JP7088749B2 - Electronic element mounting boards, electronic devices, and electronic modules - Google Patents

Description

The present invention relates to an electronic element, for example, an image pickup element such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, a light emitting element such as an LED (Light Emitting Diode), and a sensor such as pressure, pressure, acceleration, and gyro. It relates to a substrate for mounting an electronic element on which an element having a function, an integrated circuit, or the like is mounted, and an electronic device.

A board for mounting an electronic element having a wiring board made of an insulating layer is known. Further, such a substrate for mounting an electronic element may consist of a large number of wiring boards in which a plurality of boards for mounting an electronic element are arranged. At this time, a step of applying plating to a pad exposed on the front surface or the back surface. A structure using an electroplating method is known as one of the above. (See Patent Document 1).

Japanese Patent Application Laid-Open No. 9-260565

Generally, when the electroplating method is used, a large number of wirings (plating wirings) connecting a plurality of adjacent electronic element mounting boards may be exposed on the side surface of the board. Since the wiring exposed on the side surface is electrically conductive with the electrode pads exposed on the front surface or the back surface of the electronic element mounting substrate, it may cause deterioration of electrical characteristics after the electronic element is mounted. Therefore, in order not to expose the wiring to the side surface, a plating wiring for electrical plating continuity, which is electrically connected to each electrode pad on the surface of the electronic element mounting substrate, is provided, and after plating is applied by the electric plating method, a laser or the like is provided. In some cases, the plated wiring and the electrode pad are insulated. However, in recent years, the electronic element mounting substrate has become smaller and smaller, and the distance between the insulating region and the electrode pad has become smaller. Therefore, for example, in the process of mounting an electronic element or an electronic component, an anisotropic conductive resin, solder, dust, or the like may adhere to the insulating region and may be electrically connected to the insulated plated wiring again. As a result, there is a concern that the electrical characteristics may deteriorate after the electronic element is mounted.

The electronic element mounting substrate according to one aspect of the present invention includes a substrate, a plurality of electrode pads located on the upper surface of the substrate, and a plurality of continuous electrode pads located on the upper surface of the substrate. The first conductor of the above, the groove portion located on the upper surface of the substrate, continuous with each of the plurality of first conductors, and located across the ends of the plurality of first conductors, and the position on the upper surface of the substrate. A plurality of second conductors, each of which is continuous in the groove portion, a first coat located on the upper surface of the plurality of first conductors, and a second coat located on the upper surface of the plurality of second conductors are provided. ing.

An electronic device according to one aspect of the present invention is characterized by comprising a substrate for mounting an electronic element and an electronic element electronic element mounted in a mounting area.

An electronic module according to one aspect of the present invention is characterized by comprising an electronic device and a housing located on the electronic device.

The substrate for mounting an electronic component according to one aspect of the present invention has a first coat and a second coat between the first conductor and the second conductor, so that the first conductor and the first conductor continuous with the electrode pad are present. It is possible to provide a wall between the two conductors. Therefore, anisotropic conductive resin, solder, dust, etc. adheres to the groove portion between the first conductor and the second conductor continuous with the electrode pad, and the first conductor and the second conductor insulated by the groove portion It is possible to reduce the electrical connection between the two. Therefore, it is possible to reduce the deterioration of the electrical characteristics after mounting the electronic element. Further, the electronic device and the electronic module according to one aspect of the present invention are provided with the above-mentioned electronic element mounting substrate, so that it is possible to reduce the deterioration of electrical characteristics.

1 (a) is a top view showing the appearance of the electronic device mounting substrate and the electronic device according to the first embodiment of the present invention, and FIG. 1 (b) is drawn from line X1-X1 of FIG. 1 (a). It is a corresponding vertical sectional view. FIG. 2A is a top view showing the appearance of the electronic device mounting substrate and the lid of the electronic device according to the first embodiment of the present invention, and FIG. 2B is FIG. 1A. It is a vertical sectional view corresponding to X2-X2 line. FIG. 3A is a top view showing the appearance of the electronic module according to the first embodiment of the present invention, and FIG. 3B is a vertical sectional view corresponding to X3-X3 line of FIG. 3A. be. 4 (a) and 4 (b) are enlarged deformation views of the main part A of the electronic device mounting substrate according to the first embodiment of the present invention. FIG. 5 is an enlarged deformation view of a main part A of the electronic device mounting substrate according to the first embodiment of the present invention. 6 (a) is a top view showing the appearance of an electronic device mounting substrate and an electronic device according to another aspect of the first embodiment of the present invention, and FIG. 6 (b) is an X6 of FIG. 6 (a). -It is a vertical sectional view corresponding to X6 line. FIG. 7A is a top view showing the appearance of the electronic device mounting substrate and the lid of the electronic device according to the second embodiment of the present invention, and FIG. 7B is FIG. 7A. It is a vertical sectional view corresponding to line X7-X7. FIG. 8A is an enlarged view of a main part B of the electronic device mounting substrate according to the second embodiment of the present invention, and FIG. 8B corresponds to the X8-X8 line of FIG. 8A. It is a cross-sectional view. 9 (a) is an enlarged view of a main part B of a substrate for mounting an electronic device according to another aspect of the second embodiment of the present invention, and FIG. 9 (b) is an enlarged view of X9-X9 of FIG. 9 (a). It is sectional drawing corresponding to a line. FIG. 10A is an enlarged view of a main part B of the electronic device mounting substrate according to the third embodiment of the present invention, and FIG. 10B corresponds to the X10-X10 line of FIG. 10A. It is a cross-sectional view. 11 (a) is an enlarged view of a main part B of a substrate for mounting an electronic device according to another aspect of the third embodiment of the present invention, and FIG. 11 (b) is an enlarged view of X11-X11 of FIG. 11 (a). It is sectional drawing corresponding to a line. 12 (a) is an enlarged view of a main part B of a substrate for mounting an electronic device according to another aspect of the third embodiment of the present invention, and FIG. 12 (b) is an enlarged view of X12-X12 of FIG. 12 (a). It is sectional drawing corresponding to a line.

