JP6989292B2 - Substrate for mounting electronic devices, electronic devices and electronic modules - Google Patents

Description

The present invention mounts an electronic element, for example, an image pickup element such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, a light emitting element such as an LED (Light Emitting Diode), or an integrated circuit. It relates to boards, electronic devices and electronic modules.

Conventionally, a substrate for mounting an electronic device having a wiring board made of an insulating layer has been known. Further, an electronic device in which an electronic element is mounted on such an electronic element mounting substrate is known (see Patent Document 1).

Japanese Unexamined Patent Publication No. 2011-165992

The electronic device mounting substrate of Patent Document 1 is provided with internal wiring between a plurality of insulating layers. A plurality of internal wirings are provided in the same layer, and a gap is provided between the plurality of internal wirings. In general, a substrate for mounting an electronic device is required to be miniaturized and have improved electrical characteristics. Therefore, the gap between the plurality of internal wirings tends to be minimized, and the thickness of the internal wiring tends to be thicker in order to reduce the electric resistance. Further, there is a demand for a thinner substrate for mounting an electronic element, and each insulating layer is also becoming thinner. Due to these multiple requirements, in the process of laminating each insulating layer, the stacking liquid used at the time of laminating may exceed the limit amount of permeation into the insulating layer, the internal wiring may be extended, and a short circuit may occur between the plurality of internal wirings. there were.

The substrate for mounting an electronic element according to one aspect of the present invention includes a first insulating layer, a second insulating layer located on the lower surface of the first insulating layer, the first insulating layer, and the second insulating layer. A second wiring located between the first wiring, the first insulating layer, and the second insulating layer, and having a gap between the first wiring and the first wiring. The first insulating film located from the upper surface of the first wiring to the upper surface of the second wiring, and the cut provided from the side wall of the first insulating layer to the side wall of the second insulating layer while filling the gap. A notch and a metallized layer provided in the notch are provided, and the first wiring and / and the second wiring have a first end portion located on the outer edge side of the second insulating layer. The upper surface of the first wiring and / and the second wiring located on the opposite side of the first end portion of the first wiring and / and the second wiring located in the notch extends to the notch, and the upper surface of the second end portion is formed on the third insulating film. It is characterized by being covered.

A method for manufacturing a substrate for mounting an electronic element according to one aspect of the present invention includes a step of preparing a first insulating sheet, a second insulating sheet laminated with the first insulating sheet, and an upper surface of the second insulating sheet. A step of forming a first wiring paste, a step of forming a second wiring paste with a gap between the first wiring paste and the upper surface of the second insulating sheet, and a step of forming the first wiring paste and the second wiring paste. The step of filling the first insulating paste between the two, and covering the upper surface of the first wiring paste and the upper surface of the second wiring paste with the first insulating paste, and the first insulation on the upper surface of the second insulating sheet. A step of laminating the sheets to form a laminated body, a step of firing the laminated body, a step of laminating the first insulating sheet on the upper surface of the second insulating sheet to form a laminated body, and the first step. The step of providing the wiring paste or the second wiring paste over the side wall of the second insulating sheet, and before the first wiring paste or the second wiring paste.
The feature is that the side wall of the second insulating sheet is covered with a third insulating paste.

An electronic device according to one aspect of the present invention is characterized by including a substrate for mounting an electronic element and an electronic element mounted on the substrate for mounting the electronic element.

An electronic module according to one aspect of the present invention comprises a top surface of the electronic device or a housing located surrounding the electronic device.

The electronic element mounting substrate according to one aspect of the present invention can reduce a short circuit between the first wiring and the second wiring of the electronic element mounting substrate by the above configuration or manufacturing method. Further, by using the electronic device provided with the electronic device mounting substrate described above, it is possible to provide an electronic device and an electronic module capable of improving the electrical characteristics.

1 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the first embodiment of the present invention, and FIG. 1 (b) is the X1-X1 line of FIG. 1 (a). It is a corresponding vertical sectional view. FIG. 2A is a top view showing the appearance of the electronic module according to the first embodiment of the present invention, and FIG. 2B is a vertical sectional view corresponding to X2-X2 line of FIG. 2A. be. 3 (a), 3 (b), and 3 (c) are schematic views showing a method of manufacturing a main part of the first embodiment of the present invention. 4 (a) and 4 (b) are schematic views showing a method of manufacturing a main part of the first embodiment of the present invention. 5 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the second embodiment of the present invention, and FIG. 2 (b) is the X5-X5 line of FIG. 2 (a). It is a corresponding vertical sectional view. 6 (a), 6 (b), and 6 (c) are schematic views showing a method of manufacturing a main part of the second embodiment of the present invention. 7 (a) and 7 (b) are schematic views showing a method of manufacturing a main part of the second embodiment of the present invention. FIG. 8A is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the third embodiment of the present invention, and FIG. 8B is drawn on line X8-X8 of FIG. 8A. It is a corresponding vertical sectional view. 9 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the fourth embodiment of the present invention, and FIG. 9 (b) is the X9-X9 line of FIG. 9 (a). It is a corresponding vertical sectional view. FIG. 10 is an enlarged view of a main part A of the embodiment shown in FIG. 11 (a) is an enlarged view of the main part A according to another aspect of the embodiment shown in FIG. 9 (a), and FIG. 11 (b) is a vertical sectional view corresponding to the line X11-X11 of FIG. 11 (a). It is a schematic diagram which shows.

<Structure of board for mounting electronic devices and electronic devices>
Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings. In the following description, an electronic device is configured in which an electronic element is mounted on an electronic element mounting substrate. Further, an electronic module is configured to have a housing or a member provided so as to be located on the upper surface side of an electronic element mounting substrate or to surround an electronic device. The electronic element mounting substrate, the electronic device, and the electronic module may be upward or downward in any direction, but for convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is upward.

(First Embodiment)
Regarding the electronic module 31, the electronic device 21, and the electronic element mounting substrate 1 in the first embodiment of the present invention with reference to FIGS. 1 to 2, the first aspect of the present invention is referred to with reference to FIGS. 3 to 4. A method of manufacturing the electronic element mounting substrate 1 according to the embodiment will be described. The electronic device 21 in the present embodiment includes an electronic element mounting substrate 1 and an electronic element 10. In this embodiment, FIG. 1 shows an electronic device 21, FIG. 2 shows an electronic module 31, and FIGS. 3 to 4 show a method for manufacturing a main part of an electronic element mounting substrate 1. .. Further, in FIGS. 1 to 4, the first insulating film 6a (first insulating paste 46a) is shown by dots and solid lines.

The electronic device mounting substrate 1 has a first insulating layer 2a and a second insulating layer 2b located on the lower surface of the first insulating layer. The electronic device mounting substrate 1 has a first wiring 5a located between the first insulating layer 2a and the second insulating layer 2b. The electronic element mounting substrate 1 has a second wiring 5b located between the first insulating layer 2a and the second insulating layer 2b and having a gap between the first wiring 5a. Have. The electronic element mounting substrate 1 fills the gap between the first wiring 5a and the second wiring 5b, and the first insulating film 6a is located from the upper surface of the first wiring 5a to the upper surface of the second wiring 5b.

The electronic device mounting substrate 1 has a first insulating layer 2a and a second insulating layer 2b located on the lower surface of the first insulating layer. Here, as in the example shown in FIG. 1, the electronic device mounting substrate 1 may have another insulating layer 2c in addition to the first insulating layer 2a and the second insulating layer 2b.

As the material of the insulating layer constituting the first insulating layer 2a, the second insulating layer 2b and the other insulating layer 2c, for example, electrically insulating ceramics or a resin is used, and as the resin, for example, plastics, a thermoplastic resin or the like is used. .. Hereinafter, the insulating substrate composed of the first insulating layer 2a, the second insulating layer 2b, and the other insulating layer 2c will be referred to as a substrate 2.

Examples of the electrically insulating ceramics used as the material of the insulating layer forming the first insulating layer 2a, the second insulating layer 2b and the other insulating layer 2c include an aluminum oxide sintered body, a mullite sintered body, and carbonized material. A silicon sintered body, an aluminum nitride material sintered body, a silicon nitride material sintered body, a glass ceramic sintered body, or the like. Examples of the resin used as the material of the insulating layer forming the first insulating layer 2a, the second insulating layer 2b and the other insulating layer 2c include a thermoplastic resin, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin or the like. It is a fluororesin or the like. Examples of the fluororesin include polyester resin and ethylene tetrafluoride resin.

