JP5958454B2 - Built-in module - Google Patents

Description

  The present invention relates to a component built-in module in which a mounted component is built in a component built-in layer provided on a core substrate.

  A conventional component built-in module 500 shown in FIG. 14 includes a core substrate 502 formed of a ceramic multilayer substrate provided with an internal electrode 501 having via conductors 501a and in-plane conductors 501b. Both main surfaces 502a and 502b of the core substrate 502 are provided. A pad electrode 503 for component mounting is formed. In addition, component built-in layers 504 and 505 are provided on both main surfaces 502 a and 502 b of the core substrate 502.

  Each component built-in layer 504, 505 includes a mounting component 506 mounted on each pad electrode 503 and a resin layer 507 covering each mounting component 506. Components such as active elements such as IC and LSI, and passive elements such as chip capacitors, chip resistors, chip thermistors, chip inductors, and filter elements are mounted on the core substrate 502 as mounting components 506. The component built-in layer 504 includes a plurality of external terminal electrodes 508 for external connection provided on one main surface opposite to the core substrate 502 and an internal connection provided on the other main surface facing the core substrate 502. A plurality of internal terminal electrodes 509 and a plurality of connection conductors 510 connecting the external terminal electrodes 508 and the internal terminal electrodes 509 are provided.

  Further, the internal terminal electrode 509 of the component built-in layer 504 is connected to a plurality of internal connection electrodes 511 formed on the one main surface 502 a of the core substrate 502, whereby the core substrate 502, each external terminal electrode 508, Are connected by connection conductors 510. Each connection conductor 510 is formed by a single via conductor having a substantially straight shape that penetrates the resin layer 507 of the component built-in layer 504 linearly in the thickness direction. An internal terminal electrode 509 for connecting the component built-in layer 504 to the core substrate 502 is formed by the end surface of the connection conductor 510 (via conductor) exposed on the other main surface of the component built-in layer 504 (for example, Patent Documents). 1).

International Publication No. 2005/071745 (paragraphs 0023-0025, FIGS. 1, 3 etc.)

  In recent years, while the number of mounting components 506 mounted on the core substrate 502 of the component built-in module 500 has increased, the size of the component built-in module 500 has been reduced. For this reason, the number of connection conductors 510 for externally connecting each mounting component 506 mounted on the core substrate 502 via the core substrate 502 is increased, and the diameter and the gap are being reduced. Therefore, the end face of each connection conductor 510 exposed on one main surface of the component built-in layer 504 is also reduced in diameter and the gap between the connection conductors is increasing. Therefore, each external terminal electrode 508 connected to each end face of each connection conductor 510 exposed on one main surface of the component built-in layer 504 is narrowed, and each external terminal electrode on one main surface of the component built-in layer 504 is narrowed. The area of the formation region 508 is also being reduced. Therefore, there is a possibility that a short circuit occurs due to the molten solder at the connection portion between the external substrate such as a mother substrate and each external terminal electrode 508, or the connection strength between the component built-in module 500 and the external substrate may be reduced.

  The present invention has been made in view of the above problems, and provides a component built-in module that can prevent a short circuit due to a bonding material such as solder and can improve connectivity with an external substrate. Objective.

In order to achieve the above object, a component built-in module of the present invention includes a core substrate and a component built-in layer provided on one main surface of the core substrate, and the component built-in layer is one of the core substrates. A mounting component mounted in a mounting region on the main surface; a plurality of first terminal electrodes for external connection provided on one main surface of the component-containing layer opposite to the core substrate; and a core of the component-containing layer Connected to the plurality of second terminal electrodes for internal connection provided on the other main surface facing the substrate and connected to one main surface of the core substrate, and the first terminal electrodes and the second terminal electrodes And a connection component mounted on one main surface of the core substrate and provided on the component built-in layer, and each first terminal electrode is formed on one main surface of the component built-in layer. The area of the first formation region is the Wider than the area of the second forming region, each second terminal electrodes are formed, said together with the connection parts first forming region and the second formation region is formed, the connection to the internal components for the connection A conductor is provided, and an interval between the centers of the adjacent first terminal electrodes is larger than an interval between the centers of the adjacent second terminal electrodes.

  In the invention configured as described above, the component built-in layer includes a mounted component mounted in the mounting region on the one main surface of the core substrate. In addition, a plurality of first terminal electrodes for external connection are provided on one main surface opposite to the core substrate of the component built-in layer provided on one main surface of the core substrate, and the other is opposed to the core substrate of the component built-in layer. A plurality of second terminal electrodes for internal connection are provided on the main surface. Each first terminal electrode and each second terminal electrode are connected by a connection conductor provided in the component built-in layer. Each second terminal electrode provided on the other main surface of the component built-in layer is connected to one main surface of the core substrate. Each first terminal electrode provided on one main surface of the component built-in layer is connected to an external substrate such as a mother substrate using a bonding material such as solder.

  Further, the distance between the centers of adjacent first terminal electrodes for external connection is configured to be larger than the distance between the centers of adjacent second terminal electrodes for internal connection. Therefore, it is possible to prevent a short circuit due to a bonding material such as solder at a bonding portion between each first terminal electrode and the external substrate. The area of the first formation region where each first terminal electrode is formed on one main surface of the component built-in layer is the area of the second formation region where each second terminal electrode is formed on the other main surface of the component built-in layer. More widely configured. Therefore, the area of the joint portion between each first terminal electrode and the external substrate can be increased, so that the joint strength can be improved and the component built-in module that can improve the connectivity with the external substrate is provided. can do.

