JP4372407B2 - Multilayer printed wiring board - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a multilayer printed wiring board, and more particularly to a multilayer printed wiring board on which electronic components are mounted.
[0002]
[Prior art]
Conventionally, a chip-in-board type multilayer printed wiring board on which electronic components are mounted has been used in order to support high-density mounting of electronic components. As a technology related to such a chip-in-board type multilayer printed wiring board, another board is laminated on the electronic component mounting side of this component storage board on the component storage board in which electronic components such as LSI bare chips are stored in the recesses. Thus, a technique for mounting electronic components inside a multilayer printed wiring board has been proposed (see, for example, Patent Document 1). Further, a technique for improving the mounting density of electronic components by mounting electronic components on substrates that form different layers and laminating those substrates via a frame substrate has also been proposed (for example, Patent Document 2).
[0003]
Since such a chip-in-board type multilayer printed wiring board is mounted on a motherboard, a large number of spherical solder bumps, which are connecting terminals for mounting the motherboard, are formed on one surface of the multilayer printed wiring board. Has been. Also, predetermined conductor patterns are conductively connected to each other on the substrates forming the respective layers of the multilayer printed wiring board through an interlayer connection structure such as a through hole or a solder bump.
[0004]
[Patent Document 1]
JP-A-7-283335
[Patent Document 2]
Japanese Patent Laid-Open No. 2001-210554
[0005]
[Problems to be solved by the invention]
The above-described conventional chip-in-board type multilayer printed wiring board is excellent in terms of improving the mounting density of electronic components. However, in recent years, it has been required to further improve the mounting density of electronic components while maintaining operation reliability.
[0006]
For example, a printed wiring board used for mobile communication requires a mixture of analog circuits and digital circuits. Here, in the analog circuit section, many resistance elements, capacitance elements, and inductance elements (hereinafter collectively referred to as “discrete elements”) are necessary, and each discrete element is exchanged for adjusting the characteristics of the analog circuit. It is desirable to be possible. In addition, stacking a board with an analog circuit and a board with a digital circuit to increase the mounting density makes the distance between the two locations extremely short, effectively reducing electromagnetic radiation noise. It is also necessary to consider the reduction.
[0007]
The present invention has been made in view of such circumstances, and an object thereof is to provide a multilayer printed wiring board capable of improving the mounting density of electronic components with a simple configuration.
[0008]
[Means for Solving the Problems]
  The multilayer printed wiring board of the present invention is a multilayer printed wiring board on which a plurality of electronic components are mounted, and a double-sided wiring board having a conductor pattern formed on both sides thereof; disposed on one side of the double-sided wiring board; A conductor pattern is formed on the surface opposite to the side of the wiring board, and at least one electronic component of the plurality of electronic components is mounted and at least one side where an interlayer conductive connection structure is formed A wiring board; disposed on the other side of the double-sided wiring board, having a conductor pattern formed on a surface opposite to the side of the double-sided wiring board, and mounting at least one of the plurality of electronic components; , At least one other wiring board on which an interlayer conductive connection structure is formed; and when there are a plurality of the one side wiring boards, the other side wiring board is disposed between the one side wiring boards.wiringWhen there are a plurality of substrates, the other sidewiringAn opening-formed wiring board disposed between the boards and formed with an opening for accommodating the electronic component and formed with a conductor pattern and an interlayer conductive connection structure; and the double-sided wiring board and the one-side wiring board , The other side wiring substrate and the opening formationwiringThe multilayer printed wiring board is characterized in that a solder member for interlayer connection is provided between the wiring boards in the laminated state of the boards.
[0009]
  In the multilayer printed wiring board of the present invention, a conductor pattern is formed on the surface of the wiring board sequentially laminated on the double-sided wiring board on the side opposite to the double-sided wiring board. As a result, in the multilayer printed wiring board of the present invention, the surface on one side is the surface on which the conductor pattern is formed on the outermost layer wiring board on one side, and the surface on the other side is on the other side. This is the surface on which the conductor pattern is formed on the outermost wiring board. For this reason, in the multilayer printed wiring board of the present invention, it is possible to mount an electronic component or a motherboard on both sides.
