JP2002170895A - Package for housing electronic component and method for sealing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a package for housing electronic components, which is excellent in the reliability of air tightness that an insulator body is not cracked and a metal frame is not flaked off when a metal cover is seam welded to the metal frame, and a method for sealing the package. SOLUTION: The package for housing electronic component comprises: an insulator body 1 having a mounting portion 1a, on the front surface of which an electronic component 6 is mounted; a metal frame 2, which surrounds the mounting portion 1a and is nearly rectangular on the front surface of the insulator body 1; and a metal cover 3, which is soldered on the metal frame 2, where in the metal frame 2, the ratio of width W1 of one pair of sides facing each other to width W2 of the other pair of sides facing each other is 1.2 to 2.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a package for accommodating electronic components such as a semiconductor device, a piezoelectric vibrator, and a surface acoustic wave device, and a method for sealing the same.

[0002]

2. Description of the Related Art Conventionally, as shown in a perspective view in FIG. 6, a small package for accommodating electronic components such as a semiconductor element and a piezoelectric vibrator has been known. Sintered body, mullite sintered body,
It is made of an electrically insulating material such as glass-ceramics, and has a concave mounting portion for mounting the electronic component 16 at the center of the upper surface.
An insulating substrate 11 having a plurality of metallized wiring conductors 14 extending from the inside of the mounting portion 11a to the outer peripheral portion of the lower surface and a brazing metallization layer 15 attached on the upper surface so as to surround the mounting portion 11a; A substantially rectangular frame-shaped metal frame made of a metal such as an iron-nickel-cobalt alloy joined to the metallizing layer 15 for brazing via a brazing material such as silver-copper brazing so as to surround the mounting portion 11a. A body 12 and a metal lid 13 made of a metal such as an iron-nickel-cobalt alloy joined to the upper surface of the metal frame 12 by a seam welding method or the like.

According to the conventional package for storing electronic components, the electronic component is mounted on the bottom surface of the mounting portion 11a of the insulating base 11.
16 and the electrodes of this electronic component 16
a) is electrically connected to the metallized wiring conductor 14 in FIG. 1A via electrical connection means made of, for example, solder, conductive resin, bonding wire, etc., and thereafter, the metal lid 13 is seam welded to the upper surface of the metal frame 12. The electronic component 16 is hermetically sealed inside a container including the insulating base 11, the metal frame 12, and the metal lid 13 by welding by a method, thereby forming an electronic device as a product.

The metal frame 12 is manufactured by punching a plate of iron-nickel-cobalt alloy with a punching die, and is usually formed so that the width of each side thereof is substantially the same. I have.

In order to seam-weld the metal cover 13 on the metal frame 12, the metal cover 13 is placed on the metal frame 12, and the metal cover 13 is placed on one of the opposite sides of the metal cover 13. While a pair of electrode rollers of the seam welding machine are pressed and rolled on the periphery, a large current for welding is applied between the pair of roller electrodes, and one of the opposite sides of the metal frame 12 and the metal cover 13 After joining, a large current for welding is passed between the pair of roller electrodes while pressing and rolling a pair of electrode rollers of the seam welding machine on the other opposed outer periphery of the metal lid 13. A method of joining the other opposing sides of the metal frame 12 and the metal lid 13 is adopted.

[0006]

