JPH05226803A - Mounting circuit board - Google Patents

Mounting circuit board

Info

Publication number
JPH05226803A
JPH05226803A JP2345592A JP2345592A JPH05226803A JP H05226803 A JPH05226803 A JP H05226803A JP 2345592 A JP2345592 A JP 2345592A JP 2345592 A JP2345592 A JP 2345592A JP H05226803 A JPH05226803 A JP H05226803A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
circuit board
semiconductor device
mounting
hole
printed board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2345592A
Other languages
Japanese (ja)
Inventor
Teruyoshi Baba
照義 馬場
Original Assignee
Matsushita Electric Works Ltd
松下電工株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/182Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. IMC (insert mounted components)
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Abstract

PURPOSE: To reduce the thickness of a mounting circuit board while a conventional mounted component is used as it is by a method wherein a hole is provided in a printed board and the mounted component is fitted to the hole so as to have the lead terminals of the components brought into contact with the surfaces of a wiring pattern formed on the printed board.
CONSTITUTION: A hole 4 which can accomodate a semiconductor device 1 composed of a semiconductor chip which is sealed in a flat package is drilled at the semiconductor device mounting position of a printed board 2 and the semiconductor device 1 is fitted to the hole 4 so as to have the bottom of the device 1 face the surface side of the printed board 2. Further, the tips of a plurality of lead terminals 3 are brought into contact with the surfaces of a wiring pattern 5 formed on the printed board 2 surface and connected to them with solder, for instance. With this constitution, the thickness of the mounting board can be reduced.
COPYRIGHT: (C)1993,JPO&Japio

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、半導体装置等の実装部品をプリント基板の一部に実装して構成される実装回路基板に関するものである。 The present invention relates to relates to a mounting circuit board constructed by mounting a mounting component such as a semiconductor device on a part of the printed circuit board.

【0002】 [0002]

【従来の技術】図4は実装回路基板の従来例を示す断面図である。 BACKGROUND OF THE INVENTION FIG. 4 is a sectional view showing a conventional example of a mounted circuit board.

【0003】例えば、フラットパッケージ内に半導体素子を封止して構成した半導体装置21をプリント基板2 For example, the semiconductor device 21 to the printed circuit board 2 constituted by sealing a semiconductor element in a flat package
2の一部に実装して実装回路基板を構成する場合、従来は、半導体装置21の底面が、プリント基板22における配線パターン25が敷設されている側の面と対面するよう該半導体装置21をプリント基板22上に載置し、 If implemented in part of 2 constitutes a mounting circuit board, conventionally, the bottom surface of the semiconductor device 21, the semiconductor device 21 so as to face the surface on which the wiring pattern 25 in the printed circuit board 22 is laid mounted on the printed circuit board 22,
該半導体装置21から突出した複数のリード端子23の先端部を、前記配線パターン25の面に半田付け接続していた。 The distal end portion of the plurality of lead terminals 23 projecting from the semiconductor device 21, has been soldered connection to a surface of the wiring pattern 25. その他のリード端子を有する実装部品をプリント基板22の一部に実装して実装回路基板を構成する場合も、前述と同様に、該実装部品をプリント基板22上に載置し、該実装部品から突出したリード端子23を、 It may constitute a mounting circuit board and mounted on a portion of the printed circuit board 22 mounted components having other lead terminal, in the same manner as described above, placing the mounted components on the printed board 22, from the mounting component the lead terminal 23 which projects,
前記配線パターン25の面に半田付け接続していた。 It was soldered connection to a surface of the wiring pattern 25.

【0004】 [0004]

【発明が解決しようとする課題】然しながら、実装回路基板を必要に応じて薄型化しようとする場合、従来の構成においては、前記半導体装置21等の実装部品の厚みが問題となる場合があり、その場合は該実装部品自体を薄型にしない限り、前記実装回路基板の薄型化は望めなかった。 [SUMMARY OF THE INVENTION] However, when trying to thinner depending mounting circuit board as required in the conventional configuration, there is a case where the thickness of the mounting parts such as the semiconductor device 21 becomes a problem, unless that case not the mounted part itself in a thin, thinning of the mounted circuit board was not expected.

【0005】本発明は上記の問題点を改善するために成されたもので、その目的とするところは、薄型化が容易に可能である実装回路基板の構造を提供することにある。 [0005] The present invention has been made to solve the problems described above, and an object is to provide a structure for mounting the circuit board thinner is easily possible.

【0006】 [0006]

【課題を解決するための手段】上記の問題点を解決するため本発明は、プリント基板に穴部を設け、実装部品のリード端子が、前記プリント基板の配線パターンの敷設面に当接するよう該穴部に該実装部品を挿着したことを特徴とするものである。 The present invention for solving the above problems BRIEF SUMMARY OF THE INVENTION may, a hole portion provided on the printed board, the lead terminals of the mounting components, the so abutting the laying surface of the wiring pattern of the printed circuit board it is characterized in that it has inserted the mounting part into the hole.

【0007】 [0007]

【作用】本発明は、半導体装置等の実装部品の一部又は全部がプリント基板に設けた穴部に挿入されており、その挿入した分だけ実装回路基板自体が薄型化される。 DETAILED DESCRIPTION OF THE INVENTION The present invention, some or all of the mounting components such as semiconductor device is inserted into the hole provided in the printed circuit board, the inserted amount corresponding mounting circuit board itself is thin.

【0008】 [0008]

【実施例】以下に本発明を、その実施例を示す図に基づいて説明する。 The present invention to the examples will be described below with reference to FIG showing its embodiments. 尚、本明細書において「穴部」とは、有底のもの及び無底のもの何れをも言う。 In the present specification, "hole portion" refers to any one of those and a bottomless bottomed. 又、本明細書において「当接する」とは、半田等、電気的接続のための媒体手段を間に介している場合をも含む。 Further, in the present specification, "contact" also includes a case where through Hitoshi Handa, the medium means for electrical connection between.

【0009】図1は、本発明に係る第1の実施例を示す断面図である。 [0009] Figure 1 is a sectional view showing a first embodiment of the present invention. 又、図2は、第1の実施例を示す上面図である。 Also, FIG. 2 is a top view showing the first embodiment.

【0010】本発明第1の実施例は図1及び図2に示すように、プリント基板2の半導体装置実装位置に、フラットパッケージ内に半導体素子を封止して構成した半導体装置1を挿入し得る穴部4が穿設されており、従来の実装状態の半導体装置21を裏返した状態、即ち該半導体装置1の底面が前記プリント基板2表面側に向いた状態で該半導体装置1が該穴部4に挿着されている。 [0010] The present invention first embodiment, as shown in FIGS. 1 and 2, the semiconductor device mounting position of the printed circuit board 2, by inserting the semiconductor device 1 configured by sealing a semiconductor element in a flat package holes 4 obtained are bored, state turned over the semiconductor device 21 of the conventional mounting state, i.e., the semiconductor device 1 in a state where the bottom surface of the semiconductor device 1 faces the printed circuit board 2 surface side bore It is inserted into section 4. このとき、前記半導体装置1から突出した複数のリード端子3の先端部が、プリント基板2表面側の該穴部4の縁に掛止されているので、該半導体装置1は該穴部4を通り抜けないようになっている。 At this time, the tip portions of the plurality of lead terminals 3 projecting from the semiconductor device 1, since it is hooked to the edge of the hole portion 4 of printed circuit board second surface side, the semiconductor device 1 is a bore 4 It has been through so as not to. 又、前記複数のリード端子3の先端部夫々は、プリント基板2表面に敷設された配線パターン5の面に対面するよう、例えば半田付けにより接続されており、該半導体装置1は配線パターン5に電気的に接続されている。 Further, the plurality of tip husband of the lead terminals 3 people is to face the surface of the wiring pattern 5 laid on the printed surface of the substrate 2, for example by soldering are connected, the semiconductor device 1 to the wiring pattern 5 It is electrically connected.

【0011】図3は、本発明に係る第2の実施例を示す断面図である。 [0011] Figure 3 is a sectional view showing a second embodiment of the present invention. 本発明第2の実施例は図3に示すように、プリント基板上12の半導体装置11実装位置に、 Second embodiment the present invention is as shown in FIG. 3, the semiconductor device 11 mounting position of the printed circuit board 12,
半導体装置11を挿入し得る穴部14が、該半導体装置11の厚さの略半分程度の深さを以て凹設されており、 Hole 14 capable of inserting a semiconductor device 11, which is recessed with a thickness of approximately half of the depth of the semiconductor device 11,
該半導体装置11が該穴部14に挿着されている。 The semiconductor device 11 is inserted into the hole portion 14. 該半導体装置11は、複数のリード端子13が該半導体装置11の側部から屈曲せずに直線的に突出したタイプのものであり、その実装状態において前記複数のリード端子13が、プリント基板2表面側の該穴部4の縁に当接されている。 The semiconductor device 11 is intended plurality of lead terminals 13 of the type linearly projected without bending from the side of the semiconductor device 11, the plurality of lead terminals 13 in its mounted state, the printed circuit board 2 It is in contact with the edge of the hole portion 4 of the surface side. 該複数のリード端子13の先端部夫々は、プリント基板12表面に敷設された配線パターン15の面に対面するよう、例えば半田付けにより接続されており、該半導体装置11は配線パターン15に電気的に接続されている。 Tip Each of the plurality of lead terminals 13, so as to face the surface of the wiring pattern 15 laid on the printed circuit board 12 surface, for example, soldering may be connected to a, the semiconductor device 11 is electrically the wiring pattern 15 It is connected to the.

【0012】尚、前述の各実施例は、実装部品としてフラットパッケージを有して構成された半導体装置を例に挙げて説明しているが、該実装部品は、前記半導体装置のように、そのリード端子の先端部が配線パターンの面に対面するよう接続されるべきものであれば足りる。 [0012] Incidentally, each of the embodiments described above, has been described by way of example semiconductor device configured with a flat package as the mounting part, the mounting part, as the semiconductor device, the sufficient as long as should the tip of the lead terminals are connected so as to face the surface of the wiring pattern.

