JPH03229488A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH03229488A JPH03229488A JP2482190A JP2482190A JPH03229488A JP H03229488 A JPH03229488 A JP H03229488A JP 2482190 A JP2482190 A JP 2482190A JP 2482190 A JP2482190 A JP 2482190A JP H03229488 A JPH03229488 A JP H03229488A
- Authority
- JP
- Japan
- Prior art keywords
- base
- printed wiring
- hole
- wiring board
- metal rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 claims description 19
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 23
- 238000000034 method Methods 0.000 abstract description 22
- 239000002184 metal Substances 0.000 abstract description 17
- 229910052751 metal Inorganic materials 0.000 abstract description 17
- 229910052802 copper Inorganic materials 0.000 abstract description 12
- 239000010949 copper Substances 0.000 abstract description 12
- 238000007747 plating Methods 0.000 abstract description 9
- 238000005530 etching Methods 0.000 abstract description 8
- 239000011521 glass Substances 0.000 abstract description 8
- 239000004593 Epoxy Substances 0.000 abstract description 6
- 239000011889 copper foil Substances 0.000 description 11
- 238000005553 drilling Methods 0.000 description 5
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010310 metallurgical process Methods 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〈産業上の利用分野〉
本発明は、プリント配線板の製造方法に関し、更に詳し
くは、表面実装用の両面型プリント配線板を製造する方
法に関する。DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for manufacturing a double-sided printed wiring board for surface mounting.
〈従来の技術〉
第３図は従来のプリント配線基板の製造方法を経時的に
示す断面図である。以下に第３図にしたがって従来のプ
リント配線基板の製造方法を説明する。<Prior Art> FIG. 3 is a sectional view showing a conventional method of manufacturing a printed wiring board over time. A conventional method of manufacturing a printed wiring board will be described below with reference to FIG.
まず、（ａ）図に示すように、基材１０と銅箔２０ａ、
２０ｂは、ガラスクロスにエポキシ樹脂を含浸させ半硬
化状態であるプリプレグ５により貼り合わされ、このプ
リント配線板の基本材となっている。First, as shown in the figure (a), a base material 10, a copper foil 20a,
20b is bonded to a semi-cured prepreg 5 made by impregnating glass cloth with epoxy resin, and serves as the basic material of this printed wiring board.
さらにこの基本材にはその銅箔２０ａ、２０ｂ上にステ
ンレス板（図示せず）が重ねられそのステンレス板を介
して熱盤（図示せず）により挟まれた状態でこれから積
層が行われる。この状態で熱および圧力が加えられると
ｗ４箔２０ａ、２０ｂと基材１０とが接着され、その後
このプリプレグ５が常温に戻されて冷え固まるとガラス
エポキシとなり、この基材１０として用いられているガ
ラスエポキシと一体となる。この一体形成された基本材
を（ｂ）図に示す。Furthermore, a stainless steel plate (not shown) is superimposed on the copper foils 20a and 20b of this basic material, and the lamination is then performed with the stainless steel plate being sandwiched between hot platens (not shown). When heat and pressure are applied in this state, the W4 foils 20a, 20b and the base material 10 are bonded together, and then this prepreg 5 is returned to room temperature, cools and hardens, and becomes glass epoxy, which is used as the base material 10. Combined with glass epoxy. This integrally formed basic material is shown in Figure (b).
次に、（Ｃ）図に示すように、ドリリング等て孔径０、
４〜０．５ｍｍのスルーホール３０を穿設する。Next, as shown in figure (C), the hole diameter is 0 by drilling etc.
A through hole 30 of 4 to 0.5 mm is bored.
次に、（ｄ）図に示すように、スルーホール３０および
銅箔２０ａ、２０ｂの全面に銅メツキを行い、銅メ・ツ
キ膜４０を形成する。Next, as shown in FIG. 3D, copper plating is performed on the entire surface of the through hole 30 and the copper foils 20a and 20b to form a copper plating film 40.
