JPS63233598A - Printed wiring board and manufacture of the same - Google Patents
Printed wiring board and manufacture of the sameInfo
- Publication number
- JPS63233598A JPS63233598A JP6784387A JP6784387A JPS63233598A JP S63233598 A JPS63233598 A JP S63233598A JP 6784387 A JP6784387 A JP 6784387A JP 6784387 A JP6784387 A JP 6784387A JP S63233598 A JPS63233598 A JP S63233598A
- Authority
- JP
- Japan
- Prior art keywords
- board
- printed wiring
- hole
- holes
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 229910000679 solder Inorganic materials 0.000 claims description 19
- 238000000034 method Methods 0.000 claims description 5
- 238000007747 plating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は印刷配線板の端面に半円状のスルーホールを有
する印刷配線板及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a printed wiring board having semicircular through holes on the end face of the printed wiring board, and a method for manufacturing the same.
従来の技術
従来、マザーボード印刷配線板１上のランド２に電子部
品を搭載したベビーボード３を表面実装する際、このベ
ビーボード３の端面部４に設けた半円状のスルーホール
５と、マザーボード１のランド２と合わせ半田付け７固
着している。2. Description of the Related Art Conventionally, when a baby board 3 on which electronic components are mounted is surface mounted on a land 2 on a motherboard printed wiring board 1, a semicircular through hole 5 provided in an end face 4 of the baby board 3 and a motherboard Together with land 2 of 1, solder 7 is fixed.
このベビーボード３のスルーホール５は、図面に示すよ
うに、パネルボード９（ベビーボードの集合体）を製作
して、所定箇所で裁断し、所定の大きさのベビーボード
３を得ている。端面のスルーホール５となる箇所は、パ
ネルボード９では真円のスルーホール１０で形成され、
このスルーホール１０は銅箔１２の上に半田めっき１４
が被覆されている。As shown in the drawing, the through holes 5 of the baby board 3 are formed by manufacturing a panel board 9 (an assembly of baby boards) and cutting it at predetermined locations to obtain the baby board 3 of a predetermined size. The portion that becomes the through hole 5 on the end face is formed by a perfectly circular through hole 10 in the panel board 9,
This through hole 10 is formed by solder plating 14 on the copper foil 12.
is covered.
発明が解決しようとする問題点
従来の印刷配線板のベビーボード３は、パネルボード９
を製作し、スルーホール５の中央部で切断し、複数個の
ベビーボード３を製作している。Problems to be Solved by the Invention The baby board 3 of the conventional printed wiring board is a panel board 9.
is manufactured and cut at the center of the through hole 5 to manufacture a plurality of baby boards 3.
この印刷配線板９の切断は裁断機で行い、この裁断時に
スルーホール５の表面に形成されている半田めっき１４
の端部１５にかえり１６や亀裂１７が発生することがあ
り信頼性を損じることがあった。This printed wiring board 9 is cut by a cutting machine, and the solder plating 14 formed on the surface of the through hole 5 is removed during cutting.
Burrs 16 and cracks 17 may occur at the end portion 15 of the device, which may impair reliability.
また、ベビーボード３をマザーボード１に半田付け７固
着すると半田付着体積が少なく信頼性に欠ける問題点が
あった。Further, when the baby board 3 is fixed to the motherboard 1 by soldering 7, there is a problem in that the solder adhesion volume is small and reliability is lacking.
問題点を解決するための手段
本発明は、スルーホールが形成されたパネルボードを製
作し、このスルーホールの中央部で裁断し半円形状のス
ルーホールを設けたベビーボードを製作する印刷配線板
の製造方法であって、このパネルボードが切断される切
断箇所にカッター幅に相当する間隔をあけて対応する少
なくとも２４１！］のスルーホールを形成し、これらの
スルーホール内に半田を充填した後、所定箇所を切断し
ベビーボードをうることを特徴とする印刷配線板の製造
方法を提供する。Means for Solving the Problems The present invention is a printed wiring board in which a panel board with through holes is formed and a baby board is manufactured by cutting the panel board at the center of the through hole to provide a semicircular through hole. A manufacturing method of at least 241!, which corresponds to the cutting points where the panel board is cut with an interval corresponding to the cutter width! To provide a method for manufacturing a printed wiring board, which comprises forming through-holes, filling solder into these through-holes, and then cutting at predetermined locations to obtain a baby board.
また、他の発明は上記製造方法によって製造された印刷
配線板を提供する。すなわち、ベビーボードの端面部に
半円形状のスルーホールが形成されたものであって、こ
のスルーホール内は半田が充填されている印刷配線板で
ある。Another invention provides a printed wiring board manufactured by the above manufacturing method. That is, a semicircular through hole is formed in the end face of the baby board, and the inside of this through hole is a printed wiring board filled with solder.
