CN104320908A - Heat dissipating type multilayer soft and hardness combined printing plate - Google Patents
Heat dissipating type multilayer soft and hardness combined printing plate Download PDFInfo
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- CN104320908A CN104320908A CN201410640587.2A CN201410640587A CN104320908A CN 104320908 A CN104320908 A CN 104320908A CN 201410640587 A CN201410640587 A CN 201410640587A CN 104320908 A CN104320908 A CN 104320908A
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Abstract
The invention relates to a heat dissipating type multilayer soft and hardness combined printing plate, and relates to the technical field of multilayer circuit printing plates. The heat dissipating type multilayer soft and hardness combined printing plate comprises a flexibility area and a rigidity area. The flexibility area comprises a flexibility copper-clad plate, a bonding thin film and a cover film. According to the flexibility copper-clad plate, liquid crystal polymer (LCP) is adopted as an insulation base membrane, and the two side walls of the insulation base membrane are tightly coated with copper foil layers. The rigidity area comprises a first rigidity copper-clad plate layer provided with a metal substrate and a second rigidity copper-clad plate layer provided with a metal substrate, a plurality of heat-dissipating grooves are evenly formed in the upper surface and the lower surface of the metal substrate of the first rigidity copper-clad plate and the upper surface and the lower surface of the metal substrate of the second copper-clad plate, and the cross sections of the heat-dissipating grooves are in an arc shape or a zigzag shape. The metal substrates are adopted, the rigidity of a rigidity area circuit board is guaranteed, a superior heat-dissipating effect is achieved, and the using stability of the circuit board is guaranteed.
Description
Technical field:
The present invention relates to multilayer line printed panel technical field, be specifically related to a kind of heat radiating type multilayer soft or hard in conjunction with printed panel.
Background technology:
Industry, Medical Devices, 3G mobile, LCD TV and other consumer electronics are as the continuous expansion of the portable electronics market demand such as hard disk drive, floppy disk, mobile phone, notebook computer, camera, video camera, PDA of electronic computer, and electronic equipment is more and more towards light, thin, short, the little and future development of multifunction.The particularly application of the flexible board of high density interconnection structure (HDI), to greatly drive the fast development of flexible printed circuit technology, simultaneously along with development and the raising of printed circuit technique, the developmental research of Rigid Flex (Rigid-Flex PCB) also gets a lot of applications, and estimates that the supply of whole world Rigid Flex from now on will roll up.Meanwhile, the durability of Rigid Flex, with flexible, also make it be more suitable for medical treatment and applies with military field, progressively nibble the market share of rigidity PCB.Because there is a large amount of cell phone manufacturer Korea S, Taiwan, therefore these manufacturers have dominated Rigid Flex market.According to the data of Taiwan circuit board association (TPCA), about there are 200 PCB manufacturers current this area.Hongkong Ye You minority enterprise at production Rigid Flex, but nearlyly possesses good production technology less than five enterprises.
In China's Mainland, this series products proportion in overall PCB market is little, and Taiwan Industrial Technology Research Institute (IEK) estimates only to account for about 2%.But the production share in continent just constantly increases, manufacturers all recognize, Rigid Flex is both light and thin, and compact, is particularly suitable for up-to-the-minute portable electronic piece and advanced medical and military equipment---and these end products are at present all in the output raising continent Rigid Flex.Therefore, insider estimates that Rigid Flex will surmount the PCB of other type in the coming years.Though product is good, some is high to manufacture threshold, and in all types of PCB, Rigid Flex is the strongest for the resistance of severe applied environment, is therefore subject to the favor of medical treatment and military equipment manufacturer.Rigid Flex has the endurance of rigidity PCB and the adaptive faculty of flexible PCB concurrently.The ratio that this type of PCB accounts for overall productivity is improving in the enterprise of China's Mainland, to make full use of the ever-increasing good chance of demand.Reduce package size, the weight of electronic product, avoid Miswire, increase assembling flexibility, improve reliability, realize the 3 D stereo assembling under different assembled condition, it is the growing necessity of electronic product, flexible circuit as a kind of there is thin, light, deflection etc. can the interconnection technique of feature of meeting requirements on three-dimensional assembling demand, obtain applying increasingly widely and paying attention at electronics and communications industry.
