JPH03257990A - Mounting method for hybrid integrated circuit board - Google Patents
Mounting method for hybrid integrated circuit boardInfo
- Publication number
- JPH03257990A JPH03257990A JP5761390A JP5761390A JPH03257990A JP H03257990 A JPH03257990 A JP H03257990A JP 5761390 A JP5761390 A JP 5761390A JP 5761390 A JP5761390 A JP 5761390A JP H03257990 A JPH03257990 A JP H03257990A
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- hybrid integrated
- circuit board
- auxiliary
- main
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims description 14
- 238000003780 insertion Methods 0.000 claims description 15
- 230000037431 insertion Effects 0.000 claims description 15
- 229910000679 solder Inorganic materials 0.000 abstract description 9
- 238000005476 soldering Methods 0.000 abstract description 9
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 5
- 239000000463 material Substances 0.000 abstract description 5
- 239000011295 pitch Substances 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
この発明は、混成集積回路を主混成集積回路基板と補助
混成集積回路基板とに機能分割して、該補助混成集積回
路基板を主混成集積回路基板に実装する混成集積回路基
板の実装方法に関し、さらに詳細には、混成集積回路の
実装密度を高めるとともに小型薄型化に形成することを
可能とする混成集積回路基板の実装方法に関するもので
ある。Detailed Description of the Invention (Industrial Field of Application) This invention divides the functions of a hybrid integrated circuit into a main hybrid integrated circuit board and an auxiliary hybrid integrated circuit board, and the auxiliary hybrid integrated circuit board is used as a main hybrid integrated circuit board. The present invention relates to a method for mounting a hybrid integrated circuit board on a circuit board, and more specifically, to a method for mounting a hybrid integrated circuit board that increases the mounting density of the hybrid integrated circuit and enables the formation of a smaller and thinner hybrid integrated circuit. .
（従来の技術）
電子機器の高機能化にともない混成集積回路に実装され
る電子部品が増大するとともに、高密度実装の要求に対
応するために、混成集積回路化される電子回路を複数の
機能ブロックに分割して、主混成集積回路基板と補助混
成集積回路基板として、該補助混成集積回路基板を主混
成集積回路基板に実装する混成集積回路基板の実装方法
が頻繁に行われている。(Prior art) As the functionality of electronic equipment increases, the number of electronic components mounted on hybrid integrated circuits increases.In order to meet the demand for high-density packaging, electronic circuits that are integrated into hybrid integrated circuits are designed to have multiple functions. A method of mounting a hybrid integrated circuit board is frequently used in which the main hybrid integrated circuit board is divided into blocks and the auxiliary hybrid integrated circuit board is mounted on the main hybrid integrated circuit board.
従来の補助混成集積回路基板を主混成集積回路基板に実
装する方法を、第三図を参照しながら説明する。A method of mounting a conventional auxiliary hybrid integrated circuit board on a main hybrid integrated circuit board will be described with reference to FIG.
アルミナ等の材質を有する主混成集積回路基板１の上面
には、受動及び能動素子等の第一の電子部品が実装され
ている。First electronic components such as passive and active elements are mounted on the upper surface of the main hybrid integrated circuit board 1 made of a material such as alumina.
また、主混成集積回路基板ｌには、同一のピッチを有し
てスルーホール等の貫通孔５が貫通形成されている。Further, through holes 5 such as through holes are formed through the main hybrid integrated circuit board l with the same pitch.
貫通孔５の下面には、該貫通孔５を囲繞するように第一
の電極ランド６が形成されている。A first electrode land 6 is formed on the lower surface of the through hole 5 so as to surround the through hole 5 .
一方、同じくアルミナ等の材質を有する補助混成集積回
路基板２の主面には、第二の電子部品４が実装されてい
る。On the other hand, a second electronic component 4 is mounted on the main surface of the auxiliary hybrid integrated circuit board 2, which is also made of a material such as alumina.
さらに、補助混成集積回路基板２の主面であって下方辺
縁部には、前記貫通孔５と同一のピッチを有して第二の
電極ランド９が形成されるとともに、該第二の電極ラン
ド９より導体パターン１１が導出形成されている。Furthermore, second electrode lands 9 are formed on the lower edge of the main surface of the auxiliary hybrid integrated circuit board 2 with the same pitch as the through holes 5, and second electrode lands 9 are formed on the lower edge of the main surface of the auxiliary hybrid integrated circuit board 2. A conductive pattern 11 is formed extending from the land 9.
第二の電極ランド９には、例えばＹ型であって幅広部８
ａを有するフレームリード８が装着されて、第二の半田
１０により半田固定されている。The second electrode land 9 has a Y-shaped wide portion 8, for example.
A frame lead 8 having a diameter a is attached and fixed by soldering with second solder 10.
フレームリード８が半田搭載された補助混成集積回路基
板２は、主混成集積回路基板１に貫通形成された貫通孔
５にフレームリード８の幅広部８ａが該貫通孔５に当接
するまで挿通されて搭載される。The auxiliary hybrid integrated circuit board 2 on which the frame leads 8 are soldered is inserted into the through-hole 5 formed through the main hybrid integrated circuit board 1 until the wide part 8a of the frame lead 8 comes into contact with the through-hole 5. It will be installed.
しかる後、フレームリード８と第一の電極ランド６とが
、第一の半田７により半田付され、フレームリード８の
不要部が切断除去されて、主混成集積回路基板ｌに補助
混成集積回路基板２が実装されている。Thereafter, the frame lead 8 and the first electrode land 6 are soldered with the first solder 7, unnecessary parts of the frame lead 8 are cut and removed, and the auxiliary hybrid integrated circuit board is attached to the main hybrid integrated circuit board l. 2 has been implemented.
上記のようにして、シングルインライン型の補助混成集
積回路基板２が主混成集積回路基板ｌに実装された混成
集積回路１５が形成されている。As described above, a hybrid integrated circuit 15 is formed in which a single in-line type auxiliary hybrid integrated circuit board 2 is mounted on a main hybrid integrated circuit board l.
（発明が解決しようとする課題）
しかしながら、上記従来の混成集積回路の実装方法によ
れば、補助混成集積回路基板にフレームリードを半田搭
載して、該フレームリードを主混成集積回路基板に貫通
形成された貫通孔に挿通するとともに半田付して補助混
成集積回路基板を主混成集積回路基板に実装しているた
め、実装高さが、フレームリードが有する幅広部の高さ
だけ増加してしまい、混成集積回路の小型薄型化に対応
することができないという問題点があった。(Problems to be Solved by the Invention) However, according to the conventional hybrid integrated circuit mounting method described above, frame leads are mounted on the auxiliary hybrid integrated circuit board by soldering, and the frame leads are formed through the main hybrid integrated circuit board. Since the auxiliary hybrid integrated circuit board is mounted on the main hybrid integrated circuit board by inserting it into the through hole and soldering it, the mounting height increases by the height of the wide part of the frame lead. There was a problem in that it could not cope with the miniaturization and thinning of hybrid integrated circuits.
また、補助混成集積回路基板の第二の電極ランドにフレ
ームリードを装着するとともに半田固定する必要がある
ため組立作業が複雑になり、しかもフレームリードの部
品コストを必要とするという問題点があった。In addition, it is necessary to attach and solder the frame lead to the second electrode land of the auxiliary hybrid integrated circuit board, which complicates the assembly work and also increases the component cost of the frame lead. .
さらに、主混成集積回路基板の貫通孔にフレームリード
を挿通して、フレームリードと第一の電極ランドとを半
田付する際に、フレームリードと第二の電極ランドとを
半田固定している第二の半田が、加熱されて溶融する恐
れがあるという問題点があった。Furthermore, when inserting the frame lead into the through hole of the main hybrid integrated circuit board and soldering the frame lead and the first electrode land, a second electrode land, which is fixed to the frame lead and the second electrode land by soldering, There is a problem that the second solder may be heated and melted.