作用
本発明の表面実装用ベビーボードは、マザーボードに固
着する際、ベビーボードの端面部に設けた半円状のスル
ーホール内に半田が全面的に充填されているので、パネ
ルボードを裁断してマザーボードを製作する際、スルー
ホールが補強されていて切断による剥れを発生すること
がなくなり高信頼性の印刷配線板かえられる。またマザ
ーボードとの接続に対しフィレットを大きくとれるので
接続強度を高め信頼性を向上することができる。Function: When the surface mount baby board of the present invention is fixed to the motherboard, the semicircular through-hole provided at the end face of the baby board is completely filled with solder. When manufacturing motherboards, the through-holes are reinforced so there is no chance of peeling due to cutting, making it possible to replace printed wiring boards with high reliability. Furthermore, since the fillet can be made larger for connection with the motherboard, connection strength can be increased and reliability can be improved.
さらに、超細密配線化に伴い、スルーホールの径が小さ
くなっても、カッター幅に相当するピッチで少なくとも
２個のスルーホールを形成しであるので、所望の半田充
填されたスルーホールを設けたベビーボードが得られる
。Furthermore, even if the diameter of through-holes becomes smaller due to ultra-fine wiring, at least two through-holes must be formed at a pitch corresponding to the cutter width, so it is possible to create through-holes filled with the desired solder. You will get a baby board.
実施例
本発明の実施例を図面に基づき説明すると、２０はパネ
ルボードであり、このパネルボード２０には所定の回路
２１、ランド２２及びスルーホール２３．２４が形成さ
れている。これらの回路２１．ランド２２及びスルーホ
ール２３．２４は公知の技術に基づいて製作されるもの
で、基材２５としてガラスエポキシ樹脂を用い、めっき
レジスト層を形成後、無電解めっき液に基材を浸漬する
ことにより得られる。Embodiment An embodiment of the present invention will be described with reference to the drawings. Reference numeral 20 denotes a panel board, and the panel board 20 has predetermined circuits 21, lands 22, and through holes 23, 24 formed therein. These circuits 21. The lands 22 and through-holes 23 and 24 are manufactured based on a known technique, by using glass epoxy resin as the base material 25, forming a plating resist layer, and then immersing the base material in an electroless plating solution. can get.
このパネルボード２０には、ベビーボード３０の端面部
３１となる箇所に少なくとも２個のスルーホール２３．
２４を形成しておく。最近はスルーホール間のビッチガ
狭くなり、スルーホールの大きさもＬＳＩに対応する場
合は０．３ａｍＪＸ下のものもある。この場合、カッタ
ー幅１Ｍのものを使用するときには２個のスルーホール
２３．２４の中心ピッチを１Ｍ１ｉ！してパネルボード
２０上に設け、カッターで切断すればベビーボード３０
の端面部３１に半円形状のスルーホールがえられる。This panel board 20 has at least two through holes 23.
Form 24. Recently, the pitch between through-holes has become narrower, and the size of through-holes that correspond to LSIs are sometimes less than 0.3amJX. In this case, when using a cutter with a width of 1M, the center pitch of the two through holes 23 and 24 should be set to 1M1i! If you place it on the panel board 20 and cut it with a cutter, it will become a baby board 30.
A semicircular through hole is formed in the end face portion 31 of.
このスルーホール２３．２４を形成したパネルボード２
０を半田槽に浸漬して、スルーホール２３．２４内に半
田３４を充填する。半田槽に浸漬する際、半田が付着し
ては困る箇所は耐半田性のテープをあらかじめ貼り付け
、半田デイツプ後にテープを剥離すればよい。Panel board 2 with these through holes 23 and 24 formed
0 into a solder bath to fill the through holes 23 and 24 with solder 34. When dipping into a solder bath, solder-resistant tape can be applied in advance to areas where solder should not adhere, and the tape can be peeled off after soldering.
所定のスルーホール２３．２４内に半田が充填されたパ
ネルボード２０を、所定幅Ｂのカッターで所定箇所を切
断すればパネルボード２０から複数個のベビーボード３
０が製作できる。カッターで切断された印刷配線板３０
は図面に示す如く、端面部３１に半円形状のスルーホー
ル２４が形成され、このスルーホール２４内には半田３
４が充填されている。By cutting the panel board 20 in which the predetermined through holes 23 and 24 are filled with solder at predetermined locations with a cutter having a predetermined width B, a plurality of baby boards 3 can be cut from the panel board 20.
0 can be produced. Printed wiring board 30 cut with a cutter
As shown in the drawing, a semicircular through hole 24 is formed in the end surface 31, and the solder 3 is inserted into the through hole 24.
4 is filled.