次に、（ｅ）図に示すように、写真法あるいは印刷法に
よりパターニングを行うことによりプリント配線基板が
形成される。Next, as shown in Figure (e), a printed wiring board is formed by patterning using a photographic method or a printing method.
〈発明が解決しようとする課題〉
ところで、上述の両面型のプリント配線基板の製造方法
によれば、以下に列記する問題が残されている。<Problems to be Solved by the Invention> However, according to the above-described method for manufacturing a double-sided printed wiring board, the following problems remain.
（１）スルーホール３０における銅箔２０ａと銅箔２０
ｂとの電気的接続の信頼性の低下である。すなわち、第
４図（ａ）に示すように、ドリリング等でスルーホール
３０の内壁面に欠損を生した状態のまま、第４図［有］
）に示すように、銅メツキを行った場合、形成された銅
メンキ膜４０にクランク５０が発生する。このクラック
５０の発生が銅箔２０ａと銅Ｆ５２０ ｂとの電気的接
続の阻害要因となっている。(1) Copper foil 20a and copper foil 20 in through hole 30
This is a decrease in the reliability of the electrical connection with b. That is, as shown in FIG. 4(a), the inner wall surface of the through hole 30 is left with a defect due to drilling etc.
), when copper plating is performed, cranks 50 occur in the formed copper plating film 40. The occurrence of this crack 50 is a factor that inhibits electrical connection between the copper foil 20a and the copper F520b.
（２）スルーホール３０とパターン６０とのランド８を
介した電気的接続の信頼性の低下である。すなわち、第
５図（ａ）に示すように、ランド８０に欠け７が発生す
るとパターン６０とスルーホール３ｏとの電気的接続が
阻害される。さらにプリント配線板の高密度化によりス
ルーホール径を小さくする場合、第５図（ｂ）に示すよ
うにランド８０の面積をより狭くする必要があり、この
ためランド８０とパターン６０との接合部分の面積は小
さくならざるをえず、このことは断線の危険性をより大
きくする。(2) The reliability of the electrical connection between the through hole 30 and the pattern 60 via the land 8 is reduced. That is, as shown in FIG. 5(a), when the chip 7 occurs in the land 80, the electrical connection between the pattern 60 and the through hole 3o is inhibited. Furthermore, when the diameter of the through hole is made smaller due to the higher density of the printed wiring board, the area of the land 80 needs to be made smaller as shown in FIG. 5(b). The area of the wire must be small, which increases the risk of wire breakage.
（３）銅箔２０ａ、２０ｂに更に銅メツキを行うことに
より銅メツキ膜４０が形成されるので、総銅厚が厚くな
る。なおこのように膜厚が厚くなるに従いエツチングに
おけるサイドエッチ量はその膜厚に比例して大きくなる
ため、膜厚を厚くすることは実装部品の高密度化の妨げ
となり、パターンのエツチング精度の悪化を引き起こす
。さらにファインパターンの形成においては、こうした
サイトエッチによる歩留りの低下を招くことは必至であ
る。(3) Since the copper plating film 40 is formed by further performing copper plating on the copper foils 20a and 20b, the total copper thickness becomes thicker. Note that as the film thickness increases, the amount of side etching during etching increases in proportion to the film thickness, so increasing the film thickness hinders the high density of mounted components and deteriorates the etching accuracy of the pattern. cause. Furthermore, in the formation of fine patterns, such site etching inevitably causes a decrease in yield.
本発明の目的は、以上の問題点を解決し、両面型プリン
］配線板を、スルーホールの孔開けの工程およびメ・２
キ工程を要することなく製造することのできる方法を提
供することにある。It is an object of the present invention to solve the above problems and improve the process of making through-holes and the process of making double-sided printed wiring boards.
The object of the present invention is to provide a method that can be manufactured without requiring four steps.
