JPH08130361A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH08130361A JPH08130361A JP26863794A JP26863794A JPH08130361A JP H08130361 A JPH08130361 A JP H08130361A JP 26863794 A JP26863794 A JP 26863794A JP 26863794 A JP26863794 A JP 26863794A JP H08130361 A JPH08130361 A JP H08130361A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- land portion
- routing pattern
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003014 reinforcing effect Effects 0.000 claims abstract description 20
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 8
- 229910052742 iron Inorganic materials 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は、引き回しパターンの断
線を解消することができるプリント配線基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board which can eliminate disconnection of a routing pattern.
【０００２】[0002]
【従来の技術】プリント配線基板として、図６に示すよ
うなものが知られている。図６において、プリント配線
基板は複数の層からなり、最下層は鉄板１０となってい
る。鉄板１０の上面には絶縁層１１が形成されており、
絶縁層１１上には適宜の形状に形成された銅箔からなる
引き回しパターン１２が形成されている。引き回しパタ
ーン１２は電子部品などと半田付接続されるランド部を
除いてレジスト層１３によって覆われており、レジスト
層１３の上面にはシルク層１４が形成されている。な
お、鉄板１０のかわりに、フェノール等が用いられたプ
リント配線基板もある。2. Description of the Related Art As a printed wiring board, one shown in FIG. 6 is known. In FIG. 6, the printed wiring board is composed of a plurality of layers, and the bottom layer is the iron plate 10. An insulating layer 11 is formed on the upper surface of the iron plate 10,
On the insulating layer 11, a routing pattern 12 made of a copper foil having an appropriate shape is formed. The routing pattern 12 is covered with a resist layer 13 except for a land portion which is soldered to an electronic component or the like, and a silk layer 14 is formed on the upper surface of the resist layer 13. There is also a printed wiring board using phenol or the like instead of the iron plate 10.
【０００３】上記プリント配線基板には、図７に示すよ
うに、電子部品２６が搭載されている。電子部品２６は
複数個の端子２１を有しており、各端子２１は、プリン
ト配線基板上のレジスト層１３から外部に露出したラン
ド部２２と半田付接続されている。ランド部２２は、プ
リント配線基板上に形成された引き回しパターン１２と
連通している。An electronic component 26 is mounted on the printed wiring board as shown in FIG. The electronic component 26 has a plurality of terminals 21, and each terminal 21 is soldered to a land portion 22 exposed to the outside from the resist layer 13 on the printed wiring board. The land portion 22 communicates with the routing pattern 12 formed on the printed wiring board.
【０００４】[0004]
【発明が解決しようとする課題】近年、各種装置などの
小型化が進み、装置等に取り付けられるプリント配線基
板自体も小面積化され、電子部品等がプリント配線基板
上に密集するような形態で配置される傾向にある。この
ようにプリント配線基板上に電子部品が密集するように
配置される場合、引き回しパターン１２の幅寸法を、
０．２から０．３ｍｍ程度の微小なものにすれば、スペ
ースを有効利用することができる。In recent years, miniaturization of various devices has progressed, and the printed wiring board itself attached to the device has a smaller area, so that electronic parts and the like are densely packed on the printed wiring board. Tend to be placed. When the electronic components are densely arranged on the printed wiring board as described above, the width dimension of the routing pattern 12 is set as follows.
The space can be effectively used by making it as small as 0.2 to 0.3 mm.
【０００５】しかし、引き回しパターン１２の幅寸法が
微小であると、図８（ａ）に示すようにプリント配線基
板に対して応力が加わった場合、あるいは、図８（ｂ）
に示すように半田ごて２７で電子部品を半田付する場合
等に、図９に示すような、ランド部２２と引き回しパタ
ーン１２との接続部分において幅寸法が急激に変化する
部分、即ち、直角状となった符号Ａの部分に応力が集中
し、引き回しパターンが切れてしまうことがあった。However, if the width dimension of the routing pattern 12 is minute, when stress is applied to the printed wiring board as shown in FIG. 8A, or as shown in FIG. 8B.
