JPS57118654A - Circuit substrate - Google Patents

Circuit substrate

Info

Publication number
JPS57118654A
JPS57118654A JP464581A JP464581A JPS57118654A JP S57118654 A JPS57118654 A JP S57118654A JP 464581 A JP464581 A JP 464581A JP 464581 A JP464581 A JP 464581A JP S57118654 A JPS57118654 A JP S57118654A
Authority
JP
Japan
Prior art keywords
circuit substrate
pattern
cut
turning
quality
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP464581A
Other languages
Japanese (ja)
Inventor
Takichi Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SEIKO KEIYO KOGYO KK
SEIKOO KEIYO KOGYO KK
SEIKOO KEIYOU KOGYO KK
Original Assignee
SEIKO KEIYO KOGYO KK
SEIKOO KEIYO KOGYO KK
SEIKOO KEIYOU KOGYO KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SEIKO KEIYO KOGYO KK, SEIKOO KEIYO KOGYO KK, SEIKOO KEIYOU KOGYO KK filed Critical SEIKO KEIYO KOGYO KK
Priority to JP464581A priority Critical patent/JPS57118654A/en
Publication of JPS57118654A publication Critical patent/JPS57118654A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4803—Insulating or insulated parts, e.g. mountings, containers, diamond heatsinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01078—Platinum [Pt]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
    • H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
    • H01L2924/15157—Top view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/15165—Monolayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing Of Printed Wiring (AREA)

Abstract

PURPOSE:To prevent the turning up of the pattern on the circuit substrate and to improve its quality by a method wherein, after the surface of the pattern on the circuit substrate has been cut, a machine work is performed on the element mounting part. CONSTITUTION:The shorting pattern 32, to be used for plating, successively formed on the circuit substrate 1 and the pattern 31 to be used for bonding are thrust-in cut in the range of 45-75 deg. against the pattern surface using a chisel 11. Then, the element mounting part is machined and cut. Through these procedures, the turning up of the pattern due to the machine work is eliminated and the quality of the circuit substrate can be improved.
JP464581A 1981-01-16 1981-01-16 Circuit substrate Pending JPS57118654A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP464581A JPS57118654A (en) 1981-01-16 1981-01-16 Circuit substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP464581A JPS57118654A (en) 1981-01-16 1981-01-16 Circuit substrate

Publications (1)

Publication Number Publication Date
JPS57118654A true JPS57118654A (en) 1982-07-23

Family

ID=11589699

Family Applications (1)

Application Number Title Priority Date Filing Date
JP464581A Pending JPS57118654A (en) 1981-01-16 1981-01-16 Circuit substrate

Country Status (1)

Country Link
JP (1) JPS57118654A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60137093A (en) * 1983-12-26 1985-07-20 株式会社フジクラ Method of cutting plated lead of flexible printed circuit board
EP0980096A4 (en) * 1997-04-30 2005-03-09 Hitachi Chemical Co Ltd Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60137093A (en) * 1983-12-26 1985-07-20 株式会社フジクラ Method of cutting plated lead of flexible printed circuit board
JPH0317236B2 (en) * 1983-12-26 1991-03-07 Fujikura Ltd
EP0980096A4 (en) * 1997-04-30 2005-03-09 Hitachi Chemical Co Ltd Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device

Similar Documents

Publication Publication Date Title
JPS5513933A (en) Circuit element substrate and its manufacturing method
JPS57118654A (en) Circuit substrate
EP0220421A3 (en) Chip breaking method
JPS541495A (en) Apparatus for machining by electricity
JPS57118653A (en) Circuit substrate
JPS5439297A (en) Wire-cut processing method
JPS51133895A (en) Laser machining
JPS5633237A (en) Injecting device for processing liquid
JPS528589A (en) Method for cutting hole and groove in hollow bodies
JPS53101975A (en) Treating method of semiconductor substrates
JPS5424380A (en) Work clamping device for machining tools
JPS541487A (en) Apparatus for machining center hole
JPS5396589A (en) Method of producing grinding, cutting electrode tools
JPS5412265A (en) Production of semiconductor elements
JPS5432978A (en) Correcting method for pattern
JPS5397681A (en) Method of cutting
JPS54114887A (en) Method of processing machines
JPS5310266A (en) Production of soldred semiconductor wafers
JPS5410670A (en) Bonding method of semiconductor chips
JPS52130292A (en) Patterning method
JPS51115388A (en) Method of machining oblique slope surface
JPS5333303A (en) Preparing commutator
JPS6445195A (en) Method of soldering printed circuit board
JPS5372292A (en) Method of and apparatus for electrical discharge machining of roll-shapedworkpieces
JPS5424573A (en) Manufactuae for semiconductor element