JPS5979595A - Method of producing printed circuit board - Google Patents
Method of producing printed circuit boardInfo
- Publication number
- JPS5979595A JPS5979595A JP19027882A JP19027882A JPS5979595A JP S5979595 A JPS5979595 A JP S5979595A JP 19027882 A JP19027882 A JP 19027882A JP 19027882 A JP19027882 A JP 19027882A JP S5979595 A JPS5979595 A JP S5979595A
- Authority
- JP
- Japan
- Prior art keywords
- conductor
- base material
- board
- copper foil
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
本発明は電子装置に使用される電気部品搭載及び裏面の
相互配線に使用される印刷配線板の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a printed wiring board used for mounting electrical components and mutual wiring on the back surface of an electronic device.
従来、この種の印刷配線板の製造方法は、無電解めっき
、電解めっきなどを用いたアディティブ法、サブトラク
ティブ法などが一般的であるが、これらの方法で基板の
スルホールを形成するのは非常に時間と労力を必要とし
て訃り、リードタイムが長い、コスト高になる等の欠点
を有していた。Conventionally, the most common manufacturing methods for this type of printed wiring board have been additive methods and subtractive methods using electroless plating, electrolytic plating, etc., but it is very difficult to form through holes in the board using these methods. It has disadvantages such as requiring time and effort, long lead time, and high cost.
本発明の目的は、円柱状の導体を基材内に等間隙で埋込
み、さらに基材表裏面に償着剤を用いて銅箔を付着させ
た基板を用いて、前記導体が埋込まれている所望の位置
に穴明けを行なって前記基板の表裏面を貫通させた後、
前記基板上の銅箔をエツチングにて所望する回路以外の
部分を除去し、半田付けにて導体と回路とを接続して配
線回路を形成することにより、上述の欠点を除去すると
ころにある。An object of the present invention is to embed cylindrical conductors in a base material at regular intervals, and further, to embed the conductors using a substrate with copper foil attached to the front and back surfaces of the base material using an adhesive. After drilling holes at desired positions and penetrating the front and back surfaces of the substrate,
The above-mentioned drawbacks are eliminated by etching the copper foil on the board to remove the portions other than the desired circuit, and by soldering to connect the conductor and the circuit to form a wired circuit.
この目的のために本発明は、円柱状の導体がその両端面
を基材表裏面に対して平行に、かつそれらが互いに接触
しないよう等間隔に基材内に埋込まれており、さらに基
材表裏面に接着剤にて付着した銅箔を有する基板におい
て、前記導体が埋込まれている所望の位置に前記導体の
両端面の直径より小さな所望の穴を明け、前記基板の表
裏面を貫通させた後、前記基板上の銅箔をエツチング法
にて所望の回路以外の銅箔部分を除去し、部品搭載時の
半田付けにて前記導体と前記回路とを接続し、印刷配線
板を作成するようにしたものである。For this purpose, the present invention has a cylindrical conductor embedded in the base material with both end surfaces parallel to the front and back surfaces of the base material and at equal intervals so that they do not touch each other. In a board having copper foil attached with adhesive to the front and back sides of the material, a desired hole smaller than the diameter of both end faces of the conductor is made at a desired position where the conductor is embedded, and the front and back sides of the board are After making the penetration, the copper foil on the board is etched to remove the copper foil parts other than the desired circuit, the conductor and the circuit are connected by soldering when mounting components, and the printed wiring board is assembled. This is what I created.
次に本発明を実施例について図面を参照して説明する。Next, embodiments of the present invention will be described with reference to the drawings.