A plurality of other insulating layers 2c may be laminated vertically on the upper surface of the first insulating layer 2a and / or the lower surface of the second insulating layer 2b. The substrate 2 composed of the first insulating layer 2a, the second insulating layer 2b and the other insulating layer 2c may be formed of six insulating layers as shown in FIG. 1, and may be formed from five or less or seven or more layers. It may be formed from the insulating layer of. When the number of insulating layers is 5 or less, the thickness of the electronic element mounting substrate 1 can be reduced. Further, when the number of insulating layers is 6 or more, the rigidity of the electronic element mounting substrate 1 can be increased. Further, as in the example shown in FIGS. 1 and 2, an opening may be provided in each insulating layer, and a step portion may be formed on the upper surface having different sizes of the provided openings, and the electrode pad described later may be formed. 3 may be provided in the step portion.

For example, the size of one side of the outermost periphery of the electronic element mounting substrate 1 is 0.3 mm to 10 cm, and when the electronic element mounting substrate 1 is rectangular in a plan view, it may be square or rectangular. There may be. Further, for example, the thickness of the electronic element mounting substrate 1 is 0.2 mm or more.

The electronic device mounting substrate 1 has a first wiring 5a located between the first insulating layer 2a and the second insulating layer 2b. The electronic element mounting substrate 1 has a second wiring 5b located between the first insulating layer 2a and the second insulating layer 2b and having a gap between the first wiring 5a. Have. Further, the substrate 2 composed of the first insulating layer 2a, the second insulating layer 2b, and the other insulating layer 2c of the electronic device mounting substrate 1 may have an electrode pad 3 on the surface thereof. Here, the electrode pad 3 may be provided on the surface of any one of the first insulating layer 2a, the second insulating layer 2b, and the other insulating layer 2c in the top view, and the first insulating layer 2a and the second insulating layer 2b may be provided. And any other surface of the insulating layer 2c, or all the insulating layers may be provided.

Electrodes for connecting an external circuit may be provided on the upper surface, side surface, or lower surface of the substrate 2. The electrodes for connecting an external circuit electrically connect the substrate 2 to the external circuit board or the electronic device 21 to the external circuit board.

Further, on the upper surface or the lower surface of the first insulating layer 2a, the second insulating layer 2b, and the other insulating layer 2c of the substrate 2, in addition to the electrode pad 3, the first wiring 5a, and the second wiring 5b, they are formed between insulating layers. A through conductor may be provided to connect the internal wiring and the internal wiring to each other up and down. These internal wirings or through conductors may be exposed on the surface of the substrate 2. The electrode pad 3, the first wiring 5a and the second wiring 5b, and the electrodes for connecting the external circuit may be electrically connected to each other by the internal wiring or the through conductor.

The electrode pad 3, the first wiring 5a, the second wiring 5b, the electrode for connecting an external circuit, the internal wiring, and the through conductor are such that the first insulating layer 2a, the second insulating layer 2b, and the other insulating layer 2c are electrically insulating ceramics. When it is composed of, it is composed of tungsten (W), molybdenum (Mo), manganese (Mn), silver (Ag) or copper (Cu), or an alloy containing at least one metal material selected from these. Further, in the electrode pad 3, the first wiring 5a, the second wiring 5b, the electrode for connecting the external circuit, the internal wiring and the through conductor, the first insulating layer 2a, the second insulating layer 2b and the other insulating layer 2c are made of resin. If so, an alloy containing copper (Cu), gold (Au), aluminum (Al), nickel (Ni), molybdenum (Mo) or titanium (Ti) or at least one metal material selected from these. Etc.

A plating layer may be provided on the exposed surface of the electrode pad 3, the electrode for connecting an external circuit, the internal wiring, and the through conductor. According to this configuration, the exposed surfaces of the electrodes for connecting external circuits, the internal wiring and the through conductor can be protected and oxidation can be suppressed. Further, according to this configuration, the electrode pad 3 and the electronic element 10 can be satisfactorily electrically connected via an electronic element connecting material 13 such as wire bonding. The plating layer may be, for example, coated with a Ni plating layer having a thickness of 0.5 μm to 10 μm, or the Ni plating layer and a gold (Au) plating layer having a thickness of 0.5 μm to 3 μm may be sequentially coated. good.

There is a gap between the first wiring 5a and the second wiring 5b. Due to this gap, the first wiring 5a and the second wiring 5b are electrically isolated and may have different potentials / signals, or have the same potential / signal and are conducted in another portion such as an upper layer or a lower layer. You may. The gap between the first wiring 5a and the second wiring 5b may be, for example, 20 μm or more, or 1% or more of one side of the substrate 2.

The first wiring 5a and the second wiring 5b may be thin wiring such as signal wiring, or may be wide plane wiring used for ground or power supply potential. Further, when the first wiring 5a and the second wiring 5b are wide plane wirings used for the ground or the power supply potential, another signal such as a signal wiring is formed in the gap between the first wiring 5a and the second wiring 5b. Wiring 5c may be provided.

The electronic element mounting substrate 1 fills the gap between the first wiring 5a and the second wiring 5b, and the first insulating film 6a is located from the upper surface of the first wiring 5a to the upper surface of the second wiring 5b. Generally, in the electronic element mounting substrate 1, a plurality of first wirings 5a and second wirings 5b are provided in the same layer between a plurality of insulating layers, and a gap is provided between the plurality of internal wirings. There is. In recent years, the substrate 1 for mounting an electronic device is required to be miniaturized and have improved electrical characteristics.

Therefore, the gap between the plurality of internal wirings (first wiring 5a and second wiring 5b) is further minimized, and the thickness of the internal wirings (first wiring 5a and second wiring 5b) is made thicker in order to reduce electrical resistance. There was a tendency to do. Further, there is a demand for the substrate 1 for mounting electronic devices to be thinner, and each insulating layer (first insulating layer 2a, second insulating layer 2b, and other insulating layers 2c) is also becoming thinner. Due to these plurality of requirements, in the step of laminating each insulating layer (first insulating layer 2a, second insulating layer 2b), the stacking liquid used at the time of laminating exceeds the limit amount permeating into the insulating layer, and the internal wiring is extended. In some cases, a short circuit may occur between a plurality of internal wirings (first wiring 5a and second wiring 5b). Here, the laminated liquid is a member provided when the insulating layers are bonded and fixed when the insulating layers are laminated. When each insulating layer is made of electrically insulating ceramic, it becomes a laminated liquid, but when each insulating layer is made of resin or the like, an adhesive or the like is also included in this.

On the other hand, the electronic element mounting substrate 1 according to the embodiment of the present invention has the above-described configuration, so that it is unnecessary between the first wiring 5a and the second wiring 5b of the electronic element mounting substrate 1. Short circuits can be reduced. In other words, by providing the first insulating film 6a so as to fill the gap between the first wiring 5a and the second wiring 5b, the laminating liquid used at the time of laminating penetrates into the insulating layer in the step of laminating each insulating layer. The first insulating film 6a suppresses the expansion of the first wiring 5a and the second wiring 5b even when the first insulating film 6a is included in the first wiring 5a and the second wiring 5b and extends at the time of laminating beyond the limit amount. Can be done. Therefore, it is possible to reduce unnecessary short circuits between the first wiring 5a and the second wiring 5b of the electronic device mounting substrate 1. At this time, the first insulating film 6a may be thicker than the first wiring 5a and the second wiring 5b. When the first insulating film 6a is thicker than the first wiring 5a and the second wiring 5b, the strength of the substrate 2 can be increased and the space can be further reduced.

Further, the gap between the plurality of internal wirings (first wiring 5a and second wiring 5b) of the electronic element mounting substrate 1 is further minimized, and the thickness of the internal wirings (first wiring 5a and second wiring 5b) is electric. When a plurality of insulating layers (first insulating layer 2a and second insulating layer 2b) are laminated in a thickened state in order to reduce resistance, the gap between the first wiring 5a and the second wiring 5b is an insulating layer and a space is created. It may be vacant. When this space is vacant, for example, the difference in thermal expansion between the space (gas) and the substrate 2 during the process of applying heat when operating the electronic element 10 or when attaching the electronic element 10 and other parts. As a result, stress may be applied to the substrate 2 around the space and cracks may occur. Further, due to the presence of space, when stress or vibration is applied from the lower surface of the electronic device mounting substrate 1, cracks or cracks may occur starting from the space.

On the other hand, the electronic device mounting substrate 1 according to the embodiment of the present invention has the above-mentioned configuration, so that space (gas) is less likely to be generated. This makes it possible to reduce the stress due to the difference in thermal expansion between the substrate 2 and the space during, for example, heat generation during operation of the electronic element 10 or heat applied when mounting the electronic element 10 and other parts, and cracks can be formed. It is possible to reduce the occurrence. Further, by reducing the generation of space, it is possible to reduce the occurrence of cracks or cracks starting from the space.

As the material of the insulating layer constituting the first insulating film 6a, for example, electrically insulating ceramics or a resin is used. The resin is, for example, a thermoplastic resin such as plastics.

Examples of the electrically insulating ceramics used as the material of the insulating layer forming the first insulating film 6a include an aluminum oxide-like sintered body, a mullite-like sintered body, a silicon carbide-based sintered body, and an aluminum nitride-based sintered body. , Silicon nitride sintered body, glass ceramic sintered body and the like. Examples of the resin used as the material of the insulating layer forming the first insulating film 6a include a thermoplastic resin, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, and a fluororesin. Examples of the fluororesin include polyester resin and ethylene tetrafluoride resin.

As in the example shown in FIGS. 1 and 2, the first wiring 5a, the second wiring 5b, and the other wiring 5c may be provided between a plurality of layers, and the first wiring 5a and the second wiring 5b are continuous. It may be provided between layers. In this case, the insulating layer provided between the two layers is the second insulating layer 2b having the first wiring 5a and the second wiring 5b provided above, and the first wiring 5a and the second wiring 5b provided below. It may be treated as the first insulating layer 2a corresponding to the second insulating layer 2b having. In other words, as in the examples shown in FIGS. 1 and 2, the second insulating layer 2b can also function as the first insulating layer 2a of the second insulating layer 2b provided below the second insulating layer 2b.

When the first wiring 5a and the second wiring 5b are provided between a plurality of insulating layers, the position where the first insulating film 6a is provided may be partially or wholly overlapped in the top view, or may be displaced. It may be provided. The position where the first insulating film 6a is provided is located at a position where a part or all of the first insulating film 6a overlaps in a top view. Therefore, for example, when the electronic element mounting substrate 1 has a mixture of analog signals and digital signals, it is clearly defined. The analog signal part and the digital signal part can be separated, and it is possible to reduce the noise on each part. Since the position where the first insulating film 6a is provided is offset from the top view, the step in the first insulating film 6a and the gap can be reduced, and the flatness of the surface can be maintained as the total of the substrate 2. It will be possible.

The first insulating layer 2a, the second insulating layer 2b, and the other insulating layer 2c and the first insulating film 6a may be made of the same material or may be different materials. When the first insulating layer 2a, the second insulating layer 2b, and the other insulating layer 2c and the first insulating film 6a are made of the same material, the thermal expansion rate, thermal conductivity, and firing of the first insulating film 6a The basic physical properties such as the temperature of the above can be similar to those of the first insulating layer 2a, the second insulating layer 2b, and other insulating layers 2c. Therefore, it can be stably manufactured when the electronic element mounting substrate 1 is manufactured. Further, even when the electronic element 10 generates heat even after the electronic element 10 is mounted, it is possible to reduce the occurrence of cracks and the like due to the difference in thermal expansion. When the first insulating layer 2a, the second insulating layer 2b, and the other insulating layer 2c and the first insulating film 6a are made of different materials, a material suitable for the case can be selected. For example, by using a material having a higher viscosity for the first insulating film 6a, it is possible to reduce the extension of the first wiring 5a and the second wiring 5b, and it is possible to make an appropriate selection according to the conditions.

The first insulating film 6a of the electronic device mounting substrate 1 may be integrally formed with the first insulating layer 2a. At this time, for example, the first insulating film 6a and the first insulating layer 2a may be simultaneously sintered. Since the first insulating film 6a and the first insulating layer 2a are integrally formed, it is possible to reduce the generation of a space between the first insulating film 6a and the first insulating layer 2a. Become. Therefore, it is possible to reduce the possibility that the first wiring 5a or the second wiring 5b crawls up the upper surface of the first insulating film 6a and comes into contact with the second wiring 5b or the first wiring 5a.

The portion of the first wiring 5a and / and the second wiring 5b that overlaps with the first insulating film 6a in the top view may have an inclined portion on the lower side in the cross-sectional view. At this time, the height of the inclined portion in the vertical cross-sectional view may be about the same as the thickness of the first insulating film 6a or less than or equal to the thickness of the first insulating film 6a. Since the first wiring 5a and / and the second wiring 5b have an inclined portion (Y-axis direction), when the first wiring 5a and / and the second wiring 5b are extended, the lateral direction (X-axis direction). ), So the possibility of short circuit can be further reduced.

The first wiring 5a and / and the second wiring 5b may be provided on the lower surface of the first insulating layer 2a or the upper surface of the second insulating layer 2b in a cross-sectional view. Both the first wiring 5a and the second wiring 5b may be provided on the lower surface of the first insulating layer 2a or the upper surface of the second insulating layer 2b, or may be provided on different surfaces. In any case, the effect of the present invention can be achieved by providing the first insulating film 6a between the first wiring 5a and the second wiring 5b.

The first insulating film 6a may overlap with the whole of the first wiring 5a and / and the second wiring 5b in the top view, or may overlap with only a part thereof. When the first insulating film 6a overlaps the entire first wiring 5a and / and the second wiring 5b in the top view, the first wiring 5a and the second wiring 5b crawl up on the surface of the first insulating film 6a. It is possible to reduce short circuits. Further, since the first insulating film 6a partially overlaps with the first wiring 5a and / and the second wiring 5b in the top view, electrical conduction with the internal wiring provided in the other insulating layer 2c is obtained. At the same time, it is possible to reduce the overall thickness of the substrate 2. Further, at this time, the size of the overlap between the first insulating film 6a and the first wiring 5a and / and the second wiring 5b is set to, for example, 30 μm or more, so that in the process of providing the first insulating film 6a, there is a deviation due to a process error. Even if this happens, it is possible to reduce the short circuit between the first wiring 5a and the second wiring 5b.

<Configuration of electronic device>
1 and 2 show an example of the electronic device 21. The electronic device 21 includes an electronic element mounting substrate 1 and an electronic element 10 mounted on the electronic element mounting substrate 1.

The electronic device 21 has an electronic element mounting substrate 1 and an electronic element 10 mounted on the electronic element mounting substrate 1. The electronic element 10 is, for example, an image pickup element such as a CMOS (Complementary Metal Oxide Semiconductor) or a CCD (Charge Coupled Device), a light emitting element such as an LED (Light Emitting Diode), or an integrated circuit such as an LSI (Large Scale Integrated). be. The electronic element 10 may be arranged on the upper surface of the substrate 2 via an adhesive. For this adhesive, for example, silver epoxy or thermosetting resin is used.

The electronic device 21 may have a lid 12 bonded to the upper surface of the electronic element mounting substrate 1 while covering the electronic element 10. Here, the substrate 1 for mounting the electronic element may be connected to the upper surface of the frame-shaped portion of the substrate 2, or may be provided so as to support the lid 12 and surround the electronic element 10 on the upper surface of the substrate 2. A frame-shaped body may be provided. Further, the frame-shaped body and the substrate 2 may be made of the same material, or may be made of different materials.

When the frame-shaped body and the substrate 2 are made of the same material, the substrate 2 may be made to be integrated with the insulating layer of the uppermost layer by providing an opening with the frame-shaped body, or separately. They may be joined with a brazing material or the like provided.

Further, as an example in which the substrate 2 and the frame-shaped body are made of different materials, the frame-shaped body may be made of the same material as the lid body joining material 14 for joining the lid body 12 and the substrate 2. At this time, by providing the lid body joining material 14 thickly, it is possible to have both the effect of adhesion and the effect of a frame-shaped body (member supporting the lid body 12). Examples of the lid bonding material 14 at this time include a thermosetting resin, a low melting point glass, a brazing material made of a metal component, and the like. Further, the frame-shaped body and the lid body 12 may be made of the same material, and in this case, the frame-shaped body and the lid body 12 may be configured as the same individual.

For the lid 12, for example, when the electronic element 10 is an image pickup element such as CMOS or CCD, or a light emitting element such as LED, a highly transparent member such as a glass material is used. Further, for the lid 12, for example, when the electronic element 10 is an integrated circuit or the like, a metal material or an organic material may be used.

The lid body 12 is bonded to the electronic element mounting substrate 1 via the lid body bonding material 14. Examples of the material constituting the lid bonding material 14 include a thermosetting resin, a low melting point glass, a brazing material made of a metal component, and the like.

The electronic device 21 has a substrate 1 for mounting an electronic device as shown in FIGS. 1 and 2. This makes it possible to improve the electrical characteristics.

<Electronic module configuration>
FIG. 2 shows an example of the electronic module 31 using the electronic device mounting substrate 1. The electronic module 31 has an electronic device 21 and a housing 32 provided so as to cover the upper surface of the electronic device 21 or the electronic device 21. In the example shown below, an imaging module will be described as an example for explanation.

The electronic module 31 has a housing 32 (lens holder). By having the housing 32, it is possible to further improve the airtightness or reduce the direct application of stress from the outside to the electronic device 21. The housing 32 is made of, for example, a resin or a metal material. Further, when the housing 32 is a lens holder, the housing 32 may incorporate one or more lenses made of resin, liquid, glass, crystal, or the like. Further, the housing 32 may be provided with a drive device or the like for driving up, down, left and right, and may be electrically connected to the electronic element mounting substrate 1.

The housing 32 may be provided with openings on at least one side in four directions when viewed from above. Then, an external circuit board may be inserted through the opening of the housing 32 and electrically connected to the electronic element mounting board 1. Further, in the opening of the housing 32, after the external circuit board is electrically connected to the electronic element mounting substrate 1, the gap of the opening is closed with a sealing material such as resin, and the inside of the electronic module 31 is airtight. It may have been done.

<Manufacturing method of electronic device mounting board and electronic device>
Next, an example of the manufacturing method of the electronic device mounting substrate 1 and the electronic device 21 of the present embodiment will be described with reference to FIGS. 3 and 4.

The electronic device mounting substrate 1 may be manufactured by a manufacturing method including the following steps. (1) A step of preparing a first insulating sheet 42a and a second insulating sheet 42b laminated with the first insulating sheet 42a. (2) A step of forming the first wiring paste 45a on the upper surface of the second insulating sheet 42b. (3) A step of forming the second wiring paste 45b on the upper surface of the second insulating sheet 42b with a gap from the first paste 45a. (4) The first insulating paste 46a is buried between the first wiring paste 45a and the second wiring paste 45b, and the upper surface of the first wiring paste 45a and the upper surface of the second wiring paste 45b are covered with the first insulating paste 46a. Process. (5) A step of laminating the first insulating sheet 45a on the upper surface of the second insulating sheet 45b to form the laminated body 42. The order of these steps is not defined in the order of numbers, and the order may be different, or a plurality of steps may be dealt with at once.

When the insulating sheet is made of, for example, a resin, it can be produced by the following manufacturing method. First, an insulating layer made of the corresponding resin is prepared as the first insulating layer 2a and the second insulating layer 2b. At this time, when the electronic device mounting substrate 1 has another insulating layer 2c, a resin layer to be the other insulating layer 2c can be provided by the same method. Next, the first wiring 5a and the second of the first insulating sheet 42a, the second insulating sheet 42b, and the other insulating sheet 42c obtained in the step (1) above by the screen printing method, the etching method, the plating method, or the like. Metallic materials (first wiring paste 45a, second wiring paste 45b, and other metal pastes) are applied or filled in the wiring 5b, the electrode pad 3, the external circuit connection electrode, the internal wiring, and the portion to be the through conductor.

Next, a resist layer to be the first insulating paste 46a is printed, applied or pasted on a predetermined place. After that, by heating, laminating, and adhering, a laminated body 42, which is a substrate 1 for mounting an electronic device made of resin, can be manufactured.

The first insulating sheet 42a and / and the second insulating sheet 42b of the electronic device mounting substrate 1 are ceramic green sheets containing a ceramic material as a main component, and the first insulating paste 46a is a ceramic paste containing a ceramic material as a main component. (6) It may have a step of firing the laminated body 42.

Hereinafter, the manufacturing method in the main part of the invention of the present embodiment will be shown. An example of the manufacturing method shown below is a case where the insulating sheet is a ceramic green sheet containing a ceramic material as a main component, and is a manufacturing method using a large number of substrates 2 and a wiring board.

The manufacturing process of the electronic device mounting substrate 1 is a step of preparing (1) a first insulating sheet 42a and a second insulating sheet 42b laminated with the first insulating sheet 42a as in the example shown in FIG. 3A. have. Examples of the insulating layer constituting the electronic device mounting substrate 1 include an aluminum oxide (Al ₂ O ₃ ) quality sintered body. When the first insulating sheet 42a and the second insulating sheet 42b to be the aluminum oxide (Al ₂ O _{3 ) quality sintered body are obtained, the powder of Al 2} O _{3 is mixed with silica (SiO 2} ) and magnesia as sintering aids. A powder such as (MgO) or Calcia (CaO) is added, a suitable binder, solvent and plasticizer are added, and then the mixture thereof is kneaded into a slurry.

After that, the first insulating sheet 42a and the second insulating sheet 42b for taking a large number of pieces can be obtained by a molding method such as a doctor blade method or a calendar roll method. At this time, when the electronic device mounting substrate 1 has another insulating layer 2c, an insulating sheet serving as the other insulating layer 2c can be provided by the same method.

The manufacturing process of the electronic device mounting substrate 1 includes (2) forming a first wiring paste 45a on the upper surface of the second insulating sheet 42b as shown in the example shown in FIG. 3 (b). In the manufacturing process of the electronic device mounting substrate 1, the second wiring paste 45b is formed on the upper surface of the second insulating sheet 42b (3) with a gap from the first paste 45a as shown in the example shown in FIG. 3 (b). Has a process.

Next, the first wiring 5a, the second wiring 5b, and the electrode pad 3 of the first insulating sheet 42a, the second insulating sheet 42b, and the other insulating sheet 42c obtained in the step (1) above by the screen printing method or the like. , External circuit connection electrodes, internal wiring, and parts to be through conductors are coated or filled with metal paste (first wiring paste 45a, second wiring paste 45b, and other metal paste). The metal paste is prepared by adding an appropriate organic binder and solvent to the metal powder, uniformly dispersing and kneading with a kneading means such as a ball mill or a planetary mixer, and then adding a required amount of solvent to print or fill through holes. It is produced by adjusting the viscosity to be suitable for.

This metal powder is a metal powder that is sintered by simultaneous firing with the first insulating sheet 42a, the second insulating sheet 42b, and other insulating sheets 42c in a later firing step, and is a metal powder that is sintered by simultaneous firing with tungsten (W), molybdenum (Mo), and the like. One or more of manganese (Mn), gold (Au), silver (Ag), copper (Cu), palladium (Pd), platinum (Pt) and the like can be mentioned. In the case of two or more types, any form such as mixing, alloy, coating, etc. may be used. The metal paste may contain glass or ceramics in order to increase the bonding strength with the first insulating sheet 42a, the second insulating sheet 42b, and the other insulating sheet 42c.

Here, the step (2) and the step (3) may be performed at the same time or separately. When the step (2) and the step (3) are performed at the same time, for example, in the screen printing method, the first wiring paste 45a and the second wiring paste 45b can be formed on the same mask and printed. can. As a result, it is possible to reduce the deviation between the first wiring paste 45a and the second wiring paste 45b, and it is possible to further reduce the short circuit between the first wiring paste 45a and the second wiring paste 45b.

When the step (2) and the step (3) are performed separately, for example, the first wiring paste 45a and the second wiring paste 45b are applied to the lower surface of the first insulating sheet 42a or the upper surface of the second insulating sheet 42b. Each can be printed separately. Further, even when the first wiring paste 45a and the second wiring paste 45b are provided on the same surface, if it is desired to provide the respective thicknesses to different thicknesses, printing can be performed separately.

This makes it possible to divide the stress when printing the first wiring paste 45a and the second wiring paste 45b into the first insulating sheet 42a and the second insulating sheet 42b. Further, since the thicknesses of the first wiring paste 45a and the second wiring paste 45b can be made different, the resistance of either wiring can be further reduced, and the electrical characteristics can be improved.

Here, before the step (2) and / and the step (3), or at the same time as the step (2) or / and the step (3), or the step (2) or / and the step (3). After that, the first ceramic shaman green sheet 42a, the second insulating sheet 42b, and / or other insulating sheet 42c may be processed by a mold or the like. For example, an opening for accommodating the electronic element 10 may be formed in the central portion of any of the insulating sheets, or a through hole may be provided in a portion serving as a through conductor that conducts the upper and lower layers. Further, the processing by the mold or the like may be performed after laminating, which will be described later, or may be processed in a plurality of times in each step. Further, as a method for processing the insulating sheet, in addition to the above-mentioned mold processing, processing with a laser, etching processing, or the like may be used.

