JPH1140911A - Printed board - Google Patents

Printed board

Info

Publication number
JPH1140911A
JPH1140911A JP9192860A JP19286097A JPH1140911A JP H1140911 A JPH1140911 A JP H1140911A JP 9192860 A JP9192860 A JP 9192860A JP 19286097 A JP19286097 A JP 19286097A JP H1140911 A JPH1140911 A JP H1140911A
Authority
JP
Japan
Prior art keywords
hole
insulating substrate
land
lands
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP9192860A
Other languages
Japanese (ja)
Inventor
Yasuharu Kudo
康晴 工藤
Kazuhiko Watanabe
一彦 渡辺
Toshiro Furuta
敏朗 古田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP9192860A priority Critical patent/JPH1140911A/en
Priority to DE19832052A priority patent/DE19832052A1/en
Publication of JPH1140911A publication Critical patent/JPH1140911A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4061—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in inorganic insulating substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0394—Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1147—Sealing or impregnating, e.g. of pores
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To avoid flowing solder flow away via through-holes and to increase the solder zones of electrodes to lands, thereby surely soldering them by forming blinding in the through-holes and blocking them. SOLUTION: Through-holes 2 of about 0.2 mm diameter are formed in an insulation board 1, a first and a second conductive patterns 3, 4 for electric writings are formed on both sides thereof. Blindings 7 for blocking the through- holes 2 are provided in the through-holes 2 near the one side of the board 1 having lands 5, and electrodes 9 of electric components 8 are mounted on the lands 5 near the through-holes 2 and soldered to the lands 5, where the in-flow of solder 10 becomes smaller in the through-holes so as to increase the solder zones of the electrodes 9 to the lands 5, thus surely soldering them.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明はチューナ等の電子機
器に使用され、特に、高密度実装に適用して好適なプリ
ント基板に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed circuit board which is used for electronic equipment such as a tuner, and is particularly suitable for high-density mounting.

【０００２】[0002]

【従来の技術】従来の電子機器に使用されるプリント基
板は、図３に示すように、絶縁基板２０にスルーホール
２１を設けると共に、絶縁基板２０の両面には電気配線
用の導電パターン２２、２３が形成されている。また、
絶縁基板２０の一方の面には、導電パターン２２と接続
されたランド２４が形成されると共に、スルーホール２
１の周面には接続導体２５を設けて、ランド２４と絶縁
基板２０の他面に設けた導電パターン２３とを接続した
構成となっている。更に、前記ランド２４を除く導電パ
ターン２２、２３と絶縁基板２０上に、絶縁体から成る
レジスト膜２６が形成されると共に、このレジスト膜２
６の一部２６ａは、絶縁基板２０の他面側で、前記スル
ーホール２１の一部を塞いだ構成となっている。2. Description of the Related Art As shown in FIG. 3, a printed circuit board used in a conventional electronic device has a through hole 21 formed on an insulating substrate 20 and conductive patterns 22 for electric wiring on both surfaces of the insulating substrate 20. 23 are formed. Also,
On one surface of the insulating substrate 20, a land 24 connected to the conductive pattern 22 is formed, and a through hole 2 is formed.
A connection conductor 25 is provided on the peripheral surface of the substrate 1, and the land 24 is connected to the conductive pattern 23 provided on the other surface of the insulating substrate 20. Further, a resist film 26 made of an insulator is formed on the conductive patterns 22 and 23 excluding the lands 24 and on the insulating substrate 20.
A part 26 a of the sixth part 6 has a configuration in which a part of the through hole 21 is closed on the other surface side of the insulating substrate 20.

