CN104582235A - Composite type circuit board - Google Patents
Composite type circuit board Download PDFInfo
- Publication number
- CN104582235A CN104582235A CN201310481542.0A CN201310481542A CN104582235A CN 104582235 A CN104582235 A CN 104582235A CN 201310481542 A CN201310481542 A CN 201310481542A CN 104582235 A CN104582235 A CN 104582235A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- flexible circuitry
- combined type
- circuitry plate
- type circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4697—Manufacturing multilayer circuits having cavities, e.g. for mounting components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/041—Stacked PCBs, i.e. having neither an empty space nor mounted components in between
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a composite type PCB which comprises a rigid circuit board and a flexible circuit board, wherein the rigid circuit board comprises a first multi-layer circuit structure which is provided with multiple first element contacts on a first bearing surface of the rigid circuit board, and the first element contacts are located outside a joint area of the first bearing surface; the flexible circuit board is configured in the joint area and provided with a second multi-layer circuit structure which is provided with multiple second element contacts on a second bearing surface of the flexible circuit board, and the second multi-layer circuit structure is electrically connected to the first multi-layer circuit structure.
Description
Technical field
The present invention relates to a kind of circuit board, and particularly relate to a kind of combined type circuit board.
Background technology
Generally speaking, can the electronic component such as configure microprocessor and antenna on the circuit board of communication device.Be be connected to each other by the circuit of circuit board between electronic component, thus carry out the transmission of data.But along with the difference of the data volume transmitted required between each electronic component, the number of, lines be connected between electronic component also changes to some extent.That is, wiring density on circuit board distributes not homogeneous, for example, microprocessor is mainly used for processing most data transmission and control action, therefore the wiring density of the land of microprocessor is relatively higher than the wiring density of other electronic components, to perform computing and the process of a large sum of data volume.
Along with the increase of microprocessor function and the variation of electronic element of circuit board, number of, lines between microprocessor or other electronic components is improved constantly, side is enough to the computing and the process that perform more a large sum of data volume, thus, the wiring density on circuit board is caused constantly to be enhanced.Due to the limited area on circuit board, when line density exceedes its limit, the circuit number of plies increasing circuit board certainly will be needed to meet its configuration.
Summary of the invention
The object of the present invention is to provide a kind of combined type circuit board, it incorporates flexible circuitry plate and rigid circuit board, the line construction of the different number of plies is provided in the zones of different of same circuit board, with the needs of the configuration in response to various different electronic component, and contribute to reduce circuit board integral thickness, simplify complicated manufacture craft and reduce manufacturing cost.
For reaching above-mentioned purpose, combined type circuit board of the present invention comprises rigid circuit board and flexible circuitry plate.Rigid circuit board has the first multilayer wiring structure.First multilayer wiring structure provides multiple first component contacts on the first loading end of rigid circuit board, and these first component contacts are positioned at outside the bonding land of the first loading end.Flexible circuitry plate is configured in bonding land.Flexible circuitry plate has the second multilayer wiring structure.Second multilayer wiring structure provides multiple second component contacts on the second loading end of flexible circuitry plate, and is electrically connected to the first multilayer wiring structure.
In one embodiment of this invention, above-mentioned bonding land comprises the depression be positioned on the first loading end, and flexible circuitry plate is configured in depression.
In one embodiment of this invention, the first loading end of above-mentioned rigid circuit board and the mutual copline of the second loading end of flexible circuitry plate.
In one embodiment of this invention, the first above-mentioned multilayer wiring structure provides multiple board contacts on the first loading end of rigid circuit board.These board contacts are positioned at bonding land, and flexible circuitry plate is engaged to these board contacts.
In one embodiment of this invention, above-mentioned combined type circuit board more comprises multiple conduction material.These conduction materials are connected between flexible circuitry plate and these board contacts.
In one embodiment of this invention, above-mentioned conduction material comprises solder (solder), conducting resinl (conductive paste) or anisotropic conductive film (Anisotropic Conductive Film, ACF).
In one embodiment of this invention, above-mentioned combined type circuit board has multiple separate functional areas.The quantity of flexible circuitry plate is multiple.These flexible circuitry plates have the second multilayer wiring structure of the different number of plies respectively, and these flexible circuitry plates are arranged in different functional areas respectively, make these functional areas have the configuration of the different number of plies.
