CN207352632U - Fingerprint module decoration, fingerprint module assembly and electronic equipment - Google Patents
Fingerprint module decoration, fingerprint module assembly and electronic equipment Download PDFInfo
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- CN207352632U CN207352632U CN201721191687.7U CN201721191687U CN207352632U CN 207352632 U CN207352632 U CN 207352632U CN 201721191687 U CN201721191687 U CN 201721191687U CN 207352632 U CN207352632 U CN 207352632U
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- plane
- fingerprint module
- annular body
- decoration
- fingerprint
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Abstract
The utility model provides a kind of fingerprint module decoration, fingerprint module assembly and electronic equipment, and wherein fingerprint module decoration includes：Annular body；The bottom of the annular body is provided with flange；Wherein, the lower surface of the flange is a coarse bonding plane, and the bonding plane passes sequentially through the madial wall that at least two intermediate inclines are connected to the annular body, lifts adhesive strength and water proof and dust proof degree.
Description
Technical field
The utility model is related to field of electronic devices, more particularly to a kind of fingerprint module decoration, fingerprint module assembly and
Electronic equipment.
Background technology
The convenient and security that nearly 2 years fingerprint recognitions are unlocked with it is rapidly developed in mobile phone industry, fingerprint recognition by
Gradually as one of standard fitting of smart mobile phone.Differentiation with brand positioning or the complication using crowd, terminal are set
Durable requirement of the standby manufacturer to fingerprint recognition is more and more stringenter.Because fingerprint recognition module is to be exposed at front face surface in complete machine
On, influence of the extraneous use environment to the fingerprint recognition service life is very big, and the particularly factor such as steam in environment is to fingerprint module
Function there are fatal influence.
Fingerprint recognition module with decoration needs retention gap because of its special design, decoration and fingerprint module chip
Coordinate the assembling of different parts.Exactly because this gap there are the steam in use environment, sweat, grease etc. can pass through gap
Slowly enter fingerprint module internal and form accumulation, corrosive deposit can be formed for a long time by accumulating, and there are wind to service life of fingerprint module
Danger.
Decoration is typically to be sticked to using glue on the flexible PCB on fingerprint module chip periphery, it may appear that is asked below
Topic point：
Decoration assembling under external force auxiliary occurs that glue is extruded the phenomenon of adhesive surface, reduces adhesive surface glue,
Viscous force is influenced, case ring obscission is easily occurred, glue amount influences the sealing function that glue plays originally after reducing, can not
Good stickup and waterproof action are played, makes fingerprint module be subject to the influences such as extraneous steam, sweat functional issues occur, and fill
Excessive glue easily occurs after assembling in gadget causes module size exceeded, influences appearance and size, causes bad order.
Utility model content
A kind of fingerprint module decoration, fingerprint module assembly and electronic equipment are provided in the utility model embodiment, with solution
Glue is extruded adhesive surface when certainly decoration assembles, and influences that viscous force is easy to fall off, can not play good stickup and waterproof action
Problem.
In order to solve the above-mentioned technical problem, the utility model embodiment adopts the following technical scheme that：
In a first aspect, the utility model embodiment provides a kind of fingerprint module decoration, including：
Annular body；
The bottom of the annular body is provided with flange；
Wherein, the lower surface of the flange is a coarse bonding plane, and the bonding plane passes sequentially through at least two
Intermediate incline is connected to the madial wall of the annular body.
Second aspect, the utility model embodiment also provide a kind of fingerprint module assembly, including：Fingerprint module and as above institute
The fingerprint module decoration stated；
Wherein, the fingerprint module includes：Fingerprint recognition chip and the flexibility for being arranged at the fingerprint recognition chip lower end
Circuit board, the annular body are socketed on the fingerprint recognition chip, and the bonding plane passes through with the flexible PCB
Adhesives bonding connection.
The third aspect, the utility model embodiment also provide a kind of electronic equipment, and the electronic equipment includes as described above
Fingerprint module assembly.