【０００３】そして、チップ部品等から成る電気部品２
７の電極部２８を、スルーホール２１の近傍のランド２
４上に載置し、このランド２４と電極部２８とを半田２
９付けして接続するようになっている。このように、電
気部品２７をスルーホール２１の近傍で半田２９付けす
ることにより、プリント基板の小型化を図っているが、
この時、半田２９は、スルーホール２１内に多く流れ込
み、電極部２８近傍での半田２９の量が少なくなる。ま
た、スルーホール２１内に流れ込んだ半田２９は、絶縁
基板２０の他面側に形成されたレジスト膜２６の一部２
６ａで、外部への流出が阻止されている。[0003] An electric component 2 comprising a chip component or the like.
7 is connected to the land 2 near the through hole 21.
4 and the lands 24 and the electrode portions 28 are
9 for connection. As described above, the electric component 27 is soldered in the vicinity of the through hole 21 to reduce the size of the printed circuit board.
At this time, a large amount of the solder 29 flows into the through-hole 21 and the amount of the solder 29 near the electrode portion 28 decreases. The solder 29 flowing into the through-hole 21 is part of the resist film 26 formed on the other surface of the insulating substrate 20.
At 6a, outflow to the outside is prevented.

【０００４】[0004]

【発明が解決しようとする課題】従来のプリント基板
は、絶縁基板２０の他面側に、スルーホール２１の一部
を塞ぐレジスト膜２６を設けたものであるため、レジス
ト膜２６を必要とし、生産性が悪く、コスト高に成ると
いう問題がある。また、スルーホール２１への半田２９
の流れ込みが多く、電極部２８近傍での半田２９の量が
少なくなり、半田付け不良を起こすという問題があっ
た。The conventional printed circuit board is provided with a resist film 26 for covering a part of the through hole 21 on the other surface side of the insulating substrate 20, so that the resist film 26 is required. There is a problem that productivity is low and costs increase. Also, solder 29 to through hole 21
And the amount of the solder 29 in the vicinity of the electrode portion 28 is reduced, resulting in a problem of poor soldering.

【０００５】[0005]

【課題を解決するための手段】上記課題を解決するため
の第１の解決手段として、絶縁基板に設けられたスルー
ホールと、前記絶縁基板の両面に形成された第１と第２
導電パターンと、前記スルーホールの近傍で前記絶縁基
板の少なくとも一方の面に形成されたランドと、前記ス
ルーホールの周面に形成され、前記ランドと前記絶縁基
板の他方の面に形成された第２導電パターンとを接続す
る接続導体と、前記スルーホール上、或いはスルーホー
ルの近傍に位置する前記ランド上に載置されて前記ラン
ドに半田付けされた電気部品とを備え、前記ランドと前
記接続導体が銀を主成分とする同一の導体で構成され、
該導体で前記スルーホールを塞ぐ目詰まり部を設けた構
成とした。更に、第２の解決手段として、前記目詰まり
部を、前記絶縁基板の他面よりも前記ランドを形成した
前記絶縁基板の一方の面に近い位置に設けた構成とし
た。As a first means for solving the above problems, there are provided a through hole provided in an insulating substrate and first and second holes formed on both surfaces of the insulating substrate.
A conductive pattern, a land formed on at least one surface of the insulating substrate in the vicinity of the through hole, and a land formed on a peripheral surface of the through hole and formed on the other surface of the land and the insulating substrate. A connection conductor for connecting the two conductive patterns, and an electric component mounted on the land located on the through hole or in the vicinity of the through hole and soldered to the land. The conductor is composed of the same conductor whose main component is silver,
The conductor was provided with a clogging portion for closing the through hole. Further, as a second solution, the clogging portion is provided at a position closer to one surface of the insulating substrate on which the lands are formed than the other surface of the insulating substrate.