However, according to such an electronic component storage package, the insulating base 11
After mounting and fixing the electronic component 16 on the mounting portion 11a of the
When the metal lid 13 is welded to the upper surface of the metal frame 12 by a seam welding method or the like, one of the opposite sides of the metal frame 12 and the metal lid 13 is welded, and then the metal frame 12 and the metal lid 13 are welded. When the other opposing sides of the metal frame 12 and the metal lid 13 are welded, the other opposing sides of the metal frame 12 and the metal lid 13 are welded to each other. It is already welded, and the current easily flows from the metal lid 13 to the metal frame 12 through this welded part, so that the metal lid just below the roller electrode of the seam welding machine
The current flowing through the metal frame 12 via the contact portion between the metal frame 13 and the metal frame 12 becomes small. Therefore, when welding the other opposing sides of the metal frame 12 and the metal lid 13, the current flowing between the pair of roller electrodes of the seam welding machine is applied to the metal frame.
By making the current larger than when welding one of the opposing sides of the metal cover 13 and one of the metal cover 13, through a contact portion between the metal cover 13 and the metal frame 12 immediately below the roller electrode of the seam welding machine. The current flowing through the metal frame 12 is set to a size necessary for welding. However, when the other opposite sides of the metal frame 12 and the metal lid 13 are welded in this manner, compared to when welding one of the opposite sides of the metal frame 12 and the metal lid 13. Since a large current flows between the pair of roller electrodes of the seam welder, the current flowing between the pair of roller electrodes of the seam welder when welding the other pair of sides of the metal frame 12 and the metal lid 13. The heat generated by the heat generation causes a large amount of heat, which causes thermal shock or thermal stress to cause cracks in the insulating base, or peeling of the metal frame 12 to greatly impair the airtightness of the package. There was something.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned conventional problems. It is an object of the present invention to crack an insulating base when a metal lid is welded to a metal frame by a seam welding method. An object of the present invention is to provide an electronic component housing package excellent in hermetic reliability without causing peeling or peeling of a metal frame, and a sealing method therefor.

[0008]

According to the present invention, there is provided an electronic component storage package comprising a substantially rectangular frame-shaped metal frame surrounding a mounting portion on an upper surface of an insulating base having a mounting portion on which an electronic component is mounted. In the electronic component housing package formed by brazing and joining a metal lid on the metal frame, the metal frame has a width opposite to one of the opposite sides with respect to the width of the other opposite side. The width of the side to be processed is 1.2 to 2 times.

Further, according to the method of sealing an electronic component housing package of the present invention, one opposing side is provided on an upper surface of an insulating base having a mounting portion on which an electronic component is mounted so as to surround the mounting portion. A metal lid is provided on the upper surface of the metal frame with respect to a package body obtained by brazing a substantially rectangular frame-shaped metal frame whose width on the other opposite side is 1.2 to 2 times the width of After being placed, the metal frame and the metal lid are seam-welded along one opposing side, and then seam-welded along the other opposing side.

According to the electronic component housing package of the present invention, the width of one opposite side of the metal frame is 1.2 to 2 times the width of the other opposite side. After seam welding one opposing side of the body and the metal lid, and then seam welding the other opposing side, the metal lid and the metal frame are immediately below the roller electrode of the seam welding machine. Since the area of the contact portion becomes large, the current for seam welding easily flows to the metal frame through the contact portion having this large area, so that the current flowing between the pair of roller electrodes of the seam welding machine is reduced. It can be small. At the same time, the width of the other opposite side of the metal frame is 1.2 to 2 times smaller than the width of one side.
Since it is twice as wide, the other side of the metal frame can favorably absorb the thermal shock and thermal stress generated when the other side is seam-welded.

According to the method of sealing an electronic component housing package of the present invention, a metal lid is placed on the upper surface of a metal frame, and the metal frame and the metal lid are separated from each other by the width of the metal frame. Is seam welded along one of the opposite sides where the metal frame body is 1.2 to 2 times wider than the other opposite side, so that the metal frame body is wider When seam welding is performed along opposing sides of the seam welding machine, the area of the contact portion between the metal cover and the metal frame immediately below the roller electrode of the seam welding machine is large, and the seam is accordingly passed through this contact portion. Since the current for welding easily flows to the metal frame, the current flowing between the pair of roller electrodes of the seam welding machine can be reduced to reduce the thermal shock and thermal stress caused by the current. At the same time, since the width of the other opposing side of the metal frame is 1.2 to 2 times wider than the width of the one opposing side, the thermal shock generated when the other side is seam-welded And thermal stress can be favorably absorbed by the other side of the metal frame.

[0012]

Next, the present invention will be described with reference to the accompanying drawings.

FIG. 1 is a perspective view showing an embodiment of an electronic component storage package according to the present invention. In FIG. 1, reference numeral 1 denotes an insulating base, 2 denotes a metal frame, and 3 denotes a metal lid. These mainly constitute a container for hermetically containing the electronic component 6.

The insulating base 1 has a substantially square shape with a side length of about 2 to 20 mm and a thickness of about 0.5 to 3 mm, and a substantially square concave mounting portion for mounting the electronic component 6 at the center of the upper surface thereof. 1a is provided. The electronic component 6 is mounted and fixed on the mounting portion 1a.

