JP4328197B2 - Electronic component storage package and electronic device - Google Patents

Description

  The present invention relates to an electronic component storage package and an electronic device for storing electronic components such as semiconductor elements and piezoelectric vibrators.

  2. Description of the Related Art Conventionally, an electronic component storage package (hereinafter also simply referred to as a package) for storing electronic components such as semiconductor elements and piezoelectric vibrators is made of ceramics as shown in a sectional view in FIG. A frame-shaped metallization formed so as to surround the mounting portion 11a on the upper surface of the insulating base 11 on which the mounting portion 11a (formed on the bottom surface of the recess in FIG. 4) for mounting the electronic component 14 is formed. A layer 13 is formed, and a metal frame 13 for sealing is brazed to the upper surface of the metallized layer 13 via a brazing material 18 such as silver brazing. And after mounting the electronic component 14 in the mounting part 11a, the electronic component 14 is airtightly sealed inside by joining the flat cover body 12 to the upper surface of the metal frame 17, and thereby as a product. It becomes an electronic device.

In such a package, a convex portion 13a is formed on the surface of the metallization layer 13 of the package, and the metal frame 17 is brazed onto the metallization layer 13 via a brazing material 18 such as silver brazing, A method of increasing the brazing strength by increasing the distance between the metallized layer 13 and the metal frame 17 and forming a pool of the brazing material 18 in this gap (for example, the following is employed). Patent Document 1).

Such a package is formed by printing a brazing material reservoir pattern on the metallized layer 13 and then printing and applying a refractory metal paste so as to cover the brazing material reservoir pattern. It is formed as a package having a convex portion 13a on the surface.
Japanese Patent No. 2889519

  However, in the package as shown in Patent Document 1, it is necessary to form the convex portion 13a having a narrow width and a high height in order to increase the accumulation of the brazing material 18, but such a convex portion 13a is If the protrusion 13a easily peels off due to thermal stress and the lid 12 is tilted at the time of bonding, the bonding strength between the insulating base 11 and the lid 12 may vary, or the lid 12 may be balanced on the package surface. It had the problem that it became difficult to join.

  Further, if the convex portion 13a is formed with a wide width, accumulation of the brazing material 18 between the lid body 12 and the package is reduced, and the insulating base 11 and the lid body 12 cannot be firmly joined. Had problems.

  Therefore, the present invention has been completed in view of the above-mentioned conventional problems, and the object thereof is to join a lid to the surface of the electronic component storage package to provide a highly sealed and flat sealed space. An object of the present invention is to provide an electronic component storage package that can be formed.

The electronic component storage package of the present invention includes an insulating base having an electronic component mounting portion formed on an upper surface thereof, a wiring conductor formed on the upper surface of the insulating base, and the mounting portion on an outer peripheral portion of the upper surface of the insulating base. And a metallized layer in a frame shape formed so as to surround the metal layer, and the metallized layer has a height that increases as the surface is continuously located on the inner peripheral side of the upper surface of the insulating substrate. characterized in that it is formed as a plurality of convex portions are.

  The electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the metallized layer covering the electronic component. And a lid body joined in this manner.

According to the electronic component storage package of the present invention, the insulating base having the electronic component mounting portion formed on the upper surface, the wiring conductor formed on the upper surface of the insulating base, and the mounting portion on the outer peripheral portion of the upper surface of the insulating base. A frame-like metallization layer formed so as to surround the metallization layer, and the metallization layer has a plurality of surfaces that are continuous and are higher in height toward the inner peripheral side of the upper surface of the insulating substrate. Because it is formed as a convex part , it is possible to increase the amount of brazing material reservoir formed on the outer peripheral side of the metallized layer, and to absorb and relax the thermal stress applied to pull inward favorably with this large brazing material reservoir it can. Further, by absorbing and dispersing the stress applied so as to be pulled inward by the side surfaces of the plurality of convex portions, it is possible to effectively prevent the convex portions from peeling off.

  In addition, since the plurality of convex portions are formed, the bonding area with the brazing material can be increased, the bonding strength with the brazing material can be increased, and the lid can be firmly attached. become.

In addition, by forming the plurality of convex portions, it is possible to suppress the inclination of the lid body at the time of joining the lid bodies, and to reduce the variation in strength and the inclination of the lid body.

Therefore, the electronic component storing package surface, the lid can be firmly and flatly junction, between the electronic component storing package and the lid, with high air-tightness, to form a flat closed space Can do.

  The electronic device of the present invention is bonded to the electronic component storage package of the present invention, the electronic component mounted on the mounting portion and having the electrode electrically connected to the wiring conductor, and the metallized layer so as to cover the electronic component. Since the electronic component storage package and the lid body can form a highly airtight sealed space, the electronic device has excellent airtightness and can be used for a long period of time. It can be a component device.

Embodiments of the electronic component storage package of the present invention will be described in detail below. FIG. 1 is a cross-sectional view showing a reference example of the package of the present invention, and FIG. 2 is an enlarged cross-sectional view of the main part of the package in FIG. FIG. 3 is an enlarged sectional view of an essential part showing an example of an embodiment of the electronic component storage package of the present invention. In these drawings, 1 is an insulating substrate, 2 is a lid, 3 is a metallized layer, and 3a is a convex portion.

The package of the present invention includes an insulating base 1 on which the mounting portion 1a of the electronic component 4 is formed on the upper surface, a wiring conductor 5 formed on the upper surface of the insulating base 1, and a mounting portion 1a on the outer periphery of the upper surface of the insulating base 1. The metallized layer 3 is formed so as to surround the metallized layer 3. The surface of the metallized layer 3 is continuous and the height of the metallized layer 3 increases as it is located on the inner peripheral side of the upper surface of the insulating substrate 1. It is formed as a plurality of protrusions 3a to have.

  The insulating substrate 1 of the present invention is made of ceramics, for example, an insulating layer made of ceramics such as an aluminum oxide sintered body (alumina ceramics), an aluminum nitride sintered body, a mullite sintered body, and a glass ceramic sintered body. It is a rectangular parallelepiped box-like body formed by laminating a plurality of layers, and a recess 4 for accommodating the light emitting element 3 is formed at the center of the upper surface. When the insulating substrate 1 is made of, for example, an aluminum oxide sintered body, an appropriate organic binder, solvent, etc. are added to and mixed with raw material powders such as aluminum oxide, silicon oxide, magnesium oxide, and calcium oxide to form a slurry. Ceramic green sheets (ceramic green sheets) are obtained by forming into a sheet shape by a conventionally known doctor blade method or calendar roll method, and thereafter, each of these ceramic green sheets is appropriately punched and moved up and down. And is fired at a high temperature (about 1600 ° C). FIG. 1 shows an example in which a recess for accommodating the electronic component 4 is formed on the upper surface of the insulating substrate 1 and a mounting portion 1a is formed on the bottom surface of the recess.

  In addition, a plurality of wiring conductors 5 led out from the mounting portion 1 a to the lower surface of the insulating base 1 are deposited on the insulating base 1. The wiring conductor 5 functions as a conductive path for electrically connecting each electrode of the electronic component 4 mounted on the mounting portion 1a to an external electric circuit, and the portion located on the mounting portion 1a is not located on the bottom surface portion. Each electrode of the electronic component 4 is electrically connected via a conductive bonding material 6 such as solder or conductive resin, and a portion led out to the lower surface of the insulating base 1 is externally connected via an electric connection means such as solder. Connected to electrical circuit. Then, it is electrically connected to each electrode of the electronic component 4, and electric power and a drive signal are supplied to the electronic component 4.

  Such a wiring conductor 5 is printed in a predetermined pattern on a green sheet as an insulating substrate 1 in advance by using a metal paste obtained by adding and mixing a suitable organic solvent and solvent to a metal powder such as W or Mo. By coating, the insulating base 1 is deposited on a predetermined position.

  The exposed surface of the wiring conductor 5 is preferably coated with a metal having excellent corrosion resistance such as nickel (Ni), gold (Au), Ag, etc. with a thickness of about 1 to 20 μm. Can be effectively prevented from being oxidized and corroded, and the connection between the wiring conductor 5, the conductive bonding material 6, and electrical connection means such as solder can be improved. Therefore, a Ni plating layer having a thickness of about 1 to 10 μm and an Au plating layer having a thickness of about 0.1 to 3 μm are sequentially deposited on the exposed surface of the wiring conductor 5 by an electrolytic plating method or an electroless plating method. It is more preferable.

Further, a frame-like metallized layer 3 is formed on the upper surface of the insulating substrate 1 so as to surround the mounting portion 1a, and the metallized layer 3 has a continuous surface and is within the upper surface of the insulating substrate 1. It is formed as a plurality of convex portions 3a as the height is high are located in the circumferential side. The metallized layer 3 and the protrusions 3a are made of metal powder metallized such as tungsten, molybdenum, copper, or silver, and function as a base metal for joining the metal frame 7 to the insulating substrate 1. A metal frame 7 surrounding the mounting portion 1a is brazed to the upper surfaces of the metallized layer 3 and the convex portion 3a via a brazing material 8 such as silver brazing, and the metal frame 2 and the metallized layer 3 are A pool of brazing material 8 having a thickness corresponding to the height of the convex portion 3a on the inner peripheral side is formed therebetween.

  Thereby, the amount of accumulation of the brazing material 8 formed on the outer peripheral side of the metallized layer 3 can be increased, and the thermal stress applied so as to be pulled inward can be favorably absorbed and relaxed by the accumulation of the large brazing material 8. Further, by absorbing and dispersing the stress applied so as to be pulled inward by the side surfaces of the plurality of convex portions 3a, it is possible to effectively prevent the convex portions 3a from peeling off.

  Further, since the plurality of convex portions 3a are formed, the bonding area with the brazing material 8 can be increased, the bonding strength with the brazing material 8 can be increased, and the lid 2 is firmly attached. Will be able to.

  Further, by forming the plurality of convex portions 3a, it is possible to suppress the inclination of the lid body 2 at the time of joining the lid body 2, and to join with the strength variation and the inclination of the lid body 2 being reduced.

  Therefore, the lid body 2 can be firmly and flatly joined to the package surface, and a highly airtight and flat sealed space can be formed between the package and the lid body 2.

  Such metallized layer 3 and convex part 3a are conventionally well-known on a ceramic green sheet serving as an insulating substrate 1 by using a metal paste obtained by adding and mixing an appropriate binder and solvent to a metal powder such as tungsten. After applying the screen printing method, the metal paste to be the convex portions 3a is printed and applied on the ceramic green sheet by using the screen printing method known in the art, and these are the ceramics to be the insulating substrate 1. By firing at the same time as the green sheet laminate, the insulating base 1 is attached in a predetermined shape so as to surround the mounting portion 1a.

  In addition to the above, the metal paste that becomes the metallized layer 3 is applied on the ceramic green sheet that becomes the insulating base 1 by using a well-known screen printing method, and the metal paste is printed and applied, and then a mold having a recess is used. By pressing on the metal paste, the convex portion 3a can be formed on the metal paste, and this is fired at the same time as the ceramic green sheet laminated body that becomes the insulating base 1 at the upper surface of the insulation expectation 1 It can be formed in a predetermined shape so as to surround the mounting portion 1a. Thus, when forming the convex part 3a with the metal mold | die etc. which has a recessed part, while being able to form the position, height, etc. of the convex part 3a with high precision, even when the width | variety of the metallization layer 3 is narrow, it is easy. Thus, the convex portion 3a can be formed. Accordingly, the lid 2 can be firmly and accurately joined to the insulating base 1.

  In addition, in order to prevent the metallized layer 3 from being oxidized and corroded on the surfaces of the metallized layer 3 and the convex portion 3a and to make the bonding with the brazing material 8 good, It is preferable that a nickel plating layer having a thickness of about 1 to 10 μm is applied by an electrolytic plating method or an electroless plating method.

Further, as shown by the enlarged sectional view of the package in FIG. 3, the surface of the metallized layer 3 is continuously, that is formed as a convex portion 3a of the more height is high is located on the inner circumferential side. Therefore, the strength of the metallized layer 3 becomes strong, the thermal stress applied to pull inwardly at a plurality of convex portions 3a side, it is possible to absorb relaxed good good.

  Moreover, it is preferable that the convex part 3a on the outer peripheral side has a thickness of 1/3 or more of the convex part 3a on the inner peripheral side, absorbs and relaxes the thermal stress applied to the side surface of each convex part 3a, and It becomes easy to suppress the inclination at the time of joining.

  The metal frame 7 brazed to the metallized layer 3 via a brazing material 8 such as silver brazing is made of a metal such as iron-nickel alloy or iron-nickel-cobalt alloy, and the lid 2 is insulated from the base. It functions as a base metal member for bonding to 1. Then, the lid 2 is placed on the metal frame 7, and, for example, if the lid 2 is made of metal, the lid 2 is joined to the metal frame 7 by welding them by the seam weld method. The Such a metal frame 7 is formed by punching a plate material made of iron-nickel alloy, iron-nickel-cobalt alloy or the like into a predetermined frame shape, and the metal frame 7 is formed on the metallized layer 3. For example, the foil-like brazing material 8 is placed, and then the brazing material 8 is heated and melted to join the metallized layer 3 through the brazing material 8.

The metal frame 7 is preferably formed with a roundness having a radius of curvature of about 5 to 50 μm at the corner between the main surface on the side bonded to the metallized layer 3 and the inner and outer surfaces. Thereby, it becomes possible to make the pool of the brazing material 8 larger by this roundness. Such rounded, when forming by punching a metal frame 2, it can be set to a desired one by adjusting the speed or the like for pressing the mold shape and mold.

  Further, on the exposed surfaces of the metal frame 7 and the brazing material 8, a nickel plating layer having a thickness of about 1 to 10 μm and a thickness of 0.1 to prevent the metal frame 7 and the brazing material 8 from being oxidized and corroded. It is preferable that a gold plating layer of about ˜3.0 μm is sequentially deposited by electroplating or electroless plating after brazing.

  The lid 2 is a flat plate made of, for example, an iron-nickel alloy or an iron-nickel-cobalt alloy, and the iron-nickel alloy or iron-nickel-cobalt alloy plate is manufactured in a predetermined shape by a punching die or the like. The

The lid 2 may be made of ceramic. When the lid 2 is made of ceramic, the frame-like metallized layer 7 attached to the lower surface of the lid 2 is directly applied to the metallized layer 3 of the insulating substrate 1. The mounting portion 1a can be brought into an airtight state by joining via the brazing filler metal 8 or the like. In addition, the convex portion 3a is not on the surface of the metallized layer 3 on the insulating base 1 side, but on the surface of the metallized layer 3 deposited on the lower surface on the lid 2 side, so that the convex portion 3a is located on the inner side of the lower surface of the lid 2. It may be formed as a plurality of convex portions having a high height.

  The electronic device according to the present invention includes an electronic component storage package according to the present invention, an electronic component 4 mounted on the mounting portion 1 a and having an electrode electrically connected to the wiring conductor 5, and the electronic component 4 disposed on the metallized layer 3. And a lid 2 joined so as to cover. As a result, a highly airtight sealed space can be formed between the package and the lid 2, and an electronic device that is excellent in airtightness and can be used for a long period of time can be obtained.

  It should be noted that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the scope of the present invention. By joining the insulating base 1 and the lid 2, the airtightness is high and the flat body can be used for a flat sealed space, and the electronic component 4 is not mounted in the sealed space. It can also be used.

It is sectional drawing which shows a reference example about the electronic component storage package of this invention. It is a principal part expanded sectional view of the electronic component storage package of FIG. It is a principal part expanded sectional view which shows an example of embodiment about the electronic component storage package of this invention. It is sectional drawing of the conventional package for electronic component accommodation.

Explanation of symbols

1: Insulating substrate 1a: mounting portion 2: lid body 3: metallized layer 3a: convex portion 5: wiring conductor

Claims (2)

An insulating base having an electronic component mounting portion formed on the upper surface, a wiring conductor formed on the upper surface of the insulating base, and a frame-like shape formed on the outer peripheral portion of the upper surface of the insulating base so as to surround the mounting portion has and a metallization layer, said metallization layer, the surface is continuously formed as the plurality of convex portions as height located on the inner peripheral side is higher in the upper surface of the insulating substrate A package for storing electronic components. The electronic component storage package according to claim 1, an electronic component mounted on the mounting portion and having an electrode electrically connected to the wiring conductor, and the metallized layer joined to cover the electronic component. An electronic device comprising a lid.

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