  Furthermore, an opening for accommodating the electronic component is formed, and a plurality of wiring boards on which a conductor pattern and an interlayer conductive connection structure are formed are arranged between the wiring boards, and these are used for interlayer connection. Connect with solder material.
[0010]
  For this reason, in the multilayer printed wiring board of the present invention, even when one surface is used for mounting on a mother board, the other surface can be used for mounting electronic components. Therefore, according to the multilayer printed wiring board of the present invention, it is possible to improve the mounting density of electronic components while mounting a plurality of electronic components with a simple configuration.it can.
[0011]
  In the multilayer printed wiring board of the present invention, a shield pattern is formed on at least one of the surfaces of the double-sided wiring board, and the one side region and the other side region with respect to the shield pattern are electromagnetically cut off. It can be. In such a configuration, electromagnetic radiation noise propagating between the one side region and the other side region with respect to the shield pattern can be reduced.
  In the multilayer printed wiring board of the present invention, the first to sixth wiring boards may be formed with a conductor pattern only on the surface opposite to the double-sided wiring board.
[0012]
  Further, in the printed wiring board of the present invention, the conductive pattern is disposed on the surface on one side of the double-sided wiring board, and a conductor pattern is formed on the surface opposite to the side of the double-sided wiring board. A first wiring board on which at least one electronic component is mounted and an interlayer conductive connection structure is formed; disposed on a surface of the first wiring board opposite to the double-sided wiring board side; An opening for accommodating an electronic component mounted on the first wiring board is formed, a conductor pattern is formed on the surface opposite to the double-sided wiring board, and an interlayer conductive connection structure is further formed. Two wiring boards; disposed on the surface of the second wiring board opposite to the double-sided wiring board side, covering the opening of the second wiring board and opposite to the double-sided wiring board side Conductor pattern on the surface A conductive pattern is formed on the surface opposite to the side of the double-sided wiring board, and is disposed on the surface of the other side of the double-sided wiring board. A fourth wiring board on which at least one is mounted and on which an interlayer conductive connection structure is formed; and is disposed on a surface of the fourth wiring board opposite to the double-sided wiring board, and the fourth wiring board A fifth wiring board in which an opening for storing the electronic component mounted on the board is formed, a conductor pattern is formed on the surface opposite to the side of the double-sided wiring board, and an interlayer conductive connection structure is formed; The fifth wiring board is disposed on the opposite side to the double-sided wiring board side, covers the opening of the fifth wiring board, and a conductor pattern is formed on the surface opposite to the double-sided wiring board side. A sixth wiring board; It is possible to adopt a configuration that.
  here,At least one electronic component of the plurality of electronic components may be mounted on a surface of at least one of the third and sixth substrates opposite to the side of the double-sided wiring substrate.
  further,BookIn the multilayer printed wiring board of the invention, the connection terminal may be provided on at least one of the surfaces of the outermost layer. In such a case, the electronic component can be easily mounted on the multilayer printed wiring board of the present invention, and the multilayer printed wiring board of the present invention can be easily mounted on the motherboard.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to FIGS.
[0014]
1A and 1B schematically show the external configuration of a multilayer printed wiring board 10 according to an embodiment of the present invention. Here, FIG. 1 (A) is a view from obliquely above, and FIG. 1 (B) is a view from obliquely below.
[0015]
As shown in FIG. 1A, the multilayer printed wiring board 10 is provided with a conductor pattern 51U on the surface in the + Z direction side, and a resistance element R, a capacitance is formed on a predetermined position of the conductor pattern 51U. Solder pads for mounting discrete elements such as element C and inductance element L are provided.
[0016]
Further, as shown in FIG. 1B, the multilayer printed wiring board 10 has a conductor pattern 51L and a plurality of solder balls 55L for mounting on the motherboard MB on the surface in the −Z direction. Here, among the plurality of solder balls 55L, the outermost one is formed on a through hole (see FIG. 2) described later, and the inner one is formed on the conductor pattern 51L.
