JP6943710B2 - Substrate for mounting electronic devices, electronic devices and electronic modules - Google Patents

Description

The present invention mounts an electronic device, for example, an imaging device such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, a light emitting element such as an LED (Light Emitting Diode), or an integrated circuit. It relates to a board, an electronic device, and an electronic module.

Conventionally, a substrate for mounting an electronic device having a wiring board made of an insulating layer has been known. Further, an electronic device and an electronic module in which an electronic element and an electronic component are mounted on such an electronic element mounting substrate are known (see Patent Document 1).

International Publication No. 2014/020975

The electronic element mounting substrate of Patent Document 1 has an electrode pad for mounting an electronic element, a component pad for mounting an electronic component, and a through conductor electrically connected to the component pad. In some parts of such an electronic element mounting board, the electrical connectivity between the component pad and other wiring provided inside the board is made higher, and the electronic component is provided inside the board. In order to reduce the electric resistance value with other wiring, a plurality of through conductors may be provided in one component pad. Further, as the electronic components are miniaturized, the component pads may be miniaturized. In such a case, if there are two or more through conductors, the distance between the through conductors may become small. As a result, the substrate (component pad) between the through conductors may have a convex shape, and there is a concern that the substrate (component pad) may be tilted in the process of mounting the electronic component.

The electronic device mounting substrate includes a substrate, a first component pad, a first through conductor, and a second through conductor. The substrate is rectangular in plan view and has a mounting area on which electronic elements are mounted. The first component pad is provided on the upper surface of the substrate. At least a part of the outer edge of the first component pad has a curved shape in a plan view, and an electronic component is mounted on the first component pad. The substrate is electrically connected to the first component pad and has a first through conductor and a second through conductor located inside the substrate. The first component pad in plan view, with has two regions to an imaginary line along the center of the first component pads on one side of the passing Ri substrate as a boundary, the outer edge of the first component pad, flat Visually, it has a linear shape parallel to the virtual line . The center of the first through conductor and the center of the second through conductor are located in different regions of the two regions with the virtual line of the first component pad as a boundary.

An electronic device according to one aspect of the present invention includes an electronic device mounted on the electronic device mounting substrate.

An electronic module according to one aspect of the present invention includes the electronic device described above, an electronic component mounted on a component pad, and a housing located on the upper surface of the electronic device.

The electronic device mounting substrate according to one aspect of the present invention can reduce the convex shape of the substrate (component pad) by the above configuration. Alternatively, the proportion of the convex portion of the substrate (component pad) having a smooth or flat portion can be increased with respect to the area of the substrate (component pad). Further, by providing the above-mentioned electronic element mounting substrate, it is possible to provide an electronic device and an electronic module capable of reducing mounting defects or dissociation during use due to tilted mounting of electronic components. It becomes possible.

FIG. 1A is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the first embodiment of the present invention, and FIG. 1B is drawn on line X1-X1 of FIG. 1A. It is a corresponding vertical sectional view. FIG. 2A is a top view showing the appearance of the electronic module according to another aspect of the first embodiment, and FIG. 2B is a vertical sectional view corresponding to line X2-X2 of FIG. 2A. Is. FIG. 3A is an enlarged plan view showing an example of a main part A of the electronic device mounting substrate and the electronic device according to the first embodiment, and FIG. 3B is another aspect of the first embodiment. It is an enlarged plan view which shows an example of the main part A of the electronic element mounting substrate and the electronic device which concerns on. FIG. 4 is an enlarged plan view showing an example of the main part A of the electronic device mounting substrate and the electronic device according to the other aspects of the first embodiment. 5 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the second embodiment of the present invention, and FIG. 5 (b) is drawn on line X5-X5 of FIG. 5 (a). It is a corresponding vertical sectional view. FIG. 6A is an enlarged plan view showing an example of a main part B of the inner layer of the electronic device mounting substrate and the electronic device according to the second embodiment, and FIG. 6B is another of the second embodiment. It is an enlarged plan view which shows an example of the main part B of the electronic element mounting substrate and the electronic device which concerns on the aspect of. 7 (a) and 7 (b) are enlarged plan views showing an example of a main part B of an electronic device mounting substrate and an electronic device according to another aspect of the second embodiment. FIG. 8A is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the third embodiment of the present invention, and FIG. 8B is drawn on line X8-X8 of FIG. 8A. It is a corresponding vertical sectional view. FIG. 9A is an enlarged plan view showing an example of the main part C of the electronic device mounting substrate and the electronic device according to the third embodiment. FIG. 10 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the fourth embodiment of the present invention, and FIG. 10 (b) is drawn along line X10-X10 of FIG. 10 (a). It is a corresponding vertical sectional view. FIG. 11 is an enlarged plan view showing an example of the main part D of the electronic device mounting substrate and the electronic device according to the fourth embodiment.

<Configuration of electronic device mounting board and electronic device>
Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings. In the following description, an electronic device is configured in which an electronic element is mounted on an electronic element mounting substrate. Further, the electronic module is configured to have a housing or a member provided so as to be located on the upper surface side of the electronic device mounting substrate or to surround the electronic device. The electronic element mounting substrate, the electronic device, and the electronic module may be in any direction upward or downward, but for convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is upward.

(First Embodiment)
The electronic module 31, the electronic device 21, and the electronic device mounting substrate 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 and 2. Further, the main part A will be described with reference to FIGS. 3 and 4. The electronic device 21 in this embodiment includes an electronic element mounting substrate 1 and an electronic element 10. Further, in FIGS. 1 to 4, the first through conductor 6a and the second through conductor 6b are indicated by dotted lines, and in FIGS. 3 to 4, the first center 6ap and the second center 6bp are indicated by black circles.

The electronic device mounting substrate 1 includes a substrate 2, a component pad 5, a first through conductor 6a, and a second through conductor 6b. The substrate 2 has a mounting region 4 on which the electronic element 10 is mounted. The component pad 5 is provided on the upper surface of the substrate 2. The electronic component 11 is mounted on the component pad 5. The substrate 2 is electrically connected to the component pad 5 and has a first through conductor 6a and a second through conductor 6b located inside the substrate 2. The component pad 5 has two regions in a plan view with a virtual line α passing through the center of the component pad 5 as a boundary. The first center 6ap, which is the center of the first through conductor 6a, and the second center 6bp, which is the center of the second through conductor, are located in different regions with the virtual line α passing through the center of the component pad 5 as a boundary. There is.

The electronic element mounting substrate 1 has a substrate 2. Here, in the example shown in FIG. 1, the substrate 2 is composed of a plurality of insulating layers, but may have a configuration such as a mold or another configuration, for example.