The insulating substrate 1 is made of an electrically insulating material such as a sintered body of aluminum oxide, a sintered body of aluminum nitride, a sintered body of mullite, and a glass-ceramic. If it is, aluminum oxide, silicon oxide, calcium oxide,
Organic binder suitable for raw material powder such as magnesium oxide
A plurality of ceramic green sheets are obtained by adding a solvent and mixing to form a slurry, and forming the sheet into a sheet by employing a conventionally known doctor blade method or the like. Applying appropriate punching and laminating these up and down,
It is manufactured by firing at a temperature of about 1600 ° C.

A plurality of metallized wiring conductors 4 extending from the bottom surface of the mounting portion 1a to the lower surface via the side surface are formed on the insulating base 1. Metallized wiring conductor 4
Functions as a conductive path for electrically connecting each electrode of the electronic component 6 mounted on the mounting portion 1a to an external electric circuit, and each electrode of the electronic component 6 is soldered on the bottom surface of the mounting portion 1a. And a portion led out to the lower surface of the insulating base 1 is connected to an external electric circuit through an electrical connection means made of solder or the like. You.

The metallized wiring conductor 4 is made of metallized metal powder such as tungsten, molybdenum, copper, silver, etc., and insulates a metal paste obtained by adding a suitable organic binder and solvent to a metal powder such as tungsten. The ceramic green sheet for the base 1 is printed and applied in a predetermined pattern by a screen printing method, and is fired together with the ceramic green sheet laminate for the insulating base 1 to thereby mount the lower surface of the mounting portion 1a of the insulating base 1 from the bottom to the side. Is formed.

The surface of the metallized wiring conductor 4 has
In order to effectively prevent the metallized wiring conductor 4 from being oxidized and corroded and to improve the connectivity between the metallized wiring conductor 4 and the electrical connection means, it is usual to use nickel having a thickness of about 1 to 10 μm. 0.1 plating layer and thickness
A gold plating layer having a thickness of about 3.0 μm is sequentially applied by a conventionally well-known electrolytic plating method or electroless plating method.

Further, on the upper surface of the insulating base 1, a mounting portion 1 is provided.
A substantially square frame-shaped brazing metallization layer 5 made of metal powder of metal such as tungsten, molybdenum, copper or silver is formed so as to surround a. The brazing metallization layer 5 has a thickness of about 10 to 20 μm and a width of each side of about 0.2 to 1 mm, and functions as a base metal for joining the metal frame 2 to the insulating base 1. And
The mounting portion 1a is provided on the upper surface of the brazing metallization layer 5.
Is surrounded by a brazing material such as silver brazing. Such a metallized layer 5 for brazing is formed by adding a suitable organic binder and a solvent to a metal powder such as tungsten and mixing the metal paste to a ceramic green sheet for the insulating substrate 1 in a predetermined pattern by a screen printing method. By printing and applying this and baking it together with the ceramic green sheet laminate for the insulating substrate 1, it is adhered and formed on the upper surface of the insulating substrate 1 so as to surround the mounting portion 1a.

In order to improve the wettability between the brazing metallization layer 5 and the brazing material, the surface of the brazing metallization layer 5 is usually nickel-plated with a thickness of about 0.5 to 5 μm. The layers are pre-applied before brazing.

The metal frame 2 brazed to the brazing metallization layer 5 via a brazing material such as silver brazing is made of a metal such as an iron-nickel alloy or an iron-nickel-cobalt alloy. The lid 3 functions as a base metal member for welding to the insulating base 1. As shown in the top view of the insulating base 1 and the metal frame 2 in FIG. 2, the metal frame 2 has an inner periphery substantially the same size as the opening of the concave portion 1a.
The thickness is about 0.1 to 0.25 mm, the width of each side is about 0.15 to 1 mm, and the width W1 of one opposite side of the metal frame 2 is the width W2 of the other opposite side.
Is 1.2 to 2 times as large.

Then, as shown in a perspective view in FIG. 3, the metal cover 3 is placed on the upper surface of the metal frame 2, and the metal cover 3 is opposed to the metal cover 3 on the narrow side of the metal frame 2. A large current for seam welding is passed between the roller electrodes R while pressing and rolling a pair of roller electrodes R of the seam welding machine on the outer periphery, and one of the opposite sides of the metal frame 2 and the metal lid 3 is opposed. After seam-welding the sides, a pair of roller electrodes R of the seam welding machine is pressed and rolled on the opposed outer periphery of the metal lid 3 on the side where the width of the metal frame 2 is wide as shown in a perspective view in FIG. By moving a large current for seam welding between the roller electrodes R while moving, the other opposing sides of the metal frame 2 and the metal cover 3 are seam-welded, so that the metal frame 2 and the metal cover 3 are joined together to form an insulating base 1, a metal frame 2, and a metal. Container comprising the body 3 which is hermetically sealed.

In the package for storing electronic components according to the present invention, the width W1 of one opposing side of the metal frame 2 is set to be 1.times. The width W2 of the other opposing side.
It is important that it is 2 to 2 times, and in the method of sealing an electronic component housing package of the present invention, the side of the metal frame 2 where the width is narrow is seam-welded, and then the other side is seam-welded. It is important to weld. As described above, the width W2 of the other opposing side is set to be 1.2 to 2 times as wide as the width W1 of one opposing side of the metal frame 2, and the side of the metal frame 2 where the width is narrow is set to be smaller. After seam welding,
Since the other side is seam-welded, when the other side is seam-welded, the area of the contact portion between the metal lid 3 and the metal frame 2 immediately below the roller electrode R of the seam welding machine becomes large. Accordingly, the current for seam welding easily flows to the metal frame 2 via the contact portion having a large area, so that the current flowing between the pair of roller electrodes R of the seam welding machine is set to be small and this current is used. The thermal shock and thermal stress can be reduced, and the thermal shock and thermal stress can be favorably absorbed in the other side of the metal frame 2. Therefore, according to the electronic component housing package and the sealing method of the present invention, when the metal cover 3 is seam-welded to the metal frame 2, cracks occur in the insulating base 1, and the metal frame 2 does not peel. Can be effectively prevented.

The width W1 on one opposite side of the metal frame 2 is different from the width W1 on the other opposite side.
2 is less than 1.2 times, after seam welding one opposing side of the metal frame 2 and the metal lid 3, and then seam welding the other opposing side, the roller of the seam welding machine is used. The area of the contact portion between the metal lid 2 and the metal frame 3 immediately below the electrode R cannot be made sufficiently large, so that a larger current needs to flow between the pair of roller electrodes R of the seam welding machine. The thermal shock and the thermal stress caused by the current increase, and it becomes difficult to absorb the thermal shock and the thermal stress in the other side of the metal frame 2 satisfactorily. Or metal frame 2
Peeling is likely to occur. On the other hand, if it exceeds twice, the package becomes large in size to provide such a wide metal frame 2. Therefore, the width W2 of the other opposing side of the metal frame 2 is specified to be 1.2 to 2 times the width W1 of the other opposing side.

Such a metal frame 2 is manufactured in a predetermined frame shape by punching out a plate material made of an iron-nickel alloy, an iron-nickel-cobalt alloy or the like by a press machine.

The brazing of the metal frame 2 to the brazing metallization layer 5 is carried out by, for example, placing a foil-like brazing material having a thickness of 10 to 50 μm on the brazing metallization layer 5. Then, the brazing metallized layer 5 and the metal frame 2 are brazed by heating and melting the brazing material.

The exposed surface of the metallized layer 5 for brazing, the exposed surface of the metal frame 2 and the exposed surface of the brazing material after brazing are oxidized on the metallized layer 5 for brazing, the metal frame 2 and the brazing material. In order to effectively prevent corrosion, usually, a nickel plating layer having a thickness of 0.5 to 5 μm and a gold plating layer having a thickness of about 0.1 to 3.0 μm are formed by a conventionally known electrolytic plating method or electroless plating method. Are sequentially applied.

Thus, according to the electronic component housing package and the sealing method of the present invention, the electronic component 6 is mounted on the mounting portion 1a of the insulating base 1 and the electrodes of the electronic component 6 are metalized wiring conductors 4.
After being mounted and fixed via electrical connection means so as to be electrically connected to the metal frame 2, the metal cover 3 is placed on the metal frame 2, and the metal frame 2 and the metal cover 3 are Metal frame 2
Are joined by seam-welding one of the opposite sides of the wide side and then seam-welding the other opposite sides, whereby the insulating base 1, the metal frame 2, and the metal lid 3 are joined together. The electronic component 6 is hermetically sealed with high reliability inside the container made of.

The present invention is not limited to the above-described embodiment, and it goes without saying that various changes can be made without departing from the scope of the present invention. For example, in the example of the above-described embodiment, the width of the metal frame 2 is narrow on its long side and wide on its short side, but the width of the metal frame 2 is as shown in a top view in FIG. Alternatively, it may be wide on the long side and narrow on the short side.

[0030]

According to the electronic component housing package of the present invention, the width of one opposite side of the metal frame is 1.2 to 2 times the width of the other opposite side. After seam welding one opposing side of the metal frame and the metal lid, when seam welding the other opposing side, the metal lid and the metal frame just below the roller electrode of the seam welding machine. The area of the contact portion with the metal frame becomes large, and the current for seam welding easily flows to the metal frame through the contact portion having a large area, so that the current flows between the pair of roller electrodes of the seam welding machine. The current can be reduced, and the thermal shock and thermal stress generated when the other side is seam-welded can be favorably absorbed in the other side of the metal frame. Therefore, it is possible to provide an electronic component housing package having excellent hermetic reliability without causing cracks in the insulating base or peeling of the metal frame.

According to the method for sealing an electronic component housing package of the present invention, a metal lid is placed on the upper surface of a metal frame, and the metal frame and the metal lid are opposed to each other. After seam welding along the side, the width of the sealing frame is 1.2 ~
Since seam welding is performed along the other opposing side that is twice as wide, when seam welding is performed along the other opposing side where the width of the sealing frame is wide, the metal is placed immediately below the roller electrode of the seam welding machine. The area of the contact portion between the lid and the metal frame becomes large, and the current for seam welding easily flows through the contact portion to the metal frame, so that a pair of roller electrodes of the seam welding machine is used. By reducing the current flowing between them, the thermal shock and thermal stress caused by this current can be reduced, and the thermal shock and thermal stress generated when the other side is seam-welded to the other side of the metal frame. Can be absorbed well. Therefore, it is possible to provide a method for sealing an electronic component housing package which is excellent in hermetic reliability without causing cracks in the insulating base or peeling of the metal frame.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an example of an embodiment of an electronic component storage package according to the present invention.

FIG. 2 is a top view of an insulating substrate 1 and a metal frame 2 of the electronic component housing package shown in FIG.

FIG. 3 is a perspective view for explaining a method of sealing an electronic component housing package according to the present invention.

FIG. 4 is a perspective view for explaining a method for sealing an electronic component housing package of the present invention.

FIG. 5 is a top view corresponding to FIG. 2, showing another example of the embodiment of the electronic component storage package of the present invention.

FIG. 6 is a perspective view showing a conventional electronic component storage package.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Insulating base 1a ... Mounting part 2 ... Metal frame W1 ... Width at one opposite side of metal frame 2 W2 ... The other of metal frame 2 Width at opposite sides 3... Metal lid 6... Electronic component R... Roller electrode of seam welding machine

Claims (2)

[Claims] An insulating substrate having a mounting portion on which an electronic component is mounted on an upper surface thereof is formed by brazing a substantially rectangular frame-shaped metal frame surrounding the mounting portion on the upper surface of the insulating base. In the electronic component housing package in which the lid is joined, the metal frame has a width on one opposing side of the metal frame on the other opposing side.
An electronic component storage package, characterized in that the package is two to two times. 2. An insulating substrate having a mounting portion on which an electronic component is mounted on an upper surface, the insulating substrate surrounding the mounting portion.
The above metal is attached to a package body formed by brazing a substantially rectangular frame-shaped metal frame in which the width of the opposite side is 1.2 to 2 times the width of the opposite side. A metal lid is placed on the upper surface of the frame, and the metal frame and the metal lid are seam-welded along the one opposite side, and then seam-welded along the other opposite side. A method of sealing an electronic component storage package.