In one embodiment of this invention, above-mentioned rigid circuit board is printed circuit board (PCB).
In one embodiment of this invention, above-mentioned flexible circuitry plate is for being high density interconnect (HighDensity Inter-connection, HDI) soft printed circuit board (Flexible Printed Circuit Board, FPCB).
Based on above-mentioned, combined type circuit board of the present invention by flexible circuitry plate is configured on rigid circuit board, to provide the configuration space of the different number of plies in zones of different.Wherein, flexible circuitry plate and rigid circuit board can have component contacts respectively, and the demand of different electronic components its configuration visual is engaged on different regions.Therefore, applying combined type circuit board of the present invention can make configuration have more elasticity, and only to need the elevated track number of plies in the region of more elevated track number of plies demand and the thinner flexible circuitry plate of line construction integral thickness is arranged on rigid electroplax, and then contribute to reducing circuit board integral thickness, simplify complicated manufacture craft and reduce manufacturing cost.
In addition, rigid circuit board can form depression corresponding on the position of flexible circuitry plate, and wherein flexible circuitry plate can be arranged in depression, with the mutual copline of the first loading end of the second loading end and rigid circuit board that make flexible circuitry plate.Thus, not only further can reduce the integral thickness of combined type circuit board, also contribute to providing smooth composition surface to the element of follow-up joint, to simplify manufacture craft, and guarantee manufacture craft reliability.
For above-mentioned feature and advantage of the present invention can be become apparent, special embodiment below, and coordinate appended accompanying drawing to be described in detail below.
Accompanying drawing explanation
Fig. 1 is the generalized section of the combined type circuit board of the present invention one example;
Fig. 2 to Fig. 4 is the generalized section of the combined type circuit board of other multiple possibility embodiments of the present invention;
Fig. 5 is the vertical view of the combined type circuit board of Fig. 4.
Symbol description
10: the first functional areas
20: the second functional areas
30: the three functional areas
40: the four functional areas
50: the five-function districts
100A ~ 100D: electronic installation
110: rigid circuit board
111: the first multilayer wiring structures
111a ~ 111c: the first insulating barrier
111d ~ 111g: first line layer
112: the first loading ends
112a: bonding land
112b: depression
113: the first component contacts
114: board contacts
120,130,140: flexible circuitry plate
121: the second multilayer wiring structures
121a ~ 121c: the second insulating barrier
121d ~ 121g: the second line layer
122,132,142: the second loading ends
123: the second component contacts
Embodiment
The present invention proposes a kind of combined type circuit board, and it incorporates flexible circuitry plate and rigid circuit board.With regard to its line construction, combined type circuit board is using rigid circuit board as its main body, and is arranged in the zones of different of rigid circuit board by least more than one flexible circuitry plate.Thus, combined type circuit board not only can provide the configuration space of the different number of plies in zones of different, carry out the needs in response to the configuration of various different electronic component, also can reduce the integral thickness of combined type circuit board, simplify complicated manufacture craft and reduce costs.Below, will be illustrated by multiple embodiment.
Fig. 1 is the generalized section of the combined type circuit board of one embodiment of the invention.Please refer to Fig. 1, in the present embodiment, combined type circuit board 100A comprises rigid circuit board 110 and flexible circuitry plate 120, aforementioned both are engaged with each other by modes such as surface adhering technical (SMT) or gummeds and are electrically connected, and wherein conducting resinl or anisotropic conductive film are the then material that both adopt usually at gluing procedures.
Generally speaking, rigid circuit board 110 is such as paper base material copper foil laminates (FR-1, FR-2, XXXPc, XPc), paper epoxy resin copper foil laminates (FR-3), glass cloth epoxy resin copper foil laminates (FR-4, G10), heat resistant glass cloth epoxy resin copper foil laminates (FR-5, G11), glass cloth polyimides system resin copper foil laminates (GPY), paper glass cloth epoxy resin copper foil laminates (CEM-1), glass adhesive-bonded fabric glass cloth epoxy resin copper foil laminates (CEM-2), the base materials such as glass adhesive-bonded fabric glass cloth mylar copper foil laminates (FR-6) or pottery form printed circuit board (PCB).And flexible circuitry plate 120 can be high density interconnect soft printed circuit board, its feature is: even if under the layer structure of high-layer, still by and micro-buried via hole, Microvia or micro-via etc., under limited area, make interconnect in layer between layer, and form the wiring aspect of high density interconnect.Below, will be illustrated by multiple embodiment.
Please continue to refer to Fig. 1, in the present embodiment, rigid circuit board 110 has the first multilayer wiring structure 111, is with the line construction of four layers as an example at this.That is, first multilayer wiring structure 111 is such as be made up of three layer of first insulating barrier 111a to 111c and four layer of first line layer 111d to 111g, wherein first line layer 111d, 111e lay respectively at on the first insulating barrier 111c on the first insulating barrier 111a, and first line layer 111f, 111g then lay respectively between the first insulating barrier 111a and 111b and between the first insulating barrier 111b and 111c.
It should be noted, in the embodiment that other are possible, still its demand visual and the appropriateness increase and decrease of the number of plies of the first multilayer wiring structure 111 also can be two-layer, six layers, eight layers or ten layers etc.
Moreover the first multilayer wiring structure 111 provides multiple first component contacts 113 on the first loading end 112 of rigid circuit board 110, and the first component contacts 113 is positioned at outside the bonding land 112a of the first loading end 112.Wherein, first component contacts 113 is such as a part of first line layer 111d, can the electronic components such as processor, antenna chip, satellite fix chip or wireless network chip be engaged in these first component contacts 113 in subsequent manufacturing processes, and be electrically connected with rigid circuit board 110.
Flexible circuitry plate 120 has the second multilayer wiring structure 121, is with the line construction of four layers as an example at this.That is, second multilayer wiring structure 121 is such as be made up of three layer of second insulating barrier 121a to 121c and four layer of the second line layer 121d to 121g, wherein second line layer 121d, 121e lays respectively at on the second insulating barrier 121c on the second insulating barrier 121a, and second line layer 121f, 121g then lays respectively between the second insulating barrier 121a and 121b and between the second insulating barrier 121b and 121c.
It should be noted, in the embodiment that other are possible, still its demand visual and the appropriateness increase and decrease of the number of plies of the second multilayer wiring structure 121 also can be two-layer, six layers, eight layers or ten layers etc.
Specifically, flexible circuitry plate 120 is configured in the 112a of bonding land, and the first multilayer wiring structure 111 provides multiple board contacts 114 being positioned at bonding land 112a on the first loading end 112 of rigid circuit board 110, wherein flexible circuitry plate 120 is engaged to board contacts 114, and is such as be connected electrically by the part second line layer 121e be positioned on the second insulating barrier 121c.Firmly engage flexible circuitry plate 120 and rigid circuit board 110 for asking, and guarantee electrical connection between the two, flexible circuitry plate 120 and board contacts 114 have more the conduction material 150 be connected between the two.Generally speaking, conduction material 150 can be solder, conducting resinl or anisotropic conductive film, but the present invention is not as limit.
In addition, the second multilayer wiring structure 121 provides multiple second component contacts 123 on the second loading end 122 of flexible circuitry plate 120.Aforementioned second component contacts 123 is such as the part of the second line layer 121d be positioned on the second insulating barrier 121a, and be electrically connected to the first multilayer wiring structure 111, in other words, aforementioned electronic element also can be engaged in these second component contacts 123 in subsequent manufacturing processes, and be electrically connected with flexible circuitry circuit board 120, wherein aforementioned electronic element is normally engaged in the first component contacts 113 or the second component contacts 123 in a welding manner.
Further, the bonding land 112a of the present embodiment is positioned at the depression 112b on the first loading end 112, and flexible circuitry plate 120 is configured in depression 112b, and engage with the board contacts 114 being positioned at the 112b that caves in, the 112b that wherein caves in utilizes laser remove the first insulating barrier 111a of subregion and be formed on rigid circuit board 110.In the present embodiment, the degree of depth of depression 112b is identical haply with the thickness of flexible circuitry plate 120, therefore after flexible circuitry plate 120 is configured in depression 112b, the first loading end 112 of rigid circuit board 110 and the second loading end 122 copline mutually of flexible circuitry plate 120.That is, the first component contacts 113 of rigid circuit board 110 is positioned on same surface with the second component contacts 123 of flexible circuitry plate 120.So, contribute to providing smooth composition surface to the element of follow-up joint, to simplify manufacture craft, and guarantee manufacture craft reliability.
Hold above-mentioned, the line construction of the different number of plies not only can be provided in the zones of different of same circuit board by integrating rigid circuit board 110 and flexible circuitry plate 120, with the needs of the configuration in response to various different electronic component, and contribute to reduce circuit board integral thickness, simplify complicated manufacture craft and reduce manufacturing cost.For example, existing electronic product such as wisdom mobile phone is treated to mainly with lightening, multiplex (MUX) greatly does its demand, is but difficult to usefulness and the endurance of effectively taking into account electronic product.Combined type circuit board proposed by the invention can meet above-mentioned designer trends and demand, and when reducing the integral thickness of circuit board, discharge more internal configurations space as the use arranging high capacity cell or associated electronic components, with under the product appeal processed in lightening, multiplex (MUX), improve usefulness and the endurance of electronic product simultaneously.
Although above-described embodiment is with the aspect of combined type circuit board 100A as an example, be not used to limit the present invention.Fig. 2 to Fig. 4 is the generalized section of the combined type circuit board of other multiple possibility embodiments of the present invention.Please refer to Fig. 2, the combined type circuit board 100A of combined type circuit board 100B and Fig. 1 of Fig. 2 different be in: the flexible circuitry plate 120 of combined type circuit board 100B is configured on the first loading end 112 of rigid circuit board 110, and engage with the board contacts 114 on the first loading end 112, make the first loading end 112 and the second loading end 122 have height fall.This height fall discharges more internal configurations space as the use arranging high capacity cell or associated electronic components, so can not only meet lightening designer trends and demand, also contributes to the usefulness and the endurance that promote electronic product.
As shown in Figure 3, the combined type circuit board 100C of Fig. 3 is compared to the combined type circuit board 100A of Fig. 1, combined type circuit board 100C has respectively and is configured on the first loading end 112 of rigid circuit board 110 by flexible circuitry plate 120, and engage with the board contacts 114 on the first loading end 112, the first loading end 110a and the second loading end 120a is made to have height fall, and flexible circuitry plate 120 is configured in depression 112b, and engage with the board contacts 114 being positioned at the 112b that caves in, make the aspect such as the first loading end 112 of rigid circuit board 110 and the mutual copline of the second loading end 122 of flexible circuitry plate 120.Under configuration like this, also can reach technology effect that above-described embodiment can be obtained.
It should be noted, the combined type circuit board 100A of Fig. 1 is arranged at flexible circuitry plate 120 in depression 112b as an example with one, with regard in practice, in response to the configuration demand of various different electronic component, and meet lightening product design trend for asking, combined type circuit board 100D then configures as shown in Figure 4, and it has flexible circuitry plate 120(such as two sandwich circuit boards of multiple different number of plies), flexible circuitry plate 130(such as four sandwich circuit boards) and flexible circuitry plate 140(such as six sandwich circuit boards).Because the number of plies of each flexible circuitry plate is different, the thickness of each flexible circuitry plate is also distinguished to some extent, therefore flexible circuitry 120,130 and 140 is such as be configured at respectively in the depression 112b of tool different depth, and is electrically connected with rigid circuit board 110 by the board contacts 114 in depression 112b.
Specifically, the first loading end 112 being arranged at the rigid circuit board 110 in depression 112b is present mutual coplanar aspect with the second loading end 142 of the second loading end 122 of flexible circuitry plate 120, the second loading end 132 of flexible circuitry plate 130 and flexible circuitry plate 140 respectively.That is, the first component contacts of rigid circuit board and each second component contacts of aforementioned flexible circuitry plate are such as be positioned on same surface.So, contribute to providing smooth composition surface to the element of follow-up joint, to simplify manufacture craft, and guarantee manufacture craft reliability.
It should be noted, although above-described embodiment be with flexible circuitry plate be configured at depression in and the mutual copline of the first loading end of the second loading end of each flexible circuitry plate and rigid circuit board explain, but in the embodiment that other do not illustrate, the second loading end being configured at the flexible circuitry plate in depression also can compared with higher than rigid circuit board the first loading end or compared with the first loading end lower than rigid circuit board, the present invention is not limited this.
Fig. 5 is the vertical view of the combined type circuit board of Fig. 4, and wherein the cross-section structure of Fig. 4 illustrated along I-I hatching line.Please refer to Fig. 4 and Fig. 5, in the present embodiment, combined type circuit board 100D can have multiple the first separate functional areas 20, functional areas 10, second, the 3rd functional areas 30, the 4th functional areas 40 and five-function district 50, wherein these functional areas are in order to the different configurations in response to various electronic component, and have the line construction of the different number of plies respectively.For example, global positioning system (GPS) chip is such as be configured on the first functional areas 10, and the overall number of plies of line construction in the first functional areas 10 is required to be four layers.CPU (CPU) is such as be configured on the second functional areas 20, and the overall number of plies of line construction in the second functional areas 20 need be at least ten layers.Power Management Unit is such as be configured on the 3rd functional areas 30, and the overall number of plies of line construction in the 3rd functional areas 30 is required to be four layers.Wireless network chip is such as be configured on the 4th functional areas 40, and the overall number of plies of line construction in the 4th functional areas 40 is required to be six layers.Radio frequency (Radio Frequency, RF) chip is such as be configured in five-function district 50, and the overall number of plies of line construction in five-function district 50 need be at least eight floor.
In other words, the number of plies of the line construction needed for above-mentioned various chip is not identical.For example, when rigid circuit board 110 is for having the multilayer circuit board of four sandwich circuit structures, the layout requirements of the visual above-mentioned various chip of producer, difference in functionality district further on rigid circuit board 110 configures corresponding flexible circuitry plate, and these flexible circuitry plates can have the second multilayer wiring structure of the different number of plies respectively.
Specifically, the number of plies of the line construction needed for global positioning system (GPS) chip and Power Management Unit is four layers, therefore global positioning system (GPS) chip and Power Management Unit are such as directly be arranged on the first loading end 112 of rigid circuit board 110, the demand of its configuration can be met, and without the need to setting up flexible circuitry plate in functional areas.On the other hand, the number of plies of the line construction needed for CPU (CPU) is at least ten layers, the number of plies that therefore can arrange the second multilayer wiring structure in the second functional areas 20 is the flexible circuitry plate 140 of at least six layers, and after flexible circuitry plate 140 is combined with rigid circuit board 110, the composite line structure that the overall number of plies is ten layers can be formed, to meet the demand of the configuration of CPU (CPU).
In addition, the number of plies of the line construction needed for wireless network chip is six layers, the number of plies that therefore can arrange the second multilayer wiring structure in the 4th functional areas 40 is the flexible circuitry plate 120 of two layers, and after flexible circuitry plate 120 is combined with rigid circuit board 110, the composite line structure of the overall number of plies six layers can be formed, to meet the demand of the configuration of wireless network chip.And radio frequency (Radio Frequency, the number of plies of the line construction RF) needed for chip is at least eight layers, the number of plies that therefore can arrange the second multilayer wiring structure in five-function district 50 is the flexible circuitry plate 130 of at least four floor, and after flexible circuitry plate 130 is combined with rigid circuit board 110, the composite line structure of the overall number of plies at least eight layers can be formed, to meet the demand of the configuration of radio frequency (Radio Frequency, RF) chip.
Under configuration like this, the configuration space that the different number of plies is provided in difference in functionality district respectively can be made, and the demand of different electronic components its configuration visual is engaged on different regions.It should be noted, although the present invention with the structural allocation of the combined type circuit board 100D of above-described embodiment for example is introduced, but be not used to limit the present invention, in the embodiment that other are possible, producer can for the configuration demand of different electronic component, and adjustment is arranged at the size etc. of the number of plies of line construction of the flexible circuitry plate on rigid circuit board, the position of bonding land and bonding land further.Therefore, applying combined type circuit board of the present invention can make configuration have more elasticity.
In sum, combined type circuit board of the present invention by flexible circuitry plate is configured on rigid circuit board, to provide the configuration space of the different number of plies in zones of different.Wherein, flexible circuitry plate and rigid circuit board can have component contacts respectively, and the demand of different electronic components its configuration visual is engaged on different regions.Therefore, applying combined type circuit board of the present invention can make configuration have more elasticity, and only to need the elevated track number of plies in the region of more elevated track number of plies demand and the thinner flexible circuitry plate of line construction integral thickness is arranged on rigid circuit board, and then contribute to reducing circuit board integral thickness, simplify complicated manufacture craft and reduce manufacturing cost.
In addition, rigid circuit board can form depression corresponding on the position of flexible circuitry plate, and wherein flexible circuitry plate can be arranged in depression, with the mutual copline of the first loading end of the second loading end and rigid circuit board that make flexible circuitry plate.Thus, not only further can reduce the integral thickness of combined type circuit board, also contribute to providing smooth composition surface to the element of follow-up joint, to simplify manufacture craft, and guarantee manufacture craft reliability.
Although disclose the present invention in conjunction with above embodiment; but itself and be not used to limit the present invention; this operator is familiar with in any art; without departing from the spirit and scope of the present invention; a little change and retouching can be done, therefore being as the criterion of should defining with the claim of enclosing of protection scope of the present invention.
Claims (9)
1. a combined type circuit board, is characterized in that, comprising:
Rigid circuit board, has the first multilayer wiring structure, and this first multilayer wiring structure provides multiple first component contacts on the first loading end of this rigid circuit board, and those first component contacts are positioned at outside the bonding land of this first loading end; And
Flexible circuitry plate, be configured in this bonding land, this flexible circuitry plate has the second multilayer wiring structure, and this second multilayer wiring structure provides multiple second component contacts on the second loading end of this flexible circuitry plate, and is electrically connected to this first multilayer wiring structure.
2. combined type circuit board as claimed in claim 1, it is characterized in that, this bonding land comprises the depression be positioned on this first loading end, and this flexible circuitry plate is configured in this depression.
3. combined type circuit board as claimed in claim 2, is characterized in that, this first loading end of this rigid circuit board and the mutual copline of this second loading end of this flexible circuitry plate.
4. combined type circuit board as claimed in claim 1, it is characterized in that, this first multilayer wiring structure provides multiple board contacts on this first loading end of this rigid circuit board, and those board contacts are positioned at this bonding land, and this flexible circuitry plate is engaged to those board contacts.
5. combined type circuit board as claimed in claim 4, is characterized in that, also comprise multiple conduction material, be connected between this flexible circuitry plate and those board contacts.
6. combined type circuit board as claimed in claim 5, is characterized in that, those conduction materials comprise solder, conducting resinl or anisotropic conductive film.
7. combined type circuit board as claimed in claim 1, it is characterized in that, this combined type circuit board has multiple separate functional areas, the quantity of this flexible circuitry plate is multiple, those flexible circuitry plates have the second multilayer wiring structure of the different number of plies respectively, and those flexible circuitry plates are arranged in different functional areas respectively, those functional areas are made to have the configuration of the different number of plies.
8. combined type circuit board as claimed in claim 1, it is characterized in that, this rigid circuit board is printed circuit board (PCB).
9. combined type circuit board as claimed in claim 1, it is characterized in that, this flexible circuitry plate is high density interconnect soft printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310481542.0A CN104582235A (en) | 2013-10-15 | 2013-10-15 | Composite type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310481542.0A CN104582235A (en) | 2013-10-15 | 2013-10-15 | Composite type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104582235A true CN104582235A (en) | 2015-04-29 |
Family
ID=53097140
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310481542.0A Pending CN104582235A (en) | 2013-10-15 | 2013-10-15 | Composite type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104582235A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03161996A (en) * | 1989-11-21 | 1991-07-11 | Nec Home Electron Ltd | Connection of flexible board, and flexible board |
| JPH10284632A (en) * | 1997-04-08 | 1998-10-23 | Fujitsu Ltd | Circuit substrate and manufacture therefor |
| GB2412790A (en) * | 2004-04-02 | 2005-10-05 | Univ City Hong Kong | Process for the assembly of electronic devices |
| CN101631432A (en) * | 2008-07-14 | 2010-01-20 | 富葵精密组件(深圳)有限公司 | Flexible-rigid compound circuit board and method for manufacturing same |
| CN102045936A (en) * | 2009-10-14 | 2011-05-04 | 欣兴电子股份有限公司 | Circuit board structure |
| EP2355634A1 (en) * | 2010-01-29 | 2011-08-10 | Fujitsu Limited | Method for connection of flexible circuit boards to rigid circuit board, device for connection thereof, printed circuit board assembly, and electronic apparatus |
| CN102497746A (en) * | 2011-12-05 | 2012-06-13 | 深圳市五株电路板有限公司 | Circuit board manufacturing method |
| CN102771200A (en) * | 2010-02-22 | 2012-11-07 | 三洋电机株式会社 | Multilayer printed circuit board and manufacturing method therefor |
| CN103037616A (en) * | 2011-10-06 | 2013-04-10 | 宏达国际电子股份有限公司 | Combined type circuit board and producing method thereof |
-
2013
- 2013-10-15 CN CN201310481542.0A patent/CN104582235A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03161996A (en) * | 1989-11-21 | 1991-07-11 | Nec Home Electron Ltd | Connection of flexible board, and flexible board |
| JPH10284632A (en) * | 1997-04-08 | 1998-10-23 | Fujitsu Ltd | Circuit substrate and manufacture therefor |
| GB2412790A (en) * | 2004-04-02 | 2005-10-05 | Univ City Hong Kong | Process for the assembly of electronic devices |
| CN101631432A (en) * | 2008-07-14 | 2010-01-20 | 富葵精密组件(深圳)有限公司 | Flexible-rigid compound circuit board and method for manufacturing same |
| CN102045936A (en) * | 2009-10-14 | 2011-05-04 | 欣兴电子股份有限公司 | Circuit board structure |
| EP2355634A1 (en) * | 2010-01-29 | 2011-08-10 | Fujitsu Limited | Method for connection of flexible circuit boards to rigid circuit board, device for connection thereof, printed circuit board assembly, and electronic apparatus |
| CN102771200A (en) * | 2010-02-22 | 2012-11-07 | 三洋电机株式会社 | Multilayer printed circuit board and manufacturing method therefor |
| CN103037616A (en) * | 2011-10-06 | 2013-04-10 | 宏达国际电子股份有限公司 | Combined type circuit board and producing method thereof |
| CN102497746A (en) * | 2011-12-05 | 2012-06-13 | 深圳市五株电路板有限公司 | Circuit board manufacturing method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114336112A (en) * | 2021-12-10 | 2022-04-12 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
| CN114336112B (en) * | 2021-12-10 | 2023-10-03 | 中国科学院深圳先进技术研究院 | Method for connecting soft and hard interfaces between flexible conductive material and hard conductive material |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101145038B1 (en) | Printed wiring board | |
| US9743533B2 (en) | Method for manufacturing rigid-flexible printed circuit board | |
| US8978244B2 (en) | Method for manufacturing printed circuit board | |
| US10736208B2 (en) | Printed wiring board for high frequency transmission | |
| US20150114690A1 (en) | Flex-rigid wiring board and method for manufacturing flex-rigid wiring board | |
| WO2009037939A1 (en) | Printed wiring board and method for manufacturing the same | |
| US20120037411A1 (en) | Packaging substrate having embedded passive component and fabrication method thereof | |
| US20140054079A1 (en) | Multilayer flexible printed circuit board and method for manufacturing same | |
| US20150282317A1 (en) | Edge contacts of circuit boards, and related apparatus and methods | |
| TWI785090B (en) | Printed circuit board | |
| US20140133118A1 (en) | Component-embedded board and method of manufacturing same | |
| US10219374B2 (en) | Printed wiring board | |
| CN116156741B (en) | Printed circuit board and mobile device | |
| CN105578749A (en) | Circuit board connecting assembly and mobile terminal | |
| JP2008071963A (en) | Multilayer wiring substrate | |
| KR100920824B1 (en) | Manufacturing method of printed circuit board and electromagnetic bandgap structure | |
| US8841561B1 (en) | High performance PCB | |
| CN104582235A (en) | Composite type circuit board | |
| TWI542265B (en) | Complex circuit board | |
| US11582859B2 (en) | Method for manufacturing flexible circuit board | |
| CN114451074B (en) | Interposer, manufacturing method of interposer and circuit board assembly | |
| KR20140148111A (en) | Rigid flexible printed circuit board and method for manufacturing thereof | |
| JP4372407B2 (en) | Multilayer printed wiring board | |
| CN111787690A (en) | Circuit board | |
| CN111356279A (en) | Circuit board and method for manufacturing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150429 |
|
| RJ01 | Rejection of invention patent application after publication |