JP2528436B2 - Manufacturing method of circuit board device - Google Patents

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a circuit board device having a crossover wiring conductor such as a hybrid integrated circuit.

[0002]

BACKGROUND OF THE INVENTION In the manufacture of hybrid integrated circuits, the electronic components used (eg, ICs) are replaced by those having substantially the same electrical characteristics but somewhat different dimensions. Often things have to be done. in this case,
If the pattern of the component mounting land of the circuit board is changed according to the electronic component, the cost of the hybrid integrated circuit is inevitably high.

In order to solve this problem, it is conceivable that a component mounting land is provided in advance so as to be suitable for a plurality of types of electronic components. However, if the component mounting land is formed in a large area, the amount of cream solder (paste solder) applied here will also increase, and during reflow soldering, the solder will flow out from the component mounting land, causing a short circuit between the terminals. Or, the lead terminals of the electronic component may be displaced. In order to solve this kind of problem, it is necessary to divide the component mounting land with a solder resist so as to be compatible with a plurality of types of electronic components (ICs).
It is disclosed in Japanese Patent No. 96376.

[0004]

By the way, when the land is divided by the solder resist, a step for dividing is required, and the cost of the circuit board device is inevitably high. Also,
In the case of dividing with a solder resist, the height of this divided region was not so high, and the flow of solder could not be sufficiently blocked.

SUMMARY OF THE INVENTION An object of the present invention is to provide a method of manufacturing a circuit board device having a dam for preventing solder flow on a land.

[0006]

SUMMARY OF THE INVENTION To achieve the above object, the present invention provides a method for manufacturing a circuit board device having a crossover wiring conductor, in which a component is mounted on a surface of the circuit board by soldering an electronic component. The process of providing the land for wiring and providing the wiring conductor, and printing the glass paste
Then, by firing, a crossover glass layer is provided on at least a portion of the wiring conductor where the crossover wiring conductor is provided, and at the same time, the same component as the crossover glass layer is formed so as to divide the component mounting land into a plurality of parts. The step of providing a solder flow prevention dam made of glass and the crossover on the crossover glass layer.
The present invention relates to a method for manufacturing a circuit board device, which comprises a step of providing a wiring conductor . Also, the claims
As shown in Fig. 2, at the same time as providing the thick film resistance,
A solder flow blocking dam of one material according to claim 1.
It is advisable to install it on top of the dam.

[0007]

In the invention of each claim, the solder flow preventing dam for dividing the land is formed at the same time when the crossover glass layer of the crossover wiring portion is formed.
Therefore, an independent process for dividing the land becomes unnecessary, and the cost of the circuit board device can be reduced. Also,
Since the solder flow blocking dam is formed of the same glass as the crossover glass layer, it can be formed thicker than the solder resist, and a high solder flow blocking dam can be easily obtained. According to the invention of claim 2,
The height of the solder flow prevention dam can be easily increased.
become.

[0008]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, a method of manufacturing a hybrid integrated circuit board device according to an embodiment of the present invention will be described with reference to FIGS.
First, as shown in FIG. 1, a wiring conductor 2, a component mounting land 3 on one side and a component mounting land 4 on the other side are provided on a circuit board 1 made of an alumina porcelain substrate. The component mounting land 3 on one side and the component mounting land 4 on the other side are arranged so as to correspond to the lead terminals of an electronic component such as an IC. The component mounting land 3 on one side is formed so as to be commonly used by a plurality of types of electronic components.
The component mounting land 4 on the other side is formed to be long so as to be compatible with a plurality of types of electronic components.

Next, as shown in FIG. 2, the crossover glass layer 5 is formed on the wiring conductor 2, and at the same time, the component mounting lands 4 on the other side are divided so that they are the same as the crossover glass layer 5. The first solder flow preventing dam 5a made of the above glass material is formed into a strip shape. The crossover glass layer 5 and the first solder flow prevention dam 5a
Is formed by printing glass paste by a known method and firing. Since the first solder flow prevention dam 5a is formed in the same step as the crossover glass layer 5, the cost can be reduced.

Next, the crossover wiring conductor 2a is formed on the crossover glass layer 5.

Next, as indicated by hatching, a resistor paste is printed and fired to form a thick film resistor layer 6 and a second solder flow preventing dam composed of the same thick film resistor. 6a is formed. Second solder flow prevention dam 6a
Is arranged on the first solder flow preventing dam 5a made of crossover glass so as to divide the component mounting land 4 on the other side into two in the longitudinal direction. As a result, the solder flow blocking dam 7 including the first solder flow blocking dam 5a made of crossover glass and the second solder flow blocking dam 6a made of a thick film resistor is obtained, and the lead land 4 is First land portion 4a and second land portion 4
It is divided into b. The first solder flow blocking dam 5a made of crossover glass has a thickness of about 20 μm, and the second solder flow blocking dam 6a made of a thick film resistor has a thickness of about 1 μm.
Since it has a thickness of 3 μm, the height of the solder flow prevention dam 7 in the land division region is about 33 μm in total.
When the crossover glass layer 5 is formed in two layers, the height of the first solder flow preventing dam 5a is further increased.
It becomes 3 μm.