For example, electrically insulating ceramics or resin is used as the material of the insulating layer constituting the substrate 2. Examples of the resin include a thermoplastic resin and the like.

Examples of the electrically insulating ceramics used as the material of the insulating layer forming the substrate 2 include an aluminum oxide-based sintered body, a mulite-based sintered body, a silicon carbide sintered body, an aluminum nitride-based sintered body, and silicon nitride. A quality sintered body, a glass-ceramic sintered body, or the like is included. Examples of the resin used as the material of the insulating layer forming the substrate 2 include a thermoplastic resin, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a fluororesin and the like. Examples of the fluorine-based resin include ethylene tetrafluoride resin.

As shown in FIG. 1, the substrate 2 may be formed of six insulating layers, or may be formed of five or less or seven or more insulating layers. When the number of insulating layers is 5 or less, the thickness of the electronic element mounting substrate 1 can be reduced. Further, when the number of insulating layers is 6 or more, the rigidity of the electronic element mounting substrate 1 can be increased. Further, as in the example shown in FIGS. 1 and 2, an opening may be provided in each insulating layer, and a stepped portion may be formed on an upper surface having different sizes of the provided openings, and an electrode pad described later may be formed. 3 may be provided in the stepped portion.

For example, the size of one side of the outermost periphery of the electronic device mounting substrate 1 is 0.3 mm to 10 cm, and when the electronic element mounting substrate 1 has a rectangular shape in a plan view, it may be square or rectangular. There may be. Further, for example, the thickness of the electronic device mounting substrate 1 is 0.2 mm or more.

The substrate 2 of the electronic element mounting substrate 1 has a mounting region 4 for mounting the electronic element 10. Here, the mounting region 4 is a region on which at least one or more electronic elements 10 are mounted, and for example, the inside of the outermost periphery of the electrode pad 3, the region on which the lid body is mounted, or more can be appropriately defined. It is possible. In this embodiment, the area overlapping the area where the lid 12 is mounted is assumed to be the mounting area 4. A component other than the electronic element 10 may be mounted in the mounting area 4. Further, the number of electronic elements 10 and / or parts mounted in the mounting region 4 is not particularly specified.

The component pad 5 of the electronic element mounting substrate 1 is provided on the upper surface of the substrate 2. The substrate 2 is electrically connected to the component pad 5 and has a first through conductor 6a and a second through conductor 6b located inside the substrate 2. Here, the upper surface of the substrate 2 is not the uppermost surface of the substrate 2, and the component pad 5 may be exposed on any of the surfaces of the substrate 2. For example, when the substrate 2 has a recess, the component pad 5 includes a structure provided on the bottom surface or a side surface of the recess in the component pad 5 provided on the upper surface of the substrate 2.

The substrate 2 of the electronic element mounting substrate 1 has an electrode pad 3 connected to, for example, the electronic element 10 on the surface thereof.
May have. Further, an electrode for connecting an external circuit may be provided on the upper surface, the side surface or the lower surface of the substrate 2. The electrode for connecting an external circuit may electrically connect the substrate 2 to the external circuit board or the electronic device 21 to the external circuit board.

The component pad 5 has at least a first through conductor 6a and a second through conductor 6b for one component pad 5. By having at least the first through conductor 6a and the second through conductor 6b, the flatness of the component pad 5 can be improved as compared with the case where there is only one through conductor. The first through conductor 6a and the second through conductor 6b overlap the component pad 5 in a top view and are directly electrically connected to each other. Further, in addition to the first through conductor 6a and the second through conductor 6b, another through conductor 6e is provided, and the other through conductor 6e also overlaps with the component pad 5 in the top view, and is electrically connected to the component pad 5. It may be connected.

Further, on the upper surface or the lower surface of the substrate 2, in addition to the electrode pad 3, the component pad 5, and / and the electrode for connecting the external circuit, the internal wiring conductor formed between the insulating layers and the through conductor connecting the internal wiring conductors to each other are vertically connected. May be provided. These internal wiring conductors or through conductors may be exposed on the surface of the substrate 2. The electrode pad 3, the component pad 5 and / and the external circuit connection electrode may be electrically connected to each other by the internal wiring conductor or the through conductor.

A plurality of insulating layers of the electrode pad 3, the component pad 5, the first through conductor 6a, the second through conductor 6b, the other through conductor 6e, the electrode for connecting an external circuit, the internal wiring conductor and / and the through conductor are electrically insulating. When it is made of ceramics, it is made of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) or copper (Cu), or an alloy containing at least one metal material selected from these. .. It may also be made of copper. Further, the electrode pad 3, the component pad 5, the first through conductor 6a, the second through conductor 6b, the other through conductor 6e, the electrode for connecting an external circuit, the internal wiring conductor and / and the through conductor have a plurality of layers made of resin. If so, an alloy containing copper (Cu), gold (Au), aluminum (Al), nickel (Ni), molybdenum (Mo) or titanium (Ti) or at least one metal material selected from these. Etc.

A plating layer may be provided on the exposed surface of the electrode pad 3, the component pad 5, the external circuit connection electrode, the internal wiring conductor and / and the through conductor. According to this configuration, the exposed surfaces of the electrodes for connecting the external circuit, the conductor layer and the through conductor can be protected and oxidation can be suppressed. Further, according to this configuration, the electrode pad 3 and the electronic element 10 can be satisfactorily electrically connected via an electronic element connecting material 13 such as wire bonding. As the plating layer, for example, a Ni plating layer having a thickness of 0.5 μm to 10 μm may be adhered, or the Ni plating layer and a gold (Au) plating layer having a thickness of 0.5 μm to 3 μm may be sequentially adhered. good.

The electronic component 11 is mounted on the component pad 5. Here, the region on which the electronic component 11 is mounted may overlap with the mounting region 4 or may be provided in a region around the mounting region 4. Further, when there are a plurality of component pads 5, a plurality of electronic components mounted on the component pads 5 may be mounted in a plurality of types.

The component pad 5 has two regions in a plan view with a virtual line α passing through the center of the component pad 5 as a boundary. The first center 6ap, which is the center of the first through conductor 6a, and the second center 6bp, which is the center of the second through conductor, are located in different regions with the virtual line α passing through the center of the component pad 5 as a boundary. There is.

The virtual line α passes through the center of the component pad 5. The center of the component pad 5 may be the center of the component pad 5 as long as it has a circular shape as shown in FIG. 3, for example, and when the component pad 5 has a rectangular shape, it is a point where two diagonal lines intersect. You may. Further, for example, as in the example shown in FIG. 4, when the component pad 5 has a shape close to a circular shape, the center of the component pad 5 may be the center when the shape close to the circular shape is regarded as a circle. However, it may be a point where the points that are the midpoints in the X direction / Y direction intersect. Further, when the component pad 5 has a polygonal shape, the center of the component pad 5 is a point where the diagonal lines intersect, a point calculated by a method of issuing a predetermined midpoint, or a midpoint in the X direction / Y direction, respectively. It may be a point where the points are intersected. The virtual line α passes through the center of the component pad 5, but may be deviated to some extent. For example, there may be an error of about 10% of the length or diameter of one side of the component pad.