When soldering an electronic component with the soldering iron 27 as shown in FIG. 9, a portion where the width dimension changes abruptly, that is, a right angle, in the connecting portion between the land portion 22 and the routing pattern 12 as shown in FIG. In some cases, stress was concentrated on the portion indicated by the symbol A, and the routing pattern was broken.
【０００６】本発明は以上のような従来技術の問題点を
解消するためになされたもので、引き回しパターンの幅
寸法が小さくても、ランド部と引き回しパターンとの接
続部分に切れが生ずることがないプリント配線基板を提
供することを目的とする。The present invention has been made in order to solve the above problems of the prior art. Even if the width dimension of the routing pattern is small, a disconnection may occur at the connecting portion between the land portion and the routing pattern. It is intended to provide a printed wiring board that does not have.
【０００７】[0007]
【課題を解決するための手段】本発明は、以上のような
目的を達成するために、電子部品素子の端子と接続され
るランド部と、ランド部と連通する引き回しパターンと
を備えたプリント配線基板において、ランド部と引き回
しパターンとの接続部に補強部を形成したことを特徴と
する。補強部は、引き回しパターン側からランド部側に
かけて緩やかに広がるようにしてもよい。また、補強部
は円弧状でもよいし、直線状でもよい。In order to achieve the above object, the present invention provides a printed wiring having a land portion connected to a terminal of an electronic component element and a routing pattern communicating with the land portion. The substrate is characterized in that a reinforcing portion is formed at a connecting portion between the land portion and the routing pattern. The reinforcing portion may be gradually expanded from the routing pattern side to the land portion side. The reinforcing portion may have an arc shape or a linear shape.
【０００８】[0008]
【作用】引き回しパターンとランド部の接続部分に補強
部を形成することにより、引き回しパターンの幅寸法の
変化が緩やかになり、引き回しパターンとランド部の接
続部への応力集中が緩和され、引き回しパターンの切れ
が解消される。[Function] By forming the reinforcing portion at the connecting portion between the routing pattern and the land portion, the change in the width dimension of the routing pattern is moderated, the stress concentration on the connection portion between the routing pattern and the land portion is relaxed, and the routing pattern is reduced. The disconnection of the is eliminated.
【０００９】[0009]
【実施例】以下、本発明にかかるプリント配線基板の実
施例について図面を参照しながら説明する。図１におい
て、プリント配線基板上には幅寸法０．２から０．３ｍ
ｍ程度の引き回しパターン３が形成されており、引き回
しパターン３の端部は四角形状のランド部２と接続され
ている。プリント配線基板の上端面は、ランド部２を除
いて図示しないレジスト層で覆われており、レジスト層
から外部に露出したランド部２には、電子部品１の端子
１ａが半田付等により接続されている。Embodiments of the printed wiring board according to the present invention will be described below with reference to the drawings. 1, the width of the printed wiring board is 0.2 to 0.3 m.
The routing pattern 3 of about m is formed, and the end of the routing pattern 3 is connected to the rectangular land portion 2. The upper end surface of the printed wiring board is covered with a resist layer (not shown) except for the land portion 2, and the terminal 1a of the electronic component 1 is connected to the land portion 2 exposed from the resist layer to the outside by soldering or the like. ing.
