GB9117011D0 - A method of manufacturing a printed wiring board having a through hole - Google Patents

A method of manufacturing a printed wiring board having a through hole

Info

Publication number
GB9117011D0
GB9117011D0 GB919117011A GB9117011A GB9117011D0 GB 9117011 D0 GB9117011 D0 GB 9117011D0 GB 919117011 A GB919117011 A GB 919117011A GB 9117011 A GB9117011 A GB 9117011A GB 9117011 D0 GB9117011 D0 GB 9117011D0
Authority
GB
United Kingdom
Prior art keywords
manufacturing
hole
wiring board
printed wiring
printed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB919117011A
Other versions
GB2247361A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9117011D0 publication Critical patent/GB9117011D0/en
Publication of GB2247361A publication Critical patent/GB2247361A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/14—Related to the order of processing steps
    • H05K2203/1453—Applying the circuit pattern before another process, e.g. before filling of vias with conductive paste, before making printed resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
GB9117011A 1990-08-10 1991-08-07 Conductive through-holes in printed wiring boards Withdrawn GB2247361A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21314890A JPH0494591A (en) 1990-08-10 1990-08-10 Manufacture of printed circuit board having through hole

Publications (2)

Publication Number Publication Date
GB9117011D0 true GB9117011D0 (en) 1991-09-18
GB2247361A GB2247361A (en) 1992-02-26

Family

ID=16634372

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9117011A Withdrawn GB2247361A (en) 1990-08-10 1991-08-07 Conductive through-holes in printed wiring boards

Country Status (2)

Country Link
JP (1) JPH0494591A (en)
GB (1) GB2247361A (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5374346A (en) * 1993-08-09 1994-12-20 Rohm And Haas Company Electroplating process and composition
JP3686861B2 (en) * 2000-12-08 2005-08-24 日本電気株式会社 Circuit board and electronic device using the same
EP1367875A4 (en) * 2001-03-07 2008-07-30 Sony Corp Land portion of printed wiring board, method for manufacturing printed wiring board, and printed wiring board mounting method
JP4554873B2 (en) 2002-04-22 2010-09-29 日本電気株式会社 Wiring board, electronic device, electronic component mounting method and manufacturing method
DE102014210483A1 (en) * 2014-06-03 2015-12-03 Conti Temic Microelectronic Gmbh Method for producing a foil arrangement and corresponding foil arrangement
WO2020133238A1 (en) * 2018-12-28 2020-07-02 华为技术有限公司 Printed circuit board and manufacturing method therefor, and electronic device
CN110113873B (en) * 2019-04-30 2021-07-30 东莞联桥电子有限公司 Preparation method of printed circuit board
CN110933868B (en) * 2019-12-28 2021-01-22 浪潮商用机器有限公司 PTH welding method for bending type positioning pin foot

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60502281A (en) * 1983-09-21 1985-12-26 アライド　コ−ポレイシヨン Printed circuit board manufacturing method
GB2156593B (en) * 1984-03-28 1987-06-17 Plessey Co Plc Through hole interconnections
SE453708B (en) * 1985-03-05 1988-02-22 Svecia Silkscreen Maskiner Ab STONE PRINTING MACHINE TO CREATE A MATERIAL LAYER ON AN INNER WALL PART FOR A THROUGH HALL IN A PLATE

Also Published As

Publication number Publication date
JPH0494591A (en) 1992-03-26
GB2247361A (en) 1992-02-26

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)