く課題を解決するための手段〉
本発明のプリント配線基板の製造方法は、両面型のプリ
ント配線基板を製造する方法において、基材に１つ以上
の貫通孔を形成した後、その貫通孔に導電性材料製の棒
を嵌め込み、その状態で上記基材の両面に導電パターン
を形成し、その導電パターンが上記棒によって電気的に
接続されることを特徴としている。Means for Solving the Problems> The method for manufacturing a printed wiring board of the present invention is a method for manufacturing a double-sided printed wiring board, in which one or more through holes are formed in a base material, and then the through holes are filled with the through holes. It is characterized in that a rod made of a conductive material is fitted, a conductive pattern is formed on both sides of the base material in this state, and the conductive pattern is electrically connected by the rod.
く作用〉
樹脂内に金属棒を嵌め込むことによりスルーホールの形
成は不要になる。またメ・ツキ工程を省略でき、金属棒
によりプリント配線基板の両面の導電パターンを接続す
ることができる。さらに、大径金属棒を用いることによ
り、小径の孔加工が不要となり、かつランド径を大きく
することができるので、スルーホールと導電パターンと
が断線することがない。Function: By fitting the metal rod into the resin, there is no need to form through holes. Furthermore, the metal plating process can be omitted, and the conductive patterns on both sides of the printed wiring board can be connected using metal rods. Furthermore, by using a large-diameter metal rod, it is not necessary to process a small-diameter hole, and the land diameter can be increased, so that there is no disconnection between the through-hole and the conductive pattern.
〈実施例〉
第１図は本発明の実施例で、プリント配線基板の製造方
法を経時的に示す断面図である。<Example> FIG. 1 is an example of the present invention, and is a sectional view showing a method of manufacturing a printed wiring board over time.
以下に本発明の実施例を第１図にしたがって詳細に説明
する。Embodiments of the present invention will be described in detail below with reference to FIG.
まず（ａ）図に示すように、基材１に金属棒９を嵌め込
むための貫通孔８をドリリング等により形成する。この
貫通孔８は基材１の表面に垂直に形成する。First, as shown in Figure (a), a through hole 8 into which a metal rod 9 is to be fitted is formed in a base material 1 by drilling or the like. This through hole 8 is formed perpendicularly to the surface of the base material 1.
次にら）図に示すように、貫通孔８に金属棒９を嵌め込
む。この金属棒９は丸棒或いは角棒を使用し、その特性
は例えば、真鍮などのように導電性が高くかつ半田付は
特性が良いものを用いる。Next, as shown in the figure, a metal rod 9 is fitted into the through hole 8. This metal rod 9 is a round rod or a square rod, and is made of, for example, brass, which has high conductivity and good soldering characteristics.
次に（Ｃ）図に示すように基材１と銅箔２ａ、２ｂはガ
ラスクロスにエポキシ樹脂を含浸させ半硬化状態である
プリプレグ５により貼り合わされ、このプリント配線板
の基本材となっている。さらにこの基本材にはその銅箔
２ａ、２ｂ上にステンレス板（図示せず）が重ねられそ
のステンレス板を介して熱盤（図示せず）により挟まれ
た状態でこれから積層が行われる。この状態で熱および
圧力が加えられると銅箔２ａ、２ｂと基材１および金属
棒９とが接着され、その後このプリプレグ５が常温に戻
されて冷え固まるとガラスエポキシとなり、この基材１
として用いられているガラスエポキシと一体となる。こ
の一体形成された基本材を（ｄ）図に示す。Next, as shown in Figure (C), the base material 1 and the copper foils 2a and 2b are bonded together using a semi-cured prepreg 5 made of glass cloth impregnated with epoxy resin, which serves as the basic material of this printed wiring board. . Further, a stainless steel plate (not shown) is superimposed on the copper foils 2a and 2b of this basic material, and the lamination is then performed with the stainless steel plate being sandwiched between heating plates (not shown). When heat and pressure are applied in this state, the copper foils 2a and 2b, the base material 1, and the metal rod 9 are bonded together, and then this prepreg 5 is returned to room temperature, and when it cools and hardens, it becomes glass epoxy, and this base material 1
It is integrated with the glass epoxy used as a material. This integrally formed basic material is shown in Figure (d).