<Structure of board for mounting electronic elements and electronic devices>
Hereinafter, some exemplary embodiments of the present invention will be described with reference to the drawings. In the following description, an electronic device is defined as a configuration in which an electronic element is mounted on a substrate for mounting an electronic element. Further, an electronic module is configured to have a housing or a member provided so as to be located on the upper surface side of an electronic element mounting substrate or to surround an electronic device. The electronic element mounting substrate, the electronic device, and the electronic module may be upward or downward in any direction, but for convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is upward.

(First Embodiment)
The electronic module 31, the electronic device 21, and the electronic element mounting substrate 1 according to the first embodiment of the present invention will be described with reference to FIGS. 1 to 6. In this embodiment, FIGS. 1, 2 and 6 show the electronic device 21, and FIG. 2 shows the electronic device 21 in which the lid 12 is omitted. FIG. 3 shows the electronic module 31. Further, FIGS. 4 to 5 show enlarged cross-sectional views of the main part A of the electronic element mounting substrate 1.

The electronic element mounting substrate 1 has a substrate 2. The substrate 2 has a plurality of electrode pads 3 on the upper surface thereof. On the upper surface of the substrate 2, a plurality of first conductors 5a continuous with each of the plurality of electrode pads 3 are provided. The plurality of first conductors 5a located on the upper surface of the substrate 2 are continuous with each of the first conductors 5a and have a groove portion 6 located across the ends of the plurality of first conductors 5a. The substrate 2 has a plurality of second conductors 5b continuous with each of the groove portions 6 on the upper surface thereof. The substrate 2 has a first coat 4a located on the upper surface of the plurality of first conductors 5a, and has a second coat 4b located on the upper surface of the plurality of second conductors 5b.

The substrate 2 may include a mounting area on the upper surface or the lower surface on which the electronic element 10 is mounted. Here, the mounting region is a region where at least one or more electronic elements 10 are mounted, and is appropriately described, for example, inside the outermost periphery of the electrode pad 3 described later, a region where the lid 12 is mounted, or other regions. It is possible to determine. Further, the component mounted in the mounting area is not limited to the electronic component 10, and may be an electronic component such as a capacitor, and the number of the electronic element 10 and / and the electronic component is not specified.

Here, in the example shown in FIGS. 1, 2 and 6, the substrate 2 is composed of a plurality of insulating layers, but for example, a configuration formed by a mold, a configuration formed by pressing a mold or the like, or the like. It may be the configuration of. The material of the insulating layer constituting the substrate 2 includes, for example, electrically insulating ceramics or a resin.

Examples of the electrically insulating ceramics used as the material of the insulating layer forming the substrate 2 include an aluminum oxide sintered body, a mulite sintered body, a silicon carbide sintered body, an aluminum nitride made sintered body, and silicon nitride. A quality sintered body, a glass-ceramic sintered body, or the like is included. Examples of the resin used as the material of the insulating layer forming the substrate 2 include a thermoplastic resin, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a fluororesin and the like. Examples of the fluororesin include ethylene tetrafluoride resin.

The substrate 2 may be formed of three insulating layers as shown in FIG. Further, it may be formed of two or less or four or more insulating layers. When the number of insulating layers is two or less, the thickness of the electronic element mounting substrate 1 can be reduced. Further, when the number of insulating layers is four or more, the rigidity of the electronic element mounting substrate 1 can be increased. Further, an opening may be provided in each insulating layer, and a step portion may be formed on an upper surface having different sizes of the provided openings, and the electrode pad 3 described later may be provided in the step portion.

The size of one side of the outermost periphery of the electronic element mounting substrate 1 is, for example, 0.3 mm to 10 cm. When the electronic element mounting substrate 1 has a rectangular shape in a plan view, it may be square or rectangular. Further, for example, the thickness of the electronic element mounting substrate 1 is 0.2 mm or more.

The substrate 2 of the electronic element mounting substrate 1 has an electrode pad 3. Here, the electrode pad 3 is
For example, it refers to a pad that is electrically connected to an electronic element 10 and / and an electronic component. Further, the upper surface of the substrate 2 has a plurality of first conductors 5a continuous with each of the plurality of electrode pads 3. Further, the substrate 2 has a plurality of second conductors 5b continuous with each of the groove portions 6 described later on the upper surface.

Further, the electronic element mounting substrate 1 may be provided with electrodes for connecting an external circuit on the upper surface, the side surface, or the lower surface of the substrate 2. The electrode for connecting an external circuit may electrically connect the substrate 2 to the external circuit board or the electronic device 21 to the external circuit board.

Further, on the substrate 2, in addition to the electrode pad 3, the first conductor 5a, the second conductor 5b and / and the electrode for connecting the external circuit, the electrodes formed between the insulating layers, the internal wiring conductor and the internal wiring conductor are connected vertically to each other. A through conductor may be provided. These electrodes, internal wiring conductors or through conductors may be exposed on the surface of the substrate 2. The electrode pad 3, the first conductor 5a, the second conductor 5b and / and the external circuit connection electrode may be electrically connected by the electrode, the internal wiring conductor or the through conductor, respectively.

The electrode pad 3, the first conductor 5a, the second conductor 5b, the external circuit connection electrode, the electrode, the internal wiring conductor and / and the through conductor are tungsten (W) when a plurality of insulating layers are made of electrically insulating ceramics. ), Molybdenum (Mo), manganese (Mn), silver (Ag) or copper (Cu), or alloys containing at least one metallic material selected from these. It may also be made of copper. Further, the electrode pad 3, the first conductor 5a, the second conductor 5b, the external circuit connection electrode, the internal wiring conductor and / and the through conductor are made of copper (Cu) or gold (Cu) when a plurality of layers are made of resin. Au), aluminum (Al), nickel (Ni), molybdenum (Mo) or titanium (Ti), or alloys containing at least one metallic material selected from these are included.

A plating layer may be further provided on the exposed surface of the electrode pad 3, the first conductor 5a, the second conductor 5b, the electrode for connecting an external circuit, the electrode, the internal wiring conductor and / and the through conductor. According to this configuration, the exposed surfaces of the electrodes for connecting external circuits, the conductor layer and the through conductor can be protected to reduce oxidation. Further, according to this configuration, the electrode pad 3 and the electronic element 10 can be satisfactorily electrically connected via an electronic element connecting material 13 such as wire bonding. The plating layer may be, for example, coated with a Ni plating layer having a thickness of 0.5 μm to 10 μm, or the Ni plating layer and a gold (Au) plating layer having a thickness of 0.5 μm to 3 μm may be sequentially coated. good.

