JPH05218612A - Printed-wiring-board assembly body - Google Patents
Printed-wiring-board assembly bodyInfo
- Publication number
- JPH05218612A JPH05218612A JP1152092A JP1152092A JPH05218612A JP H05218612 A JPH05218612 A JP H05218612A JP 1152092 A JP1152092 A JP 1152092A JP 1152092 A JP1152092 A JP 1152092A JP H05218612 A JPH05218612 A JP H05218612A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- electronic component
- board assembly
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Combinations Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Abstract
Description
【0001】[0001]
【産業上の利用分野】本発明は、プリント配線基板組立
体に関し、特に複数枚のプリント配線基板を支柱部材を
介して立体的に組立られるスタック型のプリント配線基
板組立体に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board assembly, and more particularly to a stack type printed wiring board assembly in which a plurality of printed wiring boards are three-dimensionally assembled via a support member.
【0002】[0002]
【従来の技術】図3(a)及び(b)は従来の一例にお
けるプリント配線基板組立体を示す部分側面図及び部分
拡大斜視図である。従来、この種のプリント配線基板組
立体は、図3に示すように、一面に形成された配線パタ
ーン5にはんだ付けによって接続され搭載される複数の
電子部品2をもつプリント配線基板1a及び1bを支持
棒9を介してねじ10で締結して、組立てられたもので
ある。また、これらプリント配線基板1aと1bとの電
気的接続はケーブル8で行なわれていた。2. Description of the Related Art FIGS. 3 (a) and 3 (b) are a partial side view and a partially enlarged perspective view showing a printed wiring board assembly in a conventional example. Conventionally, as shown in FIG. 3, a printed wiring board assembly of this type includes printed wiring boards 1a and 1b having a plurality of electronic components 2 which are connected to a wiring pattern 5 formed on one surface by soldering and mounted. It is assembled by fastening with a screw 10 via a support rod 9. The cable 8 electrically connects the printed wiring boards 1a and 1b.
【0003】このようなプリント配線基板組立体は、配
線パターンが比較的に粗く、実装される電子部が多い場
合に採られる構造のもので、一般的な電気機械の制御部
に広く使用されていた。Such a printed wiring board assembly has a structure that is adopted when the wiring pattern is relatively rough and there are many electronic parts to be mounted, and it is widely used in the control part of general electric machines. It was
【0004】[0004]
【発明が解決しようとする課題】上述した従来のプリン
ト配線基板組立体はプリント配線基板の複数を立体的に
積み重ねて組立てるのに支持棒を使用し機械的に接続を
行いケーブルにより電気的な接続を行なっているのでプ
リント配線基板上での支持棒を周囲領域口には電子部品
を載置することが出来ないという欠点がある。このこと
はプリント配線基板の実装密度の向上を阻害するという
問題があった。The conventional printed wiring board assembly described above is mechanically connected by using a support rod to stack and assemble a plurality of printed wiring boards three-dimensionally and electrically connected by a cable. Therefore, there is a drawback in that the support bar on the printed wiring board cannot mount electronic parts on the peripheral area opening. This has a problem that it hinders the improvement of the mounting density of the printed wiring board.
【0005】本発明の目的はかかる問題を解消すべく取
付部により占有される領域を少くし、より高密度に電子
部品の実装が図れるプリント配線基板組立体を提供する
ことである。SUMMARY OF THE INVENTION An object of the present invention is to provide a printed wiring board assembly in which the area occupied by the mounting portion is reduced and electronic components can be mounted at a higher density in order to solve such a problem.
【0006】[0006]
【課題を解決するための手段】本発明のプリント配線基
板組立体は、複数枚のプリント配線基板を中間部材を介
して積み重ねて組立るプリント配線基板組立体におい
て、前記プリント配線基板のそれぞれに対応する側縁部
に形成される凹みに棒状の電子部品を挿入し、この電子
部品の両端と前記プリント配線基板の配線パターンと接
続されることを特徴としている。A printed wiring board assembly of the present invention is a printed wiring board assembly in which a plurality of printed wiring boards are stacked and assembled via an intermediate member, and the printed wiring board assembly corresponds to each of the printed wiring boards. It is characterized in that a rod-shaped electronic component is inserted into a recess formed in a side edge portion of the printed wiring board, and both ends of the electronic component are connected to the wiring pattern of the printed wiring board.
