GB2247361A - Conductive through-holes in printed wiring boards - Google Patents

Conductive through-holes in printed wiring boards Download PDF

Info

Publication number
GB2247361A
GB2247361A GB9117011A GB9117011A GB2247361A GB 2247361 A GB2247361 A GB 2247361A GB 9117011 A GB9117011 A GB 9117011A GB 9117011 A GB9117011 A GB 9117011A GB 2247361 A GB2247361 A GB 2247361A
Authority
GB
United Kingdom
Prior art keywords
hole
printed wiring
conductive material
wiring board
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9117011A
Other versions
GB9117011D0 (en
Inventor
Masao Akabane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9117011D0 publication Critical patent/GB9117011D0/en
Publication of GB2247361A publication Critical patent/GB2247361A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Abstract

A method of manufacturing a printed wiring board having a through hole comprises filling the through hole with an electrically conductive material which is then hardened, and a component insertion hole 8 made e.g. by drilling. In the described method, component mounting space can be obtained without reducing the design density of the printed wiring board. Suitable dimensions are disclosed. <IMAGE>

Description

"A METHOD OF MANUFACTURING A PRINTED WIRING BOARD HAVING A THROUGH HOLE" The present invention relates to a method of manufacturing a printed wiring board having a through hole.
Printed wiring boards having a through hole have been used in practice. In such boards the circuits provided on both surfaces of the substrate are in contact with one another through a conduction circuit provided in the through hole.
The known method of providing such a conduction circuit in the through hole comprises plating the through hole, or filling the through hole with an electrically conductive material. The former of these methods has many problems in the plating process, facilities and environment, and has additional disadvantages such as high process costs.
The latter method of filling the through hole with a conductive material has the advantages that it has good workability and inexpensive process costs; however, it has not the advantage of its availability as a component insertion hole as in the case of the plated through hole and has disadvantages such as the necessity of providing a separate component insertion hole for circuit design, which prevents the circuit density from being made high.
The present invention seeks to overcome the disadvantages in the conventional methods for forming a conduction circuit in the through hole, and its object is to provide a method for forming a conduction circuit which can also be utilised as a component insertion hole.
According to the invention there is provided a method of manufacturing a printed wiring board having a through hole wherein the method includes, after filling the through hole with an electrically conductive material, hardening the conductive material and making a component insertion hole.
In order that the invention may be better understood an embodiment thereof will now be described by way of example only and with reference to the accompanying drawings in which: Figures 1 (a) and (b) are explanatory views showing the method for manufacturing a printed wiring board of the present invention; and Figure 2 is an explanatory view showing a state in which a component is mounted.
First, as shown in Figure 1 (a), at the position of the designed pattern of the printed wiring circuit of a double-sided copper-clad laminate (not shown) at which a through hole is processed, through holes 4 having a hole diameter of 0.8 mm for instance are made by a drill or punch.
Thereafter, each through hole 4 is filled with an electrically conductive material 5 comprising a solventness conductive paste by means of a silk screen printing method or the like and the conductive material S is hardened.
Further, by etching the copper foils on both sides of the double-sided copper-clad laminate according to the desired circuit patterns, desired printed wiring circuits (not shown) are formed on both sides of substrate 1.
The printed wiring circuits are coated with resist 6 leaving connecting lands 2 and 3 and other electrical connecting lands (not shown). In connection with the coating work of the solder resist 6, a marking print is performed.
Thereafter, leaving a coating film portion for the side wall as conduction circuit 7, a component lead insertion hole 8 having a hole diameter of 0.6 mm for instance is made, by means of a drill, in the centre of the conductive material 5 filled in each through hole 4.
Incidentally, when the conductive material 5 is filled in the through hole 4, it is filled while it is bonded to connecting lands 2 and 3, and the bonding width of the bonding portions 5a and 5b is desirably in the order of 0.1 mm, which are formed leaving the solder portions in connecting lands 2 and 3 and should be 0.5 mm or less.
With the above method, through hole 4 can form conduction circuit 7 through the filled conductive material 5 to electrically conduct connecting lands 2 and 3, and component lead insertion hole 8 can be formed in the conduction circuit 7.
Accordingly, as shown in Figure 2, when mounting component 9, component 9 can be mounted by soldering 11 lead 10 to connecting land 2 after the insertion of lead 10 of component 9 into insertion hole 8.
As apparent from the above description, in accordance with the present invention, component mounting is enabled as in the plated through hole and it is possible to accomplish a high-density circuit, and there is an advantage that the conduction circuit in the through hole can be formed with the workability in the method of forming it by filling a conductive material.