[0017]
As shown in the cross-sectional view of FIG. 2, the multilayer printed wiring board 10 includes a substrate 20, a substrate 30 </ b> U, a substrate 40 </ b> U, and a substrate 50 </ b> U sequentially stacked on the + Z direction side of the substrate 20. The multilayer printed wiring board 10 includes a substrate 30L1, a substrate 40L1, a substrate 30L2, a substrate 40L2, and a substrate 50L that are sequentially stacked on the −Z direction side of the substrate 20.
[0018]
The substrate 20 is a flat substrate, and on the surface in the + Z direction side, a conductor pattern 21U which is an electric signal or power supply path (hereinafter, referred to as an “electric signal path etc.”) is formed. Yes. A shield pattern 25, which is a solid conductor pattern, is formed on the entire surface of the substrate 20 except for the outer edge portion, and a conductor pattern 21L, which is an electric signal path, is formed near the outer edge portion. Is formed. Furthermore, in the vicinity of the outer edge of the substrate 20 and other regions, through holes 22 (see FIG. 3) that are paths for electric signals and the like are formed. Through these through holes 22, conduction between a part of the conductor pattern 21 </ b> U and the shield pattern 25 and conduction between the other part of the conductor pattern 21 </ b> U and the conductor pattern 21 </ b> L are achieved. The through hole 22 formed here is filled with a conductor such as copper. Similarly, other through holes to be described later are filled with a conductor such as copper.
[0019]
The substrate 30U is a flat substrate, and a conductor pattern 31U, which is a path for electric signals, is formed on the surface on the + Z direction side. Further, a through hole 32U (see FIG. 4), which is an electric signal path, is formed in the vicinity of the outer edge of the substrate 30U. The conductive pattern 31U and the conductive pattern 21U are electrically connected to each other through the through holes 32U and the solder bumps 33U (see FIG. 4) on the ends of the through holes 32U on the −Z direction side. .
[0020]
Further, an electronic component 35U such as a bare chip of a large scale integrated circuit (LSI) is mounted on the central portion of the surface on the + Z direction side of the substrate 30U. The electronic component 35U has its signal input / output terminal and power supply terminal fixedly connected to the conductor pattern 31U via the solder bump 36. Further, the electronic component 35U is fixedly attached to the substrate 30U by an underfill resin 37. Here, as the underfill resin 37, it is preferable to use an anisotropic conductive resin, a non-conductive resin, or the like.
[0021]
It should be noted that no conductor portion exists on the −Z direction side surface of the substrate 30U except for the −Z direction side end portion of the through hole 32U. This is because when a conductive pattern is formed on the −Z direction side surface of the substrate 30U, when the substrate 30U is stacked on the substrate 20, such a conductive pattern and the conductive pattern 21U formed on the + Z direction side surface of the substrate 20 are used. This is to prevent a short circuit.
[0022]
The substrate 40U is a square-shaped substrate in which an opening (hereinafter referred to as a “device hole”) for accommodating the electronic component 35U is formed in the central portion. A conductor pattern 41U is formed. When stacked on the substrate 30U, the substrate 40U has a thickness such that the + Z direction side surface is positioned higher than the + Z direction side surface of the electronic component 35U mounted on the substrate 30U. As a result, the entire electronic component 35U is accommodated in the central cavity formed by the substrates 30U and 40U. The thickness of the substrate 40U may be adjusted as appropriate according to the thickness of the electronic components to be mounted and the solder bumps for mounting these electronic components.
[0023]
Further, the substrate 40U is formed with a through hole 42U (see FIG. 5) which is an electric signal path. Conductiveness between the conductor pattern 41U and the above-described conductor pattern 31U is achieved through these through holes 42U and solder bumps 43U (see FIG. 5) on the −Z direction side ends of the through holes 42U. .
[0024]
In addition, in the −Z direction side surface of the substrate 40U, as in the case of the substrate 30U, in order to prevent a short circuit with the conductor pattern 31U formed on the + Z direction side surface of the substrate 30, the −Z direction of the through hole 42U. Except for the side end, no conductor is present.
[0025]
The substrate 50U is a flat substrate, and on the surface in the + Z direction side, as described above, the conductor pattern 51U that is a path for electric signals and the like is formed, and a discrete component R is provided at a predetermined position of the conductor pattern 51. , C, L mounting solder pads are formed. Further, a through hole 52U (see FIG. 6), which is an electric signal path, is formed in the vicinity of the outer edge of the substrate 50U. The conductor pattern 51U and the above-described conductor pattern 41U are electrically connected to each other through the through hole 52U and the solder bump 53U (see FIG. 6) on the −Z direction side end of the through hole 52U. .