次に（ｅ）図に示すように、エツチングレジスト（図示
せず）を形成し、パターン形成する。Next, as shown in Figure (e), an etching resist (not shown) is formed and patterned.
以上の工程により所望のプリント配線基板が形成される
。このプリント配線基板は、１本以上でかつ、多くのパ
ターンを共有する金属棒９を用いることにより、基材１
表面の導電パターンの電気的接続が行われる。この金属
棒９は大径（１，０〜１．５ｍｍ）であるため、ランド
径を大きくすることができ、導体パターン間の接続信奪
頁性は大きい。A desired printed wiring board is formed through the above steps. This printed wiring board is constructed by using one or more metal rods 9 that share many patterns.
Electrical connections are made to the conductive patterns on the surface. Since this metal rod 9 has a large diameter (1.0 to 1.5 mm), the land diameter can be increased, and the connection plausibility between the conductor patterns is high.
なお、本発明の応用例を第２図に示す。これはパターン
引き回しが困難な場合に用いられ、その形成方法は、第
１図（ｄｌの状態において部分的にスルーホール３を形
成し、その後基板１表面およびスルーホール３に銅メツ
キを行い銅メツキ膜４を形成した後、エツチングレジス
トを形成しパターン形成を行う。An application example of the present invention is shown in FIG. This is used when it is difficult to route the pattern, and the method for forming it is as shown in Figure 1 (dl), where the through holes 3 are partially formed, and then the surface of the substrate 1 and the through holes 3 are plated with copper. After forming the film 4, an etching resist is formed to form a pattern.
以上の工程により第２図に示す構成のプリント配線基板
が形成される。Through the above steps, a printed wiring board having the configuration shown in FIG. 2 is formed.
〈発明の効果〉
本発明のプリント配線基板の製造方法によれば、あらか
じめ嵌め込まれた金属棒により導体パターンの電気的接
続が行われるので、孔開けの必要がなく、その後のメソ
キ工程も必要がない。すなわち、スルーホールの形成が
不必要なことから導電パターンの電気的接続の阻害要因
となっていたクラックの発生も、スルーホールと導電パ
ターンのランドを介した電気的接続の信鯨性低下も起こ
りえず、金属棒により基板両面の導電パターンの電気的
接続は確実に行われる。またメソキ工程を省くことがで
きるので膜厚は増加せず、頂く形成される。したがって
、サイドエツチングによる歩留りの低下が起こらないの
で、パターニング精度が向上する。さらにファインパタ
ーン形成においても、歩留りが向上することはいうまで
もない。<Effects of the Invention> According to the method for manufacturing a printed wiring board of the present invention, the electrical connection of the conductor pattern is made by the metal rods fitted in advance, so there is no need for drilling holes and no subsequent metal forming process. do not have. In other words, since the formation of through-holes is unnecessary, cracks may occur that impede the electrical connection of the conductive pattern, and the reliability of the electrical connection between the through-hole and the land of the conductive pattern may deteriorate. In addition, the electrical connection between the conductive patterns on both sides of the substrate is ensured by the metal rod. Furthermore, since the meso-oxidation step can be omitted, the film thickness does not increase and the film is formed in a thin layer. Therefore, since the yield does not decrease due to side etching, patterning accuracy is improved. Furthermore, it goes without saying that the yield is improved in fine pattern formation as well.
このように孔開は工程およびメソキ工程を省くことがで
きることから、製造工程は闇路化され、製造時間の短縮
化ひいては製品コストの低減化をはかることができる。In this way, since the hole-drilling process and the metallurgical process can be omitted, the manufacturing process can be simplified, and the manufacturing time and product cost can be reduced.