Further, unlike the conventional configuration, the area of the first formation region in which each first terminal electrode is formed is larger than the area of the second formation region in which each second terminal electrode is formed, and adjacent first terminal electrodes Since the distance between the centers of the second terminal electrodes is larger than the distance between the centers of the adjacent second terminal electrodes, the connectivity between each first terminal electrode and the external substrate can be ensured. It is possible to further reduce the diameter and further narrow the gap of each second terminal electrode connected to the substrate. In addition, since the diameter and the gap of each second terminal electrode connected to the core substrate can be further reduced, the core substrate can be reduced in size (small area) and each second terminal electrode can be reduced. By reducing the area of the second formation region in which the is formed, it is possible to secure a large-area mounting region on one main surface of the core substrate, so that it is possible to improve the component mounting density of the mounted components. Further, a first forming region provided with each first terminal electrode and a second forming region provided with each second terminal electrode are formed, and a connection component provided with a connection conductor therein is formed as a second forming region. Each second terminal electrode provided in the region is connected and mounted on one main surface of the core substrate, whereby the wiring structure of the component built-in layer can be easily formed. Further, since the wiring structure of the component built-in layer can be easily formed, the manufacturing cost of the component built-in module can be reduced.

  In addition, the mounting region is disposed at least in a central portion of the one main surface of the core substrate, and each second terminal electrode of the second formation region is outside the mounting region of the one main surface of the core substrate. It is preferable that the first formation region is connected so as to partially overlap the second formation region in plan view.

  If it does in this way, a mounting component can be collectively arrange | positioned in the mounting area | region arrange | positioned at least in the center part of the one main surface of a core board | substrate.

  The connection component may be formed of a resin multilayer substrate in which a via conductor and an in-plane conductor are formed as the connection conductor.

  When configured in this way, using conventional methods such as build-up method and batch lamination method, connecting parts can be easily and cost-effectively using a resin multilayer substrate with via conductors and in-plane conductors formed as connecting conductors inside. Can be formed. In addition, since the wiring structure of the component built-in layer is formed by the via conductor and the in-plane conductor provided as the connection conductors on the resin multilayer substrate, the second main surface facing the one main surface of the core substrate of the component built-in layer is formed. 2. A wiring structure configured such that a gap between each via conductor is widened from the forming region side toward the first forming region side of one main surface opposite to the one main surface of the core substrate. Can be formed.

  A plurality of the connection components may be mounted on one main surface of the core substrate.

  In this way, the wiring structure of the component built-in layer can be formed by mounting each connection component at an arbitrary position on the one main surface of the core substrate on which the mounted component is mounted. The degree of design freedom can be increased.

  The first formation region may be disposed so as to overlap both the second formation region and the mounting region in plan view.

  In this way, by arranging the connection conductor in the region on the external substrate side of the region overlapping the placement position of the mounted component in a plan view in the component built-in layer, the region of the component built-in layer that has conventionally been a dead space can be reduced. Effective use can increase the area of the first formation region in which the first terminal electrodes are formed, and can widen the distance between the centers of the first terminal electrodes.

  Further, the first formation region may be formed so as to coincide with the core substrate in plan view.

  In this case, the first terminal electrodes are formed in the first formation region having a large area so as to coincide with the core substrate in a plan view, so that the center between the first terminal electrodes is formed. The interval can be further increased.

  Further, the core substrate has a rectangular shape in plan view, and on the other main surface of the component built-in layer, there are four second forming regions arranged at each corner portion of one main surface of the core substrate. It may be provided separately.

  With this configuration, each of the four second formation regions is arranged at each corner portion of the one main surface of the core substrate, so that each second terminal electrode formed in each of the second formation regions is the core. It is arranged and connected in a balanced manner to each corner portion of the one main surface of the substrate. Therefore, the connectivity between the core substrate and the component built-in layer can be improved. In addition, mounting components can be arranged using the peripheral portion excluding each corner portion of one main surface of the core substrate as a mounting area, so that the mounting density of the mounting components can be increased and the layout of the mounting components can be freely set. The degree can be increased.

  The area of the first terminal electrode may be larger than the area of the second terminal electrode.

  If it does in this way, the connection strength of a 1st terminal electrode and an external board | substrate can be improved by forming the area of a 1st terminal electrode larger than the area of a 2nd terminal electrode. In addition, since the distance between the centers of the adjacent first terminal electrodes is formed larger than the distance between the centers of the adjacent second terminal electrodes, the area of the first terminal electrode is made larger than before. Can be formed.

  Moreover, you may further provide the other mounting components mounted in the other main surface of the said core board | substrate.

  If it does in this way, the mounting density of the mounting components mounted in the component built-in module can be raised.

  The component built-in layer may further include a resin layer that covers the mounted component.

  In this way, the mounted component provided in the component built-in layer can be protected by the resin layer.

  According to the present invention, the distance between the centers of the adjacent first terminal electrodes for external connection is configured to be larger than the distance between the centers of the adjacent second terminal electrodes for internal connection. It is possible to prevent a short circuit due to a bonding material such as solder at a bonding portion between the first terminal electrode and the external substrate. The area of the first formation region where each first terminal electrode is formed on one main surface of the component built-in layer is the area of the second formation region where each second terminal electrode is formed on the other main surface of the component built-in layer. Since the area of the bonding portion between each first terminal electrode and the external substrate can be increased and the bonding strength can be improved, the connectivity with the external substrate can be improved. It is possible to provide a module with a built-in component that can