In the manufacturing process of the electronic element mounting substrate 1, as shown in the example shown in FIG. 3C, (4) the first insulating paste 46a is embedded between the first wiring paste 45a and the second wiring paste 45b, and the first insulating paste 46a is embedded. It has a step of covering the upper surface of the 1 wiring paste 45a and the upper surface of the 2nd wiring paste 45b with the 1st insulating paste 46a. The first insulating paste 46a is obtained by adding an appropriate organic binder and solvent to the first insulating sheet 42a, the second ceramic green sheet 42b, and other ceramic powder used for producing the insulating sheet 42c, and using a ball mill, a planetary mixer, or the like. A product prepared by uniformly dispersing and kneading with a kneading means and then adjusting the viscosity by adding a required amount of a solvent can be used. The first insulating paste 46a may be provided by the screen printing method or the like described above in the same manner as the first wiring paste 45a and the second wiring paste 45b.

The first insulating paste 46a may be provided so as to be overlapped on the steps (2) and (3), that is, after the first wiring paste 45a and the second wiring paste 45b are formed. Further, for example, after the first wiring paste 45a and the second wiring paste 45b are provided on the upper surface of the second insulating sheet 42b, the first insulating paste 46a is printed on the lower surface of the first insulating sheet 42a, and in the step of laminating described later. The first insulating paste 46a may be embedded between the first wiring paste 45a and the second wiring paste 45b, and may be provided so as to cover the upper surface of the first wiring paste 45a and the upper surface of the second wiring paste 45b.

In the manufacturing process of the electronic device mounting substrate 1, as shown in FIGS. 4 (a) and 4 (b), (5) the first insulating sheet 42a is laminated on the upper surface of the second insulating sheet 42b to form a laminated body. It has a step of forming 42. Here, the laminated liquid is applied to the lower surface of the first insulating sheet 42a or the upper surface of the second insulating sheet 42b. At this time, for example, the first wiring paste 45a and the second wiring paste 4
By applying the laminate liquid so as to avoid 5b and other metal pastes, the first wiring paste 45a, the second wiring paste 45b, and other metal pastes are spread by the laminate liquid, and the first wiring paste 45a and the second wiring paste 45b are used. , It is possible to further reduce short circuits between other metal pastes. Further, by applying the laminate liquid including, for example, the first wiring paste 45a, the second wiring paste 45b, and other metal pastes, it is possible to further improve the stackability.

After appropriately applying the laminated liquid, the first insulating sheet 42a, the second insulating sheet 42b, and other insulating sheets 42c are laminated and pressed. This makes it possible to produce an insulating sheet laminate to be the substrate 2 (the substrate for mounting the electronic device 1).

The manufacturing process of the electronic device mounting substrate 1 includes (6) a step of firing the laminated body 42. Next, the insulating sheet laminate to be the substrate 2 is fired at a temperature of about 1500 ° C. to 1800 ° C. to obtain a multi-layered wiring board in which a plurality of substrates 2 (electronic element mounting substrate 1) are arranged. By this step, the above-mentioned first wiring paste 45a, second wiring paste 45b, and other metal pastes are fired at the same time as the insulating sheet to be the substrate 2 (the substrate for mounting the electronic element 1), and the first wiring 5a, The second wiring 5b, the electrode pad 3, the electrode for connecting an external circuit, the internal wiring, and the through conductor.

Next, the multi-layered wiring board obtained by firing is divided into a plurality of substrates 2 (electronic element mounting substrate 1). In this division, a method of forming a dividing groove in a large number of wiring boards along the outer edge of the substrate 2 (electronic element mounting substrate 1) and breaking along the dividing groove to divide the wiring board, etc. Therefore, a method of cutting along the outer edge of the substrate 2 (electronic element mounting substrate 1) can be used.

The dividing groove can be formed by cutting a multi-piece wiring board smaller than the thickness of the multi-piece wiring board after firing, but the cutter blade may be pressed against the insulating sheet laminate for the multi-piece wiring board or dicing. It may be formed by making a cut smaller than the thickness of the insulating sheet laminate by an apparatus. Further, the multi-layer wiring board can be divided into a plurality of substrates 2 (electronic element mounting substrate 1) by cutting by a dicing method or a laser without forming a dividing groove on the multi-element wiring board. .. Before or after dividing the above-mentioned multi-layer wiring board into a plurality of substrates 2 (electronic element mounting substrate 1), an electrode pad 3 and an external connection pad are used by electroplating or electroless plating, respectively. And the exposed wiring conductors may be plated.

Next, the electronic element 10 is mounted on the electronic element mounting substrate 1. The electronic element 10 is electrically bonded to the electronic element mounting substrate 1 by wire bonding, gold bumps, solder balls, or the like. At this time, an adhesive or the like may be provided on the electronic element 10 or the electronic element mounting substrate 1 and fixed to the electronic element mounting substrate 1. Further, after the electronic element 10 is mounted on the electronic element mounting substrate 1, the lid body 12 may be joined by the lid body joining material 14.

Generally, there is a demand for the electronic element mounting substrate 1 to be thinner, and each insulating layer is also becoming thinner. As a result, in the step of laminating each insulating layer, the laminating liquid used at the time of laminating exceeds the limit amount permeating into the insulating layer and is contained in the first wiring paste 45a and / and the second wiring paste 45b. The wiring paste 45a and / and the second wiring paste 45b may be extended and a short circuit may occur. Further, in the step of applying the laminating liquid and then laminating, the first wiring paste 5a and / and the second wiring paste 5b may dissolve in the laminating liquid due to the pressure at the time of laminating, and a short circuit may occur.

On the other hand, in the manufacturing method according to the present invention, the first insulating paste 46a is provided so as to fill the space between the first wiring paste 45a and the second wiring paste 45b. This makes it possible to reduce the occurrence of a short circuit between the first wiring paste 45a and the second wiring paste 45b due to the inclusion of the adhesive liquid and / or the pressure of pressurization during laminating.

(Second embodiment)
Next, a method for manufacturing the electronic device mounting substrate 1 and the electronic device mounting substrate 1 according to the second embodiment of the present invention will be described with reference to FIGS. 5 to 7. Note that FIG. 5 shows the shapes of the electronic device mounting substrate 1 and the electronic device 21 in the present embodiment, and FIGS. 6 to 7 show schematic views showing a manufacturing method of a main part of the second embodiment. .. The electronic element mounting substrate 1 of the present embodiment is different from the electronic element mounting substrate 1 of the first embodiment in that the shape of the first insulating film 6a in a cross-sectional view is different.

In the example shown in FIG. 5, the first insulating film 6a of the electronic device mounting substrate 1 has a recessed portion in the middle portion of the gap between the first wiring 5a and the second wiring 5b in a cross-sectional view. As in the example shown in FIG. 5, even if the first insulating film 6a has a recessed portion in the center, the first insulating film 6a is provided so as to overlap the ends of the first wiring 5a and the second wiring 5b. Therefore, the effect of the present invention can be achieved.

Further, in general, when the insulating layer is an electrically insulating ceramic, the thickness or shape of the wiring or the like provided inside the substrate 2 is absorbed by the insulating sheet at the time of manufacture, and the shape of the wiring or the like is formed on the surface of the substrate 2. It has a structure that is hard to appear. However, in recent years, the electronic element mounting substrate 1 has been required to be thinner. Due to this demand for thinning, the thickness or shape of the first wiring 5a, the second wiring 5b and / and the first insulating film 6a is absorbed by the first insulating layer 2a, the second insulating layer 2b or the other insulating layer 2c. It is difficult, for example, if there is a step or the like, the shape may appear on the surface of the substrate 2 and the equilibrium degree of the surface of the substrate 2 may be deteriorated. On the other hand, as shown in the example shown in FIG. 5, the first insulating film 6a of the electronic device mounting substrate 1 has a recessed portion in the vicinity of the central portion, so that the first insulating layer 2a is replaced with the first insulating film 6a. It is possible to get into the recessed part of. Therefore, the board 1 for mounting the electronic element is thinned, and the thickness and shape of the first wiring 5a, the second wiring 5b, and the first insulating film 6a cannot be completely absorbed by the first insulating layer 2a or the second insulating layer 2b, and the electronic element. It is possible to reduce the case where the degree of equilibrium on the surface of the mounting substrate 1 deteriorates. Therefore, it is possible to stabilize the mounting of the electronic element 10.

6 to 7 show a schematic diagram showing a method of manufacturing a main part in the present embodiment. In the schematic diagram of the main part of the manufacturing method shown in FIGS. 6 to 7, in the step of applying the first insulating paste 46a, the first insulating paste 46a is a cross-sectional view of the first wiring paste 45a and the second wiring paste 45b. It is applied so as to have a dent in the gap. By applying the first insulating paste 46a in this way, the first insulating sheet 42a is embedded in the recessed portion of the first insulating paste 46a in the laminating step shown in FIG. 7A. As a result, the electronic device mounting substrate 1 as shown in the example shown in FIG. 5 can be manufactured, and the case where the equilibrium degree on the surface of the electronic device mounting substrate 1 deteriorates can be reduced. Therefore, it is possible to stabilize the mounting of the electronic element 10.

As a method of applying the first insulating paste 46a as in the examples shown in FIGS. 6 to 7, for example, in the case of screen printing, the pressure of the squeegee is adjusted or the member used for the mask is changed to a soft material. It can be applied by adjusting the paste. It can also be created by printing the first insulating paste 46a twice so that a dented portion is formed.

Further, as in the example shown in FIGS. 5 to 7, the corner portion of the first insulating film 6a may draw an arc. As a result, stress is concentrated on the corners of the first insulating film 6a (first insulating paste 46a) in steps such as laminating, and cracks or cracks occur in the first insulating film 6a (first insulating paste 46a). Can be reduced.

As in the example shown in FIGS. 6 to 7, the first insulating paste 46a may extend laterally in the cross-sectional view due to the stress at the time of laminating. As a result, the thickness of the first insulating paste 46a on the upper surface portions of the first wiring paste 45a and the second wiring paste 45b can be made thinner, and local changes in the cross-sectional view can be reduced. It is possible to further reduce the case where the degree of equilibrium on the surface of the mounting substrate 1 deteriorates. Therefore, it is possible to stabilize the mounting of the electronic element 10.

(Third embodiment)
Next, the electronic device mounting substrate 1 according to the third embodiment of the present invention will be described with reference to FIG. The electronic element mounting substrate 1 of the present embodiment differs from the electronic element mounting substrate 1 of the first embodiment in that it has a second insulating film 6b, a first insulating film 6a and / and a first. 2 The position of the insulating film 6b is different between the plurality of layers in the top view.

In the example shown in FIG. 8, the first wiring 5a and / and the second wiring 5b are at the end located on the outer edge side of the second insulating layer 2b, from the upper surface of the first wiring 5a and / and the second wiring 5b. The second insulating film 6b is provided over the upper surface of the two insulating layers 2b. In general, in recent years, the electronic element mounting substrate 1 is required to be miniaturized. Due to this requirement, the distance between the end portion of the first wiring 5a and / and the second wiring 5b located on the outer edge side of the second insulating layer 2b and the end portion located on the outer edge side of the second insulating layer 2b becomes narrower. Is required.

Therefore, in the step of laminating each insulating layer in combination with the above-mentioned request for thinning, the laminating liquid used at the time of laminating penetrates into the insulating layer (first insulating layer 2a, second insulating layer 2b or other insulating layer 2c). In some cases, the internal wiring (first wiring 5a and / and the second wiring 5b) may be extended due to the pressure at the time of stacking and exposed to the side surface of the substrate 2. The internal wiring (first wiring 5a and / and the second wiring 5b) is exposed to the side surface of the substrate 2 and short-circuited with other components or exposed internal wiring (first wiring 5a and / and the second wiring 5b). ) May have progressed to the inside, resulting in malfunction of the electronic device 21.

On the other hand, as in the example shown in FIG. 8, the first wiring 5a and / and the second wiring 5b are the first wiring 5a and / and the second wiring at the end located on the outer edge side of the second insulating layer 2b. By having the second insulating film 6b from the upper surface of the 5b to the upper surface of the second insulating layer 2b, the first wiring 5a and / and the second wiring 5b of the electronic element mounting substrate 1 are exposed to the side surface of the substrate 2. It is possible to reduce the amount of wiring. In other words, by covering the terminals on the outer edge side of the first wiring 5a and / and the second wiring 5b with the second insulating film 6b, the laminated liquid used at the time of laminating penetrates into the insulating layer in the step of laminating each insulating layer. The second insulating film 6b expands the first wiring 5a and / and the second wiring 5b even when it is included in the first wiring 5a and / and the second wiring 5b and extends at the time of laminating beyond the limit amount. It can be suppressed.

Therefore, it is possible to reduce the exposure of the first wiring 5a and / and the second wiring 5b of the electronic device mounting substrate 1 to the side surface of the substrate 2. As a result, the first wiring 5a and / and the second wiring 5b are exposed to the side surface of the substrate 2, resulting in a short circuit with other components or an exposed internal wiring (first wiring 5a and / and the second wiring 5b). Deterioration of the surface of the electronic device 21 progresses to the inside, and it is possible to reduce the possibility of malfunction of the electronic device 21.

Further, the outer end portion of the second insulating film 6b may be provided at a position overlapping the outer edge of the second insulating layer 2b in the top view, or may be provided inside the outer edge of the second insulating layer 2b. It is also good. Since the outer end of the second insulating film 6b is provided at a position overlapping the outer edge of the second insulating layer 2b in the top view, it is possible to reduce delamination in the insulating layers, for example. Further, since the outer end portion of the second insulating film 6b is provided inside the outer edge of the second insulating layer 2b, the second insulating layer 2b is exposed to the side surface, and the thickness of the second insulating layer 6b causes the second insulating layer 2b to be exposed to the side surface. It is possible to reduce the risk that the housing 32 cannot be provided because the external dimensions of the substrate 2 are changed.

As shown in the example shown in FIG. 8, the electronic device mounting substrate 1 is provided with a first wiring 5a, a second wiring 5b, a first insulating film 6a, and a second insulating film 6b in a plurality of layers, and the first wiring. The gap between the 5a and the second wiring 5b is provided so as to be offset in the top view. In general, when the gaps of the substrate 2 having a plurality of insulating layers and internal wiring are overlapped in a top view, the surface of the substrate 2 may be deformed or a space may be generated inside the substrate 2 due to the gaps. On the other hand, by locating the first insulating layer 6a and the gap so as not to overlap each other as in the example shown in FIG. 8, the surface of the substrate 2 described above is deformed or the gap causes the inside of the substrate 2 to be deformed. It is possible to reduce the generation of space. In particular, when the gap is filled at a position overlapping the mounting region of the electronic element 10, the mounting region is not easily deformed, so that the mounting stability of the electronic element 10 on the substrate 2 is improved.

In the method for manufacturing the electronic element mounting substrate 1 as shown in FIG. 8, in addition to the step of providing the first insulating film 6a in the step described in the first embodiment, the first wiring 5a (first wiring paste 45a) is provided. ) Or / and the second wiring 5b (second wiring paste 45b) is located on the upper surface of the first wiring 5a (first wiring paste 45a) and / and the second wiring 5b (with respect to the outer edge of the second insulating sheet 42b). A step of covering from the upper surface of the second wiring paste 45b) to the upper surface of the second insulating sheet 42b with the second insulating paste 46b is further provided. By obtaining such a step, it becomes possible to manufacture the electronic device mounting substrate 1 as shown in the example shown in FIG. 8, and thereby, the first wiring 5a and / and the first wiring 5a and / and the electronic element mounting substrate 1 of the electronic device mounting substrate 1 can be manufactured. It is possible to reduce the exposure of the 2 wirings 5b to the side surface of the substrate 2. As a result, the first wiring 5a and / and the second wiring 5b are exposed to the side surface of the substrate 2, and unexpected short circuit or deterioration with other parts progresses to the internal wiring, resulting in malfunction of the electronic device 21. It is possible to reduce the risk of occurrence.

The second insulating paste 46b to be the second insulating film 6b can be provided by the same method as the first insulating paste 46a to be the first insulating film 6a described in the first embodiment (for example, a screen printing method or the like). .. The material constituting the second insulating film 6b is made of a material similar to that of the first insulating film 6a. Further, the first insulating film 6a and the second insulating film 6b may be provided with different materials, or may be provided with the same kind of material. When the first insulating film 6a and the second insulating film 6b are provided with different materials, the physical characteristics of the first insulating film 6a and the second insulating film 6b or the first insulating paste 46a and the second insulating paste 46b, respectively. Since the viscosity and the like of the above can be changed as appropriate, it is possible to appropriately select the optimum material for each effect. When the first insulating film 6a and the second insulating film 6b are made of the same material, one plate is used for the step of applying the first insulating film 6a and the second insulating film 6b. And the step of applying can be completed in one step.

The first insulating paste 46a to be the first insulating film 6a and the second insulating paste 46b to be the second insulating film 6b may be applied in the same step or may be applied in separate steps. By applying the first insulating paste 46a and the second insulating paste 46b in the same process, it is possible to minimize the misalignment between the first insulating paste 46a and the second insulating paste 46b. Further, by applying the first insulating paste 46a and the second insulating paste 46b in different steps, the thicknesses of the first insulating paste 46a and the second insulating paste 46b can be made different, and the respective effects can be further improved. It is possible to make the thickness suitable for the above, and it is possible to enhance the effect in the present invention.

(Fourth Embodiment)
Next, the electronic device mounting substrate 1 according to the fourth embodiment of the present invention will be described with reference to FIGS. 9 to 11. Note that FIG. 9 shows the shapes of the electronic device mounting substrate 1 and the electronic device in the present embodiment, and FIG. 10 is a schematic view showing an enlarged view of the main part A inside FIG. 9 and a cross-sectional view thereof. FIG. 11 shows an enlarged view of a main part A according to another aspect of the present embodiment and a schematic view showing a cross-sectional view thereof. The main part A is indicated by a two-dot chain line. The electronic element mounting substrate 1 of the present embodiment differs from the electronic element mounting substrate 1 of the first embodiment in that the substrate 2 has a through hole (the mounting method of the electronic element 10 is different), and the substrate 2 Is a point having a notch 7 and a metallized layer 7a in a part of the side surface.

In the example shown in FIG. 9, the electronic element mounting substrate 1 has a through hole at a position overlapping with the electronic element 10 in a top view. Further, the electronic element 10 mounted on the electronic device 21 is provided so as to be located in a through hole provided in the substrate 2 in a top view. With such a configuration, for example, when the electronic element 10 is an image pickup element, the height of the electronic module 31 can be further reduced. Further, although the electronic element mounting substrate 1 has the electronic component 22 on the surface, in the example structure shown in FIG. 9, more electronic component 22 can be mounted, so that the electronic device can be further mounted. Miniaturization is possible.

The electronic component 22 is, for example, a passive component such as a chip capacitor, an inductor, a resistor, or an OIS.
(Optical Image Stabilization), signal processing circuits, active components such as gyro sensors, etc. These electronic components 22 are connected to a pad provided on the substrate 2 by a joining material with solder, a conductive resin, or the like. Note that these electronic components 22 may be connected to the electronic element 10 via internal wiring or the like provided on the substrate 2.

In the case of mounting as shown in the example shown in FIG. 9, the electronic element 10 is connected to the electronic element mounting substrate 1 by an electronic element connecting material 13 such as a gold bump or a solder ball, and then the connection is strengthened by a sealing material. , Further may be sealed. Further, for example, it may be connected by an electronic element connecting material 13 such as ACF (Anisotropic Conductive Film).

In the example shown in FIG. 9, the electronic device mounting substrate 1 has a notch 7 from the side wall of the first insulating layer 2a to the side wall of the second insulating layer 2b, and the notch 7 is provided with the metallized layer 7a. Has been done. As described above, the electronic device mounting substrate 1 has the notch 7, and the notch 7 has the metallized layer 7a, so that the notch 7 and the metallized layer 7a provided in the notch 7 are side terminals. Can be used as. Therefore, in the electronic module 31 using the electronic element mounting substrate 1, the housing 32 and the electronic element mounting substrate 1 can be electrically connected to each other.

Further, since the electronic element mounting substrate 1 has the notch 7, the legs of the housing 32 and the like can be fitted into the notch 7. Further, by providing the metallize layer 7a in the notch 7, the housing 32 and the electronic device mounting substrate 1 can be fixed with a metal material such as solder, and the connection strength can be further improved. Further, the notch 7 and / and the metallized layer 7a may be provided in the other insulating layer 2c, and the cut provided in the first insulating layer 2a, the second insulating layer 2b and / and the other insulating layer 2c. The size of the notch 7 may be different for each layer.

The metallized layer 7a may be made of a material similar to that of the first wiring 5a or the second wiring 5b. Here, the metallized layer 7a and the first wiring 5a and / and the second wiring 5b may be made of the same material or may be made of different materials. Since the metallized layer 7a and the first wiring 5a and / and the second wiring 5b are made of the same material, the physical properties and characteristics can be made equal, so that the specifications at the time of manufacturing can be made uniform. .. Further, when the metallized layer 7a and the first wiring 5a and / and the second wiring 5b are made of different materials, the physical properties and characteristics can be made equal, so that a material having specifications that are easier to manufacture can be appropriately used. It becomes possible to select. In particular, since the metallized layer 7a is provided on the side surface, it is possible to select a material having a high viscosity by making the material of the metallized layer 7a different from that of the first wiring 5a and / or the second wiring 5b.

Further, as in the example shown in FIG. 9, the first wiring 5a and / and the second wiring 5b of the electronic device mounting substrate 1 have an end portion located on the outer edge side of the second insulating layer 2b up to the notch 7. The upper surface of the end portion of the first wiring 5a and / and the second wiring 5b extending and located in the notch 7 is covered with the third insulating film 6c. With such a configuration, it is possible to reduce the exposure of the first wiring 5a and / and the second wiring 5b located in the notch 7 of the electronic device mounting substrate 1 to the side surface of the notch 7. In other words, by covering the terminals on the outer edge side of the first wiring 5a and / and the second wiring 5b with the third insulating film 6c, the laminated liquid used at the time of laminating penetrates into the insulating layer in the step of laminating each insulating layer. The third insulating film 6c expands the first wiring 5a and / and the second wiring 5b even when it is included in the first wiring 5a and / and the second wiring 5b and extends at the time of laminating beyond the limit amount. It can be suppressed.

Therefore, it is possible to reduce the exposure of the first wiring 5a and / and the second wiring 5b of the electronic device mounting substrate 1 to the side surface of the notch 7. As a result, the first wiring 5a and / and the second wiring 5b are exposed to the side surface of the notch 7, resulting in an unexpected short circuit with the housing 32, or the exposed first wiring 5a and / and the second wiring 5b. It is possible to reduce the fact that the diameter of the notch 7 changes and the legs of the housing 32 do not fit.

Further, the ends of the first wiring 5a and / and the second wiring 5b may be electrically connected to the metallized film 7a provided in the notch 7. Further, at this time, even if the third insulating film 6c is provided between the first wiring 5a or the second wiring 5b electrically connected to the metallized film 7a and the second wiring 5b or the first wiring 5a. good. This makes it possible to reduce unnecessary short circuits between the first wiring 5a or the second wiring 5b electrically connected to the metallized layer 7a and the other provided second wiring 5b or the first wiring 5a.

In other words, the third insulating film 6c is provided so as to fill the gap between the first wiring 5a or the second wiring 5b electrically connected to the metallized layer 7a and the other provided second wiring 5b or the first wiring 5a. As a result, in the step of laminating each insulating layer, the first wiring 5a or the second wiring 5b electrically connected to the metallized layer 7a and others exceed the limit amount at which the laminating liquid used at the time of laminating penetrates into the insulating layer. It is possible to prevent the first wiring 5a and / and the second wiring 5b from spreading when they are included in the second wiring 5b or the first wiring 5a provided at the position of the above and are extended during stacking. can.

Therefore, an unnecessary short circuit between the first wiring 5a or the second wiring 5b electrically connected to the metallized layer 7a of the electronic device mounting substrate 1 and the second wiring 5b or the first wiring 5a provided elsewhere. Can be reduced. Further, as described above, the first wiring 5a and / and the second wiring 5b are exposed to the side surface of the notch 7, resulting in an unexpected short circuit with the housing 32 or the exposed first wiring 5a and / and the second wiring. The diameter of the notch 7 is changed by 5b, and it is possible to reduce the fact that the legs of the housing 32 do not fit.

In the example shown in FIGS. 10 and 11, an enlarged view of the main part A of the fourth embodiment and a schematic view showing a cross-sectional view thereof are shown. In the present embodiment, the outer edge of the third insulating film 6c may be located inside the outer edge of the notch 7 as in the example shown in FIG. 10 in the top view, or may overlap as in the example shown in FIG. You may. Since the outer edge of the third insulating film 6c is located inside the outer edge of the notch 7 as shown in the example shown in FIG. 10 in the top view, the diameter of the notch 7 changes depending on the thickness of the third insulating film 6c. It is possible to reduce the possibility that the legs of the housing 32 do not fit. Further, as in the example shown in FIG. 11, the outer edge of the third insulating film 6c overlaps with the outer edge of the notch 7, so that the first wiring 5a or the second wiring 5b electrically connected to the metallized layer 7a is formed. It is possible to make the area where the third insulating layer 6a and the third insulating layer 6a overlap larger, and it is possible to further reduce the occurrence of a short circuit with the second wiring 5b or the first wiring 5a provided in addition to the above.

Further, as in the example shown in FIG. 11B, when the outer edge of the third insulating film 6c overlaps the outer edge of the notch 7 in the top view, the third insulating film 6c covers the side surface of the notch 7. Further, the outer side thereof may be covered with the metallize layer 7a. With such a configuration, the first wiring layer 5a or the second wiring layer 5b electrically connected to the metallize layer 7a can be pressed by the third insulating film 6a and the metallize layer 7a, and the metallize layer 7a and the second wiring layer 5b can be electrically pressed. It is possible to improve the bonding strength between the first wiring layer 5a or the second wiring layer 5b and the substrate 2 connected to the substrate 2. Therefore, it is possible to improve the reliability of the electronic device mounting substrate 1.

Further, as in the example shown in FIG. 11B, when the first wiring 5a and the second wiring 5b are provided between a plurality of insulating layers, the metallized layer 7a and the first wiring provided in the notch 7 are provided. It may have layers that are not electrically connected to the layer 5a or the second wiring layer 5b. At this time, the second insulating film 6b may be provided from the end of the first wiring layer 5a or the second wiring layer 5b on the notch 7 side to the notch 7. Further, at this time, the second insulating film 6b may or may not cover the side wall of the notch 7. Even in such a configuration, it is possible to reduce the exposure of the first wiring 5a or the second wiring 5b of the electronic device mounting substrate 1 to the side surface of the notch 7. As a result, the first wiring 5a or the second wiring 5b is exposed to the side surface of the notch 7, which causes an unexpected short circuit with the housing 32 or the exposed diameter of the notch 7 due to the exposed first wiring 5a or the second wiring 5b. However, it is possible to reduce the fact that the legs of the housing 32 do not fit.

In the method of manufacturing the electronic element mounting substrate 1 as shown in FIGS. 9 and 10, in addition to the steps described in the first embodiment, the first wiring 5a (first wiring paste 45a) or the second wiring 5b The step of providing the (second wiring paste 45b) over the side wall of the second insulating sheet 42b, and the first wiring 5a (first wiring paste 45a) or the second wiring 5b (second wiring paste 45b) extended to the notch 7 side. ), The step of covering the upper surface of the first wiring 5a or the second wiring 5b provided at another position with the third insulating paste 46c and the step of covering the side surface of the notch 7 with the metallized film 7a. I have. By obtaining such a step, it becomes possible to manufacture the electronic device mounting substrate 1 as shown in the examples shown in FIGS. 9 to 10. Further, according to this configuration, other wiring is provided from the upper surface of the first wiring 5a (first wiring paste 45a) or the second wiring 5b (second wiring paste 45b) extended to the notch 7 side of the electronic element mounting substrate 1. It is possible to reduce the short circuit between the second wiring 5b or the first wiring 5a.

As a step of covering the side surface of the notch 7 with the metallized film 7a, for example, using a screen printing method or the like, using a plate making so that the printing is located inside the side surface of the notch 7, from the upper surface of the notch 7. Examples thereof include a method of applying a metal paste to be a metallized film 7a.

In the method of manufacturing the electronic element mounting substrate 1 as shown in FIG. 11, in addition to the steps described in the first embodiment, the first wiring 5a (first wiring paste 45a) or the second wiring 5b (second wiring 5b). In the step of providing the wiring paste 45b) over the side wall of the second insulating sheet 42b, and in the side wall of the second insulating sheet 42 of the first wiring 5a (first wiring paste 45a) or the second wiring 5b (second wiring paste 45b). , A step of covering with a third insulating paste 46c is provided. At this time, similarly to the manufacturing methods of FIGS. 9 to 10, the side surface of the notch 7, the first wiring 5a (first wiring paste 45a) or the second wiring 5b (second wiring paste 45b), and the third wiring. A step of covering the insulating film 6c (third insulating paste 46c) with the metallized film 7a may be provided.

By obtaining such a process, it becomes possible to manufacture the electronic device mounting substrate 1 as shown in the example shown in FIG. Further, the effect of the present invention can be obtained, and the first wiring layer 5a or the second wiring layer 5b electrically connected to the metallize layer 7a can be suppressed by the third insulating film 6c and the metallize layer 7a. This makes it possible to improve the bonding strength between the first wiring layer 5a or the second wiring layer 5b electrically connected to the metallized layer 7a and the substrate 2. Therefore, it is possible to improve the reliability of the electronic device mounting substrate 1.

The third insulating paste 46c to be the third insulating film 6c can be provided by the same method as the first insulating paste 46a to be the first insulating film 6a described in the first embodiment (for example, screen printing method or the like). .. The material constituting the third insulating film 6c is made of a material similar to that of the first insulating film 6a.

The present invention is not limited to the example of the above-described embodiment, and various modifications such as numerical values are possible. Further, for example, in the example shown in FIGS. 1 to 7, the shape of the electrode pad 3 is rectangular in the top view, but it may be circular or other polygonal shape. Further, the arrangement, number, shape, mounting method of the electronic element, and the like of the electrodes 3 in this embodiment are not specified. The various combinations of the feature portions in the present embodiment are not limited to the examples of the above-described embodiments.

1 ... Electronic element mounting substrate 2 ... Base 2a ... First insulating layer 2b ... Second insulating layer 2c ... Other insulating layers 3 ... Electrode pads 5 ...・ ・ Wiring 5a ・ ・ ・ First wiring 5b ・ ・ ・ Second wiring 5c ・ ・ ・ Other signal wiring 5c
6 ... Insulating film 6a ... First insulating film 6b ... Second insulating film 6c ... Third insulating film 7 ... Notch 7a ... Metallized layer 10 ... Electronic element 12 ... lid 13 ... electronic element connecting member 14 ... lid joining material 21 ... electronic device 22 ... electronic component 31 ... electronic module 32 ... housing 42 ... Insulation sheet 42a ... First insulation sheet 42b ... Second insulation sheet 45 ... Internal wiring paste 45a ... First wiring paste 45b ... Second wiring paste 46a ... First insulation paste 46b ... Second insulation Paste 46c ... Third insulating paste

Claims (8)

With the first insulating layer
The second insulating layer located on the lower surface of the first insulating layer and
The first wiring located between the first insulating layer and the second insulating layer,
A second wiring located between the first insulating layer and the second insulating layer and having a gap between the first wiring and the first wiring.
A first insulating film located from the upper surface of the first wiring to the upper surface of the second wiring while filling the gap.
A notch provided from the side wall of the first insulating layer to the side wall of the second insulating layer, and
It is provided with a metallized layer provided in the notch.
In the first wiring and / and the second wiring, the first end portion located on the outer edge side of the second insulating layer extends to the notch.
The upper surface of the first wiring and / and the second wiring located in the notch and located on the opposite side of the first end is covered with a third insulating film. A board for mounting electronic devices. The substrate for mounting an electronic device according to claim 1, wherein the first insulating film is integrally formed with the first insulating layer. The electron according to claim 1 or 2, wherein the first end portion of the first wiring and / and the second wiring located in the notch is also covered with the third insulating film. Board for mounting elements. The electronic device mounting substrate according to any one of claims 1 to 3.
An electronic device including an electronic element mounted on the electronic element mounting substrate. The electronic device according to claim 4 and
An electronic module comprising an upper surface of the electronic device or a housing located around the electronic device. A step of preparing a first insulating sheet and a second insulating sheet laminated with the first insulating sheet, and a step of forming a first wiring paste on the upper surface of the second insulating sheet.
A step of forming a second wiring paste by leaving a gap with the first wiring paste on the upper surface of the second insulating sheet.
A step of filling the first insulating paste between the first wiring paste and the second wiring paste and covering the upper surface of the first wiring paste and the upper surface of the second wiring paste with the first insulating paste.
A step of laminating the first insulating sheet on the upper surface of the second insulating sheet to form a laminated body,
A step of providing the first wiring paste or the second wiring paste over the side wall of the second insulating sheet, and
A step of covering the side wall of the first wiring paste or the second insulating sheet of the second wiring paste with the third insulating paste.
A method for manufacturing a substrate for mounting an electronic device, which is characterized by the above. The first wiring paste and / and the second wiring paste are placed between the outer edge of the second insulating sheet and / or the upper surface of the first wiring paste and / and the second insulating sheet from the upper surface of the second wiring paste. method of manufacturing an electronic element mounting substrate according to claim 6, characterized in that it comprises a step of covering the second insulating paste over the top surface of the. The first insulating sheet and / and the second insulating sheet are ceramic green sheets containing a ceramic material as a main component, and the first insulating paste is a ceramic paste containing a ceramic material as a main component, and the laminate is fired. The method for manufacturing a substrate for mounting an electronic element according to claim 6 or 7, wherein the process is included.

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