JP5462450B2 - Component built-in printed wiring board and method for manufacturing component built-in printed wiring board - Google Patents

Description

  The present invention relates to an improvement in a component built-in printed wiring board and a method for manufacturing a component built-in printed wiring board.

  In small electronic devices such as portable terminals, functions and miniaturization have progressed, functions to be integrated into semiconductor integrated circuit elements have expanded, and the number of input / output terminals for the semiconductor integrated circuit elements has increased. For this reason, the number of packages mounted on printed wiring boards has been increasing. On the other hand, in order to reduce the size of an electronic device, a small semiconductor package having a large number of pins is required. Conventionally, a semiconductor package such as a ball grid array (BGA) has been widely used. This BGA semiconductor package is configured by mounting a semiconductor integrated circuit element on a substrate such as a printed wiring board and sealing the mounted semiconductor integrated circuit element with a resin.

  By the way, in recent years, as a printed wiring board for forming a plurality of layers, a chip component such as a capacitor is soldered on a pad made of a conductive pattern formed on a pattern forming surface on the inner layer side, and an insulating material is laminated on the inner layer side. By covering the chip parts with an insulating material, the manufacturing technology of the printed wiring boards with built-in parts has been developed for practical use.

  However, in the printed wiring board with a built-in component as described above, the chip component is removed from the insulating material in the process of laminating the printed wiring board on the inner layer side on which the chip component is mounted and the insulating material by hot pressing in a vacuum state. There was a problem that it was destroyed by the transmitted stress. For this reason, a means for protecting the built-in chip component mounted on the inner layer side from external stress or stress due to thermal expansion is required.

Therefore, in Patent Document 1, a through-hole is provided in a substrate, a multilayer chip capacitor is disposed in the through-hole, and then a built-in component composed of a multilayer printed wiring board formed by filling the through-hole with an embedded resin. A configuration of a printed wiring board is disclosed.
On the other hand, Patent Document 2 discloses a configuration of a component built-in printed wiring board in which an insulating layer having a thickness for covering a circuit component is formed by applying a filling material on a substrate on which the circuit component is mounted. ing.
JP 2003-069229 A JP 2007-234697 A

However, the component built-in printed wiring board disclosed in Patent Document 1 has a problem in that a through-hole for incorporating a multilayer chip capacitor and filling a resin has to be provided in the substrate. In addition, multilayer chip capacitors are difficult to mount because they are conductive on the front and back surfaces of the through hole, and further, a polishing process is necessary to ensure the flatness of the substrate surface after resin filling. was there.
On the other hand, the component built-in printed wiring board disclosed in Document 2 has a problem that the filling material that covers the circuit component becomes an insulating layer, and therefore, other than a resin that is resistant in the subsequent plating process cannot be applied. In addition, since the filling material is applied to the entire surface of the substrate, there is a problem that the amount of resin used increases and the productivity is low.

The present invention has been made to solve the above-described problems, and an object of the present invention is to provide a component built-in printed wiring board in which the built-in electronic circuit component has high reliability and excellent flatness.
It is another object of the present invention to provide a method for manufacturing the component built-in printed wiring board with high productivity.

That is, the component built-in printed wiring board of the present invention has a base substrate having a component mounting surface, and one or more openings that are disposed on the component mounting surface of the base substrate and expose the component mounting surface. In addition, a partition frame base material in which no step is provided in the opening, one or more electronic circuit components mounted on the component mounting surface in the opening, and the electronic circuit filled in the opening An insulating layer that covers the component; and a plate-like lid base material that is disposed on the insulating layer and has the same or a similar shape to the opening and has the same or slightly smaller size than the opening; wherein the lid substrate in said opening, wherein the upper surfaces of the lid substrate of the partition frame substrate is arranged such that the height of the same, wherein an upper surface of the partition frame base and the upper surface of the lid substrate to form a Tan Taira surface And said that you are.

  Moreover, it is preferable that the component built-in printed wiring board of the present invention includes a through hole that penetrates the partition frame base material, and the insulating layer and the through hole do not contact each other. Furthermore, it is preferable to provide a single layer or a plurality of wiring layers on the upper surface of the partition frame substrate and the upper surface of the lid substrate.

The method for manufacturing a component-embedded printed wiring board according to the present invention includes a step of mounting one or more electronic circuit components on a component mounting surface of a base substrate, and one or more openings on the component mounting surface. A step of laminating a partition frame base material in which no step is provided in the portion, a step of filling the opening with a liquid resin to form an insulating layer, and the opening on the insulating layer in the opening. the section shape and the same or similar shape and a to the opening of the same or slightly smaller size of the plate-shaped lid substrate, the upper surface and the upper surface of the lid substrate of the partition frame substrate is of the same And a step of arranging and stacking so as to have a height.

  Moreover, it is preferable that the manufacturing method of the component built-in printed wiring board of this invention includes the process of making a through-hole penetrate the said partition frame base material. Furthermore, it is preferable to include a step of laminating a single layer or a plurality of wiring layers on the upper surface of the partition frame substrate and the upper surface of the lid substrate.

According to the component built-in printed wiring board of the present invention, the electronic circuit component is arranged in the opening of the partition frame base material provided on the component mounting surface of the base base material and covered with the insulating layer. . Thereby, since the electronic circuit component is reliably protected by the insulating layer, it is not destroyed by external stress or the like. Therefore, it is possible to provide a component built-in printed wiring board with high reliability of the built-in electronic circuit component.
In addition, a plate-like lid base material is provided on the insulating layer, and the upper surface of the partition frame base material and the upper surface of the lid base material form a substantially flat surface. Component mounting and further multilayering can be facilitated. Therefore, it is possible to provide a component built-in printed wiring board that can cope with high functionality.
Furthermore, since the volume of the opening can be easily changed by forming the opening in the partition frame base material, it is possible to provide a component built-in printed wiring board having a high degree of design freedom according to the function to be provided. .

  According to the component built-in printed wiring board of the present invention, when the through hole is provided in the component built-in printed wiring board, the through hole penetrates the partition frame base material, and the insulating layer and the through hole are formed. It is configured not to touch. Thus, since the insulating layer and the plating solution do not come into contact with each other during the plating step, a resin having no plating solution resistance despite excellent stress relaxation performance can be used as the insulating layer.

  Further, according to the component built-in printed wiring board of the present invention, since a single layer or a plurality of wiring layers are provided on the upper surface of the partition frame base material and the upper surface of the lid base material, a multilayer print is provided together with the base base material. A wiring board can be constituted.

  According to the manufacturing method of the component built-in printed wiring board of the present invention, the partition frame base material having the opening is laminated on the base base material. Thereby, it is not necessary to form an opening for incorporating the electronic circuit component in the surface layer of the printed wiring board. Moreover, since the electronic circuit component is mounted on the base substrate in advance, it is not necessary to mount the electronic circuit component in the opening provided in the surface layer of the printed wiring board. Thereby, an electronic circuit component can be easily mounted on a base substrate. Furthermore, since the insulating layer is formed by filling the opening with liquid resin, the electronic circuit component can be reliably covered and protected. Furthermore, since the volume of the opening can be easily reduced, the amount of resin filled in the opening can be saved. Further, since the lid base material is laminated on the insulating layer, the surface layer of the component built-in printed wiring board can be made substantially flat without performing a flattening process or the like after the insulating layer is formed. Therefore, it is possible to provide a highly productive manufacturing method for a built-in component printed wiring board with high reliability of the embedded electronic circuit component and excellent flatness.

  Moreover, according to the manufacturing method of the component built-in printed wiring board of this invention, it has the structure which makes a through-hole penetrate the partition frame base material. Thereby, even a resin that is excellent in stress relaxation performance and does not have plating solution resistance can be used as an insulating layer.

  Furthermore, according to the manufacturing method of the component built-in printed wiring board of the present invention, since it comprises a step of laminating a single layer or multiple layers of wiring layers on the upper surface of the partition frame substrate and the upper surface of the lid substrate, The manufacturing method of the component built-in printed wiring board which comprises a multilayer printed wiring board with a base base material can be provided.

As described above, according to the component built-in printed wiring board of the present invention, it is possible to provide a component built-in printed wiring board with high reliability and excellent flatness of the built-in electronic circuit component.
Moreover, according to the manufacturing method of the component built-in printed wiring board of this invention, the manufacturing method of the said component built-in printed wiring board with high productivity can be provided.

  Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the drawings. FIG. 1 is a schematic cross-sectional view showing a component built-in printed wiring board according to a first embodiment of the present invention. 2 to 10 are process cross-sectional views illustrating a method of manufacturing a component built-in printed wiring board according to the first embodiment of the present invention. FIG. 11 is a schematic cross-sectional view showing a component built-in printed wiring board according to a second embodiment of the present invention. In addition, FIGS. 1-11 is for demonstrating the structure of the component built-in printed wiring board wiring which is one Embodiment of this invention, and the manufacturing method, The magnitude | size of each part shown, thickness, a dimension, etc. are as follows. The actual dimensional relationship of the component built-in printed wiring board may be different.

<First Embodiment>
First, the component built-in printed wiring board according to the first embodiment of the present invention will be described.
As shown in FIG. 1, the component built-in printed wiring board 20 according to the first embodiment includes a base substrate 1 having a component mounting surface 1a and electronic circuit components 2 (2a, 2b, 2c) mounted on the component mounting surface 1a. ), A partition frame base material 3 provided on the component mounting surface 1a and having an opening 3A, an insulating layer 4 filled in the opening 3A and covering the electronic circuit component 2, and provided on the insulating layer 4 The lid base material 5 is provided.

  As shown in FIG. 1, the base substrate 1 is a double-sided printed wiring board formed by laminating a sheet-like member made of an insulating material and wiring layers 8 and 9. Further, an electronic circuit component 2 is mounted on the inner layer side surface of the base substrate 1 to form a component mounting surface 1a. On the other hand, the surface on the outer layer side of the base substrate 1 is a pattern forming surface 1b.

  The material having insulating properties is not particularly limited, and can be appropriately selected according to the function given to the base substrate 1. For example, when the base substrate 1 is given flexibility, an insulating resin such as polyimide can be applied. When the flexibility is not given, a prepreg in which a glass cloth is impregnated with a resin is applicable. Can be applied. Furthermore, a plurality of insulating materials may be used in combination.

  A wiring layer 8 is provided on the component mounting surface 1 a of the base substrate 1, and a plurality of conductor patterns including electrode pads for mounting the mounting surface of the electronic circuit component 2 to be mounted are formed.

On the other hand, a wiring layer 9 is provided on the pattern forming surface 1b on the outer layer side of the base substrate 1, and a plurality of conductor patterns as shown in FIG. 1 are formed.
The base substrate 1 includes via holes (through via holes) 10 and 11 formed through the conductor patterns of the wiring layers 8 and 9 and via holes formed without penetrating the conductor patterns of the wiring layer 8. (Non-penetrating via hole) 12. Thereby, electrical connection between the wiring layers 8 and 9 is established in the base substrate 1. In addition, the structure of the via hole provided in order to make conduction | electrical_connection of the base base material 1 is not specifically limited, Either one or both of penetration and non-penetration can be selected suitably.

  Here, as shown in FIG. 1, the via hole 11 provided in the opening 3 </ b> A and in contact with the insulating layer 4 may be partially filled with the insulating layer 4. is there. In contrast, the non-penetrating via hole 12 provided in the opening 3A and in contact with the insulating layer 4 is not likely to be filled with the insulating layer 4. Thus, when it is not desired to fill the insulating layer 4 in the via hole provided in the opening 3A, the diameter of the via hole can be reduced or a non-through via hole can be selected.

  On the other hand, the through-via hole 10 that is provided at a location where the partition frame base material 3 is laminated and is not in contact with the insulating layer 4 does not fill the inside of the via hole 10 with the insulating layer 4. Thus, in order to avoid the filling of the insulating layer 4 into the through via hole, the through via hole can be arranged at a position where the partition frame base material 4 is laminated.

  The electronic circuit component 2 is mounted and provided on the component mounting surface 1 a in the opening 3 </ b> A of the partition frame base material 3. The electronic circuit component 2 is an active element having two or more terminals having a specific operation function. Further, as shown in FIG. 1, the electronic circuit component 2 is chip components 2a, 2b, and 2c in which a pair of terminals are provided on a rectangular parallelepiped component body, and examples thereof include chip components such as capacitors and resistance elements. it can.

  As shown in FIG. 1, the terminals of the electronic circuit component 2 (2a to 2c) are soldered to a conductor pattern constituting an electrode pad formed on the component mounting surface 1a, so that the electronic circuit component 2 is connected to the component mounting surface 1a. Has been implemented.

  As shown in FIG. 1, the partition frame base material 3 is a continuous plate-like member having one or more openings 3 </ b> A that expose the component mounting surface 1 a, and is stacked on the component mounting surface 1 a. Yes. Further, at least the upper surface 3a of the partition frame base material 3 is substantially flat. Here, the upper surface 3a is a surface opposite to the surface in contact with the component mounting surface 1a of the partition frame base material.

The material of the partition frame base material 3 is not particularly limited, and can be appropriately selected according to the function given to the component built-in printed wiring board 20. For example, in the case where flexibility is given to the component built-in printed wiring board 20, an insulating resin such as polyimide can be applied, and in the case where flexibility is not given, a glass cloth is impregnated with resin. Prepreg can be applied.
Moreover, the thickness of the partition frame base material 3 is not particularly limited, but is configured to be at least larger than the height after mounting the electronic circuit components 2a to 2c. Thus, in order to adjust the partition frame base material 3 to a predetermined layer thickness, a single member having a predetermined thickness may be used, or a plurality of insulating members having different thicknesses may be combined. It may be used.

  The opening 3 </ b> A is configured such that one opening of a through hole provided in the partition frame base 3 is closed by a component mounting surface 1 a of the base base 1. One or more electronic circuit components 2 are mounted on the mounting surface 1a in the opening 3A. Further, the shape and volume of the opening 3A are not particularly limited, and can be appropriately changed depending on the number and layout of the electronic circuit components 2 mounted in the opening 3A.

  In the partition frame base material 3, the occupation ratio of the opening 3A can be changed as appropriate. Thereby, the usage of the insulating layer 4 filled in the opening 3A can be freely changed in design, and functions such as flexibility and stress relaxation can be easily imparted to the component built-in printed wiring board 20.

  As shown in FIG. 1, the insulating layer 4 is mounted on the component mounting surface 1 a in the opening 3 </ b> A in order to relieve external stress on the electronic circuit component 2 and suppress destruction of the electronic circuit component 2. Further, the electronic circuit components 2a and 2b and 2c are provided so as to cover each of the electronic circuit components 2a and 2b.

  The insulating layer 4 is a thermosetting resin and is formed by filling a liquid resin into the opening 3A and then curing, but the material of the insulating layer 4 is not particularly limited thereto. Any electronic circuit component 2 may be used as long as it can protect against external stress. Further, when one or more openings 3A are provided in the partition frame base material 3, all of the insulating layers 4 may be made of the same material, or different materials may be applied to the openings 3A. .

  As shown in FIG. 1, the insulating layer 4 is filled in the gap S between the electronic circuit component 2 and the component mounting surface 1a. Thereby, since there is no air pocket (air void) etc. in the gap | interval S, the highly reliable printed wiring board 20 with a built-in component with which the mounted electronic circuit component 2 is not destroyed can be provided.

  The lid base material 5 is a plate-like member disposed on the insulating layer 4 as shown in FIG. The lid substrate 5 is not particularly limited as long as it is an insulating material, and can be appropriately selected according to the function to be given to the component built-in printed wiring board 20. For example, when flexibility is given, an insulating resin such as polyimide can be applied, and when flexibility is not given, a prepreg in which a glass cloth is impregnated with a resin can be applied. it can. Furthermore, a plurality of insulating materials may be used in combination.

The shape of the lid base material 5 is not particularly limited, but is preferably the same as or similar to the shape of the opening 3A. Moreover, it is preferable that the magnitude | size of the cover base material 5 is the same magnitude | size as the opening part 3A, or slightly small. If the size of the lid base material 5 is slightly smaller than the opening 3A and there is a slight gap between the lid base 5 and the opening 3A, the gap is filled with the insulating layer 4 May be.
Furthermore, the upper surface 5a of the lid substrate 5 is a surface opposite to the surface in contact with the insulating layer 4, and is a substantially flat surface. Further, the lid substrate 5 has a flat surface at least at the upper surface 5a.