It is sectional drawing which shows the component built-in module concerning 1st Embodiment of this invention. It is a figure which shows the components for a connection with which the component built-in module of FIG. 1 is equipped, Comprising: (a) is a perspective view, (b) is a top view, (c) is a back view. It is sectional drawing which shows the component built-in module concerning 2nd Embodiment of this invention. It is a figure which shows the components for a connection with which the component built-in module of FIG. 3 is provided, (a) is a perspective view, (b) is a top view, (c) is a back view. It is sectional drawing which shows the component built-in module concerning 3rd Embodiment of this invention. It is a figure which shows the components for a connection with which the component built-in module of FIG. 5 is equipped, Comprising: (a) is a perspective view, (b) is a top view, (c) is a back view. It is sectional drawing which shows the component built-in module concerning 4th Embodiment of this invention. It is a figure which shows the components for a connection with which the component built-in module of FIG. 7 is provided, (a) is a perspective view, (b) is a top view, (c) is a back view. It is a bottom view which shows the arrangement | positioning state of the mounting components in the one main surface of a board | substrate. It is sectional drawing which shows the component built-in module concerning 5th Embodiment of this invention. It is a figure which shows the components for a connection with which the component built-in module of FIG. 10 is equipped, Comprising: (a) is a perspective view, (b) is a top view, (c) is a back view. It is a bottom view which shows the arrangement | positioning state of the mounting components in the one main surface of a board | substrate. It is a figure which shows the components for a connection with which the component built-in module concerning 6th Embodiment of this invention is provided, Comprising: (a) is a perspective view, (b) is a top view, (c) is a back view. It is sectional drawing of the conventional component built-in module.

<First Embodiment>
A first embodiment of the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is a cross-sectional view showing a component built-in module according to the first embodiment of the present invention, FIG. 2 is a diagram showing connection components provided in the component built-in module of FIG. 1, (a) is a perspective view, (b) ) Is a plan view, and FIG.

  The component built-in module 1 includes a core substrate 2 and component built-in layers 3 and 4 provided on both main surfaces 2a and 2b of the core substrate 2, respectively. Then, mounting components 5 and 6 such as ICs and ceramic multilayer chip components are mounted on both main surfaces 2a and 2b of the core substrate 2 and provided on the component built-in layers 3 and 4, so that the component built-in module 1 is Bluetooth. (Registered trademark) modules, wireless LAN modules, high-frequency communication modules such as antenna switch modules, and modules such as power supply modules. As shown in FIG. 1, the component built-in layer 3 includes a mounting component 5 and a connection component 7 for external connection mounted in a mounting region 21 set in the central portion of the one main surface 2 a of the core substrate 2. The component built-in layer 4 includes a mounting component 6 (corresponding to “another mounting component” in the present invention) mounted on a mounting region 22 set over almost the entire other main surface 2 b of the core substrate 2. .

  The component built-in layer 3 on the one main surface 2a of the core substrate 2 is provided with a resin layer 8 that covers the one main surface 2a, the mounting component 5, and the inner surface of the connection component 7. The component built-in layer 4 on the other main surface 2 b is provided with a resin layer 9 that covers the other main surface 2 b and the mounted component 6. The resin layers 8 and 9 are formed of a general thermosetting resin such as an epoxy resin or a cyanate resin.

  The core substrate 2 is configured by a general substrate such as a resin substrate such as a glass epoxy resin or a liquid crystal polymer, a ceramic (LTCC) substrate, or a glass substrate, and the core substrate 2 is used depending on the purpose of use of the component built-in module 1. May be formed on either a single-layer substrate or a multilayer substrate. On both main surfaces 2a and 2b of the core substrate 2, a plurality of mounting electrodes 2c for mounting the mounting components 5, 6 and the like by bonding with a bonding material such as solder H or ultrasonic vibration bonding are formed. Has been. In addition, wiring electrodes such as in-plane conductors (not shown) and via conductors (not shown) are appropriately provided in the core substrate 2 by a conductive material containing Ag, Cu, Au, or the like. 2 c is electrically connected via a wiring electrode in the core substrate 2. Various electric circuits may be formed in the core substrate 2 by combining in-plane conductors and via conductors.

  For example, when the core substrate 2 is formed of an LTCC (Low Temperature Co-Fired Ceramics) multilayer substrate, for example, the core substrate 2 is formed as follows. That is, first, a ceramic green sheet is prepared in which a slurry in which a mixed powder such as alumina and glass is mixed with an organic binder and a solvent is formed into a sheet shape. Next, via conductors containing Ag, Cu, Au or the like are filled in via holes formed by laser processing or the like at predetermined positions of the ceramic green sheet, via conductors for interlayer connection are formed. Various in-plane conductors are formed by printing. Then, the ceramic substrate formed by laminating and press-bonding the ceramic green sheets is fired at a low temperature of about 1000 ° C. at a so-called low temperature, thereby forming the core substrate 2.

  The connection component 7 is formed of a resin multilayer substrate 71 having substantially the same outer shape as the core substrate 2 having a rectangular shape in plan view. In addition, a plurality of external connections are provided on the lower surface 71a (corresponding to the “first formation region” of the present invention) of the resin multilayer substrate 71 that forms part of one main surface of the component built-in layer 3 opposite to the core substrate 2. The first terminal electrode 10 is formed. In addition, on the upper surface 71b (corresponding to the “second formation region” of the present invention) of the resin multilayer substrate 71 that forms a part of the other main surface of the component-embedded layer 3 that faces the core substrate 2, a plurality of internal connection layers are provided. A second terminal electrode 11 is formed.

  The resin multilayer substrate 71 includes a flat plate portion 72 and a frame portion 73 having substantially the same outer shape as the core substrate 2. As shown in FIG. 1 and FIG. 2 (c), the flat plate portion 72 has a rectangular through hole 72a formed in the flat plate central portion, and a plurality of first terminal electrodes 10 are formed in a lattice shape on the lower surface 71a. It is arranged and formed. As shown in FIG. 1 and FIGS. 2A and 2B, the frame portion 73 has a frame shape in which a rectangular opening 73a is formed in the center portion of a rectangular plate in plan view. A plurality of second terminal electrodes 11 are formed on the upper surface 71b and arranged in a lattice pattern on the upper surface 71b. As shown in FIG. 1, the opening 73 a faces the mounting region 21 of the one main surface 2 a when the connection component 7 (resin multilayer substrate 71) is mounted on the one main surface 2 a of the core substrate 2. It is formed in the position to do.

  1 and 2A to 2C, the through hole 72a of the flat plate portion 72 is formed to have a smaller area than the opening 73a of the frame portion 73 in plan view. Therefore, the area of the lower surface 71a of the resin multilayer substrate 71 on which the first terminal electrodes 10 are formed on one main surface of the component built-in layer 3 is the same as that of the second terminal electrode 11 on the other main surface of the component built-in layer 3. It is formed wider than the area of the upper surface 71 b of the resin multilayer substrate 71.

  A connection conductor 12 that connects each first terminal electrode 10 and each second terminal electrode 11 is provided inside the resin multilayer substrate 71. The connection conductor 12 includes a via conductor 12 a and an in-plane conductor 12 b formed inside the resin multilayer substrate 71. The via conductor 12a is formed by filling a via hole with a conductive paste containing Ag, Cu, Au, or the like, performing via fill plating on the via hole, or arranging a rod-like metal material such as Cu. The The in-plane conductor 12b is formed by a technique such as screen printing using a conductive paste containing Ag, Cu, Au, or the like, or formed by etching a metal foil or a metal thin film using photolithography.

  In this embodiment, the first terminal electrode 10 is formed by the end surface of the via conductor 12a exposed on the lower surface 71a of the resin multilayer substrate 71, and the second end surface of the via conductor 12a exposed on the upper surface 71b of the resin multilayer substrate 71 is second. A terminal electrode 11 is formed. Further, the flat plate portion 72 and the frame portion are arranged such that the interval (gap) between the via conductors 12a forming the first terminal electrode 10 is larger than the interval between the via conductors 12a forming the second terminal electrode 11. Via conductors 12 a are disposed in the respective 73. Therefore, as shown in FIGS. 2B and 2C, the distance A between the centers of the adjacent first terminal electrodes 10 is formed larger than the distance B between the centers of the adjacent second terminal electrodes 11. ing.

  Further, in the connection component 7 (resin multilayer substrate 71), the second terminal electrodes 11 on the upper surface 71b of the frame portion 73 surround the mounting region 21 outside the mounting region 21 on the one main surface 2a of the core substrate 2. Is mounted on the one main surface 2 a of the core substrate 2. When the connection component 7 is mounted on the one main surface 2a of the core substrate 2, the lower surface 71a of the resin multilayer substrate 71 overlaps both the upper surface 71b and the mounting region 21 of the core substrate 2 in plan view. Placed in. Further, the mounting component 5 mounted on the mounting region 21 on the one main surface 2 a of the core substrate 2 is disposed in the opening 73 a portion of the frame portion 73 of the resin multilayer substrate 71.

  Each second terminal electrode 11 formed on the upper surface 71b of the resin multilayer substrate 71 is connected to a mounting electrode (not shown) for internal connection provided on the one main surface 2a of the core substrate 2 with a bonding material such as solder. The connection component 7 is mounted on the one main surface 2a of the core substrate 2 by using the connection. Further, each first terminal electrode 10 formed on the lower surface 71a of the resin multilayer substrate 71 is externally connected to an external substrate such as a mother substrate using a bonding material such as solder H, whereby the component built-in module 1 (core The substrate 2) is externally connected to the external substrate.

  The connection component 7 included in the component built-in module 1 is formed as follows, for example.

  That is, when the resin multilayer substrate 71 is formed by the collective laminating method, first, the flat plate portion 72 and the frame portion 73 in which the via conductor 12a and the in-plane conductor 12b are respectively formed are prepared. And the resin multilayer board | substrate 71 is formed by laminating | stacking the flat plate part 72 and the frame part 73 through adhesive layers, such as a prepreg. When the resin multilayer substrate 71 is formed by the build-up method, a support substrate is first prepared, and conductive layers are formed on both surfaces of the support substrate via an adhesive layer such as a prepreg. Then, the resin multilayer substrate 71 is formed by repeatedly performing the formation of the in-plane conductor 12b by patterning the conductive layer using photolithography, the formation of the via conductor 12a by forming the via hole, and the lamination of the resin insulating layer. Is done.

  In addition to the manufacturing method described above, for example, instead of separately forming the flat plate portion 72 and the frame portion 73, by forming a structure to be the resin multilayer substrate 71, by grinding with a router or the like, A method of forming portions corresponding to the flat plate portion 72 and the frame portion 73 may be used. Further, the connection component 7 may be formed of a printed board made of a thermosetting resin and glass cloth.

  As described above, in this embodiment, the component built-in layer 3 includes the mounting component 5 mounted on the mounting region 21 of the one main surface 2 a of the core substrate 2 and the resin layer 8 that covers the mounting component 5. Yes. A plurality of first terminal electrodes 10 for external connection are provided on the lower surface 71 a of the connection component 7, and a plurality of second terminal electrodes 11 for internal connection are provided on the upper surface 71 b of the connection component 7. Further, each first terminal electrode 10 and each second terminal electrode 11 are connected by a connection conductor 12 provided in the connection component 7. In addition, each second terminal electrode 11 on the upper surface 71 b of the connection component 7 is connected to the one main surface 2 a of the core substrate 2, whereby the connection component 7 is mounted on the one main surface 2 a of the core substrate 2. A connection component 7 is provided in the built-in layer 3. Each first terminal electrode 10 provided on the lower surface 71a of the connection component 7 is connected to an external substrate such as a mother substrate using a bonding material such as solder H. Further, the distance A between the centers of the adjacent first terminal electrodes 10 for external connection is configured to be larger than the distance B between the centers of the adjacent second terminal electrodes 11 for internal connection.

  Therefore, it is possible to prevent a short circuit due to a bonding material such as solder H at the bonding portion between each first terminal electrode 10 and the external substrate. In addition, the area of the lower surface 71a of the connection component 7 forming the first formation region in which each first terminal electrode 10 is formed on one main surface of the component built-in layer 3 corresponds to each second surface on the other main surface of the component built-in layer 3. The area is larger than the area of the upper surface 71b of the connection component 7 forming the second formation region in which the terminal electrode 11 is formed. As a result, the area of the joint portion between each first terminal electrode 10 and the external substrate can be increased, so that the joint strength can be improved and the connectivity with the external substrate can be improved. 1 can be provided.

  Further, unlike the conventional configuration, the area of the lower surface 71a of the connection component 7 on which each first terminal electrode 10 is formed is larger than the area of the upper surface 71b of the connection component 7 on which each second terminal electrode 11 is formed. Since the distance A between the centers of the adjacent first terminal electrodes 10 is wider than the distance B between the centers of the adjacent second terminal electrodes 11, each first terminal electrode 10 and the external substrate Therefore, it is possible to further reduce the diameter and further narrow the gap of each second terminal electrode 11 connected to the core substrate 2. In addition, since the diameter and gap of each second terminal electrode 11 connected to the core substrate 2 can be further reduced, the core substrate 2 can be reduced in size (small area) and each second terminal electrode 11 can be reduced. By reducing the area of the upper surface 71b of the connection component 7 on which the two-terminal electrode 11 is formed, a large-area mounting region 21 can be secured on the one main surface 2a of the core substrate 2. The component mounting density can be improved.

  Further, since the mounting region 21 is disposed at the central portion of the one main surface 2 a of the core substrate 2, the mounting components 5 can be collectively disposed at the central portion of the one main surface 2 a of the core substrate 2.

  In addition, a lower surface 71a provided with each first terminal electrode 10 and an upper surface 71b provided with each second terminal electrode 11 are formed, and a connection component 7 provided with a connection conductor 12 therein is connected to the upper surface 71b. Each second terminal electrode 11 is connected and mounted on the one main surface 2a of the core substrate 2, whereby the wiring structure of the component built-in layer 3 can be easily formed. Moreover, since the wiring structure of the component built-in layer 3 can be easily formed, the manufacturing cost of the component built-in module 1 can be reduced.

  Further, since the connecting component 7 is formed by the resin multilayer substrate 71 in which the via conductors 12a and the in-plane conductors 12b are formed as the connecting conductors 12, conventional methods such as a build-up method and a batch lamination method are used. By using it, the connecting component 7 can be formed easily and at low cost. Further, the wiring structure of the component built-in layer 3 is formed by the via conductors 12a and the in-plane conductors 12b provided as the connection conductors 12 on the resin multilayer substrate 71, whereby one main surface 2a of the core substrate 2 of the component built-in layer 3 is formed. From the side of the second forming region (the upper surface 71b of the resin multilayer substrate 71) of the other main surface facing the first main region 2a of the core substrate 2 on the side opposite to the one main surface 2a, the first forming region (the lower surface of the resin multilayer substrate 71). A wiring structure configured such that the gap between the via conductors 12a is widened toward the 71a) side can be easily formed in the component built-in layer 3.

  Further, as shown in FIG. 1, the connection conductor 12 is arranged in a region on the external substrate side below the mounting component 5 in the component built-in layer 3, thereby lower surface 71 a (the resin multilayer substrate 71). The first formation region) overlaps both the upper surface 71b (second formation region) of the connection component 7 (resin multilayer substrate 71) and the mounting region 21 set on the one main surface 2a of the core substrate 2 in plan view. Are arranged as follows. Therefore, the area under the mounting component 5 of the component built-in layer 3 that has conventionally been a dead space is effectively used to increase the area of the lower surface 71a of the connection component 7 on which the first terminal electrodes 10 are formed. It is possible to increase the distance A between the centers of the first terminal electrodes 10.

  Moreover, since the mounting component 6 is further mounted on the other main surface 2b of the core substrate 2, the component mounting density of the mounting components 5 and 6 mounted on the component built-in module 1 can be further increased.

Second Embodiment
A second embodiment of the present invention will be described with reference to FIGS. 3 is a cross-sectional view showing a component built-in module according to a second embodiment of the present invention, FIG. 4 is a diagram showing connection components provided in the component built-in module of FIG. 3, and (a) is a perspective view, (b) ) Is a plan view, and FIG.

  This embodiment differs from the first embodiment described above in that a through-hole is formed in the flat plate portion 72 of the resin multilayer substrate 71 forming the connection component 7 as shown in FIGS. 3 and 4A to 4C. 72a is not formed. Therefore, in this embodiment, the lower surface 71a of the connection component 7 (resin multilayer substrate 71) on which the first terminal electrode 10 is formed is formed so as to coincide with the core substrate 2 in plan view. Since other configurations are the same as those of the first embodiment, description of the configurations is omitted by giving the same reference numerals.

  As described above, according to this embodiment, the same effects as those of the first embodiment described above can be obtained, and the following effects can be obtained. That is, by forming the first terminal electrodes 10 on the lower surface 71a of the large-area resin multilayer substrate 71 formed so as to coincide with the core substrate 2 in plan view, the first terminal electrodes 10 are connected to each other. The distance A between the centers can be further increased.