Here, the first conductor 5a is electrically connected to the electrode pad 3. Further, the second conductor 5b is located away from the first conductor 5a with a groove 6 described later interposed therebetween.

The substrate 2 of the electronic element mounting substrate 1 has continuous grooves 6 in each of the first conductor 5a and the second conductor 5b. The groove 6 is, for example, a portion where the first conductor 5a and / and the second conductor 5b are cut by a laser or the like. Generally, when the electroplating method is used, the wiring connecting a plurality of adjacent electronic element mounting substrates may be exposed on the side surface. Since the wiring exposed on the side surface is electrically conductive with the electrode pads exposed on the front surface or the back surface of the electronic element mounting substrate, it may cause deterioration of electrical characteristics after the electronic element is mounted.

On the other hand, in the present embodiment, the substrate 2 of the electronic element mounting substrate 1 has continuous grooves 6 in each of the first conductor 5a and the second conductor 5b. This groove is provided with a first conductor 5a that conducts with each electrode pad 3 on the surface of the substrate 2, and a second conductor 5b for conducting electroplating. It is possible to insulate the conductor 5a and the second conductor 5b. As a result, the electronic element mounting substrate 1 can reduce the wiring exposed on the side surface of the substrate 2 or the wiring exposed on the side surface and the internal wiring conducting with the electrode pad 3 from conducting. It will be possible. Therefore, it is possible to reduce the deterioration of the electrical characteristics after mounting the electronic element 10 in the electronic device 21.

Here, the groove 6 is a region between the first conductor 5a and the second conductor 5b, and is a portion where the first conductor 5a and the second conductor 5b are not located on the surface of the substrate 2. The groove 6 may have an exposed upper surface of the substrate 2 when viewed from above, or may have a concave shape as described later.

A metal body may be adhered to the surface of the groove 6. At this time, since the first conductor 5a and the second conductor 5b are not connected via the metal body, the effect of the present embodiment can be achieved. The virtual extension line from the end of the first conductor 5a on the side continuous with the groove 6 and the virtual extension line from the end of the second conductor 5b on the side continuous with the groove 6 intersect each other in the top view. It may be (overlapping).

The substrate 2 of the electronic element mounting substrate 1 has a first coat 4a located on the upper surface of the plurality of first conductors 5a, and has a second coat 4b located on the upper surface of the plurality of second conductors 5b. As described above, by forming the groove 6 with a laser or the like after coating the electric field plating, it is possible to reduce the deterioration of the electrical characteristics after mounting the electronic element in the electronic device 21. However, in recent years, the electronic element mounting substrate has become smaller and smaller, and the distance between the insulating region and the electrode pad has become smaller. Therefore, without the first coat 4a and the second coat 4b, for example, in the process of mounting an electronic element or an electronic component, anisotropic conductive resin, solder, dust, or the like adheres to the insulating region, and the insulated second conductor is insulated. It may be electrically connected again, and there is a concern that the electrical characteristics may deteriorate after the electronic element is mounted.

On the other hand, in the present embodiment, the substrate 2 of the electronic element mounting substrate 1 has the first coat 4a located on the upper surface of the plurality of first conductors 5a, and the second substrate 2 located on the upper surface of the plurality of second conductors 5b. It has a coat 4b. With this structure, it is possible to provide a simple wall with the first coat 4a and the second coat 4b in the vicinity of the groove 6 between the first conductor 5a and the second conductor 5b continuous with the electrode pad 3. .. Therefore, it is possible to reduce the possibility that the anisotropic conductive resin, solder, dust, etc. used in the process of mounting the electronic element 10 in the groove 6 flows from the electrode pad 3 side or adheres due to other factors. It becomes. This makes it possible to reduce the electrical connection between the first conductor 5a and the second conductor 5b, which are electrically insulated by the groove 6. As a result, it is possible to reduce the deterioration of the electrical characteristics of the electronic device 21 after mounting the electronic element 10.

Further, in the present embodiment, the second coat 4b is located on the upper surface of the second conductor 5b. The electronic device may use a lid, which will be described later, on the upper surface. At this time, the lid may be joined using a lid joining material described later. At this time, the lid joint material flows into the groove, or dust or the like generated in the process of applying the lid joint material adheres to the groove, so that the first conductor is electrically connected again to be insulated. It may end up. As a result, there is a concern that the electrical characteristics may deteriorate after the electronic element is mounted.

On the other hand, by having the second coat 4b also on the upper surface of the second conductor 5b as in the present embodiment, the lid joint material 14 or dust or the like generated when the lid joint material 14 is applied adheres to the groove 6. Can be reduced. This makes it possible to reduce the electrical connection between the first conductor 5a and the second conductor 5b, which are electrically insulated by the groove 6. As a result, it is possible to reduce the deterioration of the electrical characteristics of the electronic device 21 after mounting the lid body 14.

As a result, it is possible to reduce the exposure of wiring on the side surface of the substrate 2 or the electrical connection between the exposed wiring and the electrode pad 3, and improve the electrical characteristics, and plating by electroplating. It becomes possible to apply a coating film.

As in the example shown in FIG. 1, the groove 6 may be provided in only one place between the first conductor 5a and the second conductor 5b, but may be provided in, for example, two or more places. When the grooves 6 are provided in two or more places, the first coat 5a needs to be located in the vicinity of the electrode pad 3, but the second coat 5b is a different place from the first coat 5a and is the second. It may be located anywhere on the upper surface of the conductor 5b.

As in the example shown in FIG. 1, when a plurality of first conductors 5a are arranged side by side, the first coat 4a may be located across the upper surface of the plurality of first conductors 5a. Since the first coat 4a is located straddling the upper surface of the plurality of first conductors 5a, it is possible to simplify the process of forming the first coat 4a. Further, when the first coat 4a is located on each of the first conductors 5a, an error occurs in the position or size of the first coat 4a due to a process error or the like in the process of forming the first coat 4a, and the first coat 4a is first. It may not be provided on the entire upper surface of the conductor 5a. At this time, since the first coat 4a straddles the plurality of first conductors 5a, even if an error occurs in the step of providing the first coat 4a, the first coat 4a cannot cover the first conductor 5a. It is possible to reduce it. Therefore, it is possible to further improve the effect of this embodiment.