さらに、プリント配線板の実装技術は、従来行われてき
たリード付き電子部品を半田デイツプによりプリント配
線基板に設けられた部品穴に「差し込む方式」から、さ
らに高密度実装の実現を目的としたいわゆるチップ化さ
れた表面実装部品（ＳＭＤ）をプリント配線基板の表面
上に「載せる方式」すなわちＳＭＴ （Ｓｕｒ’ｆａｃ
ｅ ？１ｏｕｎｔ Ｔｅｃｈｎｏｌｏｇｙ）へ移り変わ
りつつある状況において、本発明の方法では表裏パター
ンのコンタクト用のスルーホールを形成する必要がない
ので、ＳＭＤを実装する技術と組み合わせることにより
このような趨勢に十分対応できる。Furthermore, mounting technology for printed wiring boards has changed from the conventional method of "inserting electronic components with leads into component holes provided on printed wiring boards using solder dips" to the so-called so-called method aimed at achieving even higher density mounting. SMT (Sur'fac
E? With the method of the present invention, there is no need to form through-holes for contact on the front and back patterns, and the method of the present invention can fully respond to this trend by combining it with SMD mounting technology.
第１図は本発明の実施例の製造方法を経時的に示す断面
図、第２図は本発明の他の実施例を示す断面図、第３図
は従来例の製造方法を示す断面図、第４図乃至第５図は
従来例の問題点を説明する図である。
・・樹脂
２ｂ・−・銅箔
・・スルーホール
・ ・銅メツキ膜
・・プリプレグ
・・金属棒FIG. 1 is a cross-sectional view showing a manufacturing method according to an embodiment of the present invention over time, FIG. 2 is a cross-sectional view showing another example of the present invention, and FIG. 3 is a cross-sectional view showing a conventional manufacturing method. FIGS. 4 and 5 are diagrams for explaining the problems of the conventional example.・・Resin 2b・−・Copper foil・・Through hole・・Copper plating film・・Prepreg・・Metal rod
Claims (1)
基材に１つ以上の貫通孔を形成した後、その貫通孔に導
電性材料製の棒を嵌め込み、その状態で上記基材の両面
に導電パターンを形成し、その両面の導電パターンを上
記棒によって電気的に相互に接続することを特徴とする
、プリント配線基板の製造方法。In a method of manufacturing a double-sided printed wiring board,
After forming one or more through holes in the base material, a rod made of a conductive material is fitted into the through hole, and in this state, conductive patterns are formed on both sides of the base material, and the conductive patterns on both sides are inserted into the rod. A method of manufacturing a printed wiring board, characterized in that the printed wiring board is electrically connected to each other by.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2482190A JPH03229488A (en) | 1990-02-02 | 1990-02-02 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2482190A JPH03229488A (en) | 1990-02-02 | 1990-02-02 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03229488A true JPH03229488A (en) | 1991-10-11 |
Family
ID=12148849
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2482190A Pending JPH03229488A (en) | 1990-02-02 | 1990-02-02 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03229488A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0645719A (en) * | 1992-04-03 | 1994-02-18 | Internatl Business Mach Corp <Ibm> | Via for tehrmoplastic base body and pad structure as well as method and apparatus for formation of above structure |
| JP2005353932A (en) * | 2004-06-14 | 2005-12-22 | Shinko Electric Ind Co Ltd | Manufacturing method of wiring board |
| KR100903291B1 (en) * | 2007-07-10 | 2009-06-16 | (주)티에스이 | Space transformer having through via and manufacturing method thereof |
-
1990
- 1990-02-02 JP JP2482190A patent/JPH03229488A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0645719A (en) * | 1992-04-03 | 1994-02-18 | Internatl Business Mach Corp <Ibm> | Via for tehrmoplastic base body and pad structure as well as method and apparatus for formation of above structure |
| JP2005353932A (en) * | 2004-06-14 | 2005-12-22 | Shinko Electric Ind Co Ltd | Manufacturing method of wiring board |
| JP4551135B2 (en) * | 2004-06-14 | 2010-09-22 | 新光電気工業株式会社 | Wiring board manufacturing method |
| KR100903291B1 (en) * | 2007-07-10 | 2009-06-16 | (주)티에스이 | Space transformer having through via and manufacturing method thereof |
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