Along with the continuous expansion of its application; flex circuit application itself is also at development; as from one side flex plate to two-sided, multilayer and even just---flex plate etc.; fine rule is wide/application of technology and the material behavior of flexible substrate itself etc. such as spacing, surface installation, stricter requirement is proposed to the making of flex plate; as the process of base material; interlayer alignment; the control of the stability of size; decontaminate, the attention of height all be should give in the aspects such as the reliability of little hole metallization and plating and surface protective coating.
Current Rigid Flex, also in continuous development, can produce ten layers, Floor 12 in the industry, even more multi-layered multilayer Rigid Flex, but the problem of such circuit board ubiquity heat radiation difficulty.
Summary of the invention:
The object of this invention is to provide a kind of heat radiating type multilayer soft or hard in conjunction with printed panel, it adopts the substrate of metal material, ensure that the rigidity of rigid region circuit board, and has excellent radiating effect, ensure that the stability that circuit board uses.
In order to solve the problem existing for background technology, the present invention is by the following technical solutions: it comprises flexure region and rigid region, the both sides of flexure region are all symmetrically arranged with rigid region, and rigid region is symmetrical along the center line of flexure region, fixing hole is uniformly distributed and runs through flexure region and rigid region.
Described flexure region comprises flexibility coat copper plate, adhering film and coverlay, and two-layer coverlay is bonded together by adhering film, and the outer wall of coverlay is all pasted with flexibility coat copper plate, is all bonded with coverlay in the middle part of the outer wall of flexibility coat copper plate.
Described rigid region comprises ground floor rigidity copper-clad plate with metal substrate and the copper-clad plate of second layer rigidity, the copper-clad plate of ground floor rigidity and the copper-clad plate of second layer rigidity bond together, and its bonding complete after be symmetrically distributed in the outer wall of flexibility coat copper plate, further, described metal substrate comprises the metal substrate of the good heat dispersion performance such as copper base, aluminum base plate.
Described flexibility coat copper plate adopts liquid crystal polymer LCP to be insulating basement membrane, and the two side of insulating basement membrane is all closely coated with copper foil layer.
Described ground floor rigidity copper-clad plate and the copper-clad plate of second layer rigidity are all adopt metal material to make metal substrate, and the two side of metal substrate is all closely coated with copper foil layer.
The metal substrate upper and lower surface of described ground floor rigidity copper-clad plate and the copper-clad plate of second layer rigidity is evenly provided with several heat radiation groove, and the cross section of this heat radiation groove is arc or zigzag.
Described adhering film adopts acrylic acid to make.
Principle of the present invention is: flexure region adopts liquid crystal polymer LCP to be insulating basement membrane, has excellent agent of low hygroscopicity and high resistant insulation effect, and dimensional stability is better, and when running into high temperature, the shrinkage of flexure region is less.Rigid region adopts surface with the metal substrate of heat radiation groove, and metal substrate is metal material, integral heat sink excellent performance, and its intensity is higher, and the scope of application is wider.
Accompanying drawing illustrates:
Fig. 1 is structural representation of the present invention,
Fig. 2 is the structural representation of flexibility coat copper plate in the present invention,
Fig. 3 is the structural representation of substrate in the present invention,
Fig. 4 is the partial enlargement structural representation of Fig. 3;
Reference numeral: A-flexure region; B-rigid region; The copper-clad plate of 1-ground floor rigidity, 11-copper foil layer two, 12-metal substrate, 13-dispel the heat groove; The copper-clad plate of 2-second layer rigidity; 3-flexibility coat copper plate, 31-copper foil layer one, 32-insulating basement membrane; 4-adhering film; 5-coverlay; 6-fixing hole.
Embodiment:
Below in conjunction with accompanying drawing, the present invention is described in detail.
