherein the liquid crystal display panel comprises: the array substrate and the opposite substrate are arranged opposite to the array substrate; the liquid crystal display panel also comprises a display area and a binding area positioned on one side of the display area; in the binding region, a first binding electrode is arranged on one side, facing the array substrate, of the opposite substrate, a protection structure is arranged on one side, facing the array substrate, of the first binding electrode, the first binding electrode and the protection structure both extend to the edge of the binding region in the direction departing from the display region, and the orthographic projection of the first binding electrode in the binding region is partially overlapped with the orthographic projection of the protection structure in the binding region; in the binding region, packaging glue comprising conductive spherical particles is arranged between the first binding electrode and the array substrate, the packaging glue is used for electrically connecting the first binding electrode and the array substrate, and the orthographic projection of the packaging glue in the binding region is not overlapped with the orthographic projection of the protection structure in the binding region.
Description
Technical Field
The invention relates to the technical field of display, in particular to a liquid crystal display panel, a liquid crystal display device and a manufacturing method.
Background
In a liquid crystal display device, metal leads are often provided on the array substrate side. In order to ensure a narrow frame of a liquid crystal display device and simultaneously introduce a display signal generated by an Integrated Circuit (IC) into the metal lead wire so as to control the display of the liquid crystal display device, the array substrate and the color film substrate which are attached together need to be subjected to edge aligning cutting, and then, silver adhesive transfer printing is utilized to perform lateral binding of a cutting surface, so that the binding of the IC Circuit board is realized. However, in the cutting process, burrs are easily generated at the edges of the metal leads, so that the binding rate of the IC circuit board is reduced, and display signals generated by the IC circuit board cannot be smoothly guided into the array substrate through the silver paste, thereby causing abnormal pictures.
In order to avoid the generation of burrs, an organic film ORG covering the metal lead is often disposed before cutting, and then cutting is performed. However, since the organic film ORG tends to have a high transmittance, a high exposure rate is often required in the manufacturing process, and the material consumption in the whole process is huge.
Therefore, the existing liquid crystal display device can not save materials while considering the binding rate.
Disclosure of Invention
The invention provides a liquid crystal display panel, a liquid crystal display device and a manufacturing method, which are used for saving materials while considering binding rate.
In a first aspect, an embodiment of the present invention provides a liquid crystal display panel, including:
the array substrate and the opposite substrate are arranged opposite to the array substrate;
the liquid crystal display panel also comprises a display area and a binding area positioned on one side of the display area;
in the binding region, a first binding electrode is arranged on one side, facing the array substrate, of the opposite substrate, a protection structure is arranged on one side, facing the array substrate, of the first binding electrode, the first binding electrode and the protection structure both extend to the edge of the binding region along a direction departing from the display region, and the orthographic projection of the first binding electrode in the binding region is partially overlapped with the orthographic projection of the protection structure in the binding region;
in the binding region, a packaging adhesive containing conductive spherical particles is arranged between the first binding electrode and the array substrate, the packaging adhesive is used for electrically connecting the first binding electrode and the array substrate, and the orthographic projection of the packaging adhesive in the binding region and the orthographic projection of the protection structure in the binding region are not overlapped with each other.
In a possible implementation manner, the protection structure is manufactured in the same layer as a light shielding strip between adjacent color resistors in the display area.
In a possible implementation manner, in the bonding region, a second bonding electrode is disposed on a side of the array substrate facing the opposite substrate, the second bonding electrode extends to an edge of the bonding region along a direction departing from the display region, and the second bonding electrode is electrically connected to the first bonding electrode through the encapsulation adhesive.
In one possible implementation manner, the second binding electrode is fabricated on the same layer as a gate layer of a pixel circuit in the display region.
In a possible implementation manner, in the binding region, along a direction close to the opposite substrate, an insulating layer and a third binding electrode are sequentially arranged on one side of the second binding electrode facing the opposite substrate, the third binding electrode extends to the edge of the binding region along a direction deviating from the display region, and the third binding electrode is electrically connected with the second binding electrode through a via hole penetrating through the insulating layer.
In a possible implementation manner, the third binding electrode is fabricated in the same layer as the source/drain layer of the pixel circuit in the display region.
In a possible implementation manner, in the bonding region, a first organic film layer is disposed on a side of the second bonding electrode facing the opposite substrate, and an orthogonal projection of the first organic film layer in the bonding region and an orthogonal projection of the encapsulation glue in the bonding region are not overlapped with each other.