The first through conductor 6a and the second through conductor 6b have a first center 6ap and a second center 6bp, respectively. The first center 6ap and the second center 6bp are the midpoints of the first through conductor 6a and the second through conductor 6b when the first through conductor 6a and the second through conductor 6b are circular, and when they have other shapes, the first center 6ap and the second center 6bp are the above-mentioned component pads 5. Similarly, it is possible to calculate the midpoint by each method. The midpoint 6ap and the second center 6bp are the centers of the first through conductor 6a and the second through conductor 6b, but they may be offset to some extent. For example, there may be an error of about 30% in the length or diameter of one side of the first through conductor 6a and the second through conductor 6b.

Some of the electronic element mounting boards have higher electrical connectivity between the component pads and other wiring provided inside the board, and other wiring provided from the electronic components to the inside of the board. In order to reduce the electric resistance value of and, a plurality of through conductors are provided in one component pad. Further, as the electronic components are miniaturized, the component pads may be miniaturized. In such a case, if there are two or more through conductors, the distance between the through conductors may become small. Since the through conductor and the material constituting the substrate are different, the through conductor may lift the substrate to the upper surface side due to changes in the manufacturing process of the substrate or the environment in which the electronic device is used. As a result, the component pad connected to the substrate or the through conductor may be lifted in a convex shape. Since this has a plurality of through conductors, the distance between the plurality of through conductors is small, so that the substrate (component pad) between the plurality of through holes tends to have a convex shape. Therefore, the flatness of the surface of the component pad 5 may be deteriorated, and there is a concern that the component pad 5 may be tilted in the process of mounting the electronic component.

On the other hand, in the present embodiment, the first center 6ap and the second center 6bp, which are the centers of the first through conductor 6a, are located in different regions bounded by the virtual line α passing through the midpoint of the component pad 5. ing. As a result, it is possible to secure a distance between the first through conductor 6a and the second through conductor 6b, and it is possible to reduce the appearance of a convex shape on the component pad 5. Therefore, the flatness of the surface of the component pad 5 deteriorates, and it is possible to reduce the tilting of the electronic component 11 in the step of mounting the electronic component 11.

Further, according to the present embodiment, it is possible to facilitate the structure in which only a part of the component pad 5 has a convex shape, but the entire component pad 5 has a convex shape. In other words, the component pad 5 itself has a convex shape toward the upper surface side, and it is possible to reduce the height difference of the flatness of the component pad 5. Therefore, it is possible to widen the portion where the height difference of the surface flatness is relatively small in the entire component pad 5, and it is possible to reduce the tilting of the electronic component 11 in the step of mounting the electronic component 11. It will be possible.

In the examples shown in FIGS. 1 to 4, the substrate 2 has a rectangular shape in a plan view, and the virtual line α is parallel to one side of the substrate 2. Even in such a case, the effect of the present embodiment of the first embodiment can be achieved.

The first through conductor 6a and the second through conductor 6b need only have the first center 6ap and the second center 6bp located in different regions. For example, the first center 6ap and the second center 6bp are different. It is in the area, and the position of other parts does not matter. For example, a part of the first through conductor 6a may cover the region where the second through conductor 6b is located. In other words, the first through conductor 6a and the second through conductor 6b may be positioned so as to overlap the imaginary line α in a plan view. As a result, the size of the component pad 5 can be further reduced, and the electronic component 11 can be miniaturized. In addition, more electronic components 11 can be mounted at high density.

Further, the first through conductor 6a and the second through conductor 6b may be located apart from the virtual line α in a plan view. From this, the distance between the first through conductor 6a and the second through conductor 6b can be increased. Therefore, it is possible to make a wider portion of the entire component pad 5 where the difference in surface flatness is relatively small. As a result, in the process of mounting the electronic component 11, it is possible to reduce the tilting of the electronic component 11 and it is possible to further improve the effect of the present embodiment.

As shown in the example shown in FIG. 3A, there may be a plurality of component pads 5 having the first through conductor 6a and the second through conductor 6b. At this time, the two sets of through conductors may have different arrangements as shown by the two component pads on the upper side of FIG. 3 (a), or may be shown by the two component pads on the lower side of FIG. 3 (a). As described above, the two sets of through conductors may have the same arrangement. In either case, the effect of the present embodiment can be achieved.

The component pad 5 of the electronic device mounting substrate 1 and the first through conductor 6a and the second through conductor 6b may be integrated. This makes it possible to improve the joint strength between the first through conductor 6a and the second through conductor 6b and the component pad 5. In particular, in the present embodiment, the first through conductor 6a and the second through conductor 6b are located apart from the virtual line α passing through the center of the component pad 5. In other words, the first through conductor 6a and the second through conductor 6b are positioned so as to be offset from the center to the outer peripheral portion of the component pad 5, respectively. When an external stress is applied to the electronic component 11, the component pad 5 connected to the electronic component 11 may deviate from the substrate 2. On the other hand, since the first through conductor 6a and the second through conductor 6b are integrated with the component pad 5, it is possible to reduce the peeling of the component pad 5 and the electronic component 11 from the substrate 2. Here, the fact that the first through conductor 6a and the second through conductor 6b are integrated with the component pad 5 means that, for example, the first through conductor 6a, the second through conductor 6b, and the component pad 5 have a glass component. At this time, the case where the glass components are melted and the first through conductor 6a and the second through conductor 6b and the component pad 5 are integrally bonded is included. Further, for example, when the first through conductor 6a, the second through conductor 6b, and the component pad 5 have a metal component, the metal components are melted and integrally bonded to each other.

As shown in the example shown in FIG. 3B, the electronic device mounting substrate 1 may be provided with other through conductors 6e in addition to the first through conductor 6a and the second through conductor 6b. When a plurality of other through conductors 6e are provided, the effect of the present embodiment is obtained by satisfying the same conditions as the first through conductor 6a and the second through conductor 6b, that is, the conditions of the present embodiment. Can be further improved.

<Configuration of electronic device>
FIG. 1 shows an example of the electronic device 21. The electronic device 21 has an electronic element mounting substrate 1 and an electronic element 10 mounted on the electronic element mounting substrate 1. Examples of the electronic element 10 include an imaging element such as a CMOS (Complementary Metal Oxide Semiconductor) and a CCD (Charge Coupled Device), a light emitting element such as an LED (Light Emitting Diode), and an LSI (Large Scale Integrated Circuit). It is an integrated circuit or the like. The electronic element 10 may be arranged on the upper surface of the substrate 2 via an adhesive. For this adhesive, for example, silver epoxy or thermosetting resin is used.

The electronic device 21 may have a lid 12 joined to the upper surface of the electronic device mounting substrate 1 while covering the electronic device 10. Here, the electronic element mounting substrate 1 may have the lid 12 bonded to the upper surface of the frame-shaped portion of the substrate 2, or supports the lid 12 so as to be the upper surface of the substrate 2 and surround the electronic element 10. The provided frame-shaped body may be provided. Further, the frame-shaped body and the substrate 2 may be made of the same material, or may be made of different materials.

When the frame-shaped body and the substrate 2 are made of the same material, the substrate 2 may be made to be integrated with the uppermost insulating layer by providing an opening with the frame-shaped body. Alternatively, they may be joined separately with a brazing material or the like.

Further, as an example in which the substrate 2 and the frame-shaped body are made of different materials, the frame-shaped body may be made of the same material as the lid body joining material 14 for joining the lid body 12 and the substrate 2. At this time, by providing the lid body joining material 14 thickly, it is possible to have both the effect of adhesion and the effect of a frame-shaped body (member supporting the lid body 12). Examples of the lid bonding material 14 at this time include a thermosetting resin, a low melting point glass, a brazing material made of a metal component, and the like. Further, the frame-shaped body and the lid body 12 may be made of the same material, and in this case, the frame-shaped body and the lid body 12 may be configured as the same individual.

For the lid 12, for example, when the electronic element 10 is an image pickup element such as CMOS or CCD, or a light emitting element such as an LED, a highly transparent member such as a glass material is used. Further, for the lid body 12, for example, when the electronic element 10 is an integrated circuit or the like, a metal material, a ceramic material, or an organic material may be used.

The lid body 12 is joined to the electronic element mounting substrate 1 via the lid body bonding material 14. Examples of the material constituting the lid bonding material 14 include a thermosetting resin, a low melting point glass, a brazing material made of a metal component, and the like.

<Electronic module configuration>
FIG. 2 shows an example of the electronic module 31 using the electronic device mounting substrate 1. The electronic module 31 is located on the electronic component 21 and / or the upper surface of the electronic component 11 and / or covers the electronic component 21 and / or the electronic component 11 mounted on the electronic device 21 and the component pad 5. It has a housing 32 provided as described above. In the example shown below, an imaging module will be described as an example for explanation.

The electronic module 31 may have a housing 32 (lens holder). By having the housing 32, it is possible to further improve the airtightness or reduce the direct application of stress from the outside to the electronic device 21. The housing 32 is made of, for example, a resin or a metal material. Further, when the housing 32 is a lens holder, the housing 32 may incorporate one or more lenses made of resin, liquid, glass, crystal, or the like. Further, the housing 32 may be provided with a driving device or the like for driving up, down, left and right, and may be electrically connected to other pads or the like of the electronic element mounting substrate 1 via a bonding material such as solder. ..

The housing 32 may be located on the upper surface of the electronic device 21, or may cover them so as to include the electronic device 21 and the electronic component 11. Further, different housings 32 for the electronic device 21 and the electronic component 11 may be located on the upper surface thereof.

The housing 32 may be provided with openings on at least one side in four directions when viewed from above. Then, an external circuit board may be inserted through the opening of the housing 32 and electrically connected to the electronic element mounting board 1. Further, in the opening of the housing 32, after the external circuit board is electrically connected to the electronic element mounting substrate 1, the gap of the opening is closed with a sealing material such as resin, and the inside of the electronic module 31 is airtight. It may have been done.

The electronic module 31 has an electronic component 11 mounted on the component pad 5. The electronic component 11 is, for example, a passive component such as a chip capacitor, an inductor, or a resistor, or an OIS (Optical Image Stabilization), a signal processing circuit, a gyro sensor, and an LED (light emitting diode).
) And other active parts.

These electronic components 11 are connected to the component pads 5 by wire bonding, gold bumps, solder, electronic component bonding materials such as conductive resin, and the like. The electronic components 11 may be connected to the electronic element 10 via internal wiring or the like provided on the substrate 2. Further, when the electronic component 11 is an LED, by arranging the electronic component 11 on the outside of the housing 32, it is possible to reduce the occurrence of flare and the like.

When the electronic module 31 has the electronic element mounting substrate 1 as shown in FIG. 1, it is possible to improve the connectivity between the component pad 5 and the electronic component 11. Therefore, it is possible to reduce the inclination of the electronic component 11 to be mounted. Further, even if an impact is applied while the electronic component 11 is using the electronic module 31, it is possible to reduce the peeling of the electronic component 11 from the component pad 5. As a result, it is possible to reduce the occurrence of malfunction of the electronic module 31.

<Manufacturing method of electronic device mounting substrate and electronic device>
Next, an example of the manufacturing method of the electronic device mounting substrate 1 and the electronic device 21 of the present embodiment will be described. An example of the manufacturing method shown below is a manufacturing method of the substrate 2 using a large number of wiring boards.

(1) First, a ceramic green sheet constituting the substrate 2 is formed. For example, in the case of obtaining the substrate 2 which is an _{aluminum oxide (Al 2} O _{3 ) quality sintered body, silica (SiO 2} ), magnesia (MgO) or calcia (CaO) or calcia (CaO) is added to _{the powder of Al 2} O ₃ as a sintering aid. ) And other powders are added, and suitable binders, solvents and plasticizers are added, and then the mixture thereof is kneaded to form a slurry. Then, a ceramic green sheet for taking a large number of pieces is obtained by a molding method such as a doctor blade method or a calendar roll method.

When the substrate 2 is made of resin, for example, the substrate 2 can be formed by molding by a transfer molding method, an injection molding method, or the like using a mold that can be molded into a predetermined shape. Further, the substrate 2 may be a substrate made of glass fibers impregnated with a resin, for example, a glass epoxy resin. In this case, the substrate 2 can be formed by impregnating a base material made of glass fiber with an epoxy resin precursor and thermosetting the epoxy resin precursor at a predetermined temperature.

(2) Next, by combining steps such as a screen printing method, punching with a die, or punching with a laser, the ceramic green sheet obtained in the step (1) above is combined with an electrode pad 3, a component pad 5, and an external circuit. A metal paste is applied to a portion to be a connecting electrode, a first through conductor 6a, a second through conductor 6b, an internal wiring conductor, and a through conductor, or a portion provided with a through hole is filled with the metal paste. This metal paste is produced by adding an appropriate solvent and a binder to the metal powder made of the above-mentioned metal material and kneading the paste to adjust the viscosity to an appropriate level. The metal paste may contain glass or ceramics in order to increase the bonding strength with the substrate 2. When the substrate 2 is made of resin, the electrode pad 3, the component pad 5, the electrode for connecting an external circuit, the first through conductor 6a, the second through conductor 6b, the internal wiring conductor and the through conductor are vapor-deposited by a sputtering method. It can be produced by a method or the like. Further, after providing a metal film on the surface, it may be produced by using a plating method.