【0013】 [0013]

【発明の効果】前述のように本発明の実装回路基板は、 [Effect of the Invention] mounted circuit board of the present invention as described above,
プリント基板に穴部を設け、実装部品のリード端子が、 A hole provided on the printed board, the lead terminals of the mounting component,
前記プリント基板の配線パターンの敷設面に当接するよう該穴部に該実装部品を挿着したことを特徴とするものであり、半導体装置等の実装部品をプリント基板の穴部に挿入するように実装しているため、従来の実装部品をそのまま流用して該実装回路基板を容易に薄型化することが可能である。 Wherein it is characterized in that it has inserted the mounted component to the hole portion so as to abut against the laying surface of the wiring pattern of the printed circuit board, so as to insert a mounting component such as a semiconductor device in the hole of the printed circuit board due to the implementation, it is possible to easily thinned the mounting circuit board by diverting it to conventional mounting components.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明第1の実施例を示す断面図。 [1] The present invention cross-sectional view showing the first embodiment.

【図2】本発明第1の実施例を示す上面図。 [2] The present invention a top view showing the first embodiment.

【図3】本発明第2の実施例を示す断面図。 [3] The present invention cross-sectional view showing a second embodiment.

【図4】従来例を示す断面図。 4 is a cross-sectional view showing a conventional example.

【符号の説明】 DESCRIPTION OF SYMBOLS

1 半導体装置(実装部品) 2 プリント基板 3 リード端子 4 穴部 5 配線パターン 11 半導体装置(実装部品) 12 プリント基板 13 リード端子 14 穴部 15 配線パターン First semiconductor device (mounting component) 2 printed circuit board 3 lead terminal 4 holes 5 wiring pattern 11 semiconductor device (mounting component) 12 PCB 13 lead terminal 14 hole 15 wiring pattern

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 プリント基板に穴部を設け、実装部品のリード端子が、前記プリント基板の配線パターンの敷設面に当接するよう該穴部に該実装部品を挿着したことを特徴とする実装回路基板。 1. A hole portion provided on the printed circuit board, mounting the lead terminal of the mounting component, characterized in that it has inserted the mounted component to the hole portion so as to abut against the laying surface of the wiring pattern of the printed circuit board circuit board.
JP2345592A 1992-02-10 1992-02-10 Mounting circuit board Granted JPH05226803A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2345592A JPH05226803A (en) 1992-02-10 1992-02-10 Mounting circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2345592A JPH05226803A (en) 1992-02-10 1992-02-10 Mounting circuit board

Publications (1)

Publication Number Publication Date
JPH05226803A true true JPH05226803A (en) 1993-09-03

Family

ID=12110982

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2345592A Granted JPH05226803A (en) 1992-02-10 1992-02-10 Mounting circuit board

Country Status (1)

Country Link
JP (1) JPH05226803A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1996041507A1 (en) * 1995-06-07 1996-12-19 The Panda Project Low profile semiconductor die carrier
EP0774888A3 (en) * 1995-11-16 1998-10-07 Matsushita Electric Industrial Co., Ltd Printing wiring board and assembly of the same
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US6307258B1 (en) 1998-12-22 2001-10-23 Silicon Bandwidth, Inc. Open-cavity semiconductor die package
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US20140367846A1 (en) * 2013-06-13 2014-12-18 Mitsubishi Electric Corporation Power semiconductor device
CN104349596A (en) * 2013-08-07 2015-02-11 鸿富锦精密工业(武汉)有限公司 Inductor and printed circuit board with inductor

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US6977432B2 (en) 1994-03-11 2005-12-20 Quantum Leap Packaging, Inc. Prefabricated semiconductor chip carrier
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
US6828511B2 (en) 1994-03-11 2004-12-07 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
WO1996041507A1 (en) * 1995-06-07 1996-12-19 The Panda Project Low profile semiconductor die carrier
US6324067B1 (en) 1995-11-16 2001-11-27 Matsushita Electric Industrial Co., Ltd. Printed wiring board and assembly of the same
EP0774888A3 (en) * 1995-11-16 1998-10-07 Matsushita Electric Industrial Co., Ltd Printing wiring board and assembly of the same
US6475832B2 (en) 1998-12-22 2002-11-05 Silicon Bandwidth, Inc. Open-cavity semiconductor die package
US6709891B2 (en) 1998-12-22 2004-03-23 Silicon Bandwidth Inc. Open-cavity semiconductor die package
US6307258B1 (en) 1998-12-22 2001-10-23 Silicon Bandwidth, Inc. Open-cavity semiconductor die package
US20140367846A1 (en) * 2013-06-13 2014-12-18 Mitsubishi Electric Corporation Power semiconductor device
CN104349596A (en) * 2013-08-07 2015-02-11 鸿富锦精密工业(武汉)有限公司 Inductor and printed circuit board with inductor

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