Claims (4)

1. A method of manufacturing a printed wiring board having a through hole wherein the method includes, after filling the through hole with an electrically conductive material, hardening the conductive material and making a component insertion hole.
2. A method as claimed in claim 1 wherein the bonding width of said conductive material and the connecting lands of the through hole is 0.5 mm or less within the tolerance allowing soldering.
3. A method as claimed in either one of claims 1 or 2 wherein said conductive material comprises a solventness conductive material.
4. A method as claimed in claim 1 substantially as hereinbefore described.
GB9117011A 1990-08-10 1991-08-07 Conductive through-holes in printed wiring boards Withdrawn GB2247361A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21314890A JPH0494591A (en) 1990-08-10 1990-08-10 Manufacture of printed circuit board having through hole

Publications (2)

Publication Number Publication Date
GB9117011D0 GB9117011D0 (en) 1991-09-18
GB2247361A true GB2247361A (en) 1992-02-26

Family

ID=16634372

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9117011A Withdrawn GB2247361A (en) 1990-08-10 1991-08-07 Conductive through-holes in printed wiring boards

Country Status (2)

Country Link
JP (1) JPH0494591A (en)
GB (1) GB2247361A (en)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0638669A1 (en) * 1993-08-09 1995-02-15 Rohm And Haas Company Electroplating process and composition
US7273988B2 (en) 2002-04-22 2007-09-25 Nec Corporation Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
CN100346679C (en) * 2000-12-08 2007-10-31 日本电气株式会社 Circuit board, electronic equipment using the circuit board and method of sorting circuit board
CN100423621C (en) * 2001-03-07 2008-10-01 索尼株式会社 Land portion of printed wiring board, method for manufacturnig printed wiring board, and printed wiring board mounting method
CN106465538A (en) * 2014-06-03 2017-02-22 大陆泰密克微电子有限责任公司 Method for producing a foil arrangement and a corresponding foil arrangement
CN110113873A (en) * 2019-04-30 2019-08-09 东莞联桥电子有限公司 A kind of preparation method of printed wiring board

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112673716B (en) 2018-12-28 2022-08-26 华为技术有限公司 Printed circuit board, manufacturing method thereof and electronic equipment
CN110933868B (en) * 2019-12-28 2021-01-22 浪潮商用机器有限公司 PTH welding method for bending type positioning pin foot

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0138671A2 (en) * 1983-09-21 1985-04-24 Allied Corporation Method of making a printed circuit board
GB2156593A (en) * 1984-03-28 1985-10-09 Plessey Co Plc Through hole interconnections
EP0194247A2 (en) * 1985-03-05 1986-09-10 Svecia Silkscreen Maskiner AB A screen printer adapted for providing a layer of material on the inner surface of a hole passing through a plate

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0138671A2 (en) * 1983-09-21 1985-04-24 Allied Corporation Method of making a printed circuit board
GB2156593A (en) * 1984-03-28 1985-10-09 Plessey Co Plc Through hole interconnections
EP0194247A2 (en) * 1985-03-05 1986-09-10 Svecia Silkscreen Maskiner AB A screen printer adapted for providing a layer of material on the inner surface of a hole passing through a plate

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0638669A1 (en) * 1993-08-09 1995-02-15 Rohm And Haas Company Electroplating process and composition
CN100346679C (en) * 2000-12-08 2007-10-31 日本电气株式会社 Circuit board, electronic equipment using the circuit board and method of sorting circuit board
CN100423621C (en) * 2001-03-07 2008-10-01 索尼株式会社 Land portion of printed wiring board, method for manufacturnig printed wiring board, and printed wiring board mounting method
US7273988B2 (en) 2002-04-22 2007-09-25 Nec Corporation Wiring board, and electronic device with an electronic part mounted on a wiring board, as well as method of mounting an electronic part on a wiring board
CN106465538A (en) * 2014-06-03 2017-02-22 大陆泰密克微电子有限责任公司 Method for producing a foil arrangement and a corresponding foil arrangement
US20170215289A1 (en) * 2014-06-03 2017-07-27 Conti Temic Microelectronic Gmbh Method For Producing A Foil Arrangement And Corresponding Foil Arrangement
US10548229B2 (en) * 2014-06-03 2020-01-28 Conti Temic Microelectronic Gmbh Method for producing a foil arrangement and corresponding foil arrangement
CN110113873A (en) * 2019-04-30 2019-08-09 东莞联桥电子有限公司 A kind of preparation method of printed wiring board
CN110113873B (en) * 2019-04-30 2021-07-30 东莞联桥电子有限公司 Preparation method of printed circuit board

Also Published As

Publication number Publication date
GB9117011D0 (en) 1991-09-18
JPH0494591A (en) 1992-03-26

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)