As in the example shown in FIG. 1, when a plurality of second conductors 5b are arranged side by side, the second coat 4b may be located across the upper surface of the plurality of second conductors 5b. Since the second coat 4b is located on the upper surface of the plurality of second conductors 5b so as to straddle the upper surface, it is possible to simplify the process of forming the second coat 4b. Further, when the second coat 4b is located on each of the second conductors 5b, an error occurs in the position or size of the second coat 4b due to a process error or the like in the process of forming the second coat 4b, and the second coat 4b is formed. It may not be provided on the entire upper surface of the conductor 5b. At this time, since the second coat 4b straddles the plurality of second conductors 5b, even if an error occurs in the process of providing the second coat 4b, the second coat 4b cannot cover the second conductor 5b. It is possible to reduce it. Therefore, it is possible to further improve the effect of this embodiment.

In the example shown in FIG. 1, the outer side of the second coat 4b is positioned so as to overlap the outer side of the substrate 2 in the upper view, but the outer side of the second coat 4b is located in the upper view than the outer side of the substrate 2. It may be located inside. As shown in the example shown in FIG. 1, the outer side of the second coat 4b of the electronic element mounting substrate 1 is positioned so as to overlap the outer side of the substrate 2 in the top view, thereby reducing the exposed portion of the second conductor 5b. It is possible to make it. Therefore, it is possible to further improve the effect of the present embodiment, reduce the amount of plating adhered by electroplating, and reduce the cost of the electronic element mounting substrate 1. Further, since the outer side of the second coat 4b of the electronic element mounting substrate 1 is located inside the outer side of the substrate 2 in the upper view, the second coat 4b is provided in the step of providing the second coat 4b. It is possible to reduce protrusion from the outer side of the substrate 2 to the outside or hanging on the side surface of the substrate 2. Therefore, it is possible to reduce the increase in the outer dimensions of the substrate 2, and it is possible to reduce the problems that the housing, which will be described later, cannot be installed and cannot be mounted (cannot fit) in the mounting area.

Materials constituting the first coat 4a and / and the second coat 4b include, for example, electrically insulating ceramics or resins. Examples of the electrically insulating ceramics used as the material of the insulating layer forming the first coat 4a and / and the second coat 4b include an aluminum oxide sintered body, a mullite sintered body, and a silicon carbide sintered body. An aluminum nitride sintered body, a silicon nitride sintered body, a glass ceramic sintered body and the like are included. Examples of the resin used as the material of the insulating layer forming the substrate 2 include a thermoplastic resin, an epoxy resin, a polyimide resin, an acrylic resin, a phenol resin, a fluororesin and the like. Examples of the fluororesin include ethylene tetrafluoride resin.

The first coat 4a and / and the second coat 4b may be a film made of an insulating paste or may be an insulating layer. In either case, the effect of the present invention can be achieved. Since the first coat 4a and / and the second coat 4b are insulating films made of an insulating paste, the substrate 2 can be made thinner. Since the first coat 4a and / and the second coat 4b are insulating layers, it is possible to provide a large thickness. Therefore, it is possible to further reduce the possibility that the anisotropic conductive resin, solder, dust, etc. used in the process of mounting the electronic element 10 in the groove 6 flows from the electrode pad 3 side or adheres due to other factors. It will be possible. This makes it possible to reduce the electrical connection between the first conductor 5a and the second conductor 5b, which are electrically insulated by the groove 6, and after mounting the electronic element 10, the electronic device It is possible to reduce the deterioration of the electrical characteristics of 21.

The material of the first coat 4a and / and the second coat 4b may be the same as that of the substrate 2. By being the same, it is possible to reduce the difference in the coefficient of thermal expansion due to the material difference in the heating step such as the step of mounting the electronic element 10, the electronic component, and / or the step of mounting the housing. Therefore, it is possible to reduce peeling or cracking due to the difference in the change in thermal expansion.

When the substrate 2 and the first coat 4a and / and the material constituting the second coat 4b are electrically insulating ceramics, the substrate 2 and the first coat 4a and / and the second coat 4b are sintered and integrated. You may. Since the substrate 2 and the first coat 4a and / and the second coat 4b are sintered and integrated, it is possible to reduce the peeling of the first coat 4a and / and the second coat 4b. Therefore, when the first coat 4a and / and the second coat 4b are peeled off, foreign matter adheres to the groove 6, and the space between the first conductor 5a and the second conductor 5b electrically insulated by the groove 6 is electrically. It is possible to reduce the connection. Therefore, it is possible to reduce the deterioration of the electrical characteristics of the electronic device 21 after mounting the electronic element 10.

The size (width) of the groove 6 between the first conductor 5a and the second conductor 5b may be, for example, 0.05 mm or more. As a result, it is possible to secure the insulating property between the first conductor 5a and the second conductor 5b even if a process error occurs when the groove 6 is manufactured by a laser or the like. Further, for example, if it is 0.5 mm or less, the size can be further reduced.

The end of the first conductor 5a, the end of the first coat 4a, the end of the second conductor 5b, and the end of the second coat 4b may overlap (may be flush with each other) in a top view. ), The end of the first coat 4a or the second coat 4b may be located inside or outside the end of the first conductor 5a or the end of the second conductor 5b. When the end of the first conductor 5a, the end of the first coat 4a, the end of the second conductor 5b, and the end of the second coat 4b overlap in a top view, when the groove 6 is manufactured by a laser or the like. At the same time, it is possible to manufacture the end portion of the first conductor 5a, the end portion of the first coat 4a, the end portion of the second conductor 5b, and the second coat 4b. Therefore, it is possible to reduce the process load of the electronic element mounting substrate 1. The end of the first conductor 5a, the end of the first coat 4a, the end of the second conductor 5b, and the end of the second coat 4b are the end of the first conductor 5a or the end of the second conductor 5b in top view. Located inside or outside. This makes it possible to reduce the contact of the laser with the first coat 4a or the second coat 4b when the groove 6 is manufactured by a laser or the like. Therefore, it is possible to reduce the generation of dust from the first coat 4a or the second coat 4b.