[0026]
In addition, in order to prevent a short circuit between the conductive pattern 41U and the electronic component 35U formed on the + Z direction side surface of the substrate 40U on the −Z direction side surface of the substrate 50U, as in the case of the substrate 30U and the substrate 40U, Except for the −Z direction side end portion of the through hole 52U, no conductor portion exists.
[0027]
The substrate 30L1 has a surface on which the conductor pattern 31L1 is formed, a surface on which the electronic component 35L1 is mounted is a surface on the −Z direction side, and a solder bump is formed on the + Z direction end of the through hole of the substrate 30L1. Except for this, the configuration is the same as the above-described substrate 30U. The conductor pattern 31L1 is electrically connected to the above-described conductor pattern 21L and shield pattern 25 through these through holes and solder bumps.
[0028]
The substrate 40L1 has the above-described substrate 40U except that the formation surface of the conductor pattern 41L1 is the −Z direction side surface and that the solder bump is formed at the + Z direction end of the through hole of the substrate 40L1. It is configured in the same way. The conductor pattern 41L1 and the above-described conductor pattern 31L1 are electrically connected to each other through these through holes and solder bumps.
[0029]
The substrate 30L2 has a surface on which the conductor pattern 31L2 is formed, a surface on which the electronic component 35L2 is mounted is a surface on the −Z direction side, and a solder bump is formed on the + Z direction end of the through hole of the substrate 30L2. Except for this, the configuration is the same as the above-described substrate 30U. The conductor pattern 31L2 and the above-described conductor pattern 41L1 are connected to each other through these through holes and solder bumps.
[0030]
The substrate 40L2 has the above-described substrate 40U except that the formation surface of the conductor pattern 41L2 is the −Z direction side surface and that the solder bump is formed at the + Z direction end of the through hole of the substrate 40L2. It is configured in the same way. The conductor pattern 41L2 and the above-described conductor pattern 31L2 are connected to each other through these through holes and solder bumps.
[0031]
The substrate 50L is a flat substrate, and as described above, the conductor pattern 51L, which is a path for electric signals, is formed on the surface in the −Z direction, and the mother board is placed on a predetermined position of the conductor pattern 51L. A solder ball 55L for mounting on the MB is formed. Further, a through hole 52L (see FIG. 7) that is an electric signal path is formed in the vicinity of the outer edge portion of the substrate 50L. The conductor pattern 51L and the above-described conductor pattern 41L2 are connected to each other through the through holes 52L and the solder bumps 53L (see FIG. 7) on the end portions of the through holes 52L in the + Z direction. Further, the solder ball 55L is also formed on the end portion on the −Z direction side in the through hole 52L at a predetermined position (in this embodiment, the outer edge portion).
[0032]
Note that the + Z direction side end of the through hole 52L is formed on the −Z direction side surface of the substrate 50L in order to prevent a short circuit between the conductor pattern 41L2 and the electronic component 35L2 formed on the −Z direction side surface of the substrate 40L2. Except for this, there is no conductor portion.
[0033]
In manufacturing the multilayer printed wiring board 10 configured as described above, the substrate 20, the substrate 30U on which the electronic component 35U is mounted, the substrate 40U, and the substrate 50U are individually manufactured. In addition, the substrate 30L1, the substrate 40L1, the substrate 30L2, the substrate 40L2, and the substrate 50U on which the electronic component 35L1 is mounted are individually manufactured.
[0034]
Here, when the substrate 20 is manufactured, for example, a copper-clad glass epoxy substrate in which a copper conductor pattern 29 is formed on both sides and the insulating layer 28 is a glass epoxy material is used as a starting material 20A (FIG. 3A). reference). In addition, a copper clad glass polyimide substrate can also be employed as a starting material.
[0035]
By applying a pattern forming method by a known subtractive method to the starting material 20A, the conductor pattern 21U is formed on the + Z direction side surface, and the conductor pattern 21L and the shield pattern 25 are formed on the −Z direction side surface. Further, the through hole 22 is formed by applying a known through hole forming method (see FIG. 3B). In this way, the substrate 20 is manufactured.
[0036]
In manufacturing the substrate 30U, as in the case of the substrate 20, the copper-clad glass epoxy substrate or the like is used as the starting material 30A (see FIG. 4A). A conductive pattern 31U is formed on the surface on the + Z direction side by applying a pattern forming method by a known subtractive method to the starting material 30A. Further, a through hole 32U is formed by applying a known through hole forming method (see FIG. 4B).
[0037]
Subsequently, the solder bump 36 is placed at a position where the signal terminal and the power supply terminal of the electronic component 35U are to be disposed on the conductor pattern 31U by a well-known solder bump forming method, and on the −Z direction side end portion of the through hole 32U. A solder bump 33U is formed on the substrate (see FIG. 4C). Then, the signal terminal and the power supply terminal of the electronic component 35U are fixedly conductively connected to the conductor pattern 31U via the solder bump 36, and the underfill resin 37 is filled between the electronic component 35U and the substrate surface ( (See FIG. 4D). Thus, the substrate 30U on which the electronic component 35U is mounted is manufactured.
[0038]
The substrate 30L1 on which the electronic component 35L1 is mounted and the substrate 30L2 on which the electronic component 35L2 is mounted are manufactured in the same manner as the substrate 30U on which the electronic component 35U is mounted.
[0039]
In manufacturing the substrate 40U, as in the case of the substrate 20, the copper-clad glass epoxy substrate or the like is used as the starting material 40A (see FIG. 5A). A conductive pattern 41U is formed on the surface in the + Z direction side by applying a pattern forming method by a known subtractive method to the starting material 40A. Further, a through hole 42U is formed by applying a known through hole forming method (see FIG. 5B).
[0040]
Subsequently, solder bumps 43U are formed on the −Z direction side end portions of the through holes 42U by a known solder bump forming method (see FIG. 5C). Then, a device hole for housing the electronic component 35U is formed by punching, cutting, or the like (see FIG. 5D). Note that the conductor pattern 41U, the through hole 42U, and the solder bump 43U may be formed after the device hole is formed by punching, cutting, or the like. In this way, the substrate 40U is manufactured.
[0041]
The substrate 40L1 and the substrate 40L2 are manufactured in the same manner as the substrate 40U.
[0042]
In manufacturing the substrate 50U, as in the case of the substrate 20 described above, a copper-clad glass epoxy plate or the like is used as the starting material 50A (see FIG. 6A). A conductive pattern 51U is formed on the surface in the + Z direction side by applying a pattern forming method by a known subtractive method to the starting material 50A. Further, a through hole 52U is formed by applying a known through hole forming method (see FIG. 6B).
[0043]
Subsequently, solder bumps 53U are formed on the −Z direction side end portions of the through holes 52U by a known solder bump forming method (see FIG. 6C). In this way, the substrate 50U is manufactured.
[0044]
Further, in manufacturing the substrate 50L, the starting material 50A is employed as in the case of the substrate 50U (see FIG. 7A). A conductive pattern 51L is formed on the surface in the −Z direction side by applying a pattern forming method by a known subtractive method to the starting material 50A. Further, a through hole 52L is formed by applying a known through hole forming method (see FIG. 7B).
[0045]
Subsequently, a solder bump 53L is formed on the + Z direction side end portion of the through hole 52U by a known solder bump forming method. Also, solder balls 55L are formed on the + Z direction side end portions of the through holes 52U at predetermined positions and on the predetermined positions of the conductor pattern 51L. In this way, the substrate 50L is manufactured.
[0046]
When the element substrates constituting the multilayer printed wiring board 10 are manufactured in this way, the multilayer printed wiring board 10 is manufactured by laminating these element substrates in the order shown in FIG. In the present embodiment, for such lamination, a batch lamination press method is used in which all the element substrates are pressed with a predetermined pressure while heating the whole. In this way, the multilayer printed wiring board 10 is manufactured. The formation of the solder resist on both surfaces of the multilayer printed wiring board 10 may be performed before the collective lamination press or after the collective lamination press.
[0047]
According to the multilayer printed wiring board 10 according to the present embodiment described above, the wiring board in which the conductor pattern is formed on the + Z direction side and the through-hole and the solder bump that are the interlayer conductive connection structure are formed on the double-sided wiring. It arrange | positions at the + Z direction side of the board | substrate 20 which is a board | substrate. In addition, a wiring board on which a conductive pattern is formed on the −Z direction side and through holes and solder bumps that are interlayer conductive connection structures are formed is disposed on the −Z direction side of the substrate 20. Therefore, it is possible to form a solder ball for mounting a motherboard on the surface in the −Z direction side after mounting the electronic component inside the substrate, and to form a solder pad for mounting the electronic component on the surface in the + Z direction side. Therefore, the mounting density of electronic components can be improved with a simple configuration.
[0048]
For example, when there is an analog circuit portion in the multilayer printed wiring board 10, a discrete element used for adjusting the operating characteristics of the analog circuit can be mounted on the + Z direction side surface of the multilayer printed wiring board 10. The mounting density of components can be improved.
[0049]
In addition, since the shield pattern 25 is formed on the surface of the substrate 20 on the −Z direction side, the + Z direction side region and the −Z direction side region of the shield pattern 25 can be electromagnetically cut off. It is possible to dramatically reduce the amount of electromagnetic radiation noise propagating through the. For example, when analog circuit units and digital circuit units coexist, electromagnetic radiation noise propagating between the analog circuit unit and the digital circuit unit is effectively reduced by arranging the shield pattern 25 between them. Can be made.
[0050]
Further, since the solder balls for mounting the motherboard are formed on the surface of the multilayer printed wiring board 10 on the −Z direction side, the multilayer printed wiring board 10 can be easily mounted on the motherboard.
[0051]
The present invention is not limited to the above-described embodiment, and various modifications are possible.
[0052]
For example, in the above embodiment, electronic components such as bare chips are mounted on the three substrates inside the multilayer printed wiring board 10, but electronic components such as bare chips are mounted on two or four or more inner layer substrates. Can be. It goes without saying that the number of element substrates constituting the multilayer printed wiring board may be increased or decreased according to the number of inner layer substrates on which electronic components such as bare chips are mounted.
[0053]
Further, which layer of the multilayer printed wiring board is used as the double-sided wiring board is arbitrary. In the case where at least a part of the conductor pattern formed on one surface of the double-sided wiring board is used as a shield pattern as in the above embodiment, there is a shield pattern between areas where electromagnetic shielding is required between them. What is necessary is just to determine the position in the multilayer printed wiring board of a double-sided wiring board so that it may be located.
[0054]
In the above embodiment, discrete components are mounted on the + Z direction side of the multilayer printed wiring board 10, but as shown in FIG. 8, the same multilayer as the multilayer printed wiring board 10 of the present embodiment is used. A multilayer printed wiring board 10B similar to the multilayer printed wiring board 10 of the present embodiment may also be mounted on the surface on the + Z direction side of the printed wiring board 10A.
[0055]
【The invention's effect】
As described above in detail, according to the multilayer printed wiring board of the present invention, it is possible to achieve a remarkable effect that the mounting density of electronic components can be improved with a simple configuration.
[Brief description of the drawings]
FIG. 1 is a perspective view schematically showing an external configuration of a multilayer printed wiring board according to an embodiment of the present invention.
FIG. 2 is a cross-sectional configuration diagram for explaining a configuration of a multilayer printed wiring board according to an embodiment of the present invention.
FIG. 3 is a view (No. 1) for explaining a production process of an element substrate constituting the multilayer printed wiring board according to the embodiment of the invention.
FIG. 4 is a view (No. 2) for explaining a production step of the element substrate constituting the multilayer printed wiring board according to the embodiment of the invention.
FIG. 5 is a diagram (No. 3) for explaining a production step of the element substrate constituting the multilayer printed wiring board according to the embodiment of the invention.
6 is a view (No. 4) for explaining a production step of the element substrate constituting the multilayer printed wiring board according to the embodiment of the invention. FIG.
FIG. 7 is a view (No. 5) for explaining a production step of the element substrate constituting the multilayer printed wiring board according to the embodiment of the invention.