(3) Next, the above-mentioned green sheet is processed by a mold or the like. Here, when the substrate 2 has a recess or a notch or the like, a recess (through hole) or a notch or the like may be formed at a predetermined portion of the green sheet to be the substrate 2. Further, at this time, a through hole may be provided by a mold, laser processing, or the like, and the first through conductor 6a and the second through conductor 6b may be manufactured by the above-mentioned method.

(4) Next, the ceramic green sheets to be the insulating layers are laminated and pressurized. As a result, the green sheets to be the insulating layers may be laminated to produce a ceramic green sheet laminate to be the substrate 2 (the substrate for mounting the electronic device 1).

(5) Next, the ceramic green sheet laminate is fired at a temperature of about 1500 ° C. to 1800 ° C. to obtain a multi-layer wiring board in which a plurality of substrates 2 (electronic element mounting substrate 1) are arranged. By this step, the metal paste described above is fired at the same time as the ceramic green sheet that becomes the substrate 2 (the substrate for mounting the electronic element 1), and the electrode pad 3, the component pad 5, the electrode for connecting the external circuit, and the first through conductor are fired at the same time. 6a, a second through conductor 6b, an internal wiring conductor, and a through conductor.

(6) Next, the multi-layer wiring board obtained by firing is divided into a plurality of boards 2 (electronic element mounting boards 1). In this division, a method of forming a dividing groove in a large number of wiring boards along the outer edge of the substrate 2 (electronic element mounting substrate 1) and breaking along the dividing groove to divide the wiring board. A method of cutting along the outer edge of the substrate 2 (electronic element mounting substrate 1) by a slicing method or the like can be used. The dividing groove can be formed by cutting a multi-piece wiring board smaller than the thickness of the multi-piece wiring board after firing, but the cutter blade may be pressed against the ceramic green sheet laminate for the multi-piece wiring board. It may be formed by cutting with a slicing device to be smaller than the thickness of the ceramic green sheet laminate. Before or after dividing the above-mentioned multi-component wiring board into a plurality of boards 2 (boards 1 for mounting electronic elements), the electrode pads 3 and component pads 5 are used by electroplating or electroless plating, respectively. Plating may be applied to the external connection pad and the exposed wiring conductor.

(7) Next, the electronic element 10 and the electronic component 11 are mounted on the electronic element mounting substrate 1. The electronic element 10 is electrically connected to the electronic element mounting substrate 1 by an electronic element connecting material 13 such as wire bonding. At this time, an adhesive or the like may be provided on the electronic element 10 or the electronic element mounting substrate 1 and fixed to the electronic element mounting substrate 1. Further, after the electronic element 10 is mounted on the electronic element mounting substrate 1, the lid body 12 may be joined by the lid body joining material 14. The electronic component 11 is electrically bonded to the electronic element mounting substrate 1 with an electronic component connecting material such as cream solder.

The electronic device 21 can be manufactured by manufacturing the electronic device mounting substrate 1 and mounting the electronic device 10 as described in steps (1) to (7) above. The process order of (1) to (7) above is not specified.

(Second Embodiment)
Next, the electronic device mounting substrate 1 and the electronic device 21 according to the second embodiment of the present invention will be described with reference to FIGS. 5 to 7. The electronic element mounting substrate 1 and the electronic device 21 of the present embodiment differ from the electronic element mounting substrate 1 and the electronic device 21 of the first embodiment in that the component pad 5 has a rectangular shape. Further, in FIGS. 6 and 7, a second component pad 5b is further provided. In FIG. 5, the first through conductor 6a, the second through conductor 6b, the third through conductor 6c, and the fourth through conductor 6d are shown by dotted lines, and in FIGS. 6 to 7, the first through conductor 6a, the second through conductor 6b, The third through conductor 6c and the fourth through conductor 6d are indicated by dotted lines, and the first center 6ap, the second center 6bp, the third center 6cp, and the fourth center 6dp are indicated by black circles. Further, in FIG. 7, the alternate long and short dash line β indicates a diagonal line in the rectangular component pad 5 (first component pad 5a and second component pad 5b).

In the example shown in FIG. 7, the first through conductor 6a and the second through conductor 6b are located diagonally. At this time, it is preferable that they are located at both ends of the diagonal line. From this, the distance between the first through conductor 6a and the second through conductor 6b can be maximized. Therefore, it is possible to widen the portion where the height difference of the surface flatness is relatively small in the entire component pad 5. As a result, in the process of mounting the electronic component 11, it is possible to reduce the tilting of the electronic component 11 and it is possible to further improve the effect of the present embodiment. At this time, by locating the first center 6ap and the second center 6bp on the diagonal line β, the distance between the penetrating conductors can be increased most, and this effect can be further improved.

In the example shown in FIGS. 5 to 7, the second component pad 5b, which is located on the upper surface of the substrate 2 and has a rectangular shape in a plan view on which the electronic component 11 is mounted, is electrically connected to the second component pad 5b. , Has a third through conductor 6c and a fourth through conductor 6d located inside the substrate 2. The electronic component 11 has two terminals such as a capacitor, an inductor, and a resistance element, and each of the terminals is mounted so as to straddle between the first component pad 5a and the second component pad 5b. Even in such a case, it is possible to obtain the same effect as that of the first embodiment. If the electronic component 11 is tilted between the first component pad 5a and the second component pad 5b during mounting, the electronic component 11 may be peeled off or sufficient characteristics may not be obtained. On the other hand, as in the present embodiment, the first component pad 5a and the second component pad 5b have a first through conductor 6a and a second through conductor 6b, and a third through conductor 6c and a fourth through conductor 6d, respectively. By doing so, it is possible to widen the portion where the difference in surface flatness between the first component pad 5a and the second component pad 5b is relatively small. Therefore, it is possible to reduce the height difference between the first component pad 5a and the second component pad 5b, and it is possible to reduce the case where the electronic component 11 is peeled off or the case where sufficient characteristics cannot be obtained. It becomes.

Further, in the example shown in FIGS. 5 to 7, the second component pad 5b has two regions with the second virtual line γ passing through the center of the second component pad 5b as a boundary in a plan view. The third center 6cp of the through conductor 6c and the fourth center 6dp of the fourth through conductor 6 are located in different regions.

In the present embodiment, the third through conductor 6c and the fourth through conductor 6d of the second component pad 5b have the first component pad 5a similarly to the first through conductor 6a and the second through conductor 6b, respectively. It is provided in each of the two regions bordered by the second virtual line γ passing through the center of 5b. As a result, even in the second component pad 5b, it is possible to widen the portion where the difference in the levelness of the surface is relatively small. Therefore, it is possible to reduce the height difference between the first component pad 5a and the second component pad 5b, and it is possible to reduce the case where the electronic component 11 is peeled off or the case where sufficient characteristics cannot be obtained. It becomes.

The second virtual line γ passes through the center of the second component pad 5b. The center of the second component pad 5b may be the center of the second component pad 5 if it has a circular shape, for example, or it may be the intersection of two diagonal lines when the second component pad 5 has a rectangular shape. Further, when the second component pad 5b has a shape close to a circular shape, the center of the second component pad 5b may be the center when the shape close to the circular shape is regarded as a circle, or the X direction / Y. It may be a point where points that are midpoints intersect in each direction. Further, when the second component pad 5b has a polygonal shape, the center of the second component pad 5b is at a point where the diagonal lines intersect, a point calculated by a method of issuing a predetermined midpoint, or in the X direction / Y direction. It may be a point where the points that are the midpoints intersect. The second virtual line γ passes through the center of the component pad 5, but may be deviated to some extent. For example, there may be an error of about 10% of the length or diameter of one side of the second component pad γ.

In the example shown in FIG. 5, the first through conductor 6a and the second through conductor 6b, the third through conductor 6c and the fourth through conductor 6d are provided from the upper surface to the lower surface of the substrate 2 in the cross-sectional view, but the first embodiment. As described in the form, the substrate 2 may be provided halfway in the cross-sectional view. These can be appropriately determined depending on the positions of the internal wirings connected to the first through conductor 6a and the second through conductor 6b, the third through conductor 6c and the fourth through conductor 6d. Further, since the first through conductor 6a and the second through conductor 6b, the third through conductor 6c and the fourth through conductor 6d are provided from the upper surface to the lower surface in a cross-sectional view, the component pad 5 (first through conductor 5) of the substrate 2 is provided. It is possible to reduce the occurrence of a difference in surface flatness between the component pad 5a and the second component pad 5b). Further, since the first through conductor 6a and the second through conductor 6b, the third through conductor 6c and the fourth through conductor 6d are provided halfway of the substrate 2 in the cross-sectional view, the lower surface of the substrate 2 (part pad 5). It is possible to reduce the occurrence of concave or convex deformation on the surface opposite to the surface provided with the above.

As shown in the example shown in FIG. 6A, the first center 6ap of the first through conductor 6a, the second center 6bp of the second through conductor 6b, and the third center of the third through conductor 6c in a plan view. The 6cp and the fourth center 6dp of the fourth through conductor 6d may be located apart from the imaginary line α and / and the second imaginary line γ. From this, the distance between the first through conductor 6a and the second through conductor 6b and between the third through conductor 6c and the fourth through conductor 6d can be increased. Therefore, it is possible to widen the portion where the height difference of the surface flatness is relatively small between the first component pad 5a and the second component pad 5b, respectively. Therefore, it is possible to reduce the height difference between the first component pad 5a and the second component pad 5b, and it is possible to reduce the case where the electronic component 11 is peeled off or the case where sufficient characteristics cannot be obtained. It becomes.

As shown in the example shown in FIG. 6B, in a plan view, the first through conductor 6a and the second through conductor 6b, the third through conductor 6c and the fourth through conductor 6d are virtual lines α and / and the second virtual line. It may be located so as to overlap with γ. As a result, the sizes of the first component pad 5a and the second component pad 5b can be further miniaturized, the electronic component 11 can be miniaturized, and more can be mounted.

The third through conductor 6c and the fourth through conductor 6d have a third center 6cp and a fourth center 6dp, respectively. The third center 6cp and the fourth center 6dp are the midpoints of the third through conductor 6c and the fourth through conductor 6d when they are circular, and when they have other shapes, they are combined with the above-mentioned component pad 5. Similarly, it is possible to calculate the midpoint by each method. The third center 6cp and the fourth center 6dp are the centers of the third through conductor 6c and the fourth through conductor 6d, but they may be judged to be offset to some extent. For example, there may be an error of about 30% in the length or diameter of one side of the third through conductor 6c and the fourth through conductor 6d.

In the example shown in FIG. 7, the first through conductor 6a and the second through conductor 6b, and the third through conductor 6c and the fourth through conductor 6d are located on the diagonal line β. From this, the distance between the first through conductor 6a and the second through conductor 6b and the distance between the third through conductor 6c and the third through conductor 6d can be maximized. Therefore, it is possible to widen the portion of the first component pad 5a and the second component pad 5b where the height difference of the surface flatness is relatively small. This makes it possible to reduce the height difference between the first component pad 5a and the second component pad 5b, and reduce the tilting of the electronic component 11 in the process of mounting the electronic component 11. It is possible to improve the effect of the embodiment. At this time, by locating the first center 6ap, the second center 6bp, the third center 6cp, and the fourth center 6dp on the diagonal line β, it is possible to increase the distance between them, which is more effective. Can be improved.

As in the example shown in FIG. 7A, the first through conductor 6a and the second through conductor 6b and the third through conductor 6c and the fourth through conductor 6d may be displaced in the same direction, and FIG. 7A. As in the example shown in (b), the first through conductor 6a and the second through conductor 6b may be displaced in different directions from the third through conductor 6c and the fourth through conductor 6d. As shown in the example shown in FIG. 7A, the first through conductor 6a and the second through conductor 6b, and the third through conductor 6c and the fourth through conductor 6d are displaced in the same direction, so that the first through conductor 6a and the fourth through conductor 6d are displaced in the same direction. It is possible to increase the distance between the 6a and the second through conductor 6b and the third through conductor 6c and the fourth through conductor 6d. Therefore, it is possible to reduce the occurrence of cracks and the occurrence of inclination between the first through conductor 6a and the second through conductor 6b, and the third through conductor 6c and the fourth through conductor 6d. Further, as a result, the space between the first through conductor 6a and the second through conductor 6b and the third through conductor 6c and the fourth through conductor 6d can be increased, so that the electricity of the capacitor or the like generated between the through conductors can be increased. Noise can be reduced. As shown in the example shown in FIG. 7B, the first through conductor 6a and the second through conductor 6b, and the third through conductor 6c and the fourth through conductor 6d are displaced in different directions, so that the first component pad It is possible to reduce the occurrence of the Manhattan phenomenon even when the inclination remains in each of the 5a and the second component pad 5b.

The second component pad 5b of the electronic device mounting substrate 1, the third through conductor 6c, and the fourth through conductor 6d may be integrated. Further, in this case, as described in the first embodiment, the component pad 5 (first component pad 5a), the first through conductor 6 and the second through conductor 6b may also be integrated. This makes it possible to improve the joint strength between the third through conductor 6c and the fourth through conductor 6d and the second component pad 5b. In particular, in the present embodiment, the first through conductor 6a, the second through conductor 6b, the third through conductor 6c and the fourth through conductor 6d are virtual lines α passing through the centers of the first component pad 5a and the second component pad 5b. It is located away from. At this time, if an external stress is applied to the electronic component 11, the first component pad 5a and / and the second component pad 5b connected to the electronic component 11 may deviate from the substrate 2. On the other hand, the first through conductor 6a and the second through conductor 6b are integrated with the first component pad 5a, and the third through conductor 6c and the fourth through conductor 6d are integrated with the second component pad 5b. It is possible to reduce the peeling of the component pad 5a and / and the second component pad 5b and the electronic component 11 from the substrate 2. Here, the fact that the third through conductor 6c and the fourth through conductor 6d are integrated with the second component pad 5b means that, for example, the third through conductor 6c, the fourth through conductor 6d, and the second component pad 5b have a glass component. When holding, the case where the glass components are melted and integrally bonded to each other is included. Further, for example, when the third through conductor 6c, the fourth through conductor 6d, and the second component pad 5b have a metal component, the metal components are melted and integrally bonded to each other.

The third through conductor 6c and the fourth through conductor 6d are made of the same materials as the first through conductor 6a and the second through conductor 6b described in the first embodiment. At this time, the first through conductor 6a, the second through conductor 6b, the third through conductor 6c, and the fourth through conductor 6d may be made of the same material, or may be made of different or partially different materials. You may.

The second component pad 5b is made of the same material as the component pad 5 (first component pad 5a) described in the first embodiment. At this time, the first component pad 5a and the second component pad 5b may be made of the same material, or may be made of different or partially different materials.

The second component pad 5b, the third through conductor 6c, and the fourth through conductor 6d are the same as the component pad 5 (first component pad 5a), the first through conductor 6a, and the second through conductor 6b described in the first embodiment. It can be provided by a manufacturing method.

(Third Embodiment)
Next, the electronic device mounting substrate 1 and the electronic device 21 according to the third embodiment of the present invention will be described with reference to FIGS. 8 to 9. The electronic element mounting substrate 1 and the electronic device 21 in the present embodiment are different from the electronic element mounting substrate 1 and the electronic device 21 in the second embodiment in that they are tilted first component pads 5a and second component pads 5b. It is a point that has. In FIG. 8, the first through conductor 6a, the second through conductor 6b, the third through conductor 6c, and the fourth through conductor 6d are shown by dotted lines, and in FIG. 9, the first through conductor 6a, the second through conductor 6b, and the third through conductor 6d are shown by dotted lines. The conductor 6c and the fourth through conductor 6d are indicated by dotted lines, and the first center 6ap, the second center 6bp, the third center 6cp, and the fourth center 6dp are indicated by black circles.

In the examples shown in FIGS. 8 and 9, the component pad 5 has a rectangular shape in a plan view, and the virtual line α is parallel to one side of the component pad 5. Even in such a case, the effect of the present embodiment of the first embodiment can be achieved. In other words, for example, as shown in FIGS. 8 and 9, even when the first component pad 5a and the second component pad 5b are rotated in the top view, the first component pad 5a or the second component pad 5b 1 A first center 6ap and a second center 6bp and / and a third center 6cp and a fourth center 6dp are provided in the region divided by the virtual line α parallel to the side, respectively. This makes it possible to secure the distance between the first through conductor 6a and the second through conductor 6b and / and the distance between the third through conductor 6c and the fourth through conductor 6d, and the first component. It is possible to reduce the appearance of the convex shape on the pad 5a and / and the second component pad 5b. Therefore, the flatness of the surfaces of the first component pad 5a and / and the second component pad 5b deteriorates, and it is possible to reduce the tilting of the electronic component 11 in the step of mounting the electronic component 11. ..

In the example shown in FIG. 8, the substrate 2 has a rectangular shape, but the shape of the substrate 2 in the present embodiment is not limited to a rectangular shape and may be a polygonal shape or a substantially circular shape.

(Fourth Embodiment)
Next, the electronic device mounting substrate 1 and the electronic device 21 according to the fourth embodiment of the present invention will be described with reference to FIGS. 10 to 11. The electronic device mounting substrate 1 and the electronic device 21 of the present embodiment are different from the electronic device mounting substrate 1 and the electronic device 21 of the first embodiment in that the substrate 2 has a through hole 2a. be. In FIG. 11, the first through conductor 6a, the second through conductor 6b, the third through conductor 6c, and the fourth through conductor 6d are shown by dotted lines, the first center 6ap, the second center 6bp, the third center 6cp, and the third through conductor 6cp. The fourth center 6 pd is indicated by a black circle.

In the example shown in FIG. 10, the substrate 2 of the electronic device mounting substrate 1 has a through hole 2a in the central portion in a plan view. Further, the electronic element 10 mounted on the electronic device 21 is provided so as to be located at a position overlapping the through hole 2a provided in the substrate 2 in a top view. That is, the through hole 2a may have the same size as the electronic element 10 or slightly smaller than the electronic element 10 in the top view. Even in such a case, this effect can be achieved. That is, the first center 6ap and the second center 6bp and / and the third center 6cp and the third are in the regions divided by the virtual line α passing through the center of the first component pad 5a and / and the second component pad 5b, respectively. The center 6 pd of 4 is provided. This makes it possible to secure the distance between the first through conductor 6a and the second through conductor 6b and / and the distance between the third through conductor 6c and the fourth through conductor 6d, and the first component. It is possible to reduce the appearance of the convex shape on the pad 5a and / and the second component pad 5b. Therefore, the flatness of the surfaces of the first component pad 5a and / and the second component pad 5b may be difficult to maintain, and it is possible to reduce the tilting of the electronic component 11 in the process of mounting the electronic component 11. Is possible. Further, it is possible to reduce the height difference between the 1st component pad 5a and the 2nd component pad 5b, which may cause peeling of the electronic component 11 or poor joining, and sufficient characteristics can be obtained. It is possible to reduce the case where there is no such thing.

At this time, the virtual line α may be parallel to one side of the substrate 2 when the substrate 2 is rectangular, or when the first component pad 5a and / and the second component pad 5b are rectangular. It may be parallel to one side of the first component pad 5a and / and the second component pad 5b, or may go to both.

Further, according to the configuration as shown in FIG. 10, for example, when the electronic element 10 is an image sensor, the image sensor is mounted under the substrate 2 and the distance between the lens and the image sensor can be secured. , The height of the electronic module 31 can be further reduced. Further, in the structure shown in FIG. 10, more electronic components 11 can be mounted, so that the electronic device can be further miniaturized. The through hole 2a may be provided in the central portion of the substrate 2 or may be provided eccentrically from the central portion of the substrate 2.

In the case of mounting as in the example shown in FIG. 10, the electronic element 10 is connected to the electronic element mounting substrate 1 by an electronic element connecting material 13 such as a gold bump or a solder ball, and then the connection is strengthened by a sealing material. , It may be further sealed. Further, 10 electronic elements may be connected by the electronic element connecting material 13 such as ACF (Anisotropic Conductive Film).

In the example shown in FIG. 11, the first through conductor 6a or the second through conductor 6b, the third through conductor 6c or the fourth through conductor 6e, and the electronic component 11 are positioned so as to overlap each other in the top view, but do not overlap. It may be located in. In the example shown in FIG. 11, the first through conductor 6a or the second through conductor 6b, the third through conductor 6c or the fourth through conductor 6e, and the electronic component 11 overlap each other in a top view, so that the first component pad 5a And the second component pad 5b can be made smaller. Therefore, the size of the electronic element mounting substrate 1 can be reduced, and the mounting density of the electronic component 11 can be further increased. Further, the first through conductor 6a or the second through conductor 6b, the third through conductor 6c or the fourth through conductor 6e, and the electronic component 11 are positioned so as not to overlap each other, so that the most convex shape is obtained. It is possible to mount the electronic component 11 so as to avoid the large through conductor portion. Therefore, since the electronic component 11 can be mounted in a portion having a better flatness, it is possible to reduce the tilting of the electronic component 11 in the step of mounting the electronic component 11. Further, it is possible to reduce the height difference between the first component pad 5a and the second component pad 5b, and it is possible to reduce the case where the electronic component 11 is peeled off or the case where sufficient characteristics cannot be obtained. It becomes.

In the method of manufacturing the electronic device mounting substrate 1 as shown in FIG. 10, in addition to the steps described in the first embodiment, a mold or a mold is provided at a position where a through hole 2a of the ceramic green sheet to be the substrate 2 is provided. It can be created by penetrating it with a laser. After that, by making the same steps as described in the first embodiment, the electronic device mounting substrate 1 as shown in the example of FIG. 10 can be made.

The present invention is not limited to the examples of the above-described embodiments, and can be combined in all of the embodiments according to the present invention as long as the contents thereof are not inconsistent. Various modifications such as numerical values are possible. Further, for example, in the example shown in FIGS. 1 to 11, the first to fourth through conductors have a circular shape in a top view, but may be rectangular, elliptical, or the like. Further, the sizes of the plurality of first to fourth through conductors in the plan view may be different or the same. Further, for example, in the examples shown in FIGS. 1 to 11, the shape of the electrode pad 3 is a quadrangular shape in a top view, but it may be a circular shape or another polygonal shape. Further, for example, in the example shown in FIGS. 1 to 11, the component pad 5 has a circular shape or a rectangular shape, but may have an elliptical shape or a polygonal shape, and a plurality of the component pads 5 may be installed in combination. good. Further, the arrangement, number, shape, mounting method of electronic elements, etc. of the electrode pads 3 and component pads 5 in this embodiment are not specified.

1 ... Electronic element mounting substrate 2 ... Substrate 2a ... Through hole 3 ... Electrode pad 4 ... Mounting area 5 ... Component pad 5a ... First component Pad 5b ... 2nd component pad 6a ... 1st through conductor 6ap ... 1st center 6b ... 2nd through conductor 6bp ... 2nd center 6c ... 3rd through conductor 6cp ... 3rd center 6d ... 4th through conductor 6dp ... 4th center 6e ... Other through conductor 6ep ... Other center 10 ... Electronic element 11 ... Electronic component 12 ... Lid Body 13 ... Electronic element bonding material 14 ... Lid body bonding material 21 ... Electronic device 31 ... Electronic module 32 ... Housing α ... (passing through the center point) Virtual line β ...・ ・ ・ Diagonal line γ ・ ・ ・ ・ 2nd virtual line (passing through the center point)

Claims (10)

A rectangular substrate in a plan view having a mounting area on which an electronic element is mounted,
A first component pad, which is located on the upper surface of the substrate and on which electronic components are mounted and whose outer edge is at least partly curved in a plan view.
It is provided with a first through conductor and a second through conductor that are electrically connected to the first component pad and are located inside the substrate.
Wherein the first component pad in plan view, said with passing through the center of the first component pad, a virtual line along the one side of the substrate with has two regions as a boundary, the first component pad The outer edge of the above has a linear shape parallel to the virtual line in a plan view .
For mounting an electronic device, the first center of the first through conductor and the second center of the second through conductor are located in different regions of the two regions in a plan view. substrate. The electronic element mounting substrate according to claim 1, wherein the substrate has a rectangular shape in a plan view, and the virtual line is parallel to one side of the substrate. The substrate for mounting an electronic device according to claim 1 or 2 , wherein the first through conductor and the second through conductor are located apart from the virtual line in a plan view. A second component pad, which is located on the upper surface of the substrate and on which electronic components are mounted and has a rectangular shape in a plan view,
It further includes a third through conductor and a fourth through conductor that are electrically connected to the second component pad and are located inside the substrate.
The second component pad has two regions in a plan view with a second virtual line passing through the center of the second component pad as a boundary.
In a plan view, the third center of the third through conductor and the fourth center of the fourth through conductor are located in different regions of the two regions of the second component pad. The substrate for mounting an electronic device according to any one of claims 1 to 3. The substrate for mounting an electronic device according to claim 4 , wherein the third through conductor and the fourth through conductor are located apart from the second virtual line in a plan view. The second component pad has a rectangular shape in a plan view and has a rectangular shape.
The substrate for mounting an electronic device according to claim 4 or 5 , wherein the third through conductor and the fourth through conductor are located on the diagonal line of the second component pad. The substrate for mounting an electronic device according to any one of claims 4 to 6 , wherein the second component pad, the third through conductor, and the fourth through conductor are integrated. The substrate for mounting an electronic device according to any one of claims 1 to 7 , wherein the substrate has a through hole in a central portion in a plan view. The electronic device mounting substrate according to any one of claims 1 to 8.
An electronic device including an electronic element mounted on the electronic element mounting substrate. The electronic device according to claim 9 and
The electronic components mounted on the first component pad and
An electronic module including a housing located on the upper surface of the electronic device.

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