JPS60137093A - Method of cutting plated lead of flexible printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention is suitable for wiring of various types of electronic equipment! i-na flexible printed circuit board (F, FPC)
), and particularly relates to a method for cutting the plated leads.

The well-known F'PCi bending 5J north has printed wiring on a thin base film, which helps save mounting space and improve 1g load, and is useful for computer-related equipment,
Widely used for audio products and 1-port devices.

[Prior art]

The manufacturing process of this FPC is as follows.

■ A resist film is formed on the steel surface of the flexible copper clad plate, which is made of copper foil in contact with the base film, using the screen method and photo method to ultimately protect the remaining circuits. do.

■ Remove the conductor in the older part by etching.

■ Peel off the resist film, wash and dry.

■ Perform various surface treatments. That is, after the circuit conductor is electroplated with solder or the like, a flux (d) is applied to protect the circuit conductor (pre-flux treatment).

■ Performs outside cedar processing and hole drilling. One by one, multiple substrates formed on a single base film are separated one by one, and a large sword, such as Roe, is used.

■ Inspection and output #5゜ Figure 1 (a) is a plan view showing the state of the PC after the surface treatment described in ■ above. This shows the configuration of the main parts of one base of C. In this figure, l is a base film, and 2 is four circuits formed on the base film 1. Each time w&
A metal terminal 3 is formed at one end of the conductor 2, and these terminals are commonly connected to a plating lead 4.Here, when performing one-step plating with the above-mentioned standard and solder,
This is for supplying DC 1 to the terminal 3 and the circuit conductor 2, and is cut from the terminal 3 prior to the inspection (insulation inspection, etc.) of the circuit conductor 2 that is performed after the completion of air plating. It is something that will be done. Then, after this inspection was completed, the external shape processing described in (■) above was carried out, and each board was placed at one point 1IAS in Figure 1.
71 and commercialized.

By the way, when cutting the plated lead 4, it is impossible to completely cut the steel foil with a normal blade, so it is difficult to cut the plated lead 4 as shown in FIG.
As shown in (B) with reference numeral 5, this is done by punching a hole on top of the plated lead 4. However, with this cutting method, it is difficult to drill a hole that is aimed at the plated lead 4. The downside is that it takes time. Yo7ko,
A part of the plated lead 4 that should have been cut may remain connected, and a non-defective product may be determined to have poor insulation during an absolute inspection.

[Purpose of the invention]

This invention is above! #In consideration of the circumstances, is it possible to easily and reliably cut the plated leads of FPC? The present invention provides a method.

[Means to achieve the purpose]

To achieve this B"l', the present invention is applied to the plating lead kV potato-shaped blade type (Vic blade type J) to perform pressure cutting all at once.

〔Example〕

Hereinafter, the present invention will be described in detail based on the F1 drawing.

Is Figure 2 one implementation of the present invention? This is a diagram to explain lJ, (the same figure), (Ron shows each state before i/Jiff, 4, after H & machining cutting, (I, t'1 is a plan view, (mouth) 1.1-J is a cross-sectional view.

In these figures, ℃, 6 is a big blade type with a cut ui + V-shaped cedar blade a at the tip, and as shown in Figure 1, it is pressed against the cutting position [(7) from above. The blade die 6 cuts the plated lead 4 all at once by forming a V-shaped notch 8 at the cutting position 7 of the plated lead 4 as shown in FIG.

According to such a method, the cutting lead 4 can be cut all at once, thereby reducing cutting time. Also, the cutting length! If (V'1 in Figure 3) is made sufficiently longer by 1° than the distance l' between both ends of the terminal 3, there will be no failure in cutting even if positional deviation occurs, improving the reliability of inspections such as insulation inspection. I can do it.

〔Effect of the invention〕

As explained above, in this invention, the FPC soil is formed and the I-plated lead and V-shaped blade m (big blade type) are used to perform pressure cutting at once, so that the plated lead can be cut reliably and in a short time. It is possible to shorten the working time. It is possible to improve the reliability of circuit pattern inspection.

[Brief explanation of the drawing]

The marks in Figure 1 and (B) (flat figures for explaining the method of cutting the plated lead of Kobinmai, and Figure 2 B) to 2) are for explaining the method of cutting the plated lead in one embodiment of the present invention. In this figure, 4 is a circle diagram. 2... 4 circuits, 3... Terminal (4 parts). 4... Plated lead, 6... Bic blade type. Applicant: Fujikura 4-Sen Co., Ltd. Agent Masu Takeda Shiga Tome C odor ■ Figure 1 (b) Ward q Su -

Claims (1)

[Claims] In a method for cutting a plated lead that is commonly connected to each terminal portion of a circuit conductor formed on a flexible printed wiring board and supplies a current to the valley shoulder portions without performing glaze plating on the niI circuit conductor. A method for cutting plated leads for a flexible printed wiring board, characterized in that the plated leads are cut by a big blade having a V-shaped tip S.