図面は本発明の実施例に係る製造工程を示した断面図で
ある。まず、図面（ａ）に示すような円柱状の金属銅１
を２．５４ｍｍピッチ間隔で含みかつ接着剤にて銅箔３
を付着させた基板２を用意し、同図（ｂ）に示すような
基板２の金属錯１が含まれている所望の位置Ａにドリル
等を用いて所望の穴４を明ける。次に同図（Ｃ）に示す
ように基板２の表裏面上の銅箔３をエツチングすること
により、所望の回路５を形成する。最後に同図（ｄ）に
示すように、各種搭載部品６を基板２上に半田付けにて
搭載する時、金属銅１と回路５とを半田７にて接続して
印刷配線板を製造する。The drawings are cross-sectional views showing manufacturing steps according to embodiments of the present invention. First, a cylindrical metal copper 1 as shown in drawing (a)
copper foil 3 with adhesive at a pitch of 2.54 mm.
A desired hole 4 is made using a drill or the like at a desired position A of the substrate 2 where the metal complex 1 is contained, as shown in FIG. 2(b). Next, as shown in FIG. 2C, the copper foil 3 on the front and back surfaces of the substrate 2 is etched to form a desired circuit 5. Finally, as shown in the same figure (d), when mounting the various mounting components 6 on the board 2 by soldering, the metal copper 1 and the circuit 5 are connected with the solder 7 to manufacture a printed wiring board. .
本発明は以上説明したように、印刷配線板用基材内に導
体を埋込み、さらに基材表裏面上に銅箔を有する基板を
使用することにより、穴明けとエツチング工程によって
簡単に印刷配線板を製造出来る効果がある。As explained above, the present invention embeds a conductor in a base material for a printed wiring board and further uses a substrate having copper foil on the front and back surfaces of the base material. It is effective in manufacturing.
図面の（ａ） 、 （ｂ） 、 （Ｃ） 、 （ｄ）図
は本発明の実施例に係る製造工程を示した断面図である
。
１・−・円柱状金属鋼、２・・・基材、３・・・銅箔、
４・・・穴、５・・・回路、６・−・部品端子、７・・
・半田。
代理人 弁理士 染 川 利 吉Figures (a), (b), (c), and (d) of the drawings are cross-sectional views showing manufacturing steps according to embodiments of the present invention. 1... Cylindrical metal steel, 2... Base material, 3... Copper foil,
4... Hole, 5... Circuit, 6... Component terminal, 7...
·solder. Agent Patent Attorney Rikichi Somekawa
Claims (1)
して、かつそれらが互いに接触しないようにして、所望
するスルホールのピッチ間隔で基材内に埋込まれて分り
、さらに基材表裏面に接着剤にてはりつけられた銅箔な
有する基板に訃いて、前記導体が埋込まれている所望の
位置に前記導体の両端面の直径より小さな所望の穴を明
けて前記基板の表裏面を貫通させた後、エツチングにて
前記基板上の銅箔のうち所望する回路以外の銅箔部分を
除去し、部品搭載時の半田付は工程の際に前記導体と前
記回路とを半田接続して印刷配線板を製造することを特
徴とする印刷配線板の製造方法。A cylindrical conductor is embedded in the base material at the desired through-hole pitch with its both end surfaces parallel to the front and back surfaces of the base material so that they do not touch each other, and then the base material A board with copper foil glued to the front and back sides with adhesive is cut down, and a desired hole smaller than the diameter of both end faces of the conductor is made at a desired position where the conductor is embedded. After penetrating the back side, the copper foil on the board other than the desired circuit is removed by etching, and the conductor and the circuit are connected by soldering during the soldering process when mounting components. A method for manufacturing a printed wiring board, comprising: manufacturing a printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19027882A JPS5979595A (en) | 1982-10-29 | 1982-10-29 | Method of producing printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19027882A JPS5979595A (en) | 1982-10-29 | 1982-10-29 | Method of producing printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5979595A true JPS5979595A (en) | 1984-05-08 |
Family
ID=16255497
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19027882A Pending JPS5979595A (en) | 1982-10-29 | 1982-10-29 | Method of producing printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5979595A (en) |
-
1982
- 1982-10-29 JP JP19027882A patent/JPS5979595A/en active Pending
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