発明の効果
本発明の印刷配線板及びその製造方法は以上に説明した
如き構成のもので、ベビーボード３０の端面部に半円状
のスルーホールが設けられこのスルーホール内に全面的
に半田が充填されているので、マザーボードのランドに
表面実装する際、フィレットが大きくとれ、マザーボー
ドとの機械的な接続強度を高めることができるので信頼
性の高い印刷配線板が得られ、産業の発達に寄与するこ
と大なる発明である。Effects of the Invention The printed wiring board and the method for manufacturing the same of the present invention have the configuration as described above, and a semicircular through hole is provided in the end face of the baby board 30, and solder is applied entirely within the through hole. Because it is filled, a large fillet can be removed when surface mounting on the land of the motherboard, increasing the strength of the mechanical connection with the motherboard, resulting in highly reliable printed wiring boards, and contributing to the development of industry. This is a great invention.
第１図は本発明の配線板の斜視図、第２図はパネルボー
ドの平面図、第３図はマザーボードに固着した状態を示
す断面図、第４図は従来のパネルボードの平面図、第５
図は同ベビーボードの斜視図、第６図はマザーボードに
固着したときの状態を示す断面図である。
１：マザーボード、 ２０：パネルボード、２３．２４
・・・スルーホール、
３０：ベビーボード、 ３１：端部、
３２：半円状のスルーホール、 ３４：半田。
特許出願人 日立コンデンサ株式会社
俸２図
率１１図Fig. 1 is a perspective view of the wiring board of the present invention, Fig. 2 is a plan view of the panel board, Fig. 3 is a sectional view showing the state fixed to the motherboard, Fig. 4 is a plan view of the conventional panel board, and Fig. 4 is a plan view of the conventional panel board. 5
The figure is a perspective view of the baby board, and FIG. 6 is a sectional view showing the state when it is fixed to the motherboard. 1: Motherboard, 20: Panel board, 23.24
...through hole, 30: baby board, 31: end, 32: semicircular through hole, 34: solder. Patent Applicant Hitachi Capacitor Co., Ltd. Salary 2 Figure Rate 11 Figure
Claims (2)
、このスルーホールの中央部で切断し半円形状のスルー
ホールを端部に形成する印刷配線板であって、このパネ
ルボードが切断される箇所にカッター幅に相当する間隔
をあけて対応する少なくとも２個のスルーホールを形成
し、これらのスルーホール内に半田を充填した後、所定
箇所を切断しベビーボードを製造することを特徴とする
印刷配線板の製造方法。(1) A printed wiring board in which a panel board with through holes is manufactured and cut at the center of the through hole to form a semicircular through hole at the end, and this panel board is cut. A baby board is manufactured by forming at least two corresponding through holes at a distance corresponding to the width of the cutter, filling these through holes with solder, and then cutting at a predetermined location. A method for manufacturing printed wiring boards.
刷配線板であって、このスルーホール内に半田が充填さ
れていることを特徴とする印刷配線板。(2) A printed wiring board characterized in that a semicircular through hole is formed in an end face, and the through hole is filled with solder.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6784387A JPS63233598A (en) | 1987-03-23 | 1987-03-23 | Printed wiring board and manufacture of the same |
| US07/046,515 US4790894A (en) | 1987-02-19 | 1987-05-06 | Process for producing printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6784387A JPS63233598A (en) | 1987-03-23 | 1987-03-23 | Printed wiring board and manufacture of the same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63233598A true JPS63233598A (en) | 1988-09-29 |
Family
ID=13356637
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6784387A Pending JPS63233598A (en) | 1987-02-19 | 1987-03-23 | Printed wiring board and manufacture of the same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63233598A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7506438B1 (en) | 2000-11-14 | 2009-03-24 | Freescale Semiconductor, Inc. | Low profile integrated module interconnects and method of fabrication |
| JP2013104883A (en) * | 2011-11-10 | 2013-05-30 | Sekisui Chem Co Ltd | Optical communication module and manufacturing method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752187A (en) * | 1980-09-12 | 1982-03-27 | Mitsubishi Electric Corp | Method of producing circuit board |
| JPS59121991A (en) * | 1982-12-28 | 1984-07-14 | 日本電気株式会社 | Printed circuit board and method of producing same |
| JPS61159789A (en) * | 1984-12-29 | 1986-07-19 | 株式会社東芝 | Manufacture of printed wiring board |
-
1987
- 1987-03-23 JP JP6784387A patent/JPS63233598A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5752187A (en) * | 1980-09-12 | 1982-03-27 | Mitsubishi Electric Corp | Method of producing circuit board |
| JPS59121991A (en) * | 1982-12-28 | 1984-07-14 | 日本電気株式会社 | Printed circuit board and method of producing same |
| JPS61159789A (en) * | 1984-12-29 | 1986-07-19 | 株式会社東芝 | Manufacture of printed wiring board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7506438B1 (en) | 2000-11-14 | 2009-03-24 | Freescale Semiconductor, Inc. | Low profile integrated module interconnects and method of fabrication |
| JP2013104883A (en) * | 2011-11-10 | 2013-05-30 | Sekisui Chem Co Ltd | Optical communication module and manufacturing method thereof |
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