Next, as shown in FIGS. 3 and 4, the component mounting land 3 on one side and the first and second land portions 4a and 4b on the other side, lead lands (not shown), etc. The overcoat glass layer 8 is formed in the area excluding. The circuit board device manufactured by the above process has the narrow first electronic component 9a shown in FIG. 4 and the wide electronic component 9 shown in FIG.
Compatible with both b and.

3 and 4 show a state in which a narrow first electronic component 9a composed of an SOP type package IC is mounted. The electronic component 9 a has a plurality of lead terminals 11 and 12 which are symmetrically led out from the flat plate-shaped main body 10.
The lead terminal 11 on one side is fixed to the component mounting land 3 on one side with solder 13 and the lead terminal 1 on the other side.
2 is fixed to the first land 4a with solder 13. Soldering of the lead terminals 11 and 12 on one side and the other side is
The solder paste (solder paste) is printed on the lands 3 and 4a, and the solder paste is reflowed. The first land portion 4a for the lead terminal 12 is the land 4
Is a portion divided by the solder flow prevention dam 7, so the amount of solder in the first land portion 4a is relatively small. Therefore, the short circuit between the lead terminals 12 and the solder 1
It is possible to prevent the positional deviation of the lead terminal 12 due to the bias of 3.

The first solder flow blocking dam 5 made of crossover glass in the solder flow blocking dam 7 is used.
Since a can be formed thicker than the overcoat glass layer 8, it has a substantially sufficient function of preventing solder flow. In this embodiment, since the second solder flow preventing dam 6a made of a thick film resistor is also provided, the solder flow can be prevented more reliably. Since the second solder flow preventing dam 6a is formed simultaneously with the formation of the thick film resistor layer 6,
By providing this, there is almost no increase in cost.

When mounting the wide second electronic component 9b, as shown in FIG. 5, one lead terminal 11 is fixed to the common land 3 with the solder 13, and the other lead terminal 12 is the second. It is fixed to the land portion 4a with the solder 13. Mutual spacing (pitch) between the lead terminals 11 and 12 of the second electronic component 9b
Is almost the same as the first electronic component 8a or is an integral multiple,
The width is larger than that of the first electronic component 9a.

Even when the second electronic component 9b is reflow-soldered, a short circuit between the lead terminals 12 due to the solder 13 and a displacement of the lead terminals 12 are prevented by the action of the solder flow preventing dam 7. .

[0017]

[Modifications] The present invention is not limited to the above-described embodiment, and for example, the following modifications are possible. (1) The component mounting land 3 on one side is also the lead terminal 1
It may be formed to be long in the extending direction of 1, and the same as the solder flow preventing dam 7 may be provided here. (2) As shown by the broken line in FIG. 5, the solder flow prevention dam 7
The overcoat glass layer 8 may be provided on the second solder flow preventing dam 6a made of the thick film resistor. Also,
The second solder flow blocking dam 6a may be omitted and only the first solder flow blocking dam 5a made of a single layer or a plurality of layers of crossover glass may be used. Further, by combining the first solder flow prevention dam 5a made of crossover glass and the overcoat glass layer 8, the solder flow prevention dam 7 is formed.
May be formed. (3) The circuit board 1 can be replaced with various substrates other than the alumina substrate.

[Brief description of drawings]

FIG. 1 is a plan view showing a circuit board according to an embodiment of the present invention in which lands are formed as wiring conductors.

FIG. 2 is a plan view showing a structure in which a crossover glass layer, a solder flow preventing dam, a thick film resistor layer, and a crossover wiring conductor are formed on the circuit board of FIG.

3 is a plan view showing a circuit board of FIG. 2 on which an overcoat glass layer is formed and electronic parts are arranged.

4 is a cross-sectional view taken along the line AA of FIG.

5 is a cross-sectional view showing what mounts a second electronic component instead of the first electronic component of FIG.

[Explanation of symbols]

 2 wiring conductor 4 land 5 crossover glass layer 5a first dam for preventing solder flow

Claims (2)

(57) [Claims] 1. A method of manufacturing a circuit board device having a crossover wiring conductor, the step of providing a component mounting land for mounting an electronic component by soldering on a surface of a circuit board and providing a wiring conductor, and a glass paste. The same as the crossover glass layer so as to form a crossover glass layer on at least a portion of the wiring conductor where the crossover wiring conductor is provided by printing and firing and at the same time divide the component mounting land into a plurality of parts. The step of providing the solder flow prevention dam made of the above glass, and the crossover wiring on the crossover glass layer.
And a step of providing a conductor, the method for manufacturing a circuit board device. 2. A crossover wiring conductor and a thick film resistor
In the method of manufacturing a circuit board device having, Solder electronic components on the surface of the circuit board
For providing component mounting lands and wiring conductors for
When, Reduced by printing glass paste and baking
With the crossover wiring conductor of the wiring conductor
A crossover glass layer is provided on the
The black part is divided into a plurality of parts mounting lands.
First solder made of the same glass as the soverglass layer
Providing a flow blocking dam, Print the resistance paste on the surface of the circuit board and fire it.
By providing the thick film resistor by simultaneously
In front of a second solder flow blocking dam made of the same material as the resistor
And a step of providing it on the first solder flow prevention dam.
A method of manufacturing a circuit board device, comprising: