JPH0567046U - Double-sided mounting board - Google Patents

Abstract

(57) [Abstract] [Purpose] To provide a double-sided mounting substrate in which through holes are provided in the substrate, in which chip components can be mounted at high density. [Structure] Solder lands 12 are provided on the front and back surfaces of a substrate 11 for soldering chip components 15, and the solder lands 12 and the wiring pattern 13 are connected to each other via through holes 16 formed in the solder lands 12. The double-sided mounting board 1 electrically connected to the through hole 1
The resin 17 is embedded in the resin 6 through the opening 16b opposite to the soldering land 12.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a double-sided mounting board in which chip components are mounted on the front and back surfaces of the board.

[0002]

[Prior Art]

 In order to miniaturize electronic devices, it is required to miniaturize the chip components used for them and to mount the chip components on the board in high density. To meet this requirement, there is a double-sided mounting board in which chip components are mounted on the front and back surfaces of the board, respectively. This double-sided mounting board will be described with reference to the sectional view of FIG. That is, the double-sided mounting substrate 1 is composed of a substrate 11 using a glass epoxy plate and the like, soldering lands 12 and wiring patterns 13 formed on the front surface 11a and the back surface 11b of the substrate 11, respectively. Chip parts 15 are connected to the attachment lands 12 by solders 14, respectively. The soldering land 12 provided on the front surface 11a of the substrate 11 is connected to the through hole 16 via the wiring pattern 13 and electrically connected to the wiring pattern 13 on the back surface 11b via the through hole 16. Has been done. A desired electric circuit is formed by soldering the chip component 15 to the soldered land 12.

[0003]

[Problems to be solved by the device]

 However, such a double-sided mounting board has the following problems. That is, when a through hole for electrical connection between the front surface and the back surface of the board is provided in the soldered land, the solder for connecting the chip component gets into this through hole, so-called solder thinning. Occurs. As a result, the amount of solder necessary for connecting the chip component and the soldering land cannot be obtained, which causes a poor electrical connection between the chip component and the soldering land. Therefore, when designing the wiring pattern and the layout of the through holes on the board, it is difficult to reduce the area of the board because the through holes must be provided in a place other than the soldering land. Therefore, an object of the present invention is to provide a double-sided mounting board having through holes provided in the board, which enables high-density mounting of chip components.

[0004]

[Means for Solving the Problems]

 The present invention is a double-sided mounting board made to solve the above problems. That is, soldering lands for soldering chip components are provided on the front and back surfaces of the board, and the soldering lands and the wiring pattern are electrically connected to each other through the through holes formed in the soldering lands. This is a mounting board in which resin is embedded in the through hole from the opening opposite to the soldering land of the through hole.

[0005]

[Action]

 Since the resin is embedded in the through holes, even if the chip component is soldered to the soldering land, the solder does not enter into the through holes and the solder does not become thin. Therefore, even if the through hole is provided in the soldering land, the chip component and the soldering land can be reliably soldered.

[0006]

【Example】

 An embodiment of the double-sided mounting substrate of the present invention will be described below with reference to the drawings. FIG. 1 is a sectional view illustrating a double-sided mounting board of the present invention. That is, the double-sided mounting board 1 is provided with soldering lands 12 provided on the front and back surfaces of the board 11, through holes 16 provided in the soldering lands 12 so as to penetrate the board 11, and through holes. It is composed of a soldering land 12 and a wiring pattern 13 electrically connected via 16. A desired electric circuit is formed by connecting a chip component 15 including a resistor and a capacitor to the soldering land 12 by using a solder 14.

