JP3393784B2 - Electronic component storage package - Google Patents
Electronic component storage packageInfo
- Publication number
- JP3393784B2 JP3393784B2 JP04367997A JP4367997A JP3393784B2 JP 3393784 B2 JP3393784 B2 JP 3393784B2 JP 04367997 A JP04367997 A JP 04367997A JP 4367997 A JP4367997 A JP 4367997A JP 3393784 B2 JP3393784 B2 JP 3393784B2
- Authority
- JP
- Japan
- Prior art keywords
- outer peripheral
- flange member
- peripheral portion
- electronic component
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Semiconductor Lasers (AREA)
- Led Device Packages (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Description
【発明の詳細な説明】
【0001】
【発明の属する技術分野】本発明は光半導体素子や圧電
振動子等の電子部品を収容するための電子部品収納用パ
ッケージに関するものである。
【0002】
【従来の技術】従来、光半導体素子や圧電振動子等の電
子部品を収容するための電子部品収納用パッケージは、
図2に断面図で示すように、酸化アルミニウム質焼結体
や窒化アルミニウム質焼結体・ムライト質焼結体・炭化
珪素質焼結体・ガラスセラミックス質焼結体等の電気絶
縁材料から成り、その上面中央部に電子部品を搭載する
ための搭載部11aおよびこの搭載部11a上面から下面に
かけて導出するメタライズ配線層12を有する略円板状ま
たは角板状の絶縁基体11と、この絶縁基体11の下面に導
出したメタライズ配線層12に銀ろう等のろう材を介して
取着された外部リード端子13と、絶縁基体11の上面外周
縁に銀ろう等のろう材を介して取着され、絶縁基体11の
外周縁から水平方向に全周にわたって絶縁基体11の外側
に突出する外周部14aを有する平板環状のフランジ部材
14と、下端部にフランジ部材14と略同じ外周寸法の鍔部
15aを有する金属キャップ15とから構成されており、絶
縁基体11の搭載部11a底面に光半導体素子等の電子部品
16をろう材・ガラス・樹脂等の接着剤を介して接着固定
するとともに電子部品16の電極をボンディングワイヤ17
を介してメタライズ配線層12に電気的に接続し、しかる
後、絶縁基体11に取着されたフランジ部材14の外周部14
aに金属キャップ15の鍔部15aを溶接し、絶縁基体11と
金属キャップ15とから主に成る容器内部に電子部品16を
気密に封止することによって製品としての電子装置とな
る。
【0003】また、絶縁基体11に取着されたフランジ部
材14と金属キャップ15との溶接は、フランジ部材14の外
周部14aと金属キャップ15の鍔部15aの外周部とを互い
に圧接しながらフランジ部材14と金属キャップ15との間
に大電流を印加し、これによってフランジ部材14と金属
キャップ15との接触部においてジュール熱を発生させ、
このジュール熱によりフランジ部材14の外周部14aと金
属キャップ15の鍔部15aとの接触部近傍を溶融させるこ
とによって行なわれる。
【0004】なお、この従来の電子部品収納用パッケー
ジにおいては、パッケージの取扱いの際等にフランジ部
材14の外周部14aに外力が印加された場合でもその外力
によって外周部14aが容易に変形してフランジ部材14と
金属キャップ15との良好な溶接が不可能となるのを防止
するために、フランジ部材14の厚みを通常約0.2 mm以
上の厚いものとしている。
【0005】
【発明が解決しようとする課題】しかしながら、この従
来の電子部品収納用パッケージにおいては、フランジ部