【００１０】図１、図２において、ランド部２と引き回
しパターン３の接続部分の両側にはＲ形状（円弧状）の
補強部４が形成されている。補強部４は引き回しパター
ン３の端部側の一部であり、この補強部４を形成するこ
とにより、引き回しパターン３とランド部２の境界部分
の幅寸法は、急激ではなく緩やかに変化する。従って、
プリント配線基板に何らかの応力等が加わった際に、引
き回しパターン３とランド部２の接続部分への応力の集
中を和らげることができ、この結果、ランド部２と引き
回しパターン３の接続部分での引き回しパターン３の切
れを防止することができる。In FIGS. 1 and 2, an R-shaped (arcuate) reinforcing portion 4 is formed on both sides of the connection portion between the land portion 2 and the routing pattern 3. The reinforcing portion 4 is a part on the end side of the routing pattern 3, and by forming the reinforcing portion 4, the width dimension of the boundary portion between the routing pattern 3 and the land portion 2 changes gently rather than abruptly. Therefore,
When some stress is applied to the printed wiring board, it is possible to reduce the concentration of stress on the connection between the routing pattern 3 and the land portion 2. As a result, the routing at the connection portion between the land portion 2 and the routing pattern 3 can be reduced. It is possible to prevent disconnection of the pattern 3.
【００１１】以上のように、引き回しパターン３のラン
ド部２と連通する接続部分に補強部４を形成することに
より、応力集中によるパターン切れが解消され、形成す
るのが難しかった幅寸法が微細な引き回しパターン３を
形成できるようになる。このため、プリント配線基板上
のスペースを有効利用でき、装置の小型化、薄型化に寄
与することができる。As described above, by forming the reinforcing portion 4 in the connecting portion communicating with the land portion 2 of the routing pattern 3, the pattern breakage due to the stress concentration is eliminated, and the width dimension which is difficult to form is fine. The routing pattern 3 can be formed. Therefore, the space on the printed wiring board can be effectively used, which contributes to downsizing and thinning of the device.
【００１２】なお、補強部は、図１、図２に示すような
四角形状のランド部２にのみ限られたものではない。図
３に示すような、円形状のランド部２’にも適用可能で
ある。The reinforcing portion is not limited to the rectangular land portion 2 as shown in FIGS. It can also be applied to a circular land portion 2'as shown in FIG.
【００１３】さらに、補強部の形状もＲ形状のものに限
られるものではない。一点に応力が集中しないように、
ランド部と接続される引き回しパターンの幅寸法が徐々
に変化しているものならばどのような形状でもよい。例
えば、図４に示す補強部５のように、直線状であっても
よい。また、この場合、図５に示すように、引き回しパ
ターン３と接続されるランド部２’の形状は円形状であ
ってもよい。Further, the shape of the reinforcing portion is not limited to the R shape. To prevent stress from concentrating on one point,
Any shape may be used as long as the width dimension of the routing pattern connected to the land portion is gradually changed. For example, it may be linear as in the reinforcing portion 5 shown in FIG. Further, in this case, as shown in FIG. 5, the shape of the land portion 2 ′ connected to the routing pattern 3 may be circular.
【００１４】[0014]
【発明の効果】本発明によれば、ランド部と引き回しパ
ターンとの接続部に補強部が形成され、補強部は引き回
しパターン側からランド部側にかけて緩やかに幅寸法が
大きくなっているため、応力の集中を押さえることがで
き、引き回しパターンのパターン切れ等を解消すること
が可能となる。According to the present invention, since the reinforcing portion is formed at the connecting portion between the land portion and the routing pattern, and the reinforcing portion gradually increases in width dimension from the routing pattern side to the land portion side, the stress is reduced. It is possible to suppress the concentration of the pattern, and it is possible to eliminate the pattern breakage of the routing pattern.
【図１】本発明にかかるプリント配線基板の実施例を示
す平面図。FIG. 1 is a plan view showing an embodiment of a printed wiring board according to the present invention.
【図２】同上要部拡大平面図。FIG. 2 is an enlarged plan view of an essential part of the same.
【図３】本発明にかかるプリント配線基板の別の実施例
を示す平面図。FIG. 3 is a plan view showing another embodiment of the printed wiring board according to the present invention.
【図４】本発明にかかるプリント配線基板のさらに別の
実施例を示す要部拡大平面図。FIG. 4 is an enlarged plan view of an essential part showing still another embodiment of the printed wiring board according to the present invention.