<Third Embodiment>
A third embodiment of the present invention will be described with reference to FIGS. FIG. 5 is a cross-sectional view showing a component built-in module according to a third embodiment of the present invention, FIG. 6 is a diagram showing connection components provided in the component built-in module of FIG. 5, (a) is a perspective view, (b) ) Is a plan view, and FIG.

  This embodiment differs from the second embodiment described above in that the frame portion 73 of the resin multilayer substrate 71 forming the connection component 7 is a frame as shown in FIGS. 5 and 6A to 6C. The upper surface 71b of the frame portion 73 having the shape in which one side of the shape is removed and the second terminal electrode 11 is formed is opposed to the portion along the three sides of the peripheral portion of the one main surface 2a of the core substrate 2. It is the point formed so as to. In addition, a portion along one side of the peripheral portion of the one main surface 2a of the core substrate 2 where the upper surface 71b of the frame portion 73 does not face is set in the mounting region 21 together with the central portion of the one main surface 2a of the core substrate 2. Yes. The mounting component 5 is mounted on a mounting region 21 set in a central portion of the one main surface 2a of the core substrate 2 and a peripheral portion extending to the central portion. Since other configurations are the same as those of the first and second embodiments described above, description of the configurations is omitted by assigning the same reference numerals.

  As described above, according to this embodiment, the same effects as those of the second embodiment described above can be obtained, and the following effects can be obtained. That is, since the mounting component 5 can be further arranged in the mounting region 21 set in a part of the peripheral portion of the one main surface 2a of the core substrate 2, the mounting density of the mounting component 5 can be increased. The degree of freedom of the layout of the mounting component 5 can be increased.

<Fourth embodiment>
A fourth embodiment of the present invention will be described with reference to FIGS. 7 is a cross-sectional view showing a component built-in module according to a fourth embodiment of the present invention, FIG. 8 is a diagram showing connection components provided in the component built-in module of FIG. 7, (a) is a perspective view, (b) ) Is a plan view, and FIG. FIG. 9 is a bottom view showing an arrangement state of mounted components on one main surface of the substrate.

  This embodiment differs from the third embodiment described above in that the resin multilayer substrate 71 forming the connection component 7 has a rectangular shape in plan view, as shown in FIGS. 7 and 8A to 8C. This is a point formed by the flat plate portion 72 and the four support portions 74 stacked on each corner portion of the flat plate portion 72. Therefore, on the other main surface of the component-containing layer 3 facing the one main surface 2 a of the core substrate 2, the four upper surfaces of the resin multilayer substrate 71 disposed at each corner portion of the one main surface 2 a of the core substrate 2. 71b (second formation region) is provided separately. In this embodiment, the resin multilayer substrate 71 is formed by laminating the flat plate portions 72 and the respective support portions 74 that are individually manufactured through an adhesive layer such as a prepreg. In the following, only the configuration different from each of the above-described embodiments will be described, and the other configurations are the same as those of the above-described first and third embodiments.

  Each support portion 74 of the resin multilayer substrate 71 has a substantially L shape in plan view, and a connection conductor 12 having a via conductor 12a and an in-plane conductor 12b is provided therein. Further, as shown in FIG. 8A, the support portion 74 is laminated on each corner of the flat plate portion 72 so that the bent portion and the corner portion of the flat plate portion 72 overlap each other. A multilayer substrate 71 is formed. As shown in FIG. 9, in this embodiment, among the one main surface 2a of the core substrate 2, the second terminal electrodes 11 on the four upper surfaces 71b of the resin multilayer substrate 71 are connected by dotted lines in FIG. A portion excluding each enclosed corner portion is set in the mounting region 21 and the mounting component 5 is mounted.

  In this embodiment, as shown in FIGS. 7 and 8C, each first terminal electrode 10 has a rectangular electrode pad on the end surface of the via conductor 12 a exposed on the lower surface 71 a of the resin multilayer substrate 71. Is provided. The shape of the electrode pad in plan view is not limited to a rectangular shape, and may be any shape such as a circular shape or a polygonal shape.

  As described above, according to this embodiment, the same effects as those of the third embodiment described above can be obtained, and the following effects can be obtained. That is, each of the four upper surfaces 71b of the resin multilayer substrate 71 is arranged at each corner portion of the one main surface 2a of the core substrate 2, so that each second terminal electrode 11 formed on each upper surface 71b is a core. The substrate 2 is arranged and connected in a balanced manner to each corner portion of the one main surface 2a. Therefore, in a state in which improvement in the connectivity between the core substrate 2 and the component built-in layer 3 is ensured, the mounting component 5 is further arranged with the peripheral portion excluding each corner portion of the one main surface 2a of the core substrate 2 as the mounting region 21. can do. Therefore, the mounting density of the mounting components 5 can be increased, and the degree of freedom of the layout of the mounting components 5 can be increased.

  Moreover, the connection strength between the first terminal electrode 10 and the external substrate can be improved by forming the area of the first terminal electrode 10 larger than the area of the second terminal electrode 11 using the electrode pad. Further, since the distance A between the centers of the adjacent first terminal electrodes 10 is formed to be larger than the distance B between the centers of the adjacent second terminal electrodes 11, the electrode pad is formed on the first terminal electrode 10. The area can be formed larger than before.

  In this embodiment, each electrode pad forming each first terminal electrode 10 is provided on the lower surface 71a of the resin multilayer substrate 71. However, the surface of each electrode pad forms the lower surface 71a of the resin multilayer substrate 71. Thus, each electrode pad may be provided so as to be recessed in the lower surface 71a of the resin multilayer substrate 71 so that only the surface thereof is exposed.