A resin 17 such as a resist material is embedded in the through hole 16 from an opening 16 b opposite to the soldering land 12. For example, when the chip component 15 is soldered to the soldering land 12 provided on the front surface 11a side of the substrate 11, the resin 17 is embedded in the through hole 16 from the opening 16b on the back surface 11b side of the through hole 16. Has been. The resin 17 in the through hole 16 is embedded in the opening 16a of the through hole 16 on the side to which the chip component 15 is connected, that is, the upper surface of the soldering land 12, so that the resin 17 is not soldered. Even if the chip component 15 is mounted on the upper surface of the land 12, it does not float up. Since the resin 17 is embedded in the through hole 16 in such a state, the solder 14 does not enter the through hole 16 during soldering, so that the solder 14 does not become thin. Therefore, even if the through hole 16 is provided in the soldering land 12, the chip component 15 and the soldering land 12 can be reliably connected.

Next, a method of manufacturing the double-sided mounting board 1 of the present invention will be briefly described. First, a soldering land 12 and a wiring pattern 13 for forming a desired electric circuit are formed on the front surface 11a and the back surface 11b of the substrate 11, respectively, by a printing method or the like.

Next, a through hole of about 0.3 to 0.4 mm is formed at a predetermined position in the soldering land 12 by a drill or the like. Then, the through hole 16 is formed by applying copper plating or the like to the through hole. Thereby, for example, the soldering land 12 provided on the front surface 11a of the substrate 11 and the wiring pattern 13 provided on the back surface 11b are electrically connected.

Then, the resin 17 is embedded in the through hole 16 from the opening 16 b on the side opposite to the soldering land 12 of the through hole 16. For example, when the chip component 15 is soldered to the soldering land 12 provided on the front surface 11a side of the substrate 11, the resin 17 is embedded in the through hole 16 from the opening 16b on the back surface 11b side. On the contrary, when the chip component 15 is soldered to the soldering land 12 provided on the back surface 11b side, the resin 17 is embedded in the through hole 16 from the opening 16b on the front surface 11a side. At this time, by controlling the hole diameter of the through hole 16 and the amount, viscosity, temperature, etc. of the resin 17, the resin 17 is prevented from protruding from the opening 16a of the through hole 16 on the soldering land 12 side. Further, by coating the resin 17 on the upper surface of the soldering land 12 provided on the front surface 11a and the back surface 11b, other than the place where soldering of the chip component 15 is performed, the wiring pattern 13 on the substrate 11 is protected. May be.

The double-sided mounting board 1 is manufactured by such a method. Predetermined chip components 15 are mounted on the soldering lands 12 provided on the front surface 11a and the back surface 11b of the manufactured double-sided mounting board 1, and soldering is performed using, for example, a reflow soldering method. At the time of soldering, since the resin 17 is embedded in the through hole 16, the solder 14 does not enter the through hole 16. That is, since the chip component 15 and the solder land 12 can be soldered without thinning the solder, the connection failure is significantly reduced.

[0012]

[Effect of the device]

 As described in the above embodiments, the double-sided mounting substrate of the present invention has the following effects. That is, since the resin is embedded in the through hole, the solder does not enter the through hole during soldering. Therefore, even if a through hole is provided in the soldering land, the soldering land and the chip component can be reliably soldered without thinning the solder. As a result, in the double-sided mounting board of the present invention, it is possible to form a through hole in the soldering land, which has not been possible until now. Therefore, the area of the substrate can be reduced, and the chip components can be mounted at high density. The present invention is particularly effective when the chip component is large and the area of the soldering land is large.

[Brief description of drawings]

FIG. 1 is a cross-sectional view illustrating a double-sided mounting board of the present invention.

FIG. 2 is a cross-sectional view illustrating a conventional double-sided mounting board.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Double-sided mounting board 11 Board 11a Front surface 11b Back surface 12 Soldering land 13 Wiring pattern 14 Solder 15 Chip component 16 Through hole 17 Resin

Claims (1)

[Scope of utility model registration request] 1. A soldering land provided for soldering a chip component on the front and back surfaces of a substrate, a through hole bored in the soldering land, and the soldering land through the through hole. And a wiring pattern electrically connected to the through-hole, wherein the through-hole is filled with resin from an opening opposite to the soldering land of the through-hole. Double-sided mounting board.