【図５】本発明にかかるプリント配線基板のさらに別の
実施例を示す平面図。FIG. 5 is a plan view showing still another embodiment of the printed wiring board according to the present invention.
【図６】従来のプリント配線基板の例を示す断面図。FIG. 6 is a cross-sectional view showing an example of a conventional printed wiring board.
【図７】同上プリント配線基板の例を示す平面図。FIG. 7 is a plan view showing an example of the same printed wiring board.
【図８】同上プリント配線基板に加わる応力の原因を示
す断面図。FIG. 8 is a sectional view showing the cause of stress applied to the printed wiring board of the above.
【図９】同上プリント配線基板の要部拡大平面図。FIG. 9 is an enlarged plan view of an essential part of the above printed wiring board.
１ａ 端子 ２ ランド部 ３ パターン ４ 補強部 1a terminal 2 land part 3 pattern 4 reinforcement part
Claims (4)
部と、該ランド部と連通する引き回しパターンとを備え
たプリント配線基板において、 ランド部と引き回しパターンとの接続部に補強部が形成
されていることを特徴とするプリント配線基板。1. A printed wiring board having a land portion connected to a terminal of an electronic component element and a wiring pattern communicating with the land portion, wherein a reinforcing portion is formed at a connection portion between the land portion and the wiring pattern. A printed wiring board characterized in that
から上記ランド部側にかけて緩やかに広がっていること
を特徴とする請求項１記載のプリント配線基板。2. The printed wiring board according to claim 1, wherein the reinforcing portion gradually spreads from the routing pattern side to the land portion side.
特徴とする請求項２記載のプリント配線基板。3. The printed wiring board according to claim 2, wherein the reinforcing portion has an arc shape.
特徴とする請求項２記載のプリント配線基板。4. The printed wiring board according to claim 2, wherein the reinforcing portion has a linear shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26863794A JPH08130361A (en) | 1994-11-01 | 1994-11-01 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26863794A JPH08130361A (en) | 1994-11-01 | 1994-11-01 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH08130361A true JPH08130361A (en) | 1996-05-21 |
Family
ID=17461323
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26863794A Pending JPH08130361A (en) | 1994-11-01 | 1994-11-01 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH08130361A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7525190B2 (en) | 1998-05-19 | 2009-04-28 | Ibiden Co., Ltd. | Printed wiring board with wiring pattern having narrow width portion |
| WO2010004943A1 (en) * | 2008-07-09 | 2010-01-14 | リンテック株式会社 | Electronic circuit and ic tag |
| US9681544B2 (en) | 2015-04-28 | 2017-06-13 | Fujitsu Limited | Printed substrate and shield sheet metal fixing method |
-
1994
- 1994-11-01 JP JP26863794A patent/JPH08130361A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7525190B2 (en) | 1998-05-19 | 2009-04-28 | Ibiden Co., Ltd. | Printed wiring board with wiring pattern having narrow width portion |
| US8018046B2 (en) | 1998-05-19 | 2011-09-13 | Ibiden Co., Ltd. | Printed wiring board with notched conductive traces |
| US8629550B2 (en) | 1998-05-19 | 2014-01-14 | Ibiden Co., Ltd. | Printed wiring board with crossing wiring pattern |
| WO2010004943A1 (en) * | 2008-07-09 | 2010-01-14 | リンテック株式会社 | Electronic circuit and ic tag |
| JP2010020472A (en) * | 2008-07-09 | 2010-01-28 | Lintec Corp | Electronic circuit and ic tag |
| KR20110031290A (en) * | 2008-07-09 | 2011-03-25 | 린텍 가부시키가이샤 | Electronic circuit and ic tag |
| US8292188B2 (en) | 2008-07-09 | 2012-10-23 | Lintec Corporation | Electronic circuit and IC tag |
| US9681544B2 (en) | 2015-04-28 | 2017-06-13 | Fujitsu Limited | Printed substrate and shield sheet metal fixing method |
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