Here, when the insulating layer 4 filled in the opening 3A is in an appropriate amount, the upper surface 3a of the partition frame base material 3 and the upper surface 5a of the lid base material 5 form a substantially flat surface. Thereby, components can be easily mounted on the component built-in printed wiring board 20, or multilayer wiring can be realized.
Moreover, when there are many insulating layers 4 with which the opening part 3A was filled, the upper surface 5a of the cover base material 5 may rise a little with respect to the upper surface 3a of the partition base material 3. However, since it becomes a substantially flat surface as a whole, it is preferable to control within the allowable range of the specification of the component built-in printed wiring board 20.
Furthermore, when there are few insulating layers with which the opening part 3A was filled, the upper surface 5a of the lid base material 5 may be slightly bent or slightly stepped with respect to the upper surface 3a of the partition frame base material 3. However, since the entire surface is substantially flat as in the case where there are many insulating layers, it is preferable to control within the allowable range of the specification of the component built-in printed wiring board 20.

Next, an example of a manufacturing method of the component built-in printed wiring board 20 shown in FIG. 1 will be described.
The manufacturing method of the component built-in printed wiring board 20 of this embodiment includes a step of mounting one or more electronic circuit components 2 on the component mounting surface 1a of the base substrate 1, and one or more openings 3A on the component mounting surface 1a. Schematic configuration from the step of laminating the partition frame base material 3 having the above, the step of filling the opening 3A with a liquid resin to form the insulating layer 4, and the step of laminating the lid base material 5 on the insulating layer 4 Has been. Hereinafter, each step will be described in detail.

(Electronic circuit component mounting process)
First, a process of mounting the electronic circuit component 2 on the component mounting surface 1a surface of the base substrate 1 (hereinafter referred to as an electronic circuit component mounting process) will be described.
In the electronic circuit component mounting step, first, as shown in FIG. 2, a base substrate 1 having a conductor pattern formed on the wiring layer 8 on the component mounting surface 1a and the wiring layer 9 on the pattern forming surface 1b is prepared.

  Next, as shown in FIG. 3, the terminals of the electronic circuit components 2a to 2c are respectively joined to the conductor patterns constituting the electrode pads provided on the wiring layer 8 of the component mounting surface 1a by soldering, and the component mounting surface One or more electronic circuit components 2 (2a to 2c) are mounted on 1a.

(Partition frame base material stacking process)
Next, a process of stacking the partition frame base material 3 having one or more openings 3A on the component mounting surface 1a (hereinafter referred to as a partition frame base material stacking process) will be described.
In the step of laminating the partition frame base material, first, as shown in FIG. 4, an adhesive layer 13 is formed on the component mounting surface 1 a of the base base material 1 at a location where the partition frame base material 3 is joined. The adhesive layer 13 may be formed by laminating a sheet-like adhesive or by applying a liquid adhesive. In addition, when the partition frame base material 3 has adhesiveness, or when the contact bonding layer is provided in the surface of the partition frame base material 3, formation of the contact bonding layer 13 can be abbreviate | omitted.

  Next, as shown in FIG. 5, for example, a partition frame in which openings 3A are formed at positions corresponding to the electronic circuit components 2a, 2b and 2c by using a conventional method such as laser, drill, punch, die cutting or the like. A base material 3 is prepared.

Next, as shown in FIG. 6, after aligning the adhesive layer 13 and the partition frame base 3 so that the electronic circuit components 2a, 2b, and 2c are arranged inside the opening 3A, the partition frame is aligned. The base material 3 is laminated on the component mounting surface 1a.
Next, the component mounting surface 1 a and the partition frame base material 3 are bonded to each other through the adhesive layer 13 by hot pressing, temperature increase processing, or the like. In this way, by applying the partition frame base material 3 having one or more openings 3A, a frame for filling the resin layer 4 covering the electronic circuit component 2 on the component mounting surface 1a of the base base material 1 is collected. Since it can be formed, productivity can be improved.

(Insulating layer forming process)
Next, a process of forming the insulating layer 4 by filling the opening 3A with a liquid resin (hereinafter referred to as an insulating layer forming process) will be described.
In the insulating layer forming step, first, as shown in FIG. 7, a liquid resin 4a is injected and filled into the opening 3A. The liquid resin 4a can be respectively injected into the opening 3A using a dispenser or the like. The injection amount of the liquid resin 4a is preferably selected as appropriate in consideration of volume shrinkage after curing.

  Further, when the liquid resin 4a is injected into the space, as shown in FIG. 7, the insulating layer 4 is filled in the gap S between the electronic circuit component 2 and the component mounting surface 1a by capillary action. A different resin may be filled for each opening 3A.

(Lamination process of lid base material)
Finally, a step of laminating the lid base material 5 on the insulating layer 4 (hereinafter referred to as a lid base layer laminating step) will be described.
In the step of laminating the lid base material, first, as shown in FIG. 8, the lid base material 5 is arranged on the filled liquid resin 4a.
Next, as shown in FIG. 9, after the release film 14 is bonded to the upper and lower parts of the component built-in printed wiring board, the weight 15 is put on and heat treatment is performed. By this heat treatment, the liquid resin 4a filled in the opening 3A is cured and the insulating layer 4 is formed. As the curing condition, an optimum condition can be appropriately selected depending on the resin filled in the opening 3A. Thus, the component built-in printed wiring board 20 of this embodiment as shown in FIG. 10 can be manufactured.

Here, in the present invention, since the lid substrate 5 is arranged before the liquid resin 4a is cured, the opening portion is formed when the amount of resin filled in the opening portion 3A is larger than the optimum resin amount. The resin may overflow from the gap between 3A and the lid base material 5. However, since it covers with the release film 14, even if it overflows from between the opening 4A and the lid base material 5, the spread of the resin 4a can be suppressed. Thereby, a flat surface can be formed without adding a process such as a flattening process later. In addition, the lid base material 5 may rise slightly, but as a whole, a substantially flat surface is formed on the upper surface 3 a of the partition frame base material 3 and the upper surface 5 a of the lid base material 5.
On the other hand, when the amount of resin filled in the opening 3A is less than the optimum amount of resin, the upper surface 5a of the lid base material 5 may be slightly bent with respect to the upper surface 3a of the partition frame base material 3. . Further, when the amount of resin is small, there may be a slight step between the upper surface 3a of the partition frame base material 3 and the upper surface 5a of the lid base material 5. However, in any case, a substantially flat surface is formed on the upper surface 3a of the partition frame base material 3 and the upper surface 5a of the lid base material 5 as a whole.

  As described above, according to the component built-in printed wiring board 20 of the present embodiment, the electronic circuit components 2 (2a to 2c) are the partition frame base material 3 provided on the component mounting surface 1a of the base base material 1. It is arranged in the opening 3a and is covered with the insulating layer 4. Thereby, since the electronic circuit component 2 is reliably protected by the insulating layer 4, it is not destroyed by external stress or the like. Therefore, the built-in component printed wiring board 20 with high reliability of the built-in electronic circuit component 2 can be provided.

Further, since the plate-like lid base material 5 is provided on the insulating layer 4, and the upper surface 3a of the partition frame base material 3 and the upper surface 5a of the lid base material 5 form a substantially flat surface, the component built-in print Component mounting on the surface layer of the wiring board 20 and further multilayering can be facilitated. Therefore, it is possible to provide the component built-in printed wiring board 20 that can cope with higher functionality.
Furthermore, since the volume of the opening 3A can be easily changed by forming the opening 3A on the partition frame base 3, the component built-in printed wiring board 20 having a high degree of design freedom according to the function to be provided is provided. can do.

  According to the manufacturing method of the component built-in printed wiring board 20 of the present embodiment, the partition frame base material 3 having the opening 3 </ b> A is laminated on the base base material 1. Thereby, it is not necessary to form an opening for incorporating the electronic circuit component 2 in the surface layer of the printed wiring board 20 later. Moreover, since the electronic circuit component 2 is mounted on the base substrate 1 in advance, it is not necessary to mount the electronic circuit component 2 later in the opening provided in the surface layer of the printed wiring board. Thereby, the electronic circuit component 2 can be easily mounted on the base substrate 1.

  Further, since the insulating layer 4 is formed by filling the opening 3A with the liquid resin 4a, the electronic circuit component 2 can be reliably covered and protected. Furthermore, since the volume of the opening 3A can be easily reduced, the amount of resin filled in the opening 3A can be saved. Further, since the lid base material 5 is laminated on the insulating layer 4, the surface layer of the component built-in printed wiring board 20 is made substantially flat without performing a flattening process or the like after the insulating layer 4 is formed. be able to. Therefore, it is possible to provide a highly productive manufacturing method for the component built-in printed wiring board 20 with high reliability and flatness of the built-in electronic circuit component 2.

<Second Embodiment>
As shown in FIG. 11, the component built-in printed wiring board 30 according to the second embodiment of the present invention is provided with a single wiring layer 17 and a through hole 18 penetrating the printed wiring board. This is different from the component built-in printed wiring board 20 of the first embodiment, and other configurations are the same as those of the first embodiment. Therefore, among the constituent elements shown in FIG. 11, the same constituent elements as those shown in FIG. 1 are denoted by the same reference numerals as those in FIG.

The insulating base material 16 is an insulating member made of, for example, prepreg or the like, and is laminated on the upper surface 3 a of the partition frame base material 3 and the upper surface 5 a of the lid base material 5.
The wiring layer 17 is a wiring layer made of a conductive material such as copper, and is provided by being laminated on the insulating base material 16. A plurality of conductor patterns are formed on the wiring layer 17.
Moreover, although the wiring layer 17 has shown the structure laminated | stacked after laminating | stacking the insulating base material 16 in this embodiment, it is not limited to this, A partition frame base is directly connected without the insulating base material 16 being interposed. You may provide on the upper surface 3a of the material 3, and the upper surface 5a of the cover base material 5. FIG. For example, a single-sided printed wiring board in which the insulating base 16 and the wiring layer 17 are integrated, a double-sided printed wiring board, a multilayer printed wiring board, or the like may be used.
Further, the electronic circuit component 2 d may be mounted on the wiring layer 17.

As shown in FIG. 11, the component built-in printed wiring board 30 has a through hole 18 that penetrates the wiring layer 9 on the pattern forming surface 1 b of the base substrate 1 and the conductor pattern of the wiring layer 17. The through hole 18 is generally formed by a plating method.
By the way, when the insulating layer 4 is a material inferior in chemical resistance or a material into which the plating solution penetrates, the insulating layer 4 cannot function originally or the electronic component circuit 2 is Failures such as corrosion will occur.

Therefore, as described above, when the insulating layer 4 is a material with poor chemical resistance or a material into which the plating solution penetrates, the through hole 18 penetrates the partition frame base material 3. Can be configured. Thereby, in the plating process for forming the through hole 18, the insulating layer 4 and the plating solution do not come into contact with each other, so that problems such as deterioration and corrosion do not occur. Therefore, even a material inferior in chemical resistance or a material into which a plating solution penetrates can be applied as the insulating layer 4.
On the other hand, when the insulating layer 4 has a plating solution resistance, it is possible to arrange the through hole 18 so as to penetrate the insulating layer 4.

Next, an example of a manufacturing method of the component built-in printed wiring board 30 shown in FIG. 11 will be described.
The manufacturing method of the component built-in printed wiring board 30 of the present embodiment is such that the wiring layer is formed on the upper surface 3a of the partition frame base material 3 and the upper surface 5a of the lid base material 5 after manufacturing the first component built-in printed wiring board 20 described above. 17 and a step of passing through holes 18 through the partition frame base material 3. Hereinafter, each step will be described in detail.

(Through hole forming process)
First, the component built-in printed wiring board 20 of the first embodiment shown in FIG. 10 is prepared. Next, as shown in FIG. 11, the insulating base material 16 and the wiring layer 17 are laminated and formed on the upper surface 3 a of the partition frame base material 3 and the upper surface 5 a of the lid base material 5.
The insulating base material 16 and the wiring layer 17 may be laminated in this order, but when both are sheet-like members, they may be laminated together. Moreover, you may use what laminated | stacked the insulating base material 16 and the wiring layer 17 in advance.

Next, in the component built-in printed wiring board in which the respective base materials are integrated, a punching process for forming the through holes 18 in the partition frame base material 3 by laser processing or drill processing is performed.
Next, the inner wall of the hole for forming the through hole 18 is plated to form an internal conductor. In this manner, the through hole 18 that electrically connects the conductor patterns between the respective layers is formed. Since the through hole 18 is provided in the partition frame base material 3, the insulating layer 4 and the plating solution do not come into contact with each other.