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with the drawings and the specific embodiments, the present invention is further elaborated.Should be appreciated that embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
With reference to Fig. 1, this embodiment is by the following technical solutions: it comprises flexure region A and rigid region B, the both sides of flexure region A are all symmetrically arranged with rigid region B, and rigid region B is symmetrical along the center line of flexure region A, fixing hole 6 is uniformly distributed and runs through flexure region A and rigid region B.
Described flexure region A comprises flexibility coat copper plate 3, adhering film 4 and coverlay 5, and two-layer coverlay 5 is bonded together by adhering film 4, and the outer wall of coverlay 5 is all pasted with flexibility coat copper plate 3, is all bonded with coverlay 5 in the middle part of the outer wall of flexibility coat copper plate 3.
Described rigid region B comprises ground floor rigidity copper-clad plate 1 with metal substrate and second layer rigidity copper-clad plate 2, ground floor rigidity copper-clad plate 1 and second layer rigidity copper-clad plate 2 bond together, and its bonding complete after be symmetrically distributed in the outer wall of flexibility coat copper plate 3, further, described metal substrate comprises the metal substrate of the good heat dispersion performance such as copper base, aluminum base plate.
With reference to Fig. 2, described flexibility coat copper plate 3 adopts liquid crystal polymer LCP to be insulating basement membrane 32, and the two side of insulating basement membrane 32 is all closely coated with the copper foil layer 1 of 35 μm.
With reference to Fig. 3, described ground floor rigidity copper-clad plate 1 and second layer rigidity copper-clad plate 2 are all adopt metal material to make metal substrate 12, and the two side of metal substrate 12 are all closely coated with the copper foil layer 2 11 of 35 μm.
With reference to Fig. 4, described ground floor rigidity copper-clad plate 1 and metal substrate 12 upper and lower surface of second layer rigidity copper-clad plate 2 are evenly provided with several heat radiation groove 13, and the cross section of this heat radiation groove 13 is arc or zigzag.
Described adhering film 4 adopts acrylic acid to make.
The principle of this embodiment is: flexure region A adopts liquid crystal polymer LCP to be insulating basement membrane 32, has excellent agent of low hygroscopicity and high resistant insulation effect, and dimensional stability is better, and when running into high temperature, the shrinkage of flexure region A is less.Rigid region B adopts surface with the metal substrate 12 of heat radiation groove 13, and metal substrate 12 is metal material, integral heat sink excellent performance, and its intensity is higher, and the scope of application is wider.
The above is only in order to illustrate technical scheme of the present invention and unrestricted, other amendment that those of ordinary skill in the art make technical scheme of the present invention or equivalently to replace, only otherwise depart from the spirit and scope of technical solution of the present invention, all should be encompassed in the middle of right of the present invention.
Claims (5)
1. heat radiating type multilayer soft or hard is in conjunction with printed panel, it is characterized in that it comprises flexure region and rigid region, the both sides of flexure region are all symmetrically arranged with rigid region, and rigid region is symmetrical along the center line of flexure region, and fixing hole is uniformly distributed and runs through flexure region and rigid region; Described flexure region comprises flexibility coat copper plate, adhering film and coverlay, and two-layer coverlay is bonded together by adhering film, and the outer wall of coverlay is all pasted with flexibility coat copper plate, is all bonded with coverlay in the middle part of the outer wall of flexibility coat copper plate; Described rigid region comprises ground floor rigidity copper-clad plate with metal substrate and the copper-clad plate of second layer rigidity, the copper-clad plate of ground floor rigidity and the copper-clad plate of second layer rigidity bond together, and its bonding complete after be symmetrically distributed in the outer wall of flexibility coat copper plate, described metal substrate comprises copper base, aluminum base plate.
2. heat radiating type multilayer soft or hard according to claim 1 is in conjunction with printed panel, and it is characterized in that described flexibility coat copper plate adopts liquid crystal polymer LCP to be insulating basement membrane, the two side of insulating basement membrane is all closely coated with copper foil layer.