【０００６】[0006]

【発明の実施の形態】本発明のプリント基板を図１、図
２に基づいて説明すると、図１は本発明のプリント基板
の要部の拡大断面図、図２は本発明のプリント基板の他
の実施形態を示す要部の拡大断面図である。そして、本
発明のプリント基板は、図１、図２に示すように、セラ
ミックから成る絶縁基板１には、直径が約０．２ｍｍ程
度の複数個のスルーホール２が形成されると共に、絶縁
基板１の両面には、電気配線用の第１、第２導電パター
ン３、４が形成されている。DESCRIPTION OF THE PREFERRED EMBODIMENTS A printed board according to the present invention will be described with reference to FIGS. 1 and 2. FIG. 1 is an enlarged sectional view of a main part of the printed board according to the present invention, and FIG. It is an expanded sectional view of an important section showing an embodiment. As shown in FIGS. 1 and 2, the printed board of the present invention has a plurality of through holes 2 having a diameter of about 0.2 mm formed in an insulating board 1 made of ceramic. First and second conductive patterns 3 and 4 for electric wiring are formed on both surfaces of 1.

【０００７】また、前記絶縁基板１の一方の面には、ス
ルーホール２の近傍にランド５が設けられると共に、ス
ルーホール２の周面には接続導体６を形成し、この接続
導体６で、ランド５と絶縁基板１の他面側に設けられた
第２導電パターン４とを接続した構成となっている。更
に、前記スルーホール２の内部には、絶縁基板１の他面
よりもランド５を形成した絶縁基板１の一方の面に近い
位置に、スルーホール２の塞ぐ目詰まり部７を設けた構
成となっている。そして、少なくとも前記ランド５、接
続導体６、及び目詰まり部７は、銀を主成分とする導体
ペーストから成る同一の導体で構成されている。また、
この実施例では、第１、第２導電パターン３、４も銀を
主成分とする導体ペーストから成る導体で形成された状
態を示している。A land 5 is provided on one surface of the insulating substrate 1 near the through hole 2, and a connection conductor 6 is formed on the peripheral surface of the through hole 2. The configuration is such that the lands 5 are connected to the second conductive patterns 4 provided on the other surface side of the insulating substrate 1. Further, a clogging portion 7 for closing the through hole 2 is provided inside the through hole 2 at a position closer to one surface of the insulating substrate 1 on which the land 5 is formed than the other surface of the insulating substrate 1. Has become. At least the land 5, the connection conductor 6, and the clogged portion 7 are formed of the same conductor made of a conductor paste containing silver as a main component. Also,
This embodiment shows a state in which the first and second conductive patterns 3 and 4 are also formed of a conductor made of a conductive paste containing silver as a main component.

【０００８】また、抵抗、コンデンサー等のチップ部品
から成る電気部品８には、電極部９を設け、この電極部
９がスルーホール２上、或いはスルーホース２の近傍で
ランド５上に載置され、電極部９とランド５とが半田１
０付けによって、電気部品８が接続、固定された状態と
なっている。そして、この半田１０付け部は、図１から
分かるように、目詰まり部７によってスルーホール２内
への半田１０の流れ込みが少なくなり、電極部９とラン
ド５との半田１０付け量を多くして、確実な半田付けを
行うものである。[0008] Further, an electrode part 9 is provided on an electric part 8 composed of chip parts such as a resistor and a capacitor, and this electrode part 9 is placed on the land 5 near the through hole 2 or the through hose 2. , Electrode part 9 and land 5 are solder 1
The electrical component 8 is connected and fixed by the attachment of zero. As shown in FIG. 1, the solder 10 attachment portion reduces the flow of the solder 10 into the through hole 2 due to the clogging portion 7, and increases the solder 10 attachment amount between the electrode portion 9 and the land 5. Thus, reliable soldering is performed.

【０００９】また、図２は本発明のプリント基板の他の
実施形態を示し、この実施例では、絶縁基板１の一方の
面に形成されたランド５と、第１導電パターン３とを非
接続状態とし、ランド５を独立して形成したもので、そ
の他の構成は前記の実施形態と同様であるので、ここで
は同一部品に同一番号を付し、その詳細な説明は省略す
る。FIG. 2 shows another embodiment of the printed circuit board according to the present invention. In this embodiment, the land 5 formed on one surface of the insulating substrate 1 and the first conductive pattern 3 are not connected. In this state, the lands 5 are independently formed, and the other configurations are the same as those of the above-described embodiment. Therefore, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted.