The ends of the plurality of second conductors 5b of the electronic element mounting substrate 1 may have a lower glossiness than other parts of the second conductor 5b. With this structure, it is possible to reduce the occurrence of corrosion or the like even when moisture, dust or the like is generated and comes into contact with the end portion of the second conductor 5b. For example, when the groove 6 is made by using a laser in the step of making the groove 6, the end portion of the second conductor 5b is oxidized by the laser and the glossiness is reduced. This protects the end of the second conductor 5b. Therefore, for example, in the process of mounting the electronic element 10, when dust such as moisture is generated, it is possible to reduce the occurrence of corrosion or the like in contact with the end portion of the second conductor 5b. Further, when the laser or the like comes into contact with the substrate 2, the glass component melts and adheres to the end portion of the second conductor 5b, so that the glossiness is reduced. Even in this case, the glass component covers the end portion of the second conductor 5b, so that the gloss is reduced. This protects the end of the second conductor 5b. Therefore, for example, in the process of mounting the electronic element 10, when dust such as moisture is generated, it is possible to reduce the occurrence of corrosion or the like in contact with the end portion of the second conductor 5b.

4 and 5 show an enlarged view of a main part A of the electronic element mounting substrate 1. The second conductor 5b of the electronic element mounting substrate 1 may extend to, for example, the outer side of the substrate 2 as shown in the example shown in FIG. 1, or a plurality of second conductors 5b may extend to the outer side of the substrate 2 as shown in the example shown in FIG. It may overlap at one point and be exposed on the side surface via the through conductor or the like and the internal wiring of the substrate 2. Even in such a case, by having the first coat 4a and the second coat 4b on the upper surfaces of the first conductor 5a and the second conductor 5b, it is possible to achieve the effect of the present embodiment.

Generally, when plating is applied to the surface of the exposed electrode pad 3 of the electronic element mounting substrate 1 by an electroplating method, a method of directly touching a terminal to a conductor connected to each electrode pad 3 to pass a current. There is also a method of arranging a plurality of electronic element mounting substrates 1 vertically and horizontally and passing a current in the state of a large number of wiring substrates to which each substrate 2 is electrically connected. For example, when plating is applied by the electroplating method in the state of a large number of wiring boards, adjacent electronic elements are mounted because the second conductor 5b extends to the outer side of the board 2 as shown in the example shown in FIG. The second conductors 5b can be electrically connected to each other directly between the boards 1. Further, for example, when plating is applied by the electroplating method in the state of a large number of wiring boards, as shown in the example shown in FIG. 4, a plurality of second conductors 5b overlap at one point, so that the substrate 2 is covered. Adjacent electronic element mounting substrates 1 can be electrically connected via the side surface. In this case, since the area exposed on the surface of the second conductor 5b can be reduced, the amount of plating adhered by electroplating can be reduced. Therefore, the cost of the electronic element mounting substrate 1 can be reduced. Further, since the area where the second conductor 5b is exposed on the surface of the substrate 2 can be reduced, it is possible to increase the number of electronic components mounted on the surface of the substrate 2 without increasing the size of the substrate 2. Become. Therefore, the electronic device 21 can be made more sophisticated and smaller.

In FIG. 4A, two adjacent second conductors 5b overlap at one point, and in FIG. 4B, three adjacent second conductors 5b overlap at one point. In this way, the number of the second conductors 5b to be overlapped can be appropriately selected. In the electroplating method, the thickness of the plating to be adhered differs depending on the magnitude of the current (the magnitude of the resistance). Therefore, the number of the second conductors 5b to be overlapped may be adjusted as appropriate according to the thickness of the plating film. ..

In the example shown in FIG. 5, the plurality of second conductors 5b are continuous with the third conductor 5c. Even in such a structure, by having the first coat 4a and the second coat 4b on the upper surfaces of the first conductor 5a and the second conductor 5b, it is possible to achieve the effect of the present embodiment. Further, since the plurality of second conductors 5b are continuous with the third conductor 5c having a large area, the current to the first conductor 5a and the electrode pad 3 before forming the second conductor 5b and the groove 6 is made uniform. It becomes possible to do. Therefore, it is possible to apply plating having a stable thickness.

When the electronic element mounting substrate 1 has a large third conductor 5c, it may cover the front surface of the second coat 4b, the second conductor 5b and / and the third conductor 5c. With this structure, it is possible to reduce the area exposed on the surface of the third conductor 5c, so that it is possible to reduce the amount of plating adhered by electroplating. Therefore, the cost of the electronic element mounting substrate 1 can be reduced.

The third conductor 5c may be made of the same material as the first conductor 5a and / and the second conductor 5b.

<Configuration of electronic device>
1 to 2 and 6 show an example of the electronic device 21. The electronic device 21 includes an electronic element mounting substrate 1 and an electronic element 10 mounted on the upper surface or the lower surface of the electronic element mounting substrate 1.

The electronic device 21 has an electronic element mounting substrate 1 and an electronic element 10 mounted on the electronic element mounting substrate 1. Examples of the electronic element 10 include an image pickup element such as a CCD (Charge Coupled Device) type or a CMOS (Complementary Metal Oxide Semiconductor) type, a light emitting element such as an LED (Light Emitting Diode), pressure, pressure, acceleration, gyro and the like. An element having a sensor function, an integrated circuit, or the like. The electronic element 10 may be arranged on the upper surface of the substrate 2 via an adhesive. For this adhesive, for example, silver epoxy or thermosetting resin is used.

The electronic element 10 and the electronic element mounting substrate 1 may be electrically connected by, for example, an electronic element connecting material 13 including wire bonding, solder balls, gold bumps, and the like.

The electronic device 21 may have a lid 12 bonded to the upper surface of the electronic element mounting substrate 1 while covering the electronic element 10. Here, the electronic element mounting substrate 1 may be connected to the upper surface of the frame-shaped portion of the substrate 2, or the lid 12 may be supported so as to be the upper surface of the substrate 2 and surround the electronic element 10. The provided frame-shaped body may be provided. Further, the frame-shaped body and the substrate 2 may be made of the same material, or may be made of different materials.

When the frame-shaped body and the substrate 2 are made of the same material, the substrate 2 may be made to be integrated with the insulating layer of the uppermost layer by providing an opening with the frame-shaped body. Further, they may be joined separately with a brazing material or the like.