3. heat radiating type multilayer soft or hard according to claim 1 is in conjunction with printed panel, it is characterized in that described ground floor rigidity copper-clad plate and the copper-clad plate of second layer rigidity are all adopt metal material to make metal substrate, and the two side of metal substrate is all closely coated with copper foil layer.
4. heat radiating type multilayer soft or hard according to claim 1 is in conjunction with printed panel, it is characterized in that the metal substrate upper and lower surface of described ground floor rigidity copper-clad plate and the copper-clad plate of second layer rigidity is evenly provided with several heat radiation groove, the cross section of this heat radiation groove is arc or zigzag.
5. heat radiating type multilayer soft or hard according to claim 1 is in conjunction with printed panel, it is characterized in that described adhering film adopts acrylic acid to make.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410640587.2A CN104320908A (en) | 2014-11-14 | 2014-11-14 | Heat dissipating type multilayer soft and hardness combined printing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410640587.2A CN104320908A (en) | 2014-11-14 | 2014-11-14 | Heat dissipating type multilayer soft and hardness combined printing plate |
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| CN104320908A true CN104320908A (en) | 2015-01-28 |
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| CN201410640587.2A Pending CN104320908A (en) | 2014-11-14 | 2014-11-14 | Heat dissipating type multilayer soft and hardness combined printing plate |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902154A (en) * | 2015-05-27 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Circuit board subassembly, camera module and camera shooting equipment with the same |
| CN109041405A (en) * | 2016-02-25 | 2018-12-18 | 广东欧珀移动通信有限公司 | Rigid Flex, terminal and Rigid Flex production method |
| TWI666976B (en) * | 2017-12-12 | 2019-07-21 | 英屬開曼群島商鳳凰先驅股份有限公司 | Flexible substrate and method thereof |
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114698225A (en) * | 2020-12-31 | 2022-07-01 | 深南电路股份有限公司 | Battery protection plate, manufacturing method thereof and electronic device |
Citations (4)
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| JPH0685406A (en) * | 1992-09-04 | 1994-03-25 | Mitsui Toatsu Chem Inc | Rigid flexible printed wirig board |
| CN1829412A (en) * | 2005-02-17 | 2006-09-06 | 新日铁化学株式会社 | Double-side flexible circuit substrate capable of repeatedly bending |
| CN102209442A (en) * | 2010-11-16 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN203219608U (en) * | 2013-01-31 | 2013-09-25 | 光明半导体（天津）有限公司 | Metal-based printed circuit board with heat radiation pattern |
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2014
- 2014-11-14 CN CN201410640587.2A patent/CN104320908A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0685406A (en) * | 1992-09-04 | 1994-03-25 | Mitsui Toatsu Chem Inc | Rigid flexible printed wirig board |
| CN1829412A (en) * | 2005-02-17 | 2006-09-06 | 新日铁化学株式会社 | Double-side flexible circuit substrate capable of repeatedly bending |
| CN102209442A (en) * | 2010-11-16 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN203219608U (en) * | 2013-01-31 | 2013-09-25 | 光明半导体（天津）有限公司 | Metal-based printed circuit board with heat radiation pattern |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104902154A (en) * | 2015-05-27 | 2015-09-09 | 南昌欧菲光电技术有限公司 | Circuit board subassembly, camera module and camera shooting equipment with the same |
| CN109041405A (en) * | 2016-02-25 | 2018-12-18 | 广东欧珀移动通信有限公司 | Rigid Flex, terminal and Rigid Flex production method |
| CN109041405B (en) * | 2016-02-25 | 2020-07-10 | Oppo广东移动通信有限公司 | Rigid-flex board, terminal and rigid-flex board manufacturing method |
| TWI666976B (en) * | 2017-12-12 | 2019-07-21 | 英屬開曼群島商鳳凰先驅股份有限公司 | Flexible substrate and method thereof |
| CN114698225A (en) * | 2020-12-31 | 2022-07-01 | 深南电路股份有限公司 | Battery protection plate, manufacturing method thereof and electronic device |
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
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Application publication date: 20150128 |