【0007】[0007]
【実施例】次に本発明について図面を参照して説明す
る。The present invention will be described below with reference to the drawings.
【0008】図1(a)〜(c)は本発明の一実施例に
おけるプリント配線基板組立体を示し、(a)は側面
図、(b)及び(c)は(a)におけるA部の拡大斜視
図である。このプリント配線基板組立体は、それぞれ対
応する側縁部に切欠き6を設け、この切欠き6に棒状の
電子部品2aをはめ込み、その入出力部をプリント配線
基板1a及び1bの配線パターン5にはんだ層3で接続
したことである。1 (a) to 1 (c) show a printed wiring board assembly according to an embodiment of the present invention, in which (a) is a side view and (b) and (c) are parts A of FIG. It is an expansion perspective view. This printed wiring board assembly is provided with a notch 6 at the corresponding side edge portion, a rod-shaped electronic component 2a is fitted in the notch 6, and its input / output portion is connected to the wiring pattern 5 of the printed wiring boards 1a and 1b. That is, they are connected by the solder layer 3.
【0009】次に、このプリント配線基板組立体の組立
について説明する。まず、プリント配線基板1a及び1
bの一面に描かれている配線パターン5に電子部品2を
載置して接続部4を介し接触させはんだ層3によって電
子部品2をプリント配線基板1面に実装する。次に、こ
れらプリント配線基板1の側面に電子部品2を実装する
ための切欠き6を形成する。この切欠き6は予め形成し
ておくと良い。またこの切欠き6の深さHは、電子部品
2aの圧さhより大きくしとくと良い。これはプリント
配線基板1a,1bに外側にある部材との短絡とさける
ためのである。一例として電子部品の厚さhを5mmと
すれば凹部の深さは7mm程度設ける。次に、電子部品
2を切欠き6に挿入し電子部品2両端に設けられている
入出力部である接続部4とプリント配線基板1面に設け
られている配線パターン5をはんだ層3を形成し接触さ
せる。Next, the assembly of this printed wiring board assembly will be described. First, the printed wiring boards 1a and 1
The electronic component 2 is placed on the wiring pattern 5 drawn on one surface of b, brought into contact with the wiring pattern 5 through the connection portion 4, and the electronic component 2 is mounted on the surface of the printed wiring board 1 by the solder layer 3. Next, the notch 6 for mounting the electronic component 2 is formed on the side surface of the printed wiring board 1. The notch 6 may be formed in advance. Further, the depth H of the notch 6 may be made larger than the pressure h of the electronic component 2a. This is to avoid a short circuit with a member outside the printed wiring boards 1a and 1b. As an example, if the thickness h of the electronic component is 5 mm, the depth of the recess is about 7 mm. Next, the electronic component 2 is inserted into the notch 6, and the solder layer 3 is formed by connecting the input / output portions provided at both ends of the electronic component 2 and the wiring pattern 5 provided on the surface of the printed wiring board 1. And contact them.
【0010】このようにプリント配線基板1aと1bが
電子部品2aのみによって機械的及び電気的に接続する
ことができる。このことは従来、電子部品2aが取付部
領域外に取付けられていたものが、取付部領域内に移載
されることにになり従来、取付けに占有された領域にも
実装されることになり、プリント配線基板に対する実装
密度を向上することが出来る。In this way, the printed wiring boards 1a and 1b can be mechanically and electrically connected only by the electronic component 2a. This means that the electronic component 2a conventionally mounted outside the mounting portion area is transferred into the mounting portion area, and is mounted also in the area conventionally occupied for mounting. The mounting density on the printed wiring board can be improved.
【0011】図2は本発明の他の実施例におけるプリン
ト配線基板組立体を説明するための部分斜視図である。
このプリント配線基板組立体は、図2に示すように、前
述の実施例における切欠きの代りに両側に突起部7を設
け中央に凹みを設けたことである。それ以外は前述の実
施例と同じである。すなわち、この突起部7の間の凹み
に電子部品を実装することである。FIG. 2 is a partial perspective view for explaining a printed wiring board assembly according to another embodiment of the present invention.