FIG. 8 is a diagram for explaining a modification.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 ... Multilayer printed wiring board, 20 ... Board | substrate (double-sided wiring board), 21U, 21L ... Conductor pattern, 22 ... Through-hole, 25 ... Shield pattern, 30U, 40U, 50U ... Board | substrate (wiring board), 31U, 41U, 51U ... Conductor pattern, 32U, 42U, 52U ... Through hole (part of interlayer connection structure), 33U, 43U, 53U ... Solder bump (part of interlayer connection structure), 35U ... Electronic components, 30L1, 30L2, 40L1, 40L2 , 50L ... substrate (wiring board), 31L1, 31L2, 41L1, 41L2, 51L ... conductor pattern, 52L ... through hole (part of interlayer connection structure), 53L ... solder bump (part of interlayer connection structure), 35L1, 35L2 ... electronic component, 36 ... solder bump, 37 ... underfill resin, 55L ... solder ball.

Claims (5)

A multilayer printed wiring board having a plurality of electronic components mounted thereon,
A double-sided wiring board having a conductor pattern formed on both sides;
Arranged on one side of the double-sided wiring board, a conductor pattern is formed on the surface opposite to the side of the double-sided wiring board, and at least one electronic component among the plurality of electronic components is mounted; At least one one-sided wiring board on which an interlayer conductive connection structure is formed;
Arranged on the other side of the double-sided wiring board, a conductor pattern is formed on the surface opposite to the double-sided wiring board side, and at least one of the plurality of electronic components is mounted, and interlayer conductive connection At least one other wiring board having a structure formed thereon;
When there are a plurality of the one side wiring boards, they are arranged between the one side wiring boards. When a plurality of the other side wiring boards are present, they are arranged between the other side wiring boards. An opening forming wiring board in which an opening for housing is formed and a conductor pattern and an interlayer conductive connection structure are formed;
A solder member for interlayer connection is provided between the wiring boards in the laminated state of the double-sided wiring board, the one side wiring board, the other side wiring board, and the opening forming wiring board. Multilayer printed wiring board.   A shield pattern is formed on at least one surface of the double-sided wiring board, and the one side region and the other side region of the shield pattern are electromagnetically cut off. The multilayer printed wiring board according to claim 1. Arranged on the surface of one side of the double-sided wiring board, a conductor pattern is formed on the surface opposite to the side of the double-sided wiring board, and at least one electronic component of the plurality of electronic components is mounted And a first wiring board on which an interlayer conductive connection structure is formed;
An opening is formed on the surface of the first wiring board opposite to the double-sided wiring board, and an opening for accommodating an electronic component mounted on the first wiring board is formed on the double-sided wiring board side. A second wiring board on which a conductor pattern is formed on the surface opposite to the substrate and further an interlayer conductive connection structure is formed;
The second wiring board is disposed on the surface opposite to the double-sided wiring board, covers the opening of the second wiring board, and has a conductor pattern on the surface opposite to the double-sided wiring board. A third wiring board formed;
Disposed on the surface of the other side of the double-sided wiring board, a conductor pattern is formed on the surface opposite to the side of the double-sided wiring board, and at least one of the plurality of electronic components is mounted; A fourth wiring board on which an interlayer conductive connection structure is formed;
An opening is formed on a surface of the fourth wiring board opposite to the double-sided wiring board side, and an opening for accommodating an electronic component mounted on the fourth wiring board is formed. A fifth wiring board on which a conductor pattern is formed on the surface opposite to the substrate and further an interlayer conductive connection structure is formed;
The fifth wiring board is disposed on the opposite side to the double-sided wiring board side, covers the opening of the fifth wiring board, and a conductor pattern is formed on the surface opposite to the double-sided wiring board side. A sixth wiring board;
The multilayer printed wiring board according to claim 1, wherein the multilayer printed wiring board is provided.   The at least one electronic component of the plurality of electronic components is mounted on a surface opposite to the double-sided wiring substrate side of at least one of the third and sixth substrates. 3. The multilayer printed wiring board according to 3.   The multilayer printed wiring board according to claim 1, further comprising a connection terminal on at least one of the surfaces of the outermost layer.

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