<Fifth Embodiment>
A fifth embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a cross-sectional view showing a component built-in module according to a fifth embodiment of the present invention, FIG. 11 is a diagram showing connection components provided in the component built-in module of FIG. 10, and (a) is a perspective view, (b) ) Is a plan view, and FIG. FIG. 12 is a bottom view showing an arrangement state of mounted components on one main surface of the substrate.

  This embodiment differs from the above-described fourth embodiment in that the central portion of the flat plate portion 72 of the resin multilayer substrate 71 forming the connection component 7 is shown in FIGS. 10 and 11A to 11C. Is formed with a rectangular opening 72b and a notch 72c communicating with the opening 72b in the left-right direction toward the figure. Further, in this embodiment, a support portion 74 having a rectangular shape in plan view is stacked on each corner portion of the flat plate portion 72. Further, the first connection terminal 10 is formed by the end face of the via conductor 12 a exposed on the lower surface 71 a of the resin multilayer substrate 71. Since other configurations are the same as those of the first and fourth embodiments described above, description of the configurations is omitted by assigning the same reference numerals.

  As described above, according to this embodiment, the same effects as those of the fourth embodiment described above can be obtained, and the following effects can be obtained. That is, as shown in FIG. 12, the same as the fourth embodiment described above, the second terminal electrodes 11 of the four upper surfaces 71b of the resin multilayer substrate 71 among the one main surface 2a of the core substrate 2 are connected. A portion excluding each corner portion surrounded by a dotted line in the figure is set in the mounting region 21, but an opening 72 b is provided in the central portion of the flat plate portion 72 of the resin multilayer substrate 71. Therefore, in the portion corresponding to the opening 72b, the mounting component 5a having a height higher than that of the mounting component 5 mounted in the other portion can be mounted on the one main surface 2a of the core substrate 2 (see FIG. 10).

<Sixth Embodiment>
A sixth embodiment of the present invention will be described with reference to FIG. FIGS. 13A and 13B are diagrams showing connection components provided in the component built-in module according to the sixth embodiment of the present invention, in which FIG. 13A is a perspective view, FIG. 13B is a plan view, and FIG.

  This embodiment is different from the fifth embodiment described above, as shown in FIGS. 13A to 13C, the component built-in layer 3 is provided with four connection components 7 for each connection. Each component 7 is arranged and mounted in an island shape on each corner portion of the one main surface 2 a of the core substrate 2. Hereinafter, only the configuration different from each of the above-described embodiments will be described, and the other configurations are the same as those of the above-described first and fifth embodiments. Therefore, the description of the configuration is omitted by attaching the same reference numerals.

  As shown in FIGS. 13A to 13C, the resin multilayer substrate 71 forming each connection component 7 is a plan view in which the connection conductor 12 having the via conductor 12 a and the in-plane conductor 12 b is provided. A rectangular base 75 and a support 74 stacked on the upper surface of the base 75 are provided. Further, the first connection terminal 10 is formed by the end face of the via conductor 12a exposed to the lower surface 71a of the base portion 75. Further, each second terminal electrode 11 on the upper surface 71b of each resin multilayer substrate 71 is connected to each corner portion of the one main surface 2a of the core substrate 2, whereby each connection component 7 is made of the core substrate. On the other hand, each corner portion of the main surface 2a is arranged and mounted in an island shape. The base 75 of each resin multilayer substrate 71 is formed to be smaller than the shape divided into four parts when the core substrate 2 is divided into two parts in the width direction and the height direction in plan view.

  As described above, according to this embodiment, the same effects as those of the fifth embodiment described above can be achieved, and the following effects can be achieved. That is, a plurality of connection components 7 are mounted on the one main surface 2a of the core substrate 2, but each connection component is placed at an arbitrary position on the one main surface 2a of the core substrate 2 on which the mounting components 5 and 5a are mounted. By mounting 7, the wiring structure of the component built-in layer 3 can be formed, so that the degree of design freedom of the component built-in module 1 can be increased.

  In this embodiment, the mounting position of each connecting component 7 on the one main surface 2a of the core substrate 2 is not limited to the above-described example, and the built-in components such as the center position of the one main surface 2a of the core substrate Depending on the configuration of the module 1, each connection component 7 may be mounted at an arbitrary position on the main surface 2 a. Further, the number of connection components 7 mounted on the one main surface 2a of the core substrate 2 is not limited to four, and two or more connection components 7 are mounted on the one main surface 2a. Just do it. Further, one connection component 7 may be mounted on the one main surface 2 a of the core substrate 2. Moreover, the some connection component 7 arrange | positioned at island shape may be connected by the rod-shaped connection member like 5th Embodiment mentioned above.

  The present invention is not limited to the above-described embodiment, and various modifications other than those described above can be made without departing from the spirit of the present invention. May be. For example, in each of the above-described embodiments, the connection component 7 is formed of the resin multilayer substrate 71, but, like the core substrate 2, a resin substrate such as a glass epoxy resin or a liquid crystal polymer, a ceramic (LTCC) substrate, a glass The connection component 7 may be formed of a general substrate such as a substrate. Moreover, each board | substrate which forms the component 7 for a connection may be formed in any of a single layer board | substrate and a multilayer board | substrate.

  Moreover, the planar view shape of the core substrate 2 is not limited to a rectangular shape, and may be any shape such as a circular shape or a polygonal shape. In addition, the planar view shape of each connection component 7 in each of the above-described embodiments, the shape of the lower surface 71a and the upper surface 71b of the resin multilayer substrate 71, and the arrangement position thereof are appropriately changed according to the planar view shape of the core substrate 2. do it.

  In each of the embodiments described above, the first formation region (the lower surface 71a of the resin multilayer substrate 71) where the first terminal electrode 10 is formed is the second formation region (the upper surface 71b of the resin multilayer substrate 71) and the mounting region 21. Are arranged so as to overlap with both of them in plan view. However, the arrangement position of the first formation region is not limited to the above-described example, and the first formation region may be formed so that the area thereof is larger than the area of the second formation region.

  Further, in each of the above-described embodiments, the wiring structure of the component built-in layer 3 is formed by mounting the connection component 7 on the one main surface 2a of the core substrate 2, but the connection component 7 is connected to the core substrate. The connecting conductor 12 may be formed by providing the via conductor 12a and the in-plane conductor 12b in the resin layer 8 of the component built-in layer 3 without being mounted on the one main surface 2a.

  Further, in each of the above-described embodiments, each of the via conductors 12a arranged in the laminating direction of the resin multilayer substrate 71 using the in-plane conductor 12b is sequentially shifted in a predetermined direction to shift each via conductor 12a. Although the interval (gap) between the via conductors 12a is increased, the interval between the via conductors 12a may be increased by the following configuration. That is, the plurality of via conductors 12a connected in the stacking direction of the resin multilayer substrate 71 are arranged by sequentially shifting the position of the center axis of each via conductor 12a in a predetermined direction in plan view. Then, by connecting the end faces of the via conductors 12a to each other in a slightly displaced state, the interval between the via conductors 12a can be widened. In each of the above embodiments, the distance A between the centers of all the adjacent first terminal electrodes 10 is configured to be larger than the distance B between the centers of the adjacent second terminal electrodes 11. You may further provide the terminal electrode for external connection in which the space | interval of adjacent terminals is not larger than the space | interval between the centers of the adjacent 2nd terminal electrodes 11. FIG.

  Further, in order to increase the mounting density of the mounting components 5, 5 a, 6 in the component built-in module and to have a function according to the purpose of use, which mounting component 5, 5 a, 6 is appropriately positioned It may be arranged and implemented. Further, the mounting component 6 does not necessarily have to be mounted on the other main surface 2 b of the core substrate 2.

  Further, the mounting method of the mounting components 5, 5 a, 6 on both main surfaces 2 a, 2 b of the core substrate 2 of the component built-in module 1 is not limited to the method using the solder H, but the surface by ultrasonic vibration technology, plasma, or the like. Each mounting component 5, 5a, 6 may be mounted on the core substrate 2 by a mounting method using an activation technique or a mounting method using a bonding wire. Further, the electrode pad described in the fourth embodiment may be applied to other embodiments, and the electrode pad may be provided in other embodiments as well. Further, the resin layer 8 is not necessarily provided on the core substrate 2, and the resin layer 8 may not be provided.

  The present invention can be widely applied to a component built-in module in which a mounted component is built in a component built-in layer provided on a core substrate.

DESCRIPTION OF SYMBOLS 1 Component built-in module 2 Core board | substrate 2a One main surface 2b The other main surface 21 Mounting area | region 3 Component built-in layer 5,5a Mounting component 6 Mounting component (other mounting components)
7 Connecting parts 71 Resin multilayer substrate 71a Lower surface (first forming region)
71b Upper surface (second formation region)
8 Resin layer 10 1st terminal electrode 11 2nd terminal electrode 12 Connection conductor 12a Via conductor 12b In-plane conductor A, B The space | interval between the centers of adjacent terminal electrodes

Claims (10)

A core substrate;
A component built-in layer provided on one main surface of the core substrate;
The component built-in layer is
A mounting component mounted on a mounting region of one main surface of the core substrate;
A plurality of first terminal electrodes for external connection provided on one main surface of the component built-in layer opposite to the core substrate;
A plurality of second terminal electrodes for internal connection provided on the other main surface facing the core substrate of the component built-in layer and connected to one main surface of the core substrate;
A connection conductor connecting each first terminal electrode and each second terminal electrode ;
Having a connecting component mounted on one main surface of the core substrate and provided in the component built-in layer ;
The area of the first formation region where each first terminal electrode is formed on one main surface of the component built-in layer is the second formation region where each second terminal electrode is formed on the other main surface of the component built-in layer. Larger than the area of
The first formation region and the second formation region are formed in the connection component, and the connection conductor is provided inside the connection component,
The component built-in module, wherein an interval between the centers of the adjacent first terminal electrodes is larger than an interval between the centers of the adjacent second terminal electrodes. The mounting region is disposed at least in a central portion of one main surface of the core substrate;
Each of the second terminal electrodes of the second formation region is connected to the outside of the mounting region on one main surface of the core substrate, and the first formation region is partly connected to the second formation region in plan view. The component built-in module according to claim 1, wherein the modules are formed to overlap each other. The connecting component, component built-in module according to claim 1, characterized in that it is formed by the connecting conductors resin multilayer substrate via conductors and in-plane conductor is formed therein as. Component built-in module according to claim 1 or 3, wherein a plurality of said connecting parts are mounted on one main surface of the core substrate. Wherein the first formation region in plan view, the component built-in module according to any one of claims 1 to 4, characterized in that it is arranged so as to overlap with both of the second formation region and the mounting region. Wherein the first formation region, component built-in module according to any one of claims 1, characterized in that it is formed so as to overlap coincides with the core substrate in a plan view 5. The core substrate has a rectangular shape in plan view,
The other second main surface of the component built-in layer, the four second forming regions disposed at each corner portion of the one main surface of the core substrate are separately provided. The component built-in module according to any one of 1 to 6 . The area of the first terminal electrode, component built-in module according to any one of claims 1 to 7, wherein greater than the area of the second terminal electrodes. Component built-in module according to any one of claims 1 to 8, further comprising another mounting components mounted on the other main surface of the core substrate. The component-embedded layer, component built-in module according to any one of claims 1 to 9, further comprising a resin layer covering the mounting part.

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