Further, as an example in which the substrate 2 and the frame-shaped body are made of different materials, the frame-shaped body may be made of the same material as the lid body joining material 14 for joining the lid body 12 and the substrate 2. At this time, by providing the lid body joining material 14 thickly, it is possible to have both the effect of adhesion and the effect of a frame-shaped body (member supporting the lid body 12). Examples of the lid bonding material 14 at this time include a thermosetting resin, a low melting point glass, a brazing material made of a metal component, and the like. Further, the frame-shaped body and the lid body 12 may be made of the same material, and in this case, the frame-shaped body and the lid body 12 may be configured as the same individual.

For the lid 12, for example, when the electronic element 10 is an image pickup element such as CMOS or CCD, or a light emitting element such as LED, a highly transparent member such as a glass material is used. Further, for the lid 12, for example, when the electronic element 10 is an integrated circuit or the like, a metal material, a ceramic material, or an organic material may be used.

The lid body 12 is bonded to the electronic element mounting substrate 1 via the lid body bonding material 14. Examples of the material constituting the lid joining material 14 include a brazing material made of a thermosetting resin, a low melting point glass, or a metal component.

By having the electronic device 21 having the electronic element mounting substrate 1 as shown in FIGS. 1 to 2 and 6.
It is possible to reduce the deterioration of the electrical characteristics of the electronic element 10.

Further, in the example shown in FIG. 6, in the electronic device 21, the lid joining material 14 covers the groove 6. By covering the groove 6 with the lid joining material 14 in this way, it is possible to reduce the adhesion of dust to the groove 6 even if dust is blown up by vibration from the outside after the step of joining the lid 12. Is possible. Therefore, it is possible to reduce the electrical connection between the first conductor 5a and the second conductor 5b electrically insulated by the groove 6, and after mounting the electronic element 10, the electronic device 21 can be used. It is possible to reduce the deterioration of the electrical characteristics of the.

<Configuration of electronic module>
FIG. 3 shows an example of the electronic module 31 using the electronic element mounting substrate 1. The electronic module 31 has an electronic device 21 and a housing 32 provided so as to cover the upper surface of the electronic device 21 or the electronic device 21. In the example shown below, an imaging module will be described as an example for explanation.

The electronic module 31 may have a housing 32 (lens holder). By having the housing 32, it is possible to further improve the airtightness or reduce the direct application of stress from the outside to the electronic device 21. The housing 32 is made of, for example, a resin or a metal material. Further, when the housing 32 is a lens holder, the housing 32 may incorporate one or more lenses made of resin, liquid, glass, crystal, or the like. Further, the housing 32 is equipped with a drive device or the like that drives the lens or the like up, down, left or right, and is electrically connected to the pad or the like located on the surface of the electronic element mounting substrate 1 via a joining material such as solder. It may have been done.

The housing 32 may be provided with openings on at least one side in four directions when viewed from above. Then, an external circuit board may be inserted through the opening of the housing 32 and electrically connected to the electronic element mounting board 1. Further, in the opening of the housing 32, after the external circuit board is electrically connected to the electronic element mounting substrate 1, the gap of the opening is closed with a sealing material such as resin, and the inside of the electronic module 31 is airtight. It may have been done.

When the electronic module 31 has the electronic element mounting substrate 1 as shown in FIG. 3, it is possible to reduce the deterioration of the electrical characteristics.

<Manufacturing method of electronic device mounting board and electronic device>
Next, an example of the manufacturing method of the electronic element mounting substrate 1 and the electronic device 21 of the present embodiment will be described. An example of the manufacturing method shown below is a manufacturing method of the substrate 2 using a large number of wiring boards.

(1) First, a ceramic green sheet constituting the substrate 2 is formed. For example, in the case of obtaining a substrate 2 which is an aluminum oxide (Al ₂ O ₃ ) quality sintered body, silica (SiO ₂ ), magnesia (MgO) or calcia (CaO) or calcia (CaO) is added to the powder of Al ₂ O ₃ as a sintering aid. ) And other powders are added, and appropriate binders, solvents and plasticizers are added, and then the mixture thereof is kneaded to form a slurry. Then, a ceramic green sheet for taking a large number of pieces is obtained by a molding method such as a doctor blade method or a calendar roll method.

When the substrate 2 is made of resin, for example, the substrate 2 can be formed by molding by a transfer molding method, an injection molding method, or the like using a mold that can be molded into a predetermined shape. Further, the substrate 2 may be a substrate made of glass fiber impregnated with a resin, for example, a glass epoxy resin. In this case, the substrate 2 can be formed by impregnating a base material made of glass fiber with a precursor of an epoxy resin and thermosetting the epoxy resin precursor at a predetermined temperature.

(2) Next, the electrode pad 3, the first conductor 5a, the second conductor 5b, the external circuit connection electrode, the internal wiring conductor, and the electrode pad 3, the first conductor 5a, the second conductor 5b, and the ceramic green sheet obtained in the step (1) above by the screen printing method or the like. A metal paste is applied or filled in the portion to be a through conductor. This metal paste is produced by adding an appropriate solvent and a binder to the above-mentioned metal powder made of a metal material and kneading the paste to adjust the viscosity to an appropriate level. The metal paste may contain glass or ceramics in order to increase the bonding strength with the substrate 2.

When the substrate 2 is made of resin, the electrode pad 3, the first conductor 5a, the second conductor 5b, the electrode for connecting an external circuit, the internal wiring conductor, and the through conductor shall be manufactured by a sputtering method, a vapor deposition method, or the like. Can be done. Further, it may be produced by using a plating method after providing a metal film on the surface. At this time, the first conductor 5a and the second conductor 5b can be continuously formed so that the electrode pad 3 can be plated by the electroplating method described later. In this step, the first coat 4a and the second coat 4b can be produced by applying an insulating paste to a predetermined portion.

(3) Next, the above-mentioned green sheet is processed by a mold or the like. Here, when the substrate 2 has an opening or a notch or the like, an opening or a notch or the like may be formed at a predetermined position on the green sheet to be the substrate 2. Further, at this time, the green sheet is formed into the first coat 4a and the second coat 4b, and an insulating layer to be the first coat 4a and the second coat 4b is produced by using a mold, punching, a laser, or the like. May be good.

