GB9207722D0 - Method of manufacturing printed wiring boards - Google Patents

Method of manufacturing printed wiring boards

Info

Publication number
GB9207722D0
GB9207722D0 GB929207722A GB9207722A GB9207722D0 GB 9207722 D0 GB9207722 D0 GB 9207722D0 GB 929207722 A GB929207722 A GB 929207722A GB 9207722 A GB9207722 A GB 9207722A GB 9207722 D0 GB9207722 D0 GB 9207722D0
Authority
GB
United Kingdom
Prior art keywords
printed wiring
wiring boards
manufacturing printed
manufacturing
boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB929207722A
Other versions
GB2260545A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon CMK Corp
Original Assignee
Nippon CMK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon CMK Corp filed Critical Nippon CMK Corp
Publication of GB9207722D0 publication Critical patent/GB9207722D0/en
Publication of GB2260545A publication Critical patent/GB2260545A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0266—Marks, test patterns or identification means
    • H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09936—Marks, inscriptions, etc. for information
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/161—Using chemical substances, e.g. colored or fluorescent, for facilitating optical or visual inspection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
GB9207722A 1991-10-15 1992-04-08 Method of manufacturing printed wiring boards Withdrawn GB2260545A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29499091A JPH05110233A (en) 1991-10-15 1991-10-15 Manufacture of printed wiring board

Publications (2)

Publication Number Publication Date
GB9207722D0 true GB9207722D0 (en) 1992-05-27
GB2260545A GB2260545A (en) 1993-04-21

Family

ID=17814922

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9207722A Withdrawn GB2260545A (en) 1991-10-15 1992-04-08 Method of manufacturing printed wiring boards

Country Status (2)

Country Link
JP (1) JPH05110233A (en)
GB (1) GB2260545A (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5227283B2 (en) * 2009-09-30 2013-07-03 太陽ホールディングス株式会社 Resin composition and printed wiring board using the same
JP2013135192A (en) * 2011-12-27 2013-07-08 Goo Chemical Co Ltd Resin composition for solder resist and resin composition for marking ink
JP2013135193A (en) * 2011-12-27 2013-07-08 Goo Chemical Co Ltd Printed wiring board
JP6451259B2 (en) * 2014-06-26 2019-01-16 株式会社リコー Flexible circuit board

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2804530C2 (en) * 1978-02-03 1986-04-30 Hoechst Ag, 6230 Frankfurt Use of water-soluble benzoxanthene dyes for fluorescent inks
US4240945A (en) * 1979-01-31 1980-12-23 Albert Gabrick Solder mask composition
US4540595A (en) * 1982-02-01 1985-09-10 International Business Machines Corporation Article identification material and method and apparatus for using it
US4670298A (en) * 1985-12-09 1987-06-02 Northern Telecom Limited Fluorescent solder paste mixture
CA1312040C (en) * 1985-12-19 1992-12-29 Joseph Victor Koleske Conformal coatings cured with actinic radiation
GB8616878D0 (en) * 1986-07-10 1986-08-20 De La Rue Thomas & Co Ltd Coating compositions
JPH06103783B2 (en) * 1987-03-16 1994-12-14 日本シイエムケイ株式会社 Printing ink for solder resist of printed wiring board

Also Published As

Publication number Publication date
JPH05110233A (en) 1993-04-30
GB2260545A (en) 1993-04-21

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)