【００１０】そして、上記プリント基板の製造方法は、
例えば、セラミックの絶縁基板１の他面側に、銀を主成
分とする導体ペーストをスクリーン印刷により第２導電
パターン４を形成し、その後、第１導電パターン３側と
なる他面側から吸引機（図示せず）で吸引して接続導体
６を形成する。そして、次に、この第２導電パターン４
を若干乾燥する。次に、この絶縁基板１の一方の面側
に、同じく銀を主成分とする導体ペーストをスクリーン
印刷により、スルーホール２を塞いだ状態でランド５と
第１導電パターン３とを形成する。この時、スルーホー
ル２上の導体ペーストは、若干多めの状態でスクリーン
印刷をしておく。次に、絶縁基板１の他面側よりスルー
ホール２の導体ペーストを、吸引機（図示せず）で第２
導電パターン４側から弱い力で吸引することにより、ス
ルーホール２周面に接続導体６を形成すると共に、目詰
まり部７を形成する。しかる後、セラミックの絶縁基板
１を炉（図示せず）で焼成すると、上述したようなプリ
ント基板が製造される。そして、クリーム半田により電
気部品８をランド５に仮止めした状態で、これを加熱炉
（図示せず）に通すと、電気部品８がランド５に半田１
０付けされた状態となる。[0010] The method of manufacturing the printed circuit board is as follows.
For example, a second conductive pattern 4 is formed on the other surface side of the ceramic insulating substrate 1 by screen printing a conductive paste containing silver as a main component, and then the suction device is formed from the other surface side on the first conductive pattern 3 side. The connection conductor 6 is formed by suction using a not-shown (not shown). Then, the second conductive pattern 4
Is slightly dried. Next, a land 5 and a first conductive pattern 3 are formed on one surface side of the insulating substrate 1 by screen printing a conductive paste also containing silver as a main component while the through holes 2 are closed. At this time, the conductor paste on the through hole 2 is screen-printed in a slightly larger state. Next, the conductor paste of the through hole 2 is applied to the second surface of the insulating substrate 1 from the other surface side by a suction machine (not shown).
The connection conductor 6 is formed on the peripheral surface of the through hole 2 and the clogged portion 7 is formed by suctioning the conductive pattern 4 from the conductive pattern 4 side with a weak force. Thereafter, when the ceramic insulating substrate 1 is fired in a furnace (not shown), the printed board as described above is manufactured. When the electric component 8 is temporarily fixed to the land 5 by cream solder and passed through a heating furnace (not shown), the electric component 8 is soldered to the land 5.
It will be in the state of 0.

【００１１】[0011]

【発明の効果】本発明のプリント基板は、スルーホール
２の内部に、スルーホール２を塞ぐ目詰まり部７を設け
たため、目詰まり部７によってスルーホール２を通して
半田１０が流れ去ることがなくなり、電極部９とランド
５との半田１０付け量が多くなって、確実な半田付けを
行うことが出来る。また、ランド５と接続導体６、及び
目詰まり部７を、銀を主成分とする同一の導体で構成さ
れているため、別部品を必要とせず、生産性が良好で、
安価なものが得られる。更に、目詰まり部７を、絶縁基
板１の一面に近い側に形成することによって、スルーホ
ール２内への半田１０の流れ込みをより少なくでき、一
層電気部品８の半田付けを確実に出来るものとなる。According to the printed circuit board of the present invention, since the clogging portion 7 for closing the through hole 2 is provided inside the through hole 2, the solder 10 does not flow through the through hole 2 due to the clogging portion 7. The amount of solder 10 between the electrode portion 9 and the land 5 is increased, so that reliable soldering can be performed. In addition, since the land 5, the connection conductor 6, and the clogged portion 7 are formed of the same conductor containing silver as a main component, no separate parts are required, and the productivity is good.
Inexpensive ones are obtained. Further, by forming the clogging portion 7 on a side near one surface of the insulating substrate 1, the flow of the solder 10 into the through hole 2 can be further reduced, and the soldering of the electric component 8 can be more reliably performed. Become.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明のプリント基板の要部の拡大断面図。FIG. 1 is an enlarged sectional view of a main part of a printed circuit board according to the present invention.