本発明は、上記事情に鑑みてなされたものであり、補助
混成集積回路基板の実装高さを、該補助混成集積回路基
板の高さのみに限定するとともに、補助混成集積回路基
板を主混成集積回路基板に実装する際に、フレームリー
ドを不要として、組立実装を簡単容易ならしめ、しかも
部品コストの低減に寄与する混成集積回路の実装方法を
提供するものである。The present invention has been made in view of the above circumstances, and it limits the mounting height of the auxiliary hybrid integrated circuit board to only the height of the auxiliary hybrid integrated circuit board, and also mounts the auxiliary hybrid integrated circuit board to the main hybrid integrated circuit board. The present invention provides a method for mounting a hybrid integrated circuit, which eliminates the need for frame leads when mounting on a circuit board, simplifies assembly and mounting, and contributes to a reduction in component costs.
（課題を解決するための手段）
上記目的を達成するために、この発明は、電子部品が実
装された補助混成集積回路基板を主混成集積回路基板に
実装する混成集積回路基板の実装方法において、前記補
助混成集積回路基板の一方に少なくとも一つの突出部を
突出成型するとともに、該突出部が挿通される少なくと
も一つの挿通孔を主混成集積回路基板に貫通成型して、
該突出部を挿通孔に挿通して半田付を行うことにより、
前記補助混成集積回路基板を主混成集積回路基板に実装
するものである。(Means for Solving the Problems) In order to achieve the above object, the present invention provides a method for mounting a hybrid integrated circuit board in which an auxiliary hybrid integrated circuit board on which electronic components are mounted is mounted on a main hybrid integrated circuit board. At least one protrusion is protrusively molded on one side of the auxiliary hybrid integrated circuit board, and at least one insertion hole through which the protrusion is inserted is formed through the main hybrid integrated circuit board,
By inserting the protrusion into the insertion hole and soldering,
The auxiliary hybrid integrated circuit board is mounted on the main hybrid integrated circuit board.
（作用）
本発明においては、電子部品が実装された補助混成集積
回路基板に少なくとも一つの突出部が成型加工されると
ともに、主混成集積回路基板に少なくとも一つの挿通孔
が成型加工されて、該突出部を挿通孔に挿通して、該突
出部に形成された突山部電極と挿通孔を囲繞するように
形成された挿通孔電極とを半田付することにより、補助
混成集積回路基板を主混成集積回路基板に実装すること
ができるため、フレームリードが不要であり、且つ実装
高さを補助混成集積回路基板高さに限定することができ
る。(Function) In the present invention, at least one protrusion is molded on the auxiliary hybrid integrated circuit board on which electronic components are mounted, and at least one insertion hole is molded on the main hybrid integrated circuit board. By inserting the protruding part into the insertion hole and soldering the protruding part electrode formed on the protruding part and the insertion hole electrode formed so as to surround the insertion hole, the auxiliary hybrid integrated circuit board is connected to the main part. Since it can be mounted on a hybrid integrated circuit board, frame leads are not required and the mounting height can be limited to the height of the auxiliary hybrid integrated circuit board.
（実施例） 本発明の実施例を、図面に基いて詳細に説明する。(Example) Embodiments of the present invention will be described in detail based on the drawings.
第一図は本発明に係わる混成集積回路の実装方法の実施
例を示す斜視図、第二図は本実施例における補助混成集
積回路基板を主混成集積回路基板に実装する状態を示す
斜視図が示されている。Figure 1 is a perspective view showing an embodiment of the hybrid integrated circuit mounting method according to the present invention, and Figure 2 is a perspective view showing the state in which the auxiliary hybrid integrated circuit board in this embodiment is mounted on the main hybrid integrated circuit board. It is shown.
第二図に示すように、アルミナ等の材質を有する主混成
集積回路基板２１には、同一のピッチを有して挿通孔２
５が貫通成型されている。As shown in FIG.
5 is through-molded.
挿通孔２５の上下外周辺部には、各々第一の表電極ラン
ド３３と第一の裏電極ランド２６とが形成されている。A first front electrode land 33 and a first back electrode land 26 are formed at the upper and lower outer peripheries of the insertion hole 25, respectively.