(4) Next, the ceramic green sheets to be the insulating layers of the substrate 2 are laminated and pressed. As a result, the green sheets to be the insulating layers may be laminated to produce a ceramic green sheet laminate to be the substrate 2 (the substrate for mounting electronic devices 1). Further, at this time, the first coat 4a and the second coat 4b are formed by laminating the insulating layer to be the first coat 4a and the second coat 4b produced in the previous step on the upper surface of the uppermost green sheet. It may be provided.

(5) Next, this ceramic green sheet laminate is fired at a temperature of about 1500 ° C. to 1800 ° C. to obtain a multi-layered wiring board in which a plurality of substrates 2 (electronic element mounting substrate 1) are arranged. By this step, the above-mentioned metal paste is fired at the same time as the ceramic green sheet that becomes the substrate 2 (the substrate for mounting the electronic element 1), and becomes an electrode pad 3, an electrode for connecting an external circuit, an internal wiring conductor, and a through conductor. ..

(6) Next, before dividing the multi-layer wiring board into a plurality of boards 2 (electronic element mounting board 1), the electrode pads 3, the external connection pads, and the exposed wiring are used by electroplating, respectively. Apply plating to the conductor.

(7) Next, a groove 6 is formed in a portion to be a groove 6 between the first conductor 5a and the second conductor 5b by using, for example, a laser or the like. By this step, the groove 6 is formed, and it becomes possible to electrically insulate the first conductor 5a and the second conductor 5b. Examples of the method for forming the groove 6 include a method of scraping with a laser, a method of melting with a chemical, and the like. Further, for example, it can be created by machining such as cutting the portion to be the groove 6 with a minitor or cutting the surface by a slicing method or the like.

(8) Next, the obtained multi-component wiring board is divided into a plurality of boards 2 (electronic element mounting board 1). In this division, a method of forming a dividing groove in a large number of wiring boards along the outer edge of the substrate 2 (electronic element mounting substrate 1) and breaking along the dividing groove to divide the wiring board. A method of cutting along the outer edge of the substrate 2 (electronic element mounting substrate 1) by a slicing method or the like can be used. The dividing groove can be formed by cutting a multi-piece wiring board smaller than the thickness of the multi-piece wiring board after firing, but the cutter blade may be pressed against the ceramic green sheet laminate for the multi-piece wiring board. It may be formed by cutting with a slicing device to be smaller than the thickness of the ceramic green sheet laminate.

(9) Next, the electronic element 10 is mounted on the upper surface or the lower surface of the electronic element mounting substrate 1. The electronic element 10 is electrically bonded to the electronic element mounting substrate 1 by an electronic element connecting material 13 such as wire bonding. At this time, an adhesive or the like may be provided on the electronic element 10 or the electronic element mounting substrate 1 and fixed to the electronic element mounting substrate 1. Further, after the electronic element 10 is mounted on the electronic element mounting substrate 1, the lid body 12 may be joined by the lid body joining material 14.

The electronic device 21 can be manufactured by manufacturing the electronic element mounting substrate 1 and mounting the electronic element 10 in the above steps (1) to (9). The process order of (1) to (9) above is not specified.

(Second embodiment)
Next, the electronic device mounting substrate 1 according to the second embodiment of the present invention will be described with reference to FIGS. 7 to 9. Note that FIG. 7 shows the shape of the electronic device 21 in which the electronic element mounting substrate 1 and the lid 12 are omitted in the present embodiment. 8 and 9 show an enlarged plan view of the main part B of FIG. 7 and an enlarged sectional view thereof.

The difference between the electronic element mounting substrate 1 of the present embodiment and the electronic element mounting substrate 1 of the first embodiment is that the substrate 2 has a dent at a position overlapping the groove 6 in a cross-sectional view. ..

FIG. 8 shows an enlarged deformation view of the main part B of FIG. 7. In the example shown in FIG. 8, the electronic element mounting substrate 1 has a dent in a part of the position where the substrate 2 overlaps the groove 6 in a cross-sectional view. For example, the electrode pad, the first conductor, and the second conductor may have a thickness of 1 μm to 50 μm. At this time, the groove has the same thickness, but the thinner the groove, the larger the amount of anisotropic conductive resin, solder, dust, etc., for example, in the process of mounting an electronic element or an electronic component. In some cases, they adhered to the groove, and the first conductor and the second conductor became easy to conduct.

On the other hand, in the present embodiment, the substrate 2 has a dent in a part of the position where the substrate 2 overlaps with the groove 6 in the cross-sectional view. As a result, even if the anisotropic conductive resin, solder, dust, or the like adheres to the groove 6 beyond the first coat 4a and / and the second coat 4b, the substrate 2 has a recessed portion. It is possible to trap in the dented part. Therefore, it is possible to reduce the electrical connection between the first conductor 5a and the second conductor 5b electrically insulated by the groove 6, and after mounting the electronic element 10, the electronic device 21 It is possible to reduce the deterioration of electrical characteristics.

When the substrate 2 is made of a plurality of electrically insulating ceramics, the depth of the recessed portion may be one layer or more of the uppermost layer among the plurality of insulating layers. Further, it may be provided halfway of the uppermost layer in the cross-sectional view.

In the example shown in FIG. 8, the outer edge of the groove 6 is located outside the outer edge of the recessed portion of the substrate 2. In other words, the distance between the first conductor 5a and the second conductor 5b is larger than the width of the recessed portion of the substrate 2. This makes it possible to reduce the conduction between the first conductor 5a and the second conductor due to the anisotropic conductive resin, solder, dust, or the like trapped in the recessed portion.

As a method for manufacturing the electronic element mounting substrate 1 shown in FIG. 8, for example, in addition to the manufacturing method of the first embodiment, there is a method of pressing a ceramic green sheet to be a substrate 2 with a mold. It can be manufactured by providing a recessed portion in advance at a position where the substrate 2 becomes a recessed portion by pressing or the like.

In the example shown in FIG. 9, the groove 6 and the outer edge of the recessed portion of the substrate 2 are positioned so as to overlap each other in the top view. In this case, when the groove 6 is made by a laser or the like, the recessed portion of the substrate 2 can be made at the same time. Therefore, it is possible to reduce the process load. Further, by forming the recessed portion of the substrate 2 at the same time as the groove 6, it is possible to reduce the process error between the position of the groove 6 and the position of the recessed portion of the substrate 2. Therefore, it is possible to further improve the effect of this embodiment.

As a method for manufacturing the electronic element mounting substrate 1 shown in FIG. 9, for example, in addition to the manufacturing method of the first embodiment, the output is increased in a step of cutting the first conductor 5a and the second conductor 5b with a laser or the like. , It can be manufactured by scraping the substrate 2 with a laser or the like. Further, it is possible to create the recessed portion of the groove 6 and the substrate 2 by machining such as cutting the portion to be the groove 6 with a minitor or cutting the surface by a slicing method or the like.

(Third embodiment)
Next, the electronic device mounting substrate 1 according to the third embodiment of the present invention will be described with reference to FIGS. 10 to 12. 10 to 12 show a deformed enlarged plan view of the main part B of FIG. 7 and a deformed enlarged cross-sectional view thereof. The difference between the electronic element mounting substrate 1 of the present embodiment and the electronic element mounting substrate 1 of the second embodiment is that the groove 6 and the recessed portion of the substrate 2 have an inclination in a cross-sectional view. ..

In the examples shown in FIGS. 10 to 12, the end portion of the groove portion has an inclined surface. As a result, even if the anisotropic conductive resin, solder, dust, or the like adheres to the groove 6 beyond the first coat 4a and / and the second coat 4b, the substrate 2 has a recessed portion. It is possible to trap in the dented part. Further, the groove 6, the first conductor 5a, the second conductor 5b, and the recessed portion of the substrate 2 each have a continuous inclination. Therefore, the anisotropic conductive resin, solder, or dust easily reaches not only the groove 6 but also the recessed portion of the substrate 2. Therefore, it is possible to reduce the electrical connection between the first conductor 5a and the second conductor 5b electrically insulated by the groove 6, and after mounting the electronic element 10, the electronic device 21 It is possible to reduce the deterioration of electrical characteristics.

In the example shown in FIG. 10, the groove 6, the first conductor 5a, the first coat 4a, the second conductor 5b, the second coat 4b, and the recessed portion of the substrate 2 each have a continuous inclination. In the example shown in FIG. 11, the groove 6, the first conductor 5a, the second conductor 5b, and the recessed portion of the substrate 2 each have a continuous inclination. In the example shown in FIG. 12, only the groove 6 provided in the substrate 2 has an inclination. In any of the cases of FIGS. 10 to 12, it is possible to obtain the same effect as that of the present embodiment. Further, the larger the inclination is, in other words, the shape is as shown in the example shown in FIG. 10 or 11, so that the effect of the present invention can be further improved. Further, as in the example shown in FIG. 12, when only the recessed portion of the substrate 2 has an inclination, the first conductor 5a, the first coat 4a, the second conductor 5b, and the second coat are formed in the process of making the inclination. It is possible to reduce the stress related to 4b. Therefore, it is possible to reduce the peeling of the first conductor 5a, the first coat 4a, the second conductor 5b, and the second coat 4b.

As a method for manufacturing the electronic device mounting substrate 1 shown in FIGS. 10 to 12, for example, in addition to the manufacturing method of the first embodiment, it can be manufactured by shaving with a laser or pressing with a mold. For example, when the electronic element mounting substrate 1 shown in FIG. 10 or 11 is manufactured, it can be manufactured by cutting so that the side surface is inclined in the step of creating the groove 6 using a laser. As a method for producing the electronic element mounting substrate 1 shown in FIG. 12, for example, in the step of preparing the ceramic green sheet to be the substrate 2 or the step of laminating, the substrate 2 is pressed with a mold or the like or scraped with a laser or the like. It is possible to create an inclination of the recessed portion located at. By creating the first conductor 5a and the like before and after that, the electronic element mounting substrate 1 shown in FIG. 12 can be manufactured.

The present invention is not limited to the example of the above-described embodiment, and various modifications such as numerical values are possible. Further, for example, in the example shown in each figure, the shape of the electrode pad 3 is rectangular in the top view, but it may be circular or other polygonal shape. Further, the arrangement, number, shape, mounting method of electronic elements, etc. of the electrode pads 3 in this embodiment are not specified. Further, the thickness and width of the coat do not have to be constant and may not be linear. The various combinations of the feature portions in the present embodiment are not limited to the examples of the above-described embodiments.

1 ... Electronic element mounting substrate 2 ... Substrate 3 ... Electrode pad 4a ... First coat 4b ... Second coat 5a ... First conductor 5b ... Second Conductor 5c ... Third conductor 6 ... Groove 10 ... Electronic element 12 ... Lid body 13 ... Electronic element bonding material 14 ... Lid body bonding material 21 ... Electronic device 31 ...・ ・ Electronic module 32 ・ ・ ・ Housing

Claims (7)

A substrate with multiple insulating layers and
A plurality of electrode pads located on the upper surface of the substrate, and
A plurality of first conductors located on the upper surface of the substrate and continuous with each of the plurality of electrode pads.
A groove portion that is continuous with each of the plurality of first conductors located on the upper surface of the substrate and is located across the ends of the plurality of first conductors.
A plurality of second conductors, each of which is continuous in the groove, located on the upper surface of the substrate.
The first coat located on the upper surface of the plurality of first conductors,
A second coat located on the upper surface of the plurality of second conductors,
An internal wiring conductor formed between the insulating layers and exposed on the surface of the substrate,
A through conductor connecting the second conductor and the internal wiring conductor is provided .
A substrate for mounting an electronic element, wherein the side surface of the second conductor located on the outer side of the substrate does not reach the outer side and is covered with the second coat . The electronic element mounting substrate according to claim 1, wherein the first coat is located so as to straddle the upper surface of the plurality of first conductors and the upper surface of the substrate. The electronic element mounting substrate according to claim 1 or 2, wherein the second coat is located so as to straddle the upper surface of the plurality of second conductors. The substrate for mounting an electronic element according to any one of claims 1 to 3, wherein the end portion of the groove portion has an inclined surface. The substrate for mounting an electronic element according to any one of claims 1 to 4, wherein the end portions of the plurality of second conductors have a glossiness smaller than that of other portions of the second conductor. The electronic device mounting substrate according to any one of claims 1 to 5.
An electronic device mounted on the upper surface of the electronic element mounting substrate and provided with the plurality of electrode pads and an electronic element electrically connected to each other. The electronic device according to claim 6 and
An electronic module including a housing located on the upper surface of the electronic device.

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