In a possible implementation manner, in the bonding region, a second organic film layer is disposed on a side of the third bonding electrode facing the opposite substrate, and an orthogonal projection of the second organic film layer in the bonding region and an orthogonal projection of the encapsulation glue in the bonding region are not overlapped with each other.
In a second aspect, an embodiment of the present invention provides a liquid crystal display device, including: the liquid crystal display panel comprises the liquid crystal display panel and conductive adhesive arranged at the edge of the binding region, wherein the conductive adhesive is used for electrically connecting the first binding electrode with a driving chip.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a liquid crystal display device, including:
cutting the panel to be cut, which is formed by bonding the array substrate and the opposite substrate together, along the edge of the binding region to form the liquid crystal display panel;
coating the conductive adhesive on the edge of the binding region;
and electrically connecting the conductive adhesive with the driving chip.
The invention has the following beneficial effects:
the embodiment of the invention provides a liquid crystal display panel, a liquid crystal display device and a manufacturing method, wherein the liquid crystal display panel comprises an array substrate and an opposite substrate arranged opposite to the array substrate, the liquid crystal display panel further comprises a display area and a binding area positioned on one side of the display area, a first binding electrode is arranged on one side, facing the array substrate, of the opposite substrate in the binding area, a protection structure is arranged on one side, facing the array substrate, of the first binding electrode, the first binding electrode and the protection structure both extend to the edge of the binding area along the direction deviating from the display area, the orthographic projection of the first binding electrode in the binding area is partially overlapped with the orthographic projection of the protection structure in the binding area, and packaging glue comprising conductive spherical particles is arranged between the first binding electrode and the opposite substrate in the binding area, so that the first binding electrode and the opposite substrate can be electrically connected through the packaging glue. That is to say, in the binding process, the first binding electrode and the protection structure are directly arranged on the opposite substrate opposite to the array substrate, on one hand, the binding electrode does not need to be arranged on the array substrate, on the other hand, the binding electrode is effectively protected through the protection structure, burrs of the first binding electrode can be avoided in the subsequent cutting process, the binding area of a cutting surface is ensured, and therefore materials are saved while the binding rate is considered.
Drawings
FIG. 1 is a schematic diagram of a prior art structure for binding IC circuit boards in a forward binding manner;
FIG. 2 is a schematic diagram of a prior art structure for bonding IC circuit boards in a lateral bonding manner;
FIG. 3 is a diagram of one structure of bonding IC circuit boards in the prior art;
fig. 4 is a schematic structural diagram of an lcd panel according to an embodiment of the present invention;
FIG. 5 is a schematic diagram illustrating a region division of an LCD panel according to an embodiment of the present invention;
fig. 6 is a schematic structural diagram of an encapsulation adhesive in an lcd panel according to an embodiment of the present invention;
FIG. 7 is a schematic diagram of a structure of an LCD panel according to an embodiment of the present invention;
FIG. 8 is a schematic diagram of an LCD panel according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a structure of an LCD panel according to an embodiment of the present invention;
FIG. 10 is a schematic diagram of a structure of an LCD panel according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a liquid crystal display device according to an embodiment of the invention;
fig. 12 is a flowchart of a method for manufacturing a liquid crystal display device according to an embodiment of the invention.
Description of reference numerals:
1-silver colloid; 2-an array substrate; 3-a metal lead; 4-a color film substrate; 5-an organic film layer; 10-an array substrate; 20-a counter substrate; a-a display area; b-a binding region; 30-a first binding electrode; 40-a protective structure; 50-packaging adhesive; 500-spherical conductive particles; 60-a second binding electrode; 70-an insulating layer; 80-a third binding structure; 901-a first organic film layer; 902-a second organic film layer; 100-a liquid crystal display panel; 90-conductive adhesive; 110-drive the chip.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the drawings of the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. And the embodiments and features of the embodiments may be combined with each other without conflict. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention without inventive step, are within the scope of protection of the invention.
Unless defined otherwise, technical or scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The use of the word "comprise" or "comprises", and the like, in the context of this application, is intended to mean that the elements or items listed before that word, in addition to those listed after that word, do not exclude other elements or items.
It should be noted that the sizes and shapes of the various figures in the drawings are not to scale, but are merely intended to illustrate the present disclosure. And the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.
In the prior art, in order to realize the binding of the IC circuit board, a forward binding manner as shown in fig. 1 is often adopted, specifically, the electrical connection between the IC circuit board and the metal leads 3 on the array substrate 2 is realized through the silver paste 1. In order to realize the narrow frame design of the display device, a lateral binding mode as shown in fig. 2 is adopted, specifically, after the array substrate 2 and the color film substrate 4 form a liquid crystal box in a box shape, edge trimming and cutting are carried out along a binding area of the liquid crystal box, and lateral binding of a cutting surface is realized through the silver adhesive 1, however, as the area of the electric connection between the silver adhesive 1 and the metal lead 3 is only the section part of the metal lead 3, once burrs exist on the section, the binding rate is reduced, so that a display signal of the bound IC circuit board cannot be smoothly guided into the array substrate through the silver adhesive, and thus, abnormal pictures are caused.
The IC circuit board is currently bound by the binding method shown in fig. 3, specifically, an organic film ORG5 covering the metal leads is added before the trimming cutting, where the dotted line NN' in fig. 3 may be a cutting line. Due to the protection effect of the organic film layer ORG5 on the metal lead 3, the section of the metal lead 3 cut by edging is smoother, so that the binding rate of the IC circuit board is improved. However, since the organic film ORG5 often has a high transmittance, a high exposure rate is often required in the manufacturing process, the entire process consumes a lot of energy, and the material consumption is huge.
In view of this, embodiments of the present invention provide a liquid crystal display panel, a liquid crystal display device, and a manufacturing method thereof, which are used for saving materials while considering a binding rate.
Fig. 4 is a schematic structural diagram of a liquid crystal display panel according to an embodiment of the present invention, specifically, the liquid crystal display panel includes:
an array substrate 10 and an opposite substrate 20 disposed opposite to the array substrate 10;
the liquid crystal display panel also comprises a display area A and a binding area B positioned on one side of the display area A;
in the binding region B, a first binding electrode 30 is arranged on one side of the opposite substrate 20 facing the array substrate 10, a protection structure 40 is arranged on one side of the first binding electrode 30 facing the array substrate 10, the first binding electrode 30 and the protection structure 40 both extend to the edge of the binding region B along a direction departing from the display region a, and the orthographic projection of the first binding electrode 30 in the binding region B is partially overlapped with the orthographic projection of the protection structure 40 in the binding region B;
in the bonding region B, an encapsulation adhesive 50 including conductive spherical particles 500 is disposed between the first bonding electrode 30 and the array substrate 10, the encapsulation adhesive 50 is used for electrically connecting the first bonding electrode 30 and the array substrate 10, and an orthographic projection of the encapsulation adhesive 50 in the bonding region B and an orthographic projection of the protection structure 40 in the bonding region B are not overlapped with each other.
In the embodiment of the present invention, fig. 5 is a schematic diagram illustrating a region division of a liquid crystal display panel, and fig. 4 is a schematic diagram illustrating a cross-sectional structure along a direction indicated by MM' in fig. 5. In a specific implementation process, in the bonding region B, a first bonding electrode 30 is disposed on a side of the opposite substrate 20 facing the array substrate 10, a protection structure 40 is disposed on a side of the first bonding electrode 30 facing the array substrate 10, and the first bonding electrode 30 may be an electrode formed by a metal material such as gold, silver, copper, or iron. The protective structure 40 may be a structure formed of an organic material. When the first binding electrode 30 is cut, the generation of burrs on the cut surface of the first binding electrode 30 can be effectively avoided by the protection structure 40.
In a specific implementation process, the first binding electrode 30 and the protection structure 40 both extend to the edge of the binding region B along a direction departing from the display region a, and an orthographic projection of the first binding electrode 30 in the binding region B is partially overlapped with an orthographic projection of the protection structure 40 in the binding region B, wherein the first binding electrode 30 and the protection structure 40 both extend to the edge of the binding region B along the direction departing from the display region a, and the orthographic projection of the protection structure 40 in the binding region B completely falls into the orthographic projection of the first binding electrode 30 in the binding region B, so that the protection structure 40 can effectively protect the first binding electrode 30 at the edge of the binding region B in a cutting process, prevent burrs from being generated on a cutting surface of the first binding electrode 30, and improve a binding rate between a subsequent IC circuit board and the first binding electrode 30.
In the embodiment of the present invention, in the bonding region B, the encapsulation adhesive 50 including the conductive spherical particles 500 is disposed between the first bonding electrode 30 and the array substrate 10, the encapsulation adhesive 50 is used to electrically connect the first bonding electrode 30 and the array substrate 10, and an orthographic projection of the encapsulation adhesive 50 in the bonding region B and an orthographic projection of the protection structure 40 in the bonding region B are not overlapped with each other. As shown in fig. 6, which is a schematic structural diagram of the package paste 50 in fig. 4, the minimum distance between the first binding electrode 30 and the array substrate 10 is denoted by h, and the conductive spherical particles 500 in the package paste 50 are denoted by 500, where a plurality of the conductive spherical particles 500 in the package paste 50 may have different diameters of at least some of the conductive spherical particles 500, if there is a conductive spherical particle 500, the diameter of some of the conductive spherical particles 500 may be equal to h, and the diameter of some of the conductive spherical particles 500 may be smaller than h. Of course, when there are a plurality of conductive spherical particles 500 included in the encapsulant 50, the diameters of the conductive spherical particles 500 may be set to be the same, and in this case, the diameters of the conductive spherical particles 500 may be h.
In a specific implementation process, as long as the first bonding electrode 30 and the array substrate 10 can be electrically connected through the conductive spherical particles 500 in the encapsulation adhesive 50, the diameter of each conductive spherical particle 500 is not limited herein, and may be specifically determined according to actual situations, so as to improve flexibility of design.
In a specific implementation process, the encapsulation adhesive 50 may be glass powder and has a certain insulating property, the encapsulation adhesive 50 may be doped with the conductive spherical particles 500, and the conductive spherical particles 500 may be conductive gold spherical particles and have a certain conductive property, and may also be other conductive metal particles known to those skilled in the art, which is not limited herein.
In a specific implementation process, the packaging adhesive 50 including the conductive spherical particles 500 is disposed between the first binding electrode 30 and the opposite substrate 20, so that on one hand, the external water and oxygen can be effectively isolated through the packaging adhesive 50, and the service life of the liquid crystal display panel is prolonged, and on the other hand, the conductive spherical particles 500 in the packaging adhesive 50 can realize the electrical connection between the first binding electrode 30 and the opposite substrate 20.
In the embodiment of the invention, the protection structure 40 and the light-shielding strip between adjacent color resistors in the display area a are manufactured in the same layer. When forming the light-shielding strip between adjacent color resists, can form the corresponding pattern of protective structure 40 in the lump, need not to set up new organic rete in addition, when saving the material, simplified protective structure 40's manufacture craft, in addition, the light-shielding strip is easier the patterning than organic rete ORG, and the cost of manufacture is lower, and the productivity is higher. Moreover, in the specific implementation process, the protection structure 40 formed by manufacturing the light-shielding strips between the adjacent color resistors in the display area a on the same layer can effectively avoid the generation of burrs on the cutting surface of the first binding electrode 30 in the cutting process, and improve the binding rate between the subsequent IC circuit board and the first binding electrode 30.
In the embodiment of the present invention, as shown in fig. 7, one of the structures of the liquid crystal display panel is schematically illustrated, specifically, in the bonding region B, a side of the array substrate 10 facing the opposite substrate 20 is provided with a second bonding electrode 60, the second bonding electrode 60 extends to an edge of the bonding region B in a direction away from the display region a, and the second bonding electrode 60 is electrically connected to the first bonding electrode 30 through the encapsulation adhesive 50. Wherein, the second binding electrode may be made of a metal material having a conductive property. In this way, after cutting, the binding of the IC circuit board can be realized through the cutting surfaces of the first binding electrode 30 and the second binding electrode 60, the binding area of the IC circuit board is increased, and further the binding rate between the subsequent IC circuit board and the first binding electrode 30 is improved.
In the embodiment of the present invention, the second binding electrode 60 and the gate layer of the pixel circuit in the display area a are fabricated on the same layer, that is, when the gate layer pattern of the pixel circuit is fabricated, the pattern of the second binding electrode 60 can be formed by the metal layer of the gate layer, so that the binding area of the IC circuit board is increased, the fabrication process of the second binding electrode 60 is simplified, the fabrication cost is reduced, and the productivity is improved.
In the embodiment of the present invention, as shown in fig. 8, one of the structural diagrams of the liquid crystal display panel is shown, specifically, in the bonding region B, an insulating layer 70 and a third bonding electrode 80 are sequentially disposed on a side of the second bonding electrode 60 facing the opposite substrate 20 in a direction close to the opposite substrate 20, the third bonding electrode 80 extends to an edge of the bonding region B in a direction away from the display region a, and the third bonding electrode 80 is electrically connected to the second bonding electrode 60 through a via hole penetrating through the insulating layer 70. Wherein, the third binding electrode may be made of a metal material having a conductive property. Therefore, after cutting, the IC circuit board can be bound by the cutting surfaces of the first binding electrode 30, the second binding electrode 60 and the third binding electrode 80, so that the binding area of the IC circuit board is increased, and the binding rate is further improved.
In the embodiment of the present invention, the third binding electrode 80 is fabricated on the same layer as the source/drain layer of the pixel circuit in the display area a. That is, when the source and drain layer pattern forming the pixel circuit is fabricated, the pattern of the third binding electrode 80 may be formed by the metal layer of the source and drain layer, so that the binding area of the IC circuit board is increased, the fabrication process of the third binding electrode 80 is simplified, the fabrication cost is reduced, and the productivity is improved.
In the embodiment of the present invention, as shown in fig. 9, one of the structural diagrams of the liquid crystal display panel is shown, specifically, in the bonding region B, a first organic film layer 901 is disposed on a side of the second bonding electrode 60 facing the opposite substrate 20, and an orthogonal projection of the first organic film layer 901 in the bonding region B and an orthogonal projection of the encapsulation adhesive 50 in the bonding region B do not overlap each other. The first organic film 901 may be an organic film ORG, or a film formed of a photoresist organic resin material. In this way, the second binding electrode 60 is effectively protected by the first organic film layer 901, so that burrs on the cutting surface of the second binding electrode 60 are prevented from being generated in the cutting process, and the binding rate between the subsequent IC circuit board and the first binding electrode 30 is improved.
In the embodiment of the present invention, as shown in fig. 10, one of the structural diagrams of the liquid crystal display panel is shown, specifically, in the bonding region B, a side of the third bonding electrode 80 facing the opposite substrate 20 is provided with a second organic film 902, and an orthogonal projection of the second organic film 902 in the bonding region B does not overlap an orthogonal projection of the encapsulation adhesive 50 in the bonding region B. The second organic film 902 may be an organic film ORG, or a film formed of a photoresist organic resin material. In this way, the third binding electrode 80 is effectively protected by the second organic film layer 902, so that burrs on the cutting surface of the third binding electrode 80 are prevented from being generated in the cutting process, and the binding rate between the subsequent IC circuit board and the first binding electrode 30 is improved.
Based on the same inventive concept, as shown in fig. 11, an embodiment of the present invention further provides a liquid crystal display device, which includes the liquid crystal display panel 100 as described above, and a conductive paste 90 disposed at the edge of the bonding region B, where the conductive paste 90 is used to electrically connect the first bonding electrode 30 with the driving chip 110. In a specific implementation process, the conductive adhesive 90 may be silver adhesive, copper adhesive, or the like, which can not only bond the IC circuit board, but also achieve electrical connection between the driving chip 110 and the first binding electrode 30. In addition, the principle of solving the problems of the liquid crystal display device is similar to that of the liquid crystal display panel 100, so the implementation of the liquid crystal display device can be referred to the implementation of the liquid crystal display panel 100, and repeated descriptions are omitted.
In a specific implementation process, the liquid crystal display device provided in the embodiment of the present invention may be any product or component having a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator. It should be understood by those skilled in the art that other essential components of the liquid crystal display device are not described herein, nor should they be construed as limitations of the present invention.
Based on the same inventive concept, as shown in fig. 12, an embodiment of the present invention further provides a method for manufacturing a liquid crystal display device, including:
s101: cutting the panel to be cut, which is formed by bonding the array substrate and the opposite substrate together, along the edge of the binding region to form the liquid crystal display panel;
s102: coating the conductive adhesive on the edge of the binding region;
s103: and electrically connecting the conductive adhesive with the driving chip.
In the specific implementation process, the specific implementation process from step S101 to step S103 is as follows:
firstly, a panel to be cut, which is formed by bonding the array substrate 10 and the opposite substrate 20 together, is cut along the edge of the bonding region B to form the liquid crystal display panel 100, in the specific implementation process, before the array substrate 10 and the opposite substrate 20 are bonded through the packaging adhesive 50 to realize the packaging of the liquid crystal display panel 100, the first bonding electrode 30 may be disposed on the opposite substrate 20, and a pattern of a light shielding bar is formed on the display region a together, then the protection structure 40 is disposed on the side, which is away from the opposite substrate 20, of the first bonding electrode 30, then the opposite substrate 20 and the array substrate 10 are bonded together through the packaging adhesive 50 including the conductive spherical particles 500 to form the panel to be cut, then the panel to be cut is cut along the edge of the bonding region B to form the liquid crystal display panel 100, then the conductive adhesive 90 is coated on the edge of the bonding region B to realize the electrical connection between the conductive adhesive 90 and the first bonding electrode 30, and then the conductive adhesive 90 is electrically connected with the driving chip 110.
In addition, the principle of solving the problems of the manufacturing method of the liquid crystal display device is similar to that of the liquid crystal display panel 100, so the implementation of the manufacturing method of the liquid crystal display device can be referred to the implementation of the liquid crystal display panel 100, and repeated descriptions are omitted.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present application without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A liquid crystal display panel, comprising:
the array substrate and the opposite substrate are arranged opposite to the array substrate;
the liquid crystal display panel also comprises a display area and a binding area positioned on one side of the display area;
in the binding region, a first binding electrode is arranged on one side, facing the array substrate, of the opposite substrate, a protection structure is arranged on one side, facing the array substrate, of the first binding electrode, the first binding electrode and the protection structure both extend to the edge of the binding region along a direction departing from the display region, and the orthographic projection of the first binding electrode in the binding region is partially overlapped with the orthographic projection of the protection structure in the binding region;
in the binding region, a packaging adhesive containing conductive spherical particles is arranged between the first binding electrode and the array substrate, the packaging adhesive is used for electrically connecting the first binding electrode and the array substrate, and the orthographic projection of the packaging adhesive in the binding region and the orthographic projection of the protection structure in the binding region are not overlapped with each other.
2. The liquid crystal display panel of claim 1, wherein the protection structure is fabricated in the same layer as the light-shielding strips between adjacent color resistors in the display region.
3. The liquid crystal display panel according to claim 1, wherein in the bonding region, a side of the array substrate facing the opposite substrate is provided with a second bonding electrode, the second bonding electrode extends to an edge of the bonding region in a direction away from the display region, and the second bonding electrode is electrically connected to the first bonding electrode through the encapsulation adhesive.
4. The liquid crystal display panel according to claim 3, wherein the second binding electrode is formed on the same layer as a gate layer of a pixel circuit in the display region.
5. The liquid crystal display panel according to claim 3, wherein in the bonding region, an insulating layer and a third bonding electrode are sequentially disposed on a side of the second bonding electrode facing the opposite substrate in a direction approaching the opposite substrate, the third bonding electrode extends to an edge of the bonding region in a direction departing from the display region, and the third bonding electrode is electrically connected to the second bonding electrode through a via hole penetrating through the insulating layer.
6. The liquid crystal display panel according to claim 5, wherein the third binding electrode is formed in the same layer as a source/drain layer of a pixel circuit in the display region.
7. The liquid crystal display panel according to claim 3, wherein a first organic film layer is disposed on a side of the second bonding electrode facing the opposite substrate in the bonding region, and an orthogonal projection of the first organic film layer in the bonding region and an orthogonal projection of the encapsulation adhesive in the bonding region do not overlap with each other.
8. The liquid crystal display panel according to claim 5, wherein in the bonding region, a second organic film layer is disposed on a side of the third bonding electrode facing the opposite substrate, and an orthogonal projection of the second organic film layer in the bonding region and an orthogonal projection of the encapsulation adhesive in the bonding region do not overlap each other.
9. A liquid crystal display device, comprising: the liquid crystal display panel of any one of claims 1 to 8, and a conductive paste disposed at an edge of the bonding region, the conductive paste being for electrically connecting the first bonding electrode with a driving chip.
10. A method for manufacturing a liquid crystal display device according to claim 9, comprising:
cutting the panel to be cut, which is formed by bonding the array substrate and the opposite substrate together, along the edge of the binding region to form the liquid crystal display panel;
coating the conductive adhesive on the edge of the binding region;
and electrically connecting the conductive adhesive with the driving chip.
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| CN114815407A (en) * | 2021-01-28 | 2022-07-29 | 京东方科技集团股份有限公司 | Display substrate, preparation method thereof and display panel |
| CN113707670B (en) * | 2021-08-03 | 2023-06-30 | 深圳市华星光电半导体显示技术有限公司 | Array substrate and display device |
| CN114967260B (en) * | 2022-05-30 | 2023-10-13 | 京东方科技集团股份有限公司 | Array substrate and display device |
| CN115016186B (en) * | 2022-06-30 | 2023-12-05 | 苏州华星光电技术有限公司 | Display mother board and display panel |
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