【図２】本発明のプリント基板の他の実施形態を示す要
部の拡大断面図。FIG. 2 is an enlarged sectional view of a main part showing another embodiment of the printed circuit board of the present invention.

【図３】従来のプリント基板の要部の拡大断面図。FIG. 3 is an enlarged sectional view of a main part of a conventional printed circuit board.

【符号の説明】[Explanation of symbols]

１ 絶縁基板 ２ スルーホール ３、４ 導電パターン ５ ランド ６ 接続導体 ７ 目詰まり部 ８ 電気部品 ９ 電極部 １０ 半田 REFERENCE SIGNS LIST 1 insulating substrate 2 through hole 3, 4 conductive pattern 5 land 6 connection conductor 7 clogged part 8 electric component 9 electrode part 10 solder

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 絶縁基板に設けられたスルーホールと、
前記絶縁基板の両面に形成された第１と第２導電パター
ンと、前記スルーホールの近傍で前記絶縁基板の少なく
とも一方の面に形成されたランドと、前記スルーホール
の周面に形成され、前記ランドと前記絶縁基板の他方の
面に形成された第２導電パターンとを接続する接続導体
と、前記スルーホール上、或いはスルーホールの近傍に
位置する前記ランド上に載置されて前記ランドに半田付
けされた電気部品とを備え、前記ランドと前記接続導体
が銀を主成分とする同一の導体で構成され、該導体で前
記スルーホールを塞ぐ目詰まり部を設けたことを特徴と
するプリント基板。A through hole provided in an insulating substrate;
First and second conductive patterns formed on both surfaces of the insulating substrate, lands formed on at least one surface of the insulating substrate in the vicinity of the through hole, and formed on a peripheral surface of the through hole; A connection conductor connecting the land and the second conductive pattern formed on the other surface of the insulating substrate; and a solder placed on the land located on the through hole or near the through hole and soldered to the land. A printed circuit board, wherein the land and the connection conductor are made of the same conductor containing silver as a main component, and a clogging portion for closing the through hole is provided by the conductor. . 【請求項２】 前記目詰まり部を、前記絶縁基板の他面
よりも前記ランドを形成した前記絶縁基板の一方の面に
近い位置に設けたことを特徴とする請求項１記載のプリ
ント基板。2. The printed circuit board according to claim 1, wherein the clogging portion is provided at a position closer to one surface of the insulating substrate on which the lands are formed than the other surface of the insulating substrate.
JP9192860A 1997-07-17 1997-07-17 Printed board Withdrawn JPH1140911A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP9192860A JPH1140911A (en) 1997-07-17 1997-07-17 Printed board
DE19832052A DE19832052A1 (en) 1997-07-17 1998-07-16 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9192860A JPH1140911A (en) 1997-07-17 1997-07-17 Printed board

Publications (1)

Publication Number Publication Date
JPH1140911A true JPH1140911A (en) 1999-02-12

Family

ID=16298183

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9192860A Withdrawn JPH1140911A (en) 1997-07-17 1997-07-17 Printed board

Country Status (2)

Country Link
JP (1) JPH1140911A (en)
DE (1) DE19832052A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ATE446667T1 (en) * 2001-09-07 2009-11-15 Medtronic Minimed Inc METHOD FOR PRODUCING A SUBSTRATE
US7323142B2 (en) 2001-09-07 2008-01-29 Medtronic Minimed, Inc. Sensor substrate and method of fabricating same

Also Published As

Publication number Publication date
DE19832052A1 (en) 1999-02-11

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