JPH11330662A - Printed board device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed board device in which size reduction is realized by increasing the mounting density of electronic part on a board. SOLUTION: In a printed board 33 comprising chip parts 17, 19, 20 each having electrodes at the opposite ends and a hole 16 to be buried with the first chip part 17, the hole 16 comprises through holes 11, 12 made at such distances as the opposite electrodes of the chip part 17 is included and a non- through hole 15 communicating the through holes 11, 12. The through holes 11, 12 are connected with the electrodes of the chip part 17 and the chip part 19 or 20 is mounted while sharing one electrode 21 in the hole 16 where the chip part 17 is buried thus realizing a printed board device having reduced size.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board used for a high-frequency module or the like.

[0002]

2. Description of the Related Art A conventional printed circuit board device has the structure shown in FIGS. Hereinafter, a conventional printed circuit board device will be described with reference to the drawings. Reference numeral 1 denotes a printed circuit board on which a high-frequency circuit used in a high-frequency module is formed.
The lands 2, 3, and 4 for mounting 6, 7 are formed. 5A, cream lands 8 are printed on the lands 2, 3, and 4 using a screen, and then, as shown in FIG. 5B. Electrical parts 5, 6, 7 as shown in FIG.
11 is mounted on the cream solder, the cream solder is melted in a reflow furnace, and the lands 2, 3, 4 of the printed circuit board 1 and the electrodes 9, 10, 1 of the electric components 5, 6, 7 are mounted.
1 is soldered. In designing the high-frequency circuit of the printed circuit board 1 and the lands 2, 3, and 4, when the electric components 5, 6, and 7 are solder-bonded to the lands 2, 3, and 4, the lands 2 and 3, As shown in FIG. 4, the lands 2, 3, and 4 are formed at predetermined intervals A and B so that the lands 3 and 4 are not connected by solder.

[0003]

However, in such a conventional configuration, the size of the substrate, which greatly affects the size of the high-frequency module, is determined by the bottom area of the electric components, the interval between lands, and the high-frequency circuit pattern. For this reason, there is a problem that there is a limit to downsizing the module.

An object of the present invention is to solve such a problem and to provide a printed circuit board device which realizes miniaturization of a high-frequency module or the like.

[0005]

In order to achieve this object, a printed circuit board device according to the present invention comprises a chip component having electrodes at both ends and a buried hole in which a first chip component of the chip component is buried. In the printed circuit board, the buried hole is formed by a through hole provided at a distance in which both electrodes of the first chip component are included, and a non-through hole formed so as to communicate between the through holes. At the same time, the through hole and the electrode of the first chip component are connected by cream solder, and the second chip component is mounted using the electrode of the first chip component in common.

[0006] Thus, downsizing of the high-frequency module and the like can be achieved.

[0007]

DETAILED DESCRIPTION OF THE INVENTION The invention according to claim 1 of the present invention is directed to a printed circuit board having a chip component having electrodes at both ends and a buried hole in which a first chip component of the chip component is buried. The buried hole is formed by a through hole provided at a distance in which both electrodes of the first chip component are included, and a non-through hole formed so as to communicate between the through holes. The hole and the electrode of the first chip are connected by cream solder, and the electrode of the first chip component is shared with the second chip.
Since the electrodes of the first chip component and the second chip component are shared, the size of the printed board can be reduced, and as a result, the size of the module and the like can be reduced. In addition, since the second chip component is mounted on the first chip component, the mounting density of the chip components can be increased. Further, since the distance between the chip components is shortened, the high frequency performance is improved.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1A is a plan view of a main part of a printed circuit board device according to an embodiment of the present invention. 11,12
Is a through hole having lands 13 and 14 on the substrate surface,
A non-through hole 15 is formed between the through holes 11 and 12 to form a buried hole 16 for burying a chip component. The broken lines in the figure are the chip components 17, 19, and 20, and the distance between the through holes 11, 12 is set to the distance in which the chip component 17 is included. Reference numeral 18 denotes a land on which one of the electrodes of the chip components 19 and 20 is mounted. Chip components 19 and 20 are mounted between lands 18 and through holes 11 and 12, respectively. FIG. 1B is a dimensional view of the buried hole 16. In this embodiment, the buried hole 16 for a 1005 size chip component has a through hole diameter 30 of 0.6 mm, a non-through hole diameter 31 of 0.8 mm, and a through hole. Hole spacing 3
2 was set to 0.8 mm.

FIG. 2 is a perspective view of an embodiment of the present invention. As shown in FIG. 2A, a chip component 17 is buried in a burying hole 16, and as shown in FIG. 22 is printed on the electrodes 21 of the chip component 17, the lands 13, 14 of the through holes 11, 12 and the land 18, and the chip components 19, 20 are mounted. The board thus mounted is passed through a reflow furnace to perform soldering. Thus, the electrodes 21 of the chip component 17, the inner surfaces of the through holes 11, 12 and the electrodes 23, 24 of the chip components 19 and 20, and the electrode 2
The lands 18 and the lands 18 are soldered. Further, the through holes 11 and 12 are electrically insulated from each other by the non-through holes 15, so that no short circuit occurs. Note that 33
Is a substrate in which the chip component 17 is embedded.

FIG. 3 is a perspective view showing an arrangement of electric components using the buried hole 16 according to the embodiment of the present invention. FIG.
3A shows a three-terminal transistor 25 mounted on the buried hole 16, and FIG. 3B shows the arrangement of the chip component 26 and the buried hole 16.

[0011]

As described above, according to the present invention, it is possible to dispose the chip components by eliminating the mounting intervals by sharing the land of the adjacent chip components, and to increase the component mounting density by increasing the component mounting density. The device can be downsized.

[Brief description of the drawings]

FIG. 1A is a plan view of a main part of a printed circuit board device according to an embodiment of the present invention, and FIG. 1B is a plan view showing practical dimensions of the buried hole.

FIG. 2A is a perspective view of a main part of a first assembly process of the printed circuit board device. FIG. 2B is a perspective view of a main part of a second assembly process of the same.

FIG. 3A is a perspective view of the component arrangement of the same transistor, and FIG.

FIG. 4 is a perspective view of a main part of a conventional printed circuit board device.

5A is a perspective view after the cream solder printing, and FIG. 5B is a perspective view of a main part after the chip component is mounted.

[Explanation of symbols]

 Reference Signs List 11 through hole 12 through hole 15 non-through hole 16 buried hole 17 chip component 19 chip component 20 chip component

Claims (1)

[Claims] 1. A printed circuit board having a chip component having electrodes at both ends and a buried hole in which a first chip component of the chip component is buried, wherein the buried hole is the first component.
The first chip is formed by a through-hole provided at a distance in which both electrodes of the chip component are included, and a non-through-hole formed so as to communicate between the through-holes. The printed circuit board device is connected to the electrode by cream solder, and the second chip component is mounted by sharing the electrode portion of the first chip component.