In this printed wiring board assembly, as shown in FIG. 2, projections 7 are provided on both sides instead of the notches in the above-described embodiment, and a recess is provided in the center. Other than that, it is the same as the above-mentioned embodiment. That is, electronic parts are mounted in the recesses between the protrusions 7.
【0012】この実施例の場合は、前述の実施例と比
べ、任意の位置に、この突起部7を接着固定することが
出来るので、取付部を自由に選択出来る利点がある。In the case of this embodiment, as compared with the above-mentioned embodiment, since the projection 7 can be fixed by adhesion at an arbitrary position, there is an advantage that the mounting portion can be freely selected.
【0013】[0013]
【発明の効果】以上説明したように本発明はプリント配
線基板の側面に電子部品を挿入するため凹部を設け、こ
の凹部に挿入された電子部品の接続部とプリント配線基
板面の配線パターンを接触させハンダ層により接続固定
することにより機械的電気的接続を同時に行うことが出
来る。従って、従来、取付部で占有された領域にも電子
部品が実装出来るので、より高密度実装が図れるプリン
ト配線板組立体が得られるという効果がある。As described above, according to the present invention, the side surface of the printed wiring board is provided with a recess for inserting an electronic component, and the connection portion of the electronic component inserted in the recess is brought into contact with the wiring pattern on the surface of the printed wiring board. Then, by fixing the connection with the solder layer, mechanical and electrical connection can be performed at the same time. Therefore, since the electronic components can be mounted in the area occupied by the mounting portion in the related art, there is an effect that a printed wiring board assembly capable of higher density mounting can be obtained.
【図1】本発明の一実施例におけるプリント配線基板組
立体を示し、(a)は側面図,(b)及び(c)は
(a)のA部を拡大して示す斜視図である。FIG. 1 shows a printed wiring board assembly according to an embodiment of the present invention, in which (a) is a side view and (b) and (c) are enlarged perspective views of a portion A of (a).
【図2】本発明の他の実施例おけるプリント配線基板組
立体を説明するための部分斜視図である。FIG. 2 is a partial perspective view illustrating a printed wiring board assembly according to another embodiment of the present invention.
【図3】従来の一例のプリント配線基板組立体を示し、
(a)は側面図,(b)は部分拡大斜視図である。FIG. 3 shows an example of a conventional printed wiring board assembly,
(A) is a side view and (b) is a partially enlarged perspective view.
1a,1b プリント配線基板 2,2a 電子部品 3 はんだ層 4 接続部 5 配線パターン 6 切欠き 7 突起部 1a, 1b Printed wiring board 2, 2a Electronic component 3 Solder layer 4 Connection part 5 Wiring pattern 6 Notch 7 Protrusion
Claims (1)
介して積み重ねて組立るプリント配線基板組立体におい
て、前記プリント配線基板のそれぞれに対応する側縁部
に形成される凹みに棒状の電子部品を挿入し、この電子
部品の両端と前記プリント配線基板の配線パターンと接
続されることを特徴とするプリント配線基板組立体。1. A printed wiring board assembly in which a plurality of printed wiring boards are stacked and assembled via an intermediate member, and a rod-shaped electronic component is formed in a recess formed in a side edge portion corresponding to each of the printed wiring boards. And a wiring pattern of the printed wiring board is connected to both ends of the electronic component.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1152092A JPH05218612A (en) | 1992-01-27 | 1992-01-27 | Printed-wiring-board assembly body |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1152092A JPH05218612A (en) | 1992-01-27 | 1992-01-27 | Printed-wiring-board assembly body |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH05218612A true JPH05218612A (en) | 1993-08-27 |
Family
ID=11780263
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1152092A Withdrawn JPH05218612A (en) | 1992-01-27 | 1992-01-27 | Printed-wiring-board assembly body |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH05218612A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6054653A (en) * | 1998-01-28 | 2000-04-25 | Hansen; Gregory Robert | Apparatus for attaching a surface mount component |
-
1992
- 1992-01-27 JP JP1152092A patent/JPH05218612A/en not_active Withdrawn
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6054653A (en) * | 1998-01-28 | 2000-04-25 | Hansen; Gregory Robert | Apparatus for attaching a surface mount component |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 19990408 |