Finally, a conductor pattern is formed on the wiring layer 17 on the outer layer side using a known method.
Thus, the component built-in printed wiring board 30 of this embodiment as shown in FIG. 11 can be manufactured.

As described above, according to the component built-in printed wiring board 30 of the present embodiment, the same effects as those of the component built-in printed wiring board 20 of the first embodiment described above can be obtained.
Further, according to the component built-in printed wiring board 30 of the present embodiment, the through hole 18 penetrates the partition frame base material 3, and the insulating layer 4 and the through hole 18 are not in contact with each other. Thus, since the insulating layer 4 and the plating solution do not come into contact with each other during the plating process, a resin having no plating solution resistance despite excellent stress relaxation performance can be used as the insulating layer 4. Therefore, it is possible to provide the component built-in printed wiring board 30 with a wide selection range of the resin applied to the insulating layer 4.

  Furthermore, according to the component built-in printed wiring board 30 of the present embodiment, the wiring layer 17 is provided on the upper surface 3a of the partition frame base material 3 and the upper surface 5a of the lid base material 5, so The wiring board 30 can be configured.

FIG. 1 is a schematic cross-sectional view showing a component built-in printed wiring board according to a first embodiment of the present invention. FIG. 2 is a process cross-sectional view illustrating the method of manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 3 is a process cross-sectional view illustrating the method of manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 4 is a process cross-sectional view illustrating the method of manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 5 is a process cross-sectional view illustrating the method for manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 6 is a process cross-sectional view illustrating the method of manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 7 is a process cross-sectional view illustrating the method of manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 8 is a process cross-sectional view illustrating the method of manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 9 is a process cross-sectional view illustrating the method of manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 10 is a process cross-sectional view illustrating the method of manufacturing the component built-in printed wiring board according to the first embodiment of the present invention. FIG. 11 is a schematic cross-sectional view showing a component built-in printed wiring board according to a second embodiment of the present invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Base base material, 1a ... Component mounting surface, 2 (2a-2d) ... Electronic circuit component, 3 ... Partition frame base material, 3A ... Opening part, 3a ... Upper surface of partition frame base material, 4 ... Insulating layer, 5 ... Lid base material, 5a ... Upper surface of lid base material, 8, 9, 17 ... Wiring layer, 10, 11, 12 ... Via hole, 18 ... Through hole, 20, 30 ... Printed wiring board with built-in components

Claims (6)

A base substrate having a component mounting surface;
A partition frame substrate that is disposed on the component mounting surface of the base substrate and has one or more openings that expose the component mounting surface, and no step is provided in the openings,
One or more electronic circuit components mounted on the component mounting surface in the opening;
An insulating layer filling the opening and covering the electronic circuit component;
A plate-shaped lid base material that is disposed on the insulating layer and has the same or similar shape to the opening and has the same or slightly smaller size than the opening.
The lid substrate in said opening, wherein the upper surfaces of the lid substrate of the partition frame substrate is arranged such that the height of the same, the lid substrate and the upper surface of the partition frame base component-embedded printed wiring board and the upper surface of which is characterized in that to form a Tan Taira surface. Comprising a through-hole penetrating the partition frame substrate;
The component built-in printed wiring board according to claim 1, wherein the insulating layer and the through hole do not contact each other.   The component built-in printed wiring board according to claim 1, further comprising a single layer or a plurality of layers of wiring layers on an upper surface of the partition frame base material and an upper surface of the lid base material. Mounting one or more electronic circuit components on the component mounting surface of the base substrate;
A step of laminating a partition frame base material having one or more openings on the component mounting surface and no step in the openings; and
Filling the opening with a liquid resin to form an insulating layer;
On the insulating layer in the opening, a plate-like lid base material that is the same as or similar to the shape of the opening and has a size that is the same as or slightly smaller than the opening, and an upper surface of the partition frame base a method for manufacturing a component-embedded printed wiring board and the upper surface of the lid substrate, characterized in that it comprises a laminating arranged such that the height of the same.   The method for manufacturing a component built-in printed wiring board according to claim 4, further comprising a step of penetrating a through hole through the partition frame base material.   6. The component built-in printed wiring board according to claim 4, further comprising a step of laminating a single layer or a plurality of wiring layers on an upper surface of the partition frame substrate and an upper surface of the lid substrate. Manufacturing method.

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