One or more embodiments of the utility model have the advantages that：
In this way, by the inclined design in the processing of decoration bottom roughness and increase glue water conservancy diversion, make fingerprint module and dress
Gadget can accommodate more glue in binding face when assembling, and increase the bonding area of glue and decoration, lift adhesive strength,
Glue realizes directed flow by water conservancy diversion inclined-plane at the same time, the gap for making glue flow between decoration and fingerprint module, filling
Design gaps, the influence for improving the corrosive liquid of the steam of fingerprint module resistance external environment condition, sweat, grease etc. at the same time improve
The mechanical performance of fingerprint module.
Brief description of the drawings
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that described embodiment is the utility model part of the embodiment, rather than whole implementation
Example.Based on the embodiment in the utility model, those of ordinary skill in the art are obtained without creative efforts
The every other embodiment obtained, shall fall within the protection scope of the present invention.
Fig. 1 shows the schematic cross-section of fingerprint module decoration in the utility model embodiment；
Fig. 2 represents the partial enlarged view of fingerprint module decoration in the utility model embodiment；
Fig. 3 represents the bottom end face schematic diagram of fingerprint module decoration in the utility model embodiment；
Fig. 4 represents glue position view in the utility model embodiment；
Fig. 5 represents the assembling schematic diagram of fingerprint module decoration in the utility model embodiment；
Fig. 6 represents the pressurization installation diagram of fingerprint module decoration in the utility model embodiment；
Fig. 7 represents the schematic diagram after the assembling of fingerprint module decoration in the utility model embodiment.
Reference numeral：Wherein in figure：
1- annular bodies, 2- flange, 3- bonding planes, 4- First Transitions inclined-plane, the second intermediate inclines of 5-, 6- fingerprint recognitions
Chip, 7- flexible PCBs, 8- glue, 9- pressue devices, 10- bonded structures.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe, it is clear that described embodiment is the utility model part of the embodiment, rather than whole implementation
Example.Based on the embodiment in the utility model, those of ordinary skill in the art are obtained without creative efforts
The every other embodiment obtained, shall fall within the protection scope of the present invention.
A kind of fingerprint module decoration disclosed in the utility model embodiment, with reference to shown in Fig. 1, Fig. 2, Fig. 3, including：
Annular body 1；The bottom of the annular body 1 is provided with flange.
Wherein, the lower surface of the flange is a coarse bonding plane 3, and the bonding plane 3 passes sequentially through at least two
A intermediate incline is connected to the madial wall of the annular body 1.
Specifically, the angle of inclination of relatively described bonding plane 3 is different from each other between at least two intermediate incline.
The annular body 1 is is socketed on fingerprint module, between the madial wall and fingerprint module of annular body 1 and annular body
Gap can be produced between 1 bottom and fingerprint module, the bottom in the annular body 1 is provided with flange 2, the lower surface of the flange 2
The madial wall of annular body 1 is connected to by least two intermediate inclines, due under normal conditions by fingerprint module decoration
When being assemblied on fingerprint module, the bottom of decoration need it is bonding with a part progress glue in fingerprint module, the flange 2
Coarse processing is done in lower surface, is formed as a coarse bonding plane 3, the contact surface of glue when increase decoration is glued
Product, lifts the cohesive force of bonding, at least one at least two intermediate incline to be formed as glue water conservancy diversion inclined-plane, and glue is guided
To madial wall, increase bond area.
Specifically, the coarse processing of the wherein bonding plane 3 is not limited to any shape, can be can also making for rule
Irregular shape, does not limit its shape, pattern etc..Wherein 2 one side of flange is installed to coordinate with miscellaneous part, realizes
With the fixing assembling between fingerprint module, the patch of larger area between fingerprint module decoration and annular body is on the other hand easy to implement
Bonding is closed, realizes the fixing assembling with fingerprint module.
Preferably, at least two intermediate incline with respect to the bonding plane 3 angle of inclination, by it is described bonding plane 3 to
It is incremented by successively on the madial wall direction of the annular body 1.
