CN114336112B - Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material - Google Patents
Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material Download PDFInfo
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Abstract
The invention discloses a method for connecting a soft interface and a hard interface between a flexible conductive material and a hard conductive material, which comprises the following steps: preparing a flexible conductive material comprising a flexible material substrate and a metal conductive film I coated on the flexible material substrate; preparing a modified hard conductive material comprising a hard material substrate, an elastomer layer and a metal conductive film II on the elastomer layer, wherein the modified hard conductive material is connected with the output end of the flexible conductive material; the metal conductive film I at the output end of the flexible conductive material is contacted with the metal conductive film II of the modified hard conductive material, and the metal conductive film I and the metal conductive film II are connected and conducted through the self-adhesion effect of the elastomer. The invention utilizes the self-adhesion characteristic of the elastomer material to realize the connection between the flexible conductive material and the external hard signal transmission end at room temperature without an external adhesive. The method not only simplifies the production process, realizes the connection of soft materials and hard materials, but also effectively ensures the conductivity and stretchability of the whole sensor, and the obtained electrophysiological signals and strain signals are more stable.
Description
Technical Field
The invention belongs to the field of flexible electronics, and particularly relates to a method for connecting a soft interface and a hard interface between a flexible conductive material and a hard conductive material.
Background
Young's modulus is one of the important indexes for measuring the mechanical properties of materials. In general, the greater the Young's modulus, the greater the hardness of the material, and conversely the lower the hardness. Materials having a large young's modulus and being not easily bent or stretched are generally called hard materials such as metal blocks, and materials having a relatively small young's modulus and being bendable and stretchable are called flexible materials such as a part of polymer materials, and the like. Because the Young's modulus difference is great, the flexible material and the hard material produce the deformation volume difference when receiving the same external force, and the soft or hard joint interface that comprises flexible material and hard material often can separate at this moment.
There are many situations where the device is used in the life, such as man-machine interaction and biological interface sensing. The skin and muscle of human body can deform to different degrees in the process of completing each action, for example, the deformation of the waist skin can easily reach more than 40% in the process of bending down. Therefore, the body surface detection equipment used for measuring body surface physiological signals such as myoelectricity, movement deformation and the like needs to adapt to the larger deformation of the body, and still has better electrical property and mechanical property when the body surface detection equipment is subjected to the larger deformation, so that the body surface detection equipment needs to have flexible stretchability. In addition, when detecting in-vivo physiological signals with deeper signal sources, such as intracranial brain electrical signals, the flexible stretchable detection device has better mechanical matching property than the rigid device and the monitoring point. The adhesion between the hard detection device and the soft biological tissue is poor, the Young modulus difference is large, and the mechanical mismatch inevitably causes tissue injury or inflammation in long-term implantation, thereby affecting the accurate measurement of physiological signals. Therefore, the flexible stretchable detection device has wide application prospects in body surface and in-vivo biological physiological signal detection. However, no matter what kind of flexible material is used as the detection device, there must be a soft-hard connection interface between the flexible material and the external hard signal transmission wire. Meanwhile, the soft and hard joint interface not only needs excellent mechanical properties such as stretching and tearing resistance, but also meets other requirements. Just as one of the functions of a flexible test device as a biological interface is electrical conductivity, a soft and hard engagement interface also requires better electrical conductivity. Therefore, the research on the connection mode between the flexible material and the hard material has very practical application value.
However, the soft and hard interface connection mode commonly used at present is mainly welding or bonding by using adhesive. The application temperature of the welding filling material is high, and great difficulty is brought to the use of the traditional elastic material with low glass transition temperature. Materials such as soldering tin commonly used in the interface become unsuitable, and the conductive adhesive prepared from the composite material often has the problems of high resistivity, poor electromagnetic wave shielding performance, poor conductive stability, poor flexibility and the like, so that the electric signal is greatly lost in the transmission process.
In summary, the mechanical factors involved in the soft and hard connection interface are more, such as elastic modulus, hardness, breaking strength and the like. Complicated mechanical factors cause problems in the transmission of electrical signals at the soft and hard joint interfaces. Therefore, the connection problem of soft and hard interfaces with very large differences in mechanical properties is solved, the stability and mechanical matching property of the whole sensing equipment can be improved, the connection state of conductors can be greatly improved, unnecessary loss of electric signals in the transmission process is reduced, and the quality and service life of the whole sensing equipment are further improved.
Chinese patent CN103118505a discloses a PCB board having the advantages of both a soft board and a hard board, and solves the problem of separation of the explosion board and the hole wall, but requires procedures of browning treatment, windowing treatment, bonding epoxy resin semi-curing tabletting, and the like, and the preparation process is complex and not environment-friendly. Chinese patent CN106550539a discloses a method for preparing a flexible printed circuit board with simple process and low cost, i.e. a flexible printed circuit board is bonded to a printed circuit board by using a laser welding method or an ultrasonic welding method, and although the production steps are greatly reduced, the physical properties of the flexible material itself, such as material denaturation caused by a high temperature environment, and further mechanical and electrical tolerance loss, are not considered. The above method is therefore not suitable for most flexible materials with low glass transition temperatures.
Disclosure of Invention
In order to solve the defects in the prior art, the invention aims to provide a method for connecting a soft interface and a hard interface between a flexible conductive material and a hard conductive material, and the method for connecting the soft interface and the hard interface can ensure better electrical performance. The specific technical scheme is as follows:
the first aspect of the invention provides a soft and hard connection interface between a flexible conductive material and a hard conductive material, wherein the soft and hard connection interface comprises a flexible conductive material output end and a modified hard conductive material connected with the flexible conductive material output end;
the flexible conductive material comprises a flexible material substrate and a metal conductive film I covered on the flexible material substrate;
the modified hard conductive material connected with the flexible material output end comprises a hard material substrate, an elastomer layer and a metal conductive film II on the elastomer layer from bottom to top, wherein the elastomer layer is coated on the hard material substrate in a jogging or adhering mode;
the soft and hard connection interface is composed of a hard material substrate, an elastomer layer, a metal conductive film II, a metal conductive film I and a flexible material substrate from bottom to top;
the metal conductive film I is connected with the metal conductive film II;
the elastomer layer on the modified hard conductive material engaged with the flexible material output end is the same as the elastomer material used for the flexible material substrate of the flexible conductive material, and the elastomer material has self-adhesive property.
Further, the flexible conductive material is a flexible electrode.
Further, the metal conductive film II is communicated with the conductive filler at the other end of the modified hard conductive material;
preferably, the conductive filler at the other end of the modified hard conductive material is a conductive filler contained in the hard conductive material itself; or the conductive filler at the other end of the modified hard conductive material is a metal conductive film II which is expanded to the whole hard material substrate.
Further, a soft and hard engagement interface may include a plurality of conductive channels to enable engagement between the high density flexible conductive material and the hard conductive material.
The second aspect of the present invention provides a method for joining soft and hard interfaces between a flexible conductive material and a hard conductive material, wherein the hard conductive material is self-made, and the joining method comprises the following steps:
preparing an elastomer solution A for later use, wherein a solvent (solvent A) of the solution is a solvent capable of dissolving a hard material substrate;
spin-coating the elastomer solution on the hard material substrate, and depositing a metal conductive film II on the elastomer layer to obtain a modified hard conductive material after the solvent is completely volatilized to obtain the hard material substrate embedded with the elastomer layer;
preparing a flexible material substrate by using the elastomer solution, for example, spin-coating the elastomer solution on hydrophobic glass, volatilizing a solvent to obtain the flexible material substrate, and depositing a metal conductive film I on the flexible material substrate to obtain a flexible conductive material;
the metal conductive film I at the output end of the flexible conductive material is contacted with the metal conductive film II of the modified hard conductive material, and the metal conductive film I and the metal conductive film II are connected through the self-adhesion of the elastomer and have conductivity.
In the technical scheme, the preparation of the self-made hard conductive material comprises the following steps: firstly, a hard material capable of being swelled by the solvent A is selected to prepare a hard material substrate with a certain shape, wherein the shape can meet the connection requirement (the shape matching when the hard material substrate is connected with a flexible conductive material, the shape matching when the hard conductive material is connected with an electronic device such as a computer, such as a USB interface, and the like). And spin-coating the elastomer solution on the hard material substrate, and obtaining the hard material substrate embedded with the elastomer layer after the solvent is completely volatilized. And depositing a metal conductive film on the elastomer layer of the hard material substrate (the shape of the conductive film is realized by covering a mask plate on the composite substrate before metal deposition), thus obtaining the self-made hard conductive material.
In the above technical solution of the present invention, the shape of the metal conductive film I may be achieved by covering a mask plate on the flexible material substrate before metal deposition.
In the above technical solution of the present invention, the connection area between the flexible conductive material and the hard conductive material is determined according to the requirement.
The third aspect of the present invention provides a joining method of a soft-hard interface between a flexible conductive material and a hard conductive material, wherein the hard conductive material is a commercial hard conductive material, and the joining method comprises the following steps:
preparing an elastomer solution B, wherein a solvent (solvent B) of the solution is a solvent which does not dissolve a commercial hard conductive material substrate;
spin-coating the elastomer solution at one end of the commercial hard conductive material substrate, namely one end to be connected with the flexible conductive material, and obtaining an elastomer layer-hard material substrate after the solvent is completely volatilized; or, separately preparing an elastomer layer and then transferring and covering one end of a commercial hard conducting material substrate to obtain an elastomer layer-hard conducting wire substrate; depositing a metal conductive film II on the elastomer layer, wherein the metal conductive film II is communicated with a conductive filler of a commercial hard conductive material substrate to obtain a modified hard conductive material;
preparing a flexible material substrate by using the elastomer solution, for example, spin-coating the elastomer solution on hydrophobic glass, volatilizing a solvent to obtain the flexible material substrate, and depositing a metal conductive film I on the flexible material substrate to obtain a flexible conductive material;
the metal conductive film I at the output end of the flexible conductive material is contacted with the metal conductive film II of the modified hard conductive material, and the metal conductive film I and the metal conductive film II are connected through the self-adhesion of the elastomer and have conductivity.
In the above technical solution of the present invention, the shape of the metal conductive film I may be achieved by covering a mask plate on the flexible material substrate before metal deposition.
Further, the commercial hard conductive material is a printed circuit board or other hard wire board.
In the above connection method of the present invention, the metal conductive film I and the metal conductive film II are patterned metal conductive films, i.e. metal conductive films having a certain shape (such as a strip-like array, etc.) to meet specific requirements. The thickness of the metal conductive film is determined according to actual needs and effects.
In the connection method, the connection of the multi-channel electrodes can be realized by realizing patterning through the covering of the mask plate.
In the connection method of the invention, the hard conductive material mainly plays a role in electric signal transmission.
The above-mentioned connection method of the present invention includes, but is not limited to, preparing a metal conductive film by using a magnetron sputtering method, a thermal evaporation coating method or a transfer printing method.
The fourth aspect of the invention provides the application of the soft and hard interface or the connection method in the soft and hard interface connection of the flexible sensor.
The beneficial effects of the invention are as follows:
1. the soft and hard connection interface provided by the invention realizes connection between the flexible material containing the conductive filler and the hard material containing the conductive filler by utilizing the self-adhesive property of the elastomer material. The soft and hard connection interface effectively ensures the conductivity and mechanical property of the whole device. The acquired electric signals and the strain signals are more stable, and the application of the flexible sensor in the fields of biomedical treatment, intelligent wearable and the like is promoted.
The metal conductive film structure on the flexible material substrate keeps good conductive performance and good self-adhesion property.
2. The soft and hard connection interface related by the invention does not introduce extra adhesive, can realize good connection of the soft and hard interfaces only by using the self-adhesive characteristic of the elastomer without extra working procedures, has simple and quick preparation method, does not generate industrial waste and wastewater, is economical and environment-friendly, has simple preparation process, less time consumption and high repeatability, and is convenient for large-scale production.
3. The invention relates to a modified hard conductive material, wherein an elastomer layer is coated on a hard material substrate in a jogged or adhered mode.
When the hard material dissolved in the solvent is adopted in the invention, the embedding of the hard material and the self-viscoelastic body can be realized, the contact surface is irregular, and the probability of de-embedding is small. The embedded surface ensures the viscosity of the hard material and the hardness of the hard material, and can realize any conductive patterning according to the requirement. In addition, the pattern similar to the USB interface provides a new idea for the shape design and application of the hard wire material. This optimizes the signal transmission path and improves the quality of the signal.
4. Compared with the flexible material containing conductive filler, the soft and hard connection interface prepared by the invention has the advantages that the resistance is not obviously increased, and the interface has good conductivity. The soft-hard connection interface can greatly reduce the loss of the electric signal in the transmission process and enhance the stability of signal transmission.