また、主混成集積回路基板２１には、第一の表電極ラン
ド３３と交互して第一の表電極ランド３６が形成されて
いる。Furthermore, first front electrode lands 36 are formed on the main hybrid integrated circuit board 21, alternating with first front electrode lands 33.
第一の表電極ランド３３と第一の裏電極ランド２６と第
一の表電極ランド３６とからは、各々第一の表扉体パタ
ーン３５と第一の表扉体パターン２８とが導出形成され
ている。A first front door pattern 35 and a first front door pattern 28 are derived from the first front electrode land 33, first back electrode land 26, and first front electrode land 36, respectively. ing.
第一の表扉体パターン３５は、図示しない電子部品搭載
ランドに接続されるととちに、該部品搭載ランドには、
受動及び能動素子等の第一の電子部品２３が実装されて
いる。The first front door body pattern 35 is connected to an electronic component mounting land (not shown), and the component mounting land includes:
First electronic components 23 such as passive and active elements are mounted.
一方、同じくアルミナ等の材質を有する補助混成集積回
路基板２２は、前記挿通孔２５のピッチに対応して、主
混成集積回路基板２１の板厚より長尺なる突出部３０が
突出形成されている。On the other hand, the auxiliary hybrid integrated circuit board 22, which is also made of a material such as alumina, is formed with protruding parts 30 that are longer than the board thickness of the main hybrid integrated circuit board 21, corresponding to the pitch of the insertion holes 25. .
該突出部３０の表裏面には、第二の突出部電極ランド３
１が形成されている。A second protrusion electrode land 3 is provided on the front and back surfaces of the protrusion 30.
1 is formed.
また、第二の突出部電極ランド３１と交互して、前記第
一の表電極ランド３６のピッチに対応して第二の電極ラ
ンド３２が形成されている。Further, second electrode lands 32 are formed alternately with the second protrusion electrode lands 31 and corresponding to the pitch of the first surface electrode lands 36 .
第二の突出部電極ランド３１及び第二の電極ランド３２
からは、第二の導体パターン２９が導出されるとともに
、図示しない部品搭載ランドに接続されている。Second protrusion electrode land 31 and second electrode land 32
A second conductor pattern 29 is led out from there, and is connected to a component mounting land (not shown).
該部品搭載ランドには、受動及び能動素子等の第二の電
子部品２４が実装されている。Second electronic components 24 such as passive and active elements are mounted on the component mounting land.
前記補助混成集積回路基板２２は、図の矢印の向きに突
出部３０が挿通孔２５に、補助混成集積回路基板２２の
底面が主混成集積回路基板２１の上面に当接するように
挿通されることにより、主混成集積回路基板２１に搭載
される。The auxiliary hybrid integrated circuit board 22 is inserted into the insertion hole 25 so that the protrusion 30 is in the direction of the arrow in the figure, and the bottom surface of the auxiliary hybrid integrated circuit board 22 is in contact with the top surface of the main hybrid integrated circuit board 21. Thus, it is mounted on the main hybrid integrated circuit board 21.
しかる後、第一図に示すように、主混成集積回路基板２
１の裏面に突出した突出部３０の先端部に形成されてい
る第二の突出部電極ランド３１と第一の裏電極ランド２
６とが第一の裏半田２７により半田付される。After that, as shown in Figure 1, the main hybrid integrated circuit board 2
The second protrusion electrode land 31 and the first back electrode land 2 formed at the tip of the protrusion 30 protruding from the back surface of the
6 are soldered using the first back solder 27.
また、補助混成集積回路基板２２の第二の電極ランド３
２は、主混成集積回路基板２１上面に形成されている第
一の表電極ランド３６に第一の表半田３４により半田付
される。In addition, the second electrode land 3 of the auxiliary hybrid integrated circuit board 22
2 is soldered to a first front electrode land 36 formed on the upper surface of the main hybrid integrated circuit board 21 using a first front solder 34 .
上記のようにして、シングルインライン型の補助混成集
積回路基板２２が主混成集積回路基板２１に実装されて
、電気的に接続された混成集積回路４０が形成されてい
る。As described above, the single in-line auxiliary hybrid integrated circuit board 22 is mounted on the main hybrid integrated circuit board 21 to form an electrically connected hybrid integrated circuit 40.
本実施例における混成集積回路の実装方法によれば、補
助混成集積回路基板２２を主混成集積回路基板２１に実
装する際に、フレームリードを使用する必要がなくなる
とともに、実装高さを補助混成集積回路基板２２の高さ
に限定することができる。According to the method for mounting a hybrid integrated circuit in this embodiment, when mounting the auxiliary hybrid integrated circuit board 22 on the main hybrid integrated circuit board 21, there is no need to use frame leads, and the mounting height can be adjusted to accommodate the auxiliary hybrid integrated circuit board 21. It can be limited to the height of the circuit board 22.
なお、主混成集積回路基板２１に貫通成型された挿通孔
２５は、内壁面に導体を形成したスールーホールとする
必要はなく、突出部３０に形成された第二の突出部電極
ランド３１を、主混成集積回路基板２１の上下面に形成
された第一の表電極ランド３３と第一の裏電極ランド２
６とに半田付することにより、主混成集積回路基板２１
の上下面を電気的に接続することができる。Note that the insertion hole 25 formed through the main hybrid integrated circuit board 21 does not need to be a through hole with a conductor formed on the inner wall surface, and the second protrusion electrode land 31 formed on the protrusion 30 can be A first front electrode land 33 and a first back electrode land 2 formed on the upper and lower surfaces of the main hybrid integrated circuit board 21
By soldering to 6, the main hybrid integrated circuit board 21
The upper and lower surfaces of the can be electrically connected.
（発明の効果）
本発明に係わる混成集積回路の実装方法は、上記のよう
に構成されているため、以下に記載するような効果を有
する。(Effects of the Invention) Since the hybrid integrated circuit mounting method according to the present invention is configured as described above, it has the following effects.
（Ａ）補助混成集積回路基板に突出部を突出成型すると
ともに、主混成集積回路基板に挿通孔を貫通成型して、
該突出部を挿通孔に挿通し、半田固定することにより補
助混成集積回路基板が主混成集積回路基板に実装されて
いるため、フレームリードが不要となり、該フレームリ
ードに要していた部品コストを削除することができると
いう優れた効果を有する。(A) Molding a protruding part on the auxiliary hybrid integrated circuit board, and molding an insertion hole through the main hybrid integrated circuit board,
The auxiliary hybrid integrated circuit board is mounted on the main hybrid integrated circuit board by inserting the protrusion into the insertion hole and fixing it with solder. This eliminates the need for frame leads, reducing component costs required for frame leads. It has the excellent effect of being able to be deleted.
（Ｂ）また、補助混成集積回路基板にフレームリードを
装着するとともに半田固定する必要がなくなるため、混
成集積回路の組立作業を簡単容易ならしめ、従って組立
作業に要する組立費用を削減することができるという優
れた効果を有する。(B) Furthermore, since it is not necessary to attach frame leads to the auxiliary hybrid integrated circuit board and to fix them with solder, the assembly work of the hybrid integrated circuit can be simplified and the assembly cost required for the assembly work can be reduced. It has this excellent effect.
（Ｃ）さらに、補助混成集積回路基板を主混成集積回路
基板に実装する際に、補助混成集積回路基板の底面を主
混成集積回路基板の主面に当接して実装することができ
るため、混成集積回路の部品高さを補助混成集積回路基
板の高さに限定することができ、混成集積回路を小型薄
型化に形成することができるという優れた効果を有する
。(C) Furthermore, when mounting the auxiliary hybrid integrated circuit board on the main hybrid integrated circuit board, it is possible to mount the auxiliary hybrid integrated circuit board with the bottom surface in contact with the main surface of the main hybrid integrated circuit board. This has the excellent effect that the height of the integrated circuit components can be limited to the height of the auxiliary hybrid integrated circuit board, and the hybrid integrated circuit can be made smaller and thinner.
第一図は本発明に係わる混成集積回路の実装方法の実施
例を示す斜視図、
第二図は本実施例における補助混成集積回路基板を主混
成集積回路基板に実装する状態を示す斜視図、
第三図は従来の混成集積回路の実装状態を示す側面図で
ある。
２１ ・
２２ ・
２５ ・
３０ ・
３１ ・
３２ ・
主混成集積回路基板、
補助混成集積回路基板、
挿通孔、
突出部、
第二の突出部電極ランド、
第二の電極ランド、
４０・・・混成集積回路。
第 ］ＩＮFig. 1 is a perspective view showing an embodiment of the hybrid integrated circuit mounting method according to the present invention; Fig. 2 is a perspective view showing a state in which the auxiliary hybrid integrated circuit board in this embodiment is mounted on the main hybrid integrated circuit board; FIG. 3 is a side view showing the mounting state of a conventional hybrid integrated circuit. 21 ・ 22 ・ 25 ・ 30 ・ 31 ・ 32 ・ Main hybrid integrated circuit board, auxiliary hybrid integrated circuit board, insertion hole, protrusion, second protrusion electrode land, second electrode land, 40... hybrid integration circuit. ]IN
Claims (1)
混成集積回路基板に実装する混成集積回路基板の実装方
法において、前記補助混成集積回路基板の一方に少なく
とも一つの突出部を突出成型するとともに、該突出部が
挿通される少なくとも一つの挿通孔を主混成集積回路基
板に貫通成型して、該突出部を挿通孔に挿通して半田付
を行うことにより、前記補助混成集積回路基板を主混成
集積回路基板に実装することを特徴とする混成集積回路
基板の実装方法。(1) In a method for mounting a hybrid integrated circuit board in which an auxiliary hybrid integrated circuit board on which electronic components are mounted is mounted on a main hybrid integrated circuit board, at least one protrusion is molded to protrude on one side of the auxiliary hybrid integrated circuit board. At the same time, at least one insertion hole through which the protrusion is inserted is formed in the main hybrid integrated circuit board, and the protrusion is inserted into the insertion hole and soldered, thereby forming the auxiliary hybrid integrated circuit board. A method for mounting a hybrid integrated circuit board, characterized by mounting on a main hybrid integrated circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5761390A JPH03257990A (en) | 1990-03-08 | 1990-03-08 | Mounting method for hybrid integrated circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5761390A JPH03257990A (en) | 1990-03-08 | 1990-03-08 | Mounting method for hybrid integrated circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03257990A true JPH03257990A (en) | 1991-11-18 |
Family
ID=13060720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5761390A Pending JPH03257990A (en) | 1990-03-08 | 1990-03-08 | Mounting method for hybrid integrated circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03257990A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5387816A (en) * | 1992-04-11 | 1995-02-07 | Nippondenso Co., Ltd. | Hybrid integrated circuit device |
| US5747858A (en) * | 1996-09-30 | 1998-05-05 | Motorola, Inc. | Electronic component having an interconnect substrate adjacent to a side surface of a device substrate |
| US5860210A (en) * | 1996-09-30 | 1999-01-19 | Motorola, Inc. | Method of manufacturing an electronic component |
| US8545199B2 (en) | 2005-07-29 | 2013-10-01 | Miba Sinter Holding Gmbh & Co Kg | Regulatable vane-cell pump with a sealing web curving in an arc |
-
1990
- 1990-03-08 JP JP5761390A patent/JPH03257990A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5387816A (en) * | 1992-04-11 | 1995-02-07 | Nippondenso Co., Ltd. | Hybrid integrated circuit device |
| US5747858A (en) * | 1996-09-30 | 1998-05-05 | Motorola, Inc. | Electronic component having an interconnect substrate adjacent to a side surface of a device substrate |
| US5860210A (en) * | 1996-09-30 | 1999-01-19 | Motorola, Inc. | Method of manufacturing an electronic component |
| US8545199B2 (en) | 2005-07-29 | 2013-10-01 | Miba Sinter Holding Gmbh & Co Kg | Regulatable vane-cell pump with a sealing web curving in an arc |
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