材14の厚みが約0.2 mm以上と厚いことから、電子装置
の小型化を図るためにフランジ部材の外周寸法を小さい
ものとした場合、その結果として外周部14aが絶縁基体
11から突出する突出幅が約0.5 mm未満の狭いものとな
るとフランジ部材14の外周部14aが撓みにくいものとな
るため、フランジ部材14に金属キャップ15を溶接する際
の熱によりフランジ部材14に大きな熱応力が印加される
と、その応力の大部分がフランジ部材14に吸収されるこ
となく絶縁基体11とフランジ部材14との接合部に印加さ
れることとなり、フランジ部材14が絶縁基体11から剥が
れたり絶縁基体11にクラックが発生したりして、容器の
気密が破れてしまうという欠点を誘発していた。
【0006】本発明は上記事情に鑑みて案出されたもの
であり、その目的は、フランジ部材の外周寸法を小さい
ものとした場合でも溶接の際にフランジ部材の剥がれや
絶縁基体のクラックが発生することがない、小型で気密
性に優れた電子部品収納用パッケージを提供することに
ある。
【0007】
【課題を解決するための手段】本発明の電子部品収納用
パッケージは、上面に電子部品が搭載される搭載部を有
する絶縁基体と、該絶縁基体の外周縁に取着され、外周
部が絶縁基体の外側に突出する平板環状のフランジ部材
と、該フランジ部材と略同じ外周寸法の鍔部を下端に有
し、該鍔部が圧接しながらの溶接によりフランジ部材に
接合される金属キャップとから成る電子部品収納用パッ
ケージにおいて、前記フランジ部材は、前記外周部の外
周側の厚みが内周側の厚みより厚いことを特徴とするも
のである。
【0008】本発明の電子部品収納用パッケージによれ
ば、金属キャップが溶接されるフランジ部材は、その厚
みが外周部の外周側が内周側よりも厚いことから、溶接
時の熱による熱応力がフランジ部材に作用したとしても
その応力はフランジ部材の外周部の内側の厚みの薄い部
分が撓むことにより良好に吸収緩和されるとともに、外
周部の外周側の厚みが厚いことからフランジ部材の機械
的強度が保たれる。従って、溶接の際のフランジ部材の
剥がれや絶縁基体のクラックが発生することがない小型
で気密性に優れた電子部品収納用パッケージとなる。
【0009】
【発明の実施の形態】次に本発明を添付の図面を基に説
明する。図1は本発明の電子部品収納用パッケージを光
半導体素子を収容するための電子部品収納用パッケージ
に適用した場合の実施の形態の一例を示す断面図であ
る。同図において1は絶縁基体、2は金属キャップであ
り、主にこの絶縁基体1と金属キャップ2とで内部に電
子部品(光半導体素子)4を気密に収容する容器3が構
成される。
【0010】絶縁基体1にはその上面中央部に光半導体
素子4を搭載するための搭載部1aが設けてあり、この
搭載部1a上面には光半導体素子4が導電性のろう材や
樹脂・ガラス等の接着剤を介して接着固定される。
【0011】絶縁基体1は、酸化アルミニウム質焼結体
・窒化アルミニウム質焼結体・ムライト質焼結体・炭化
珪素質焼結体・ガラスセラミック焼結体等の電気絶縁材
料から成る略円板体または角板体であり、例えば酸化ア
ルミニウム質焼結体から成る場合は、酸化アルミニウム
・酸化珪素・酸化カルシウム・酸化マグネシウム等の原
料粉末に適当なバインダや溶剤を添加混合して泥漿状と
なすとともにこれを従来周知のドクターブレード法等を
採用してシート状となすことによって複数枚のセラミッ
クグリーンシートを得、しかる後、これらセラミックグ
リーンシートの各々に適当な打ち抜き加工を施すととも
にこれらを上下に積層し、高温(約1600℃)で焼成する
ことによって製作される。
【0012】また絶縁基体1には搭載部1a上面から下
面にかけて複数個のメタライズ配線5が被着形成されて
おり、このメタライズ配線5の搭載部1a上面の部位に
は光半導体素子4の底面および電極が導電性の接着剤お
よびボンディングワイヤ6を介して電気的に接続され、
他方、絶縁基体1の下面に導出された部位には外部電気
回路基板に接続されるピン状の外部リード端子7が銀ろ
う等のろう材を介して取着されている。
【0013】メタライズ配線5はタングステンやモリブ
デン・モリブデン−マンガン・銅・銀・銀−パラジウム
等の金属粉末焼結体から成り、例えばタングステンから
成る場合は、タングステン粉末に適当な有機バインダや
溶剤を添加混合して得た金属ペーストを絶縁基体1とな
るセラミックグリーンシートに予め従来周知のスクリー
ン印刷法により所定パターンに印刷塗布し、これをセラ
ミックグリーンシートと同時に焼成することによって絶
縁基体1の搭載部1a上面から下面にかけて被着形成さ
れる。
【0014】なお、メタライズ配線5には通常、メタラ
イズ配線5が酸化腐食するのを有効に防止するとともに
メタライズ配線5と導電性接着剤およびボンディングワ
イヤ6との接続性を良好なものとするために、その露出
表面にニッケルめっき層と金めっき層とが順次被着され
ている。
【0015】絶縁基体1は、またその上面の外周縁に環
状のメタライズ金属層8が被着形成されており、このメ
タライズ金属層8にフランジ部材9が銀ろう等のろう材
を介して取着されている。
【0016】この環状のメタライズ金属層8はタングス
テンやモリブデン・モリブデン−マンガン・銅・銀・銀
−パラジウム等の金属粉末焼結体から成り、絶縁基体1
にフランジ部材9を接合させるための下地金属として作
用する。例えばタングステンから成る場合は、タングス
テン粉末に適当なバインダや溶剤を添加混合して得た金
属ペーストを絶縁基体1となるセラミックグリーンシー
ト上に所定パターンに印刷し、これをセラミックグリー
ンシートと同時に焼成することによって絶縁基体1の上
面の外周縁に環状に被着される。
【0017】なお、この環状のメタライズ金属層8は必
要に応じてメタライズ配線層5の一部に電気的に接続さ
れており、通常、その表面にはニッケルめっき層や金め
っき層等のろう材との濡れ性に優れ且つ耐食性に優れる
めっき金属層が被着されている。
【0018】また、メタライズ金属層8にろう付取着さ
れたフランジ部材9は、鉄−ニッケル合金や鉄−ニッケ
ル−コバルト合金等の金属から成り、絶縁基体1の外周
縁から水平方向に全周にわたり絶縁基体の外側に突出す
る外周部9aを有する平板環状体であり、更に外周部9
aの内周側でその厚みが例えば0.1 mm程度と薄く、ま
た外周部9aの外周側でその厚みが例えば0.2 mm程度
と厚いものとなっている。
【0019】このフランジ部材9は金属キャップ2を絶
縁基体1に接合させるための接合金具として作用し、そ
の外周部9aには金属キャップ2が溶接により接合され
る。
【0020】ここで、フランジ部材9はその厚みが外周
部9aの内周側で薄いことから、外周部9aに金属キャ
ップ2を溶接する際に溶接の熱による熱応力が外周部9
aに作用したとしてもその応力は外周部9aの厚みが薄
い内周側が撓むことにより良好に吸収緩和され、その結
果、フランジ部材9が絶縁基体1から剥がれたり絶縁基
体1にクラックが発生することが有効に防止される。
【0021】フランジ部材9は、その外周部9aの内周
側で厚みの薄い部分の幅がその部分の厚みに対して2.5
倍未満となると、外周部9aの内周側が撓みにくいもの
となって、外周部9aに金属キャップ2を溶接する際に
溶接の熱による応力を撓むことにより良好に吸収緩和す
ることが困難となる傾向にある。従って、フランジ部材
9は、その外周部9aの内周側で厚みの薄い部分の幅が
その部分の厚みに対して2.5 倍以上の幅であることが好
ましい。
【0022】また、フランジ部材9は、その厚みが外周
部9aの外周側で厚いことから、この厚みの厚い外周側
で外周部9aの機械的強度が保たれ、その結果、パッケ
ージの取り扱いの際等にフランジ部材9の外周部9aに
外力が印加されてもその外力により外周部9aが容易に
変形することはなく、従って、フランジ部材9と金属キ
ャップ2とを溶接により接合する際にフランジ部材9と
金属キャップ2とを良好に溶接させることが可能とな
る。
【0023】フランジ部材9は、その外周部9aの外周
側で厚みの厚い部分の厚みが0.2 mm未満では、外周部
9aに外力が印加された際に外周部9aが容易に変形し
易い傾向にある。従ってフランジ部材9は、その外周部
9aの外周側で厚みの厚い部分の厚みが0.2 mm以上で
あることが好ましい。
【0024】なお、フランジ部材9の絶縁基体1への取
着は、例えば絶縁基体1の上面に被着させたメタライズ
金属層8上に銀ろう等のろう材箔を環状に形成したろう
材プリフォームとフランジ部材9とを順次載置し、しか
る後、このろう材プリフォームを加熱溶融させることに
よってメタライズ金属層8上に取着され、絶縁基体1の
外周縁に取着される。
【0025】フランジ部材9に溶接される金属キャップ
2は、例えば鉄−ニッケル合金や鉄−ニッケル−コバル
ト合金等の金属から成り、下端部にこのフランジ部材9
と略同じ外周寸法の鍔部2aを、上端部にガラス等の透
光性材料から成る窓部材2bを有するシルクハット形状
の容器部材であり、内部に光半導体素子4を収容するた
めの空所が形成されており、絶縁基体1に取着されたフ
ランジ部材9に鍔部2aが溶接されることにより、絶縁
基体1と金属キャップ2とから主に成る容器3内部に光
半導体素子4が気密に封止され、また窓部材9bを透し
て光半導体素子4と外部との光信号の授受を行なうこと
が可能となる。
【0026】なお、金属キャップ2のフランジ部材9へ
の溶接は、フランジ部材9の外周部9aの外周部と金属
キャップ2の鍔部2aの外周部とを互いに圧接しなが
ら、フランジ部材9と金属キャップ2との間に大電流を
印加し、これによってフランジ部材9と金属キャップ2
との接触部においてジュール熱を発生させ、このジュー
ル発熱によりフランジ部材9および金属キャップ2の接
触部近傍を溶融させることによって行なわれる。
【0027】かくして本発明の電子部品収納用パッケー
ジによれば、絶縁基体1の搭載部1a上面に光半導体素
子4を接着剤を介して接着固定するとともに光半導体素
子4の各電極をボンディングワイヤ6を介してメタライ
ズ配線層5に電気的に接続し、しかる後、絶縁基体1に
取着させたフランジ部材9に金属キャップ2を溶接し、
絶縁基体1と金属キャップ2とから成る容器3内部に光
半導体素子4を気密に封止することによって製品として
の電子装置となる。
【0028】なお、本発明は上述の実施の形態の例に限
定されるものではなく、本発明の要旨を逸脱しない範囲
であれば種々の変更は可能である。例えば、上述の実施
の形態の例では光半導体素子を収容する電子部品収納用
パッケージを例に説明したが、本発明の電子部品収納用
パッケージは圧電振動子等の他の電子部品を収容する電
子部品収納用パッケージに適用され得ることは言うまで
もない。
【0029】
【発明の効果】本発明の電子部品収納用パッケージによ
れば、絶縁基体の外周縁に取着され金属キャップが溶接
される平板環状のフランジ部材の厚みが外周部の外周側
が内周側より厚いことから、電子装置の小型化を図るた
めにフランジ部材の外周寸法を小さいものとした結果、
外周部が絶縁基体から突出する突出幅が狭いものとなっ
たとしても、この外周部に金属キャップを溶接する際に
溶接の熱により発生する熱応力はフランジ部材の外周部
の厚みが薄い内周側が撓むことにより良好に吸収緩和さ
れ、その結果、フランジ部材が絶縁基体から剥がれたり
絶縁基体にクラックが発生することが有効に防止され
る。更に、フランジ部材はその厚みが外周部の外周側で
厚いことから、この厚みの厚い外周側で外周部の機械的
強度が保たれる結果、パッケージの取扱いの際等にフラ
ンジ部材の外周部に外力が印加されてもその外力により
外周部が容易に変形することはない。従って、フランジ
部材と金属キャップとを溶接により接合する際、フラン
ジ部材と金属キャップとを良好に溶接させることが可能
となり、小型で気密性に優れる電子部品収納用パッケー
ジが実現できる。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component housing package for housing electronic components such as optical semiconductor elements and piezoelectric vibrators. 2. Description of the Related Art Conventionally, electronic component housing packages for housing electronic components such as optical semiconductor elements and piezoelectric vibrators have been known.
As shown in the cross-sectional view of FIG. 2, it is made of an electrically insulating material such as an aluminum oxide sintered body, an aluminum nitride sintered body, a mullite sintered body, a silicon carbide sintered body, and a glass ceramic sintered body. A substantially disk-shaped or square-plate-shaped insulating base 11 having a mounting portion 11a for mounting an electronic component at the center of the upper surface thereof and a metallized wiring layer 12 extending from the upper surface to the lower surface of the mounting portion 11a; External lead terminals 13 attached to a metallized wiring layer 12 led out to the lower surface of 11 via a brazing material such as silver brazing, and attached to the outer peripheral edge of the upper surface of the insulating base 11 via a brazing material such as silver brazing. A flat annular flange member having an outer peripheral portion 14a protruding outside the insulating base 11 over the entire periphery in the horizontal direction from the outer peripheral edge of the insulating base 11
14 and a flange portion having substantially the same outer peripheral dimensions as the flange member 14 at the lower end portion
And a metal cap 15 having an upper surface 15a.
16 is bonded and fixed via an adhesive such as brazing material, glass, resin, etc., and the electrodes of the electronic component 16 are bonded to bonding wires 17.
And electrically connected to the metallized wiring layer 12 through the outer peripheral portion 14 of the flange member 14 attached to the insulating base 11.
By welding a flange portion 15a of the metal cap 15 to a, and hermetically sealing the electronic component 16 inside a container mainly composed of the insulating base 11 and the metal cap 15, an electronic device as a product is obtained. [0003] In addition, the flange member 14 attached to the insulating base 11 and the metal cap 15 are welded by pressing the outer peripheral portion 14a of the flange member 14 and the outer peripheral portion of the flange portion 15a of the metal cap 15 with each other. A large current is applied between the member 14 and the metal cap 15, thereby generating Joule heat at a contact portion between the flange member 14 and the metal cap 15,
This Joule heat is used to melt the vicinity of the contact portion between the outer peripheral portion 14a of the flange member 14 and the flange portion 15a of the metal cap 15. In this conventional package for storing electronic components, even when an external force is applied to the outer peripheral portion 14a of the flange member 14 when the package is handled, the outer peripheral portion 14a is easily deformed by the external force. In order to prevent the good welding of the flange member 14 and the metal cap 15 from being impossible, the thickness of the flange member 14 is usually set to be about 0.2 mm or more. [0005] However, in this conventional package for storing electronic parts, the thickness of the flange member 14 is as large as about 0.2 mm or more. When the outer peripheral dimension of the member is reduced, the outer peripheral portion 14a is
When the protrusion width protruding from the flange 11 is less than about 0.5 mm, the outer peripheral portion 14a of the flange member 14 becomes difficult to bend. When the thermal stress is applied, most of the stress is applied to the joint between the insulating base 11 and the flange member 14 without being absorbed by the flange member 14, and the flange member 14 is peeled from the insulating base 11. Or the cracks occur in the insulating base 11, causing a drawback that the airtightness of the container is broken. The present invention has been made in view of the above circumstances, and an object of the present invention is to cause peeling of a flange member and cracking of an insulating base during welding even when the outer peripheral dimension of the flange member is reduced. It is an object of the present invention to provide a small and highly airtight electronic component storage package that does not need to be mounted. A package for storing electronic components according to the present invention has an insulating base having a mounting portion on which an electronic component is mounted on an upper surface, and an outer peripheral portion attached to an outer peripheral edge of the insulating base. A metal member having a flat annular member having a flat portion whose outer periphery is substantially the same as that of the flange member at the lower end, the flange being joined to the flange member by welding while being pressed against the flange member; In the electronic component storage package including the cap, the outer peripheral portion of the flange member is thicker than the inner peripheral thickness of the outer peripheral portion. According to the electronic component housing package of the present invention, the thickness of the flange member to which the metal cap is welded is greater on the outer peripheral side of the outer peripheral part than on the inner peripheral side. Even if it acts on the flange member, the stress is favorably absorbed and alleviated by bending the thin portion inside the outer peripheral portion of the flange member, and the thickness of the outer peripheral portion of the outer peripheral portion is large, so that the mechanical force of the flange member is increased. The target strength is maintained. Therefore, a small and airtight electronic component storage package free of peeling of the flange member and cracking of the insulating base during welding can be obtained. Next, the present invention will be described with reference to the accompanying drawings. FIG. 1 is a sectional view showing an example of an embodiment in which the electronic component housing package of the present invention is applied to an electronic component housing package for housing an optical semiconductor element. In FIG. 1, reference numeral 1 denotes an insulating base, and 2 denotes a metal cap. The insulating base 1 and the metal cap 2 mainly constitute a container 3 in which an electronic component (optical semiconductor element) 4 is hermetically accommodated. A mounting portion 1a for mounting the optical semiconductor element 4 is provided at the center of the upper surface of the insulating base 1. On the upper surface of the mounting portion 1a, the optical semiconductor element 4 is provided with a conductive brazing material or resin. It is bonded and fixed via an adhesive such as glass. The insulating substrate 1 is a substantially disc made of an electrically insulating material such as a sintered body of aluminum oxide, a sintered body of aluminum nitride, a sintered body of mullite, a sintered body of silicon carbide, and a sintered body of glass ceramic. For example, in the case of an aluminum oxide sintered body, an appropriate binder or solvent is added to and mixed with raw material powders of aluminum oxide, silicon oxide, calcium oxide, magnesium oxide, etc. to form a slurry. Along with this, a plurality of ceramic green sheets are obtained by adopting a conventionally known doctor blade method or the like into a sheet shape, and thereafter, each of these ceramic green sheets is subjected to an appropriate punching process and these are vertically It is manufactured by laminating and firing at a high temperature (about 1600 ° C.). A plurality of metallized wirings 5 are formed on the insulating substrate 1 from the upper surface to the lower surface of the mounting portion 1a. The electrodes are electrically connected via a conductive adhesive and a bonding wire 6,
On the other hand, a pin-shaped external lead terminal 7 connected to an external electric circuit board is attached to a portion led out to the lower surface of the insulating base 1 via a brazing material such as silver brazing. The metallized wiring 5 is made of a metal powder sintered body such as tungsten or molybdenum / molybdenum-manganese / copper / silver / silver / palladium. The metal paste obtained by mixing is preliminarily printed and applied in a predetermined pattern on a ceramic green sheet serving as the insulating substrate 1 by a conventionally known screen printing method, and is fired simultaneously with the ceramic green sheet to thereby mount the mounting portion 1a of the insulating substrate 1. It is formed from the upper surface to the lower surface. The metallized wiring 5 is usually used to effectively prevent the metallized wiring 5 from being oxidized and corroded, and to improve the connectivity between the metallized wiring 5 and the conductive adhesive and the bonding wire 6. On the exposed surface, a nickel plating layer and a gold plating layer are sequentially applied. The insulating base 1 has an annular metallized metal layer 8 formed on the outer peripheral edge of the upper surface thereof, and a flange member 9 is attached to the metallized metal layer 8 via a brazing material such as silver solder. Have been. The annular metallized metal layer 8 is made of a sintered metal powder such as tungsten or molybdenum / molybdenum-manganese / copper / silver / silver / palladium.
Acts as a base metal for bonding the flange member 9 to the base member. For example, when it is made of tungsten, a metal paste obtained by adding and mixing an appropriate binder and a solvent to tungsten powder is printed in a predetermined pattern on a ceramic green sheet serving as the insulating substrate 1, and is fired simultaneously with the ceramic green sheet. Thus, the insulating substrate 1 is annularly attached to the outer peripheral edge of the upper surface. The annular metallized metal layer 8 is electrically connected to a part of the metallized wiring layer 5 if necessary, and its surface is usually provided with a brazing material such as a nickel plating layer or a gold plating layer. A plated metal layer having excellent wettability and excellent corrosion resistance. The flange member 9 brazed to the metallized metal layer 8 is made of a metal such as an iron-nickel alloy or an iron-nickel-cobalt alloy. Is a flat plate-shaped annular body having an outer peripheral portion 9a protruding outside the insulating base over the outer peripheral portion 9a.
The thickness on the inner peripheral side of a is as small as about 0.1 mm, and the thickness on the outer peripheral side of the outer peripheral portion 9a is as large as about 0.2 mm, for example. The flange member 9 functions as a joint for joining the metal cap 2 to the insulating base 1. The metal cap 2 is joined to the outer peripheral portion 9a by welding. Here, since the thickness of the flange member 9 is thin on the inner peripheral side of the outer peripheral portion 9a, when the metal cap 2 is welded to the outer peripheral portion 9a, thermal stress caused by welding heat is applied to the outer peripheral portion 9a.
Even if the stress acts on the insulating substrate 1, the stress is favorably absorbed and relaxed by bending the inner peripheral side where the outer peripheral portion 9 a is thin, and as a result, the flange member 9 is peeled from the insulating substrate 1 or a crack is generated in the insulating substrate 1. Is effectively prevented. The width of the thin portion on the inner peripheral side of the outer peripheral portion 9a of the flange member 9 is 2.5 times the thickness of the portion.
If it is less than twice, the inner peripheral side of the outer peripheral portion 9a is less likely to bend, and it is difficult to satisfactorily absorb and relax by bending the stress due to welding heat when welding the metal cap 2 to the outer peripheral portion 9a. Tend to be. Therefore, it is preferable that the width of the thin portion of the flange member 9 on the inner peripheral side of the outer peripheral portion 9a is 2.5 times or more the thickness of the portion. Further, since the flange member 9 has a large thickness on the outer peripheral side of the outer peripheral portion 9a, the mechanical strength of the outer peripheral portion 9a is maintained on the outer peripheral side where the thickness is large. As a result, when the package is handled, Even when an external force is applied to the outer peripheral portion 9a of the flange member 9, the outer peripheral portion 9a is not easily deformed by the external force. Therefore, when the flange member 9 and the metal cap 2 are joined by welding, the flange member 9 9 and the metal cap 2 can be satisfactorily welded. If the thickness of the thick portion on the outer peripheral side of the outer peripheral portion 9a is less than 0.2 mm, the outer peripheral portion 9a tends to be easily deformed when an external force is applied to the outer peripheral portion 9a. is there. Therefore, it is preferable that the thickness of the flange member 9 on the outer peripheral side of the outer peripheral portion 9a is 0.2 mm or more. The flange member 9 is attached to the insulating base 1 by, for example, forming a brazing material such as silver brazing on the metallized metal layer 8 attached to the upper surface of the insulating base 1 in an annular shape. The reform and the flange member 9 are sequentially placed, and thereafter, the brazing filler metal preform is attached by heating and melting to the metallized metal layer 8 and attached to the outer peripheral edge of the insulating base 1. The metal cap 2 to be welded to the flange member 9 is made of a metal such as an iron-nickel alloy or an iron-nickel-cobalt alloy.
A silk hat-shaped container member having a flange portion 2a having substantially the same outer peripheral dimension as that of the above and a window member 2b made of a translucent material such as glass at an upper end portion, and a space for accommodating the optical semiconductor element 4 therein. Is formed, and the flange portion 2a is welded to the flange member 9 attached to the insulating base 1, so that the optical semiconductor element 4 is hermetically sealed inside the container 3 mainly composed of the insulating base 1 and the metal cap 2. The optical signal can be transmitted and received between the optical semiconductor element 4 and the outside through the window member 9b. The welding of the metal cap 2 to the flange member 9 is performed by pressing the outer peripheral portion 9a of the flange member 9 and the outer peripheral portion of the flange portion 2a of the metal cap 2 against each other while pressing the outer peripheral portion 9a of the flange member 9 against the metal. A large current is applied between the flange member 9 and the metal cap 2.
This is performed by generating Joule heat at the contact portion with the flange member 9 and melting the vicinity of the contact portion between the flange member 9 and the metal cap 2 by the Joule heat. Thus, according to the electronic component housing package of the present invention, the optical semiconductor element 4 is bonded and fixed to the upper surface of the mounting portion 1a of the insulating base 1 with an adhesive, and each electrode of the optical semiconductor element 4 is connected to the bonding wire 6. Is electrically connected to the metallized wiring layer 5 through the metal cap 2, and then the metal cap 2 is welded to the flange member 9 attached to the insulating base 1,
An electronic device as a product is obtained by hermetically sealing the optical semiconductor element 4 inside the container 3 including the insulating base 1 and the metal cap 2. The present invention is not limited to the above-described embodiment, and various changes can be made without departing from the gist of the present invention. For example, in the example of the above-described embodiment, an electronic component housing package for housing an optical semiconductor element has been described as an example. However, the electronic component housing package of the present invention is an electronic housing for other electronic components such as a piezoelectric vibrator. It goes without saying that the present invention can be applied to a component storage package. According to the electronic component housing package of the present invention, the thickness of the flat annular flange member attached to the outer peripheral edge of the insulating base and to which the metal cap is welded is such that the outer peripheral side of the outer peripheral portion is the inner peripheral portion. Because the outer dimensions of the flange member were reduced in order to reduce the size of the electronic device,
Even when the width of the outer peripheral portion protruding from the insulating base becomes narrow, the thermal stress generated by the welding heat when welding the metal cap to the outer peripheral portion is limited by the thin inner peripheral portion of the flange member. The side is flexibly absorbed and alleviated, and as a result, the flange member is effectively prevented from peeling off from the insulating base and generating cracks in the insulating base. Further, since the thickness of the flange member is large on the outer peripheral side of the outer peripheral portion, the mechanical strength of the outer peripheral portion is maintained on the thick outer peripheral side. Even when an external force is applied, the outer peripheral portion is not easily deformed by the external force. Therefore, when the flange member and the metal cap are joined by welding, the flange member and the metal cap can be satisfactorily welded, and a compact and highly airtight electronic component housing package can be realized.
【図面の簡単な説明】
【図1】本発明の電子部品収納用パッケージを光半導体
素子を収容する電子部品収納用パッケージに適用した場
合の実施の形態の一例を示す断面図である。
【図2】従来の電子部品収納用パッケージを示す断面図
である。
【符号の説明】
1・・・・絶縁基体
2・・・・金属キャップ
2a・・・鍔部
3・・・・容器
4・・・・光半導体素子(電子部品)
9・・・・フランジ部材
9a・・・外周部BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a cross-sectional view showing an example of an embodiment when an electronic component housing package of the present invention is applied to an electronic component housing package for housing an optical semiconductor element. FIG. 2 is a cross-sectional view showing a conventional electronic component storage package. [Description of Signs] 1 ... Insulating base 2 ... Metal cap 2a ... Flange 3 ... Container 4 ... Optical semiconductor element (electronic component) 9 ... Flange member 9a ... outer periphery
Claims (1)
する絶縁基体と、該絶縁基体の外周縁に取着され、外周
部が絶縁基体の外側に突出する平板環状のフランジ部材
と、該フランジ部材と略同じ外周寸法の鍔部を下端に有
し、該鍔部が圧接しながらの溶接によりフランジ部材に
接合される金属キャップとから成る電子部品収納用パッ
ケージにおいて、前記フランジ部材は、前記外周部の外
周側の厚みが内周側の厚みより厚いことを特徴とする電
子部品収納用パッケージ。(1) An insulating substrate having a mounting portion on which an electronic component is mounted on an upper surface, and attached to an outer peripheral edge of the insulating substrate, the outer peripheral portion protruding outside the insulating substrate. For storing electronic parts, comprising: a flat annular flange member having a flange portion having a substantially same outer peripheral dimension as the flange member at its lower end; and a metal cap joined to the flange member by welding while the flange portion is being pressed against the flange member. In the package, the thickness of the outer peripheral portion of the flange member is greater than the thickness of the inner peripheral portion of the outer peripheral portion .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04367997A JP3393784B2 (en) | 1997-02-27 | 1997-02-27 | Electronic component storage package |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP04367997A JP3393784B2 (en) | 1997-02-27 | 1997-02-27 | Electronic component storage package |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH10242318A JPH10242318A (en) | 1998-09-11 |
JP3393784B2 true JP3393784B2 (en) | 2003-04-07 |
Family
ID=12670533
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP04367997A Expired - Fee Related JP3393784B2 (en) | 1997-02-27 | 1997-02-27 | Electronic component storage package |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3393784B2 (en) |
-
1997
- 1997-02-27 JP JP04367997A patent/JP3393784B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPH10242318A (en) | 1998-09-11 |
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