The flexible electronic product packaged in the connection mode of the soft and hard interfaces has good deformation conduction capacity, and the deformation amount can reach 80% of the deformation amount of the flexible electrode.
Drawings
FIG. 1 is a front view (A) and a schematic cross-sectional view (B) of a flexible material comprising a conductive filler;
FIG. 2 is a front view (A) and a schematic cross-sectional view (B) of a modified hard material comprising a conductive filler;
FIG. 3 is a front view (A) and a cross-sectional view (B) of the soft-hard engagement interface;
FIG. 4 is a front view (A) and a schematic cross-sectional view (B) of a SEBS-Au film flexible material;
FIG. 5 is a front view (A) and a schematic cross-sectional view (B) of a polystyrene-SEBS-Au film hard material;
FIG. 6 is a front view (A) and a schematic cross-sectional view (B) of a soft and hard joint interface consisting of a polystyrene-SEBS-Au film hard substrate and a SEBS-Au flexible electrode;
FIG. 7 is a physical diagram of a hard-soft engagement interface;
FIG. 8 is a graph showing the electrical performance of a soft and hard joint interface formed by a polystyrene-SEBS-Au film hard substrate and a SEBS-Au flexible electrode in the stretching process of the SEBS-Au flexible electrode.
Detailed Description
For a clearer understanding of the present invention, the present invention will now be further described with reference to the following examples and drawings. The examples are for illustration only and are not intended to limit the invention in any way. In the examples, each of the starting reagent materials is commercially available, and the experimental methods without specifying the specific conditions are conventional methods and conventional conditions well known in the art, or according to the conditions recommended by the instrument manufacturer.
Example 1
The flexible conductive material is also called a flexible material containing conductive filler in this embodiment; the modified hard conductive material is also called as modified hard material containing conductive filler.
Fig. 3 is a front view (a) and a cross-sectional schematic view (B) of a soft and hard joint interface between a flexible conductive material and a hard conductive material, including a flexible conductive material output and a modified hard conductive material joined to the flexible conductive material output. The soft and hard connection interface is composed of a hard material substrate, an elastomer layer, a metal conductive film II, a metal conductive film I and a flexible material substrate from bottom to top, wherein the metal conductive film I is connected with the metal conductive film II.
As shown in fig. 1, the flexible conductive material includes a flexible material substrate and a metal conductive film I coated on the flexible material substrate.
As shown in fig. 2, the modified hard conductive material connected with the output end of the flexible conductive material comprises a hard material substrate, an elastomer layer and a metal conductive film II on the elastomer layer, wherein the elastomer layer is coated on the hard material substrate in a jogging or adhering manner.
The elastomer layer on the modified hard conductive material connected with the output end of the flexible conductive material is the same as the elastomer material used by the flexible material substrate of the flexible conductive material, and the elastomer material has self-adhesive property.
The metal conductive film II is communicated with a conductive filler, such as a wire, at the other end of the modified hard conductive material.
In a specific embodiment, the modified hard conductive material itself comprises a conductive filler, such as a wire, with which the metal conductive film II is in communication.
In a specific embodiment, the modified hard conductive material itself does not contain a conductive filler, and the conductivity of the flexible conductive material and the hard conductive material is achieved by expanding the metal conductive film II to the entire hard material substrate, with the metal conductive film II acting as a conductive filler.
In a specific embodiment, the flexible conductive material is a flexible electrode.
In a specific embodiment, a plurality of metallic conductive films I are deposited on a hard material substrate to prepare a multi-conductive via soft and hard joint interface.
Example 2
The embodiment provides a method for connecting a soft-hard interface between a flexible material with a conductive channel and a modified commercial hard material, which specifically comprises the following steps:
(1) An elastomer solution is prepared for later use, wherein the solvent of the solution is a solvent incapable of dissolving a commercial hard material. The concentration of the elastomer solution which is usually used is 15% -60%, which is determined according to actual requirements.
The elastomeric material used has self-adhesive properties, for example, it can be a linear triblock copolymer (SEBS) with polystyrene as end block and ethylene-butene copolymer obtained by hydrogenating polybutadiene as intermediate elastomeric block.
(2) And spin-coating an elastomer solution prepared at one end of the commercial hard material substrate connected with the flexible material containing the conductive filler, and obtaining the elastomer layer-commercial hard material substrate after the solvent is completely volatilized. The elastomer layer-commercial hard material substrate can also be made by separately preparing the elastomer layer and then transferring it over the commercial hard material, which method is required to ensure that the wire ends on the hard material are exposed.
And depositing a metal conductive film on the elastomer layer, and ensuring that the metal conductive film is communicated with a wire of a commercial hard conductive material to obtain the modified commercial hard material.
(3) And (3) taking the prepared elastomer solution as a flexible material substrate, and depositing a metal conductive film to prepare the flexible material with the conductive filler.
(4) The metal conductive film I of the flexible material output end is contacted with the metal conductive film II of the transformed commercial hard material, the butt joint surface is pressed, the flexible material output end is connected with the hard material through the self-adhesion of the elastomer, and meanwhile, the butt joint of the conductive films I and II is realized.
Example 3
The embodiment provides a method for connecting a soft interface and a hard interface between a flexible material containing conductive filler and a hard material containing conductive filler, which specifically comprises the following steps:
(1) Preparing an elastomer solution for later use, wherein the solvent of the solution is a solvent capable of dissolving hard materials. The concentration of the elastomer solution which is usually used is 15% -60%, which is determined according to actual requirements. The elastomeric material used has self-adhesive properties.
In this example, SEBS was used as an elastomer material, toluene was used as a solvent, and polystyrene soluble in toluene was used as a hard material. The mass ratio of SEBS to toluene is about 1:7.
(2) The prepared SEBS-toluene solution is spin-coated on a polystyrene wafer with a smooth and flat surface. In order to make spin coating more uniform, SEBS-toluene solution is required to be quickly dripped after the rotation speed of a spin coater is stable. Placing the substrate in a ventilation place after spin coating, standing until toluene is completely volatilized, obtaining a hard polystyrene substrate embedded with an elastomer layer, cutting the circular substrate into a required shape, placing the substrate in a magnetron sputtering device, covering the substrate by a mask plate with a specific shape, sputtering gold in the magnetic sputtering device, and obtaining the self-made hard material containing conductive filler, wherein the thickness of the gold film is about 40 mu m (Au film II). The self-made hard material containing conductive filler comprises a polystyrene-SEBS-Au film from bottom to top, and the front view and the schematic cross-section of the self-made hard material are shown in figure 5.
In the embodiment, polystyrene is used as a hard material substrate without a wire, a deposited Au film is expanded to the whole hard material substrate, and the Au film is used as the wire of the hard material substrate, so that the modified hard material containing the conductive filler is prepared. Further, an interface is arranged at the other end of the hard wire material, and the interface is communicated with a commercial hard wire or is directly connected with the signal processing electronic equipment.
(3) Spin-coating SEBS-toluene solution on a fluorinated silicon wafer, and standing until toluene is completely volatilized to obtain a flexible material substrate. And covering the flexible material substrate with a mask plate, and sputtering Au with a magnetic sputtering device to obtain the flexible conductive material with the SEBS-Au film, wherein the thickness of the Au film is about 40 mu m (Au film I), and the front view and the schematic section of the flexible conductive material are shown in figure 4.
(4) The polystyrene-SEBS-Au film hard material and the SEBS-Au flexible material are butted, the Au film at the output end of the flexible material is contacted with the hard material Au film when butted, and the overlapped part is lightly pressed until the two are stuck, so that the soft and hard joint interface which is optimized by the self-adhesion of the elastomer material SEBS is prepared, and the soft and hard joint interface is shown in figure 6. The soft and hard joint surface prepared by means of the self-adhesive property of the elastomer has good mechanical property and electrical property.
A physical diagram of the hard-to-soft interface of the polystyrene-SEBS-Au film hard substrate and the SEBS-Au flexible electrode is shown in FIG. 7. In the physical diagram, the hard material substrate does not contain wires, the Au film is deposited on the whole hard material substrate, and the Au film is used as the wires of the hard material substrate.
The stretchability and conductivity of the soft and hard-joined interface and the unjoined SEBS-Au flexible electrode prepared in this example were examined with a tensile machine as shown in fig. 8. Compared with an unpackaged flexible electrode, the performance of the soft and hard connection interface is not greatly reduced, the conductivity stretching rate is 80% of that of the flexible electrode, and the soft and hard connection interface has no trace of detachment in the stretching process.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While still being apparent from variations or modifications that may be made by those skilled in the art are within the scope of the invention.
Claims (7)
1. A soft and hard connection interface between a flexible conductive material and a hard conductive material, wherein the soft and hard connection interface comprises a flexible conductive material output end and a first modified hard conductive material or a second modified hard conductive material connected with the flexible conductive material output end;
the flexible conductive material comprises a flexible material substrate and a metal conductive film I covered on the flexible material substrate;
the first modified hard conductive material or the second modified hard conductive material connected with the output end of the flexible conductive material comprises a hard material substrate, an elastomer layer and a metal conductive film II on the elastomer layer from bottom to top, wherein the elastomer layer is coated on the hard material substrate in a jogging or adhering mode;
the soft and hard connection interface is composed of a hard material substrate, an elastomer layer, a metal conductive film II, a metal conductive film I and a flexible material substrate from bottom to top;
the metal conductive film I is connected with the metal conductive film II;
the elastomer layer on the first modified hard conductive material or the second modified hard conductive material connected with the output end of the flexible conductive material is the same as the elastomer material used for the flexible material substrate of the flexible conductive material, and the elastomer material has self-adhesive property;
the first modified hard conductive material is self-made, and the connection method of the soft and hard connection interface comprises the following steps:
preparing a first elastomer solution, wherein a solvent of the first elastomer solution is a solvent capable of dissolving a hard material substrate;
spin-coating the first elastomer solution on the hard material substrate, and depositing a metal conductive film II on the elastomer layer to obtain a first modified hard conductive material after the solvent is completely volatilized to obtain the hard material substrate embedded with the elastomer layer;
preparing a flexible material substrate by using the first elastomer solution, and depositing a metal conductive film I on the flexible material substrate to prepare a flexible conductive material;
the metal conductive film I at the output end of the flexible conductive material is contacted with the metal conductive film II of the first modified hard conductive material, and the metal conductive film I and the metal conductive film II are connected through the self-adhesion of the elastomer and have conductivity;
the second modified hard conductive material is commercial hard conductive material, and the joining method of the soft and hard joining interface comprises the following steps:
preparing a second elastomer solution, wherein the solvent of the second elastomer solution is a solvent which does not dissolve a commercial hard conductive material substrate;
spin-coating the second elastomer solution at one end of the commercial hard conductive material substrate, and obtaining an elastomer layer-hard material substrate after the solvent is completely volatilized; or, separately preparing an elastomer layer and then transferring and covering one end of a commercial hard conducting material substrate to obtain an elastomer layer-hard conducting wire substrate; depositing a metal conductive film II on the elastomer layer, wherein the metal conductive film II is communicated with a conductive filler of a commercial hard conductive material substrate to obtain a second modified hard conductive material;
preparing a flexible material substrate by using the second elastomer solution, and depositing a metal conductive film I on the flexible material substrate to prepare a flexible conductive material;
the metal conductive film I at the output end of the flexible conductive material is contacted with the metal conductive film II of the second modified hard conductive material, and the metal conductive film I and the metal conductive film II are connected through the self-adhesion of the elastomer and have conductivity.
2. The soft and hard joint interface according to claim 1, wherein the flexible conductive material is a flexible electrode.
3. The soft and hard joint interface according to claim 1, wherein the metallic conductive film II is in communication with a conductive filler at the other end of the first or second modified hard conductive material.
4. A soft and hard joint interface according to claim 3, wherein the conductive filler at the other end of the first or second modified hard conductive material is a conductive filler contained in the first or second modified hard conductive material itself; or, the conductive filler at the other end of the first modified hard conductive material or the second modified hard conductive material is a metal conductive film II which is expanded to the whole hard material substrate.
5. The hard and soft interface of claim 1, wherein the commercially available hard conductive material is a printed circuit board or a hard wire board.
6. The flexible and rigid connection interface of claim 1 wherein the metal conductive film I and metal conductive film II are patterned metal conductive films.
7. The flexible/rigid connection interface of claim 1 wherein the metallic conductive film I and the metallic conductive film II are prepared by magnetron sputtering, thermal vapor deposition plating or transfer printing.
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