The structure so that at least two transition being set in turn between bonding plane 3 and the madial wall of annular body 1 are oblique
At face, the inclined spaces formed with gradient, easy to madial wall direction of the glue 8 from coarse bonding plane 3 to annular body 1
Extruding flowing.
As a preferred embodiment, when intermediate incline is two, wherein, at least two intermediate inclines bag
Include：
4 and second intermediate incline 5 of First Transition inclined-plane, 4 and second intermediate incline 5 of First Transition inclined-plane is by described viscous
The madial wall for connecing plane 3 to the annular body 1 is sequentially connected；The relatively described bonding plane 3 in the First Transition inclined-plane 4 has
First angle of inclination, the relatively described bonding plane 3 in the First Transition inclined-plane 4 have the second angle of inclination；Described first tilts
Angle is less than second angle of inclination.
With reference to shown in Fig. 4, Fig. 5, Fig. 6 and Fig. 7, when intermediate incline be two when, the lower end of fingerprint module decoration with
When fingerprint module is pasted, glue 8 squeezes into rough surface, and bottom is uneven to increase by 8 flow resistance of glue, subtracts the flowing of glue 8
It is slow, and extrude colloid in pressing and flowed towards 4 and second intermediate incline of First Transition inclined-plane, 5 direction, intermediate incline combines dress
The bonding plane 3 of gadget bottom roughness design, influences glue 8 and is flowed to the direction of the madial wall close to annular body 1, transition is oblique
Glue 8 can be introduced to fit-up gap by the setting in face, and fit-up gap is filled, and the space that inclined-plane is formed can accommodate more glue
Water 8, can increase dispensing amount, the Mechanical Reliability energy after increase module assembling, and the structure maximizing avoids excessive glue, real
While being now bonded strong degree, ensure cosmetic look.
Wherein, 4 and second intermediate incline 5 of First Transition inclined-plane is not limited to any angled ramp, only needs First Transition oblique
The angle of inclination in face 4 is less than the angle of inclination of the second intermediate incline 5 so that 4 and second intermediate incline 5 of First Transition inclined-plane
The inclined spaces of formation have the glue accommodating space of bigger, wherein, First Transition inclined-plane 4 is preferably arranged to even surface, is easy to
Madial wall direction extruding flowing of the glue 8 from coarse bonding plane 3 to annular body 1.
The processing technology of 4 and second intermediate incline 5 of First Transition inclined-plane includes but not limited to numerically-controlled machine tool processing, laser carving adds
Work, carving processing, rolling and processing, punching press etc..
Structure design in the fingerprint module decoration, by handling and increasing glue water conservancy diversion in decoration bottom roughness
Inclined design, more glue 8 are accommodated in binding face when fingerprint module is assembled with decoration, and increase glue 8 and decoration
The bonding area of part, while glue 8 realizes directed flow by water conservancy diversion inclined-plane, glue 8 is flow to decoration and fingerprint module
Between gap, be filled with design gaps, improve the corrosive liquid of the steam of fingerprint module resistance external environment condition, sweat, grease etc.
The influence of body, lifts water proof and dust proof degree, while improves the mechanical performance of fingerprint module.
Wherein, specifically, which is not limited to metal material, plastic cement material etc., that is, is provided with flange 2
Annular body 1 can be metal material or plastic cement material.Preferably, which is metalwork, meets decoration demand.
A kind of fingerprint module assembly is also disclosed in the utility model, with reference to shown in Fig. 3, Fig. 4, Fig. 5 and Fig. 6, including：Fingerprint mould
Group and fingerprint module decoration as described above.
Wherein, fingerprint module includes：Fingerprint recognition chip 6 and the flexible electrical for being arranged at 6 lower end of fingerprint recognition chip
Road plate 7, the annular body 1 are socketed on the fingerprint recognition chip 6, and the bonding plane 3 and the flexible PCB 7 are logical
Cross adhesives bonding connection.
Specifically, which is glue 8.The structure, in assembling, the chip perimeter position on flexible PCB 7
Dispensing is put, because in subsequent combination glue 8 can be allowed to orient there are the water conservancy diversion inclined-plane of glue 8 on fingerprint module decoration
Flowing, therefore the dispensing amount in the process can increase, and fingerprint module decoration is socketed on fingerprint recognition chip 6, pressurization
Device 9 pressurizes to fingerprint module decoration, and wherein the bottom of the annular body 1 of decoration applies vertical pressure, water conservancy diversion to glue 8
Incline position is because there are angle, and pressure is broken down into vertical and horizontal two power, wherein at coarse 3 position of bonding plane
Glue 8 is equal to because bond area is big and faying face is coarse can increase flow resistance and is applied with horizontal stroke to the glue 8 of incline position
To strength, glue 8 can flow to open place, push with reference to the pushing on inclined-plane and move glue 8 and know to decoration and fingerprint
Gap flowing between other chip 6 and flexible PCB 7, is finally reached effect of the glue by gap filling.
Specifically, bonded structure is equipped between the lateral wall of the upper surface of the flexible PCB 7 and fingerprint recognition chip 6
10, which forms the oblique of lateral wall and the upper surface for the flexible PCB 7 for connecting the fingerprint recognition chip 6
Face, the inclined-plane is parallel with the first inclined-plane at least two intermediate incline, and first inclined-plane is and the annular
The adjacent inclined-plane of the madial wall of main body 1.
The bonded structure 10 can be the adhesive structure after curing, which is formed by the adhesive structure after curing, added
Gu structural strength in fingerprint module between flexible PCB 7 and fingerprint recognition chip 6 and preventing from inwardly intaking into dirt, which refers to
The lateral wall of line identification chip 6 and the inclined-plane of the upper surface of flexible PCB 7 and first at least two intermediate incline are oblique
Face is parallel, realizes the cooperation installation in structure.
The utility model provides a kind of electronic equipment, which includes fingerprint module assembly as described above, improves
Fingerprint module resists the influence of the corrosive liquid of the steam of external environment condition, sweat, grease etc. while improves the machinery of fingerprint module
Performance.The electronic equipment can be but be not limited to mobile phone, tablet computer etc..
The above, is only specific embodiment of the present utility model, but the scope of protection of the utility model is not limited to
In this, any one skilled in the art can readily occur in change in the technical scope that the utility model discloses
Or replace, it should be covered within the scope of the utility model.Therefore, the scope of protection of the utility model should be wanted with right
Subject to the protection domain asked.
Each embodiment in this specification is described by the way of progressive, what each embodiment stressed be with
The difference of other embodiment, between each embodiment identical similar part mutually referring to.
Although having been described for the preferred embodiment of the utility model embodiment, those skilled in the art once learn
Basic creative concept, then can make these embodiments other change and modification.So appended claims are intended to solve
It is interpreted as including preferred embodiment and falls into all change and modification of the utility model embodiment scope.
Finally, it is to be noted that, in the utility model embodiment, such as first and second or the like relation art
Language is used merely to distinguish one entity or operation from another entity or operation, without necessarily requiring or implying this
There are any actual relationship or order between a little entities or operation.Moreover, term " comprising ", "comprising" or its
What his variation is intended to non-exclusive inclusion, so that process, method, article or end including a series of elements
End equipment not only includes those key elements, but also including other elements that are not explicitly listed, or further include as this mistake
Journey, method, article or the intrinsic key element of terminal device.In the absence of more restrictions, by sentence " including one
It is a ... " limit key element, it is not excluded that also exist in the process including the key element, method, article or terminal device
Other identical element.
Above-described is the preferred embodiment of the utility model, it should be pointed out that for the ordinary person of the art
For, some improvements and modifications can also be made under the premise of principle described in the utility model is not departed from, these are improved and profit
Decorations are also within the protection scope of the present utility model.
Claims (9)
- A kind of 1. fingerprint module decoration, it is characterised in that including：Annular body；The bottom of the annular body is provided with flange；Wherein, the lower surface of the flange is a coarse bonding plane, and the bonding plane passes sequentially through at least two transition Inclined-plane is connected to the madial wall of the annular body.
- 2. fingerprint module decoration according to claim 1, it is characterised in thatThe angle of inclination of the relatively described bonding plane of at least two intermediate incline, it is main to the annular by the bonding plane It is incremented by successively on the madial wall direction of body.
- 3. fingerprint module decoration according to claim 1, it is characterised in that at least two intermediate incline includes：First Transition inclined-plane and the second intermediate incline, the First Transition inclined-plane and the second intermediate incline are bonded plane extremely by described The madial wall of the annular body is sequentially connected；The relatively described bonding plane in the First Transition inclined-plane has the first angle of inclination, and the First Transition inclined-plane is relatively described Bonding plane has the second angle of inclination；First angle of inclination is less than second angle of inclination.
- 4. fingerprint module decoration according to claim 3, it is characterised in that the First Transition inclined-plane is even surface.
- 5. fingerprint module decoration according to claim 1, it is characterised in that the annular body is metalwork.
- A kind of 6. fingerprint module assembly, it is characterised in that including：Fingerprint module and such as claim 1 to 5 any one of them refer to Line module decoration；Wherein, the fingerprint module includes：Fingerprint recognition chip and the flexible circuit for being arranged at the fingerprint recognition chip lower end Plate, the annular body are socketed on the fingerprint recognition chip, and the bonding plane passes through Nian Jie with the flexible PCB Material bonding connection.
- 7. fingerprint module assembly according to claim 6, it is characterised in that the upper surface of the flexible PCB with it is described Bonded structure is equipped between the lateral wall of fingerprint recognition chip, the bonded structure forms a connection fingerprint recognition chip Lateral wall and the inclined-plane of the upper surface of the flexible PCB, the inclined-plane and first at least two intermediate incline are oblique Face is parallel, and first inclined-plane is the inclined-plane adjacent with the madial wall of the annular body.
- 8. fingerprint module assembly according to claim 6, it is characterised in that the adhesives is glue.
- 9. a kind of electronic equipment, it is characterised in that the electronic equipment includes such as claim 6 to 8 any one of them fingerprint Module assembly.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721191687.7U CN207352632U (en) | 2017-09-18 | 2017-09-18 | Fingerprint module decoration, fingerprint module assembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721191687.7U CN207352632U (en) | 2017-09-18 | 2017-09-18 | Fingerprint module decoration, fingerprint module assembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207352632U true CN207352632U (en) | 2018-05-11 |
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ID=62410312
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721191687.7U Active CN207352632U (en) | 2017-09-18 | 2017-09-18 | Fingerprint module decoration, fingerprint module assembly and electronic equipment |
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| Country | Link |
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| CN (1) | CN207352632U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109299710A (en) * | 2018-12-06 | 2019-02-01 | 上海摩软通讯技术有限公司 | Fingerprint mould group and terminal device |
| CN110394973A (en) * | 2019-08-23 | 2019-11-01 | 广州市德帝鑫皮具有限公司 | A kind of spike bonding structure and method |
| CN111818750A (en) * | 2020-05-29 | 2020-10-23 | 维沃移动通信有限公司 | Functional module and electronic equipment |
-
2017
- 2017-09-18 CN CN201721191687.7U patent/CN207352632U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109299710A (en) * | 2018-12-06 | 2019-02-01 | 上海摩软通讯技术有限公司 | Fingerprint mould group and terminal device |
| CN110394973A (en) * | 2019-08-23 | 2019-11-01 | 广州市德帝鑫皮具有限公司 | A kind of spike bonding structure and method |
| CN111818750A (en) * | 2020-05-29 | 2020-10-23 | 维沃移动通信有限公司 | Functional module and electronic equipment |
| CN111818750B (en) * | 2020-05-29 | 2022-01-28 | 维沃移动通信有限公司 | Functional module and electronic equipment |
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