JPH02214195A - Method of mounting electronic part - Google Patents

Abstract

PURPOSE:To improve density of mounting electronic parts on a board by inserting an electronic part into an insertion section formed on the board and by connecting electrodes thereof to a conductor pattern provided in an area near the insertion section. CONSTITUTION:Both sides of a board 2 are provided with conductor patterns 4, 6, 8, 10, 12 corresponding to an electronic circuit to be constituted. A through- hole 24 is formed as an insertion section between the conductor patterns 6, 8. An electronic part 18 is provided through the through-hole 24. Electrodes 26, 28 of an electronic part 16 are fixed between the conductor patterns 4, 6, electrodes 30, 32 of an electronic part 18 are fixed between the conductor patterns 6, 8, and electrodes 34, 36 of an electronic part 20 are fixed between the conductor patterns 10, 12 by use of an adhesive 38; and each thereof is electrically connected through a solder 22. Electrical connection is carried out in this way by providing the electronic part 18 to the insertion section 24 formed on the board 2 to improve package density of the electronic part 18 against the board 2.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for mounting electronic components onto a substrate such as a hybrid IC.

[Conventional technology]

In a hybrid IC (hybrid integrated circuit) in which multiple electronic components are mounted on a substrate made of ceramic or the like, for example, as shown in FIG. 4.6.8.10, 12 are formed, and the conductor pattern 8.10 is electrically connected through a through hole I4 penetrating the front and back surfaces of the substrate 2.

Electronic components 16, 18, and 20 are electrically connected with solder 22 between the conductor patterns 4.6, 6.8, and 10.12 of the substrate 2, respectively, to be mounted. ing.

[Problem to be solved by the invention]

In such a hybrid IC, the electronic components 16.18.20 relative to the substrate 2 can be reduced in size by reducing the distance between adjacent conductor patterns 4.6.8.10.12, etc., and miniaturizing the electronic components 16.18.20. The packaging density has been improved and substantial miniaturization has been achieved.

In addition, electronic components 16, 18, 20 to be mounted, such as resistors, capacitors, transistors, etc., are becoming increasingly smaller, and the area occupied by one electronic component on the board 2 is becoming smaller. The area occupied by the electronic components on the board is the sum of the projected area of each electronic component and its soldering area, and the area occupied by the electronic components on the board is quite large.

Furthermore, miniaturized electronic components such as resistors and capacitors whose lengths and widths are equal to or less than the thickness of the substrate have been put into practical use.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide a method for mounting electronic components in which the density of mounting electronic components on a board is improved by utilizing the thickness of the board as a mounting space for the electronic components.

[Means to solve the problem]

The electronic component mounting method of the present invention is characterized in that an insertion portion into which the electronic component is inserted is formed on a substrate, and electrodes of the electronic component are connected to a conductive pattern placed on the surface of the substrate. .

Further, in the electronic component mounting method of the present invention, the insertion portion into which the electronic component is inserted is formed as a through hole, and the electrodes of the electronic component inserted into the through hole are connected to conductors installed on the front and back surfaces of the substrate. It is characterized by being connected to a pattern.

[For production]

According to the electronic component mounting method of the present invention, the electronic component is inserted into the insertion section formed on the board, and the electrodes of the electronic component are connected to the conductor pattern installed near the insertion section, thereby mounting the electronic component on the board. Electronic components are mounted inside.

In addition, by inserting an electronic component into a through hole formed in the board as an insertion part, the electronic component can be mounted inside the board, and the electrodes of the electronic component can be connected to the conductor patterns formed on the front and back surfaces of the board. Since the conductor patterns formed on the front and back surfaces of the board are electrically connected via the electronic component installed in the through hole, the function of a conventional through hole can be obtained.

〔Example〕

FIG. 1 shows a first embodiment of the electronic component mounting method of the present invention.

As shown in FIG. 1A, conductive patterns 4.6.8.1O112 are printed and printed on the front and back surfaces of the substrate 2 made of an insulating material such as ceramic, corresponding to the electronic circuit to be constructed. Formed by firing. Between the conductor patterns 4 and 6,
Between conductor patterns 6 and 8, and between conductor patterns 1O112
Chip-type electronic components such as passive components such as resistors, coils, and capacitors, and active components such as transistors and diodes are planned to be mounted in between, and the spacing between each component corresponds to the electrode spacing of the electronic components to be mounted. are doing.

Next, as shown in FIG. 1B, a through hole 24 is formed between the conductive patterns 6 and 8 of the substrate 2 as an insertion portion into which an electronic component is inserted. This through hole 24 is formed, for example, after the formation of the conductive pattern 6.8, and no conductive pattern is formed on its wall surface. Further, the through hole 24 has a diameter that allows installation of an electronic component to be connected between the conductor patterns 6.8.

Next, as shown in FIG. 1(C), a conductor pattern 4.
An electronic component 16 to be connected is installed between the holes 6 and 6, and an electronic component 18 is inserted into the through hole 24. And the first
As shown in (D) of the figure, electrodes 26.28 of the electronic component 16 are located between the conductive patterns 4.6, electrodes 30.32 of the electronic component 18 are located between the conductive patterns 6.8, and the conductive patterns 10. Each electronic component 16, 181, 20 is attached to the front and back surfaces of the substrate 2 or the through hole 2 using an adhesive 38 as a fixing means so that the electrodes 34, 36 of the electronic component 20 correspond to the gaps between the 12 and 12.
Fixed within 4.

Next, as shown in FIG.
, the electrodes 30.32 of the electronic component 18 are placed on the conductor pattern 6.8.
, the electrodes 34. of the electronic component 20 are attached to the conductive patterns 10.12.
36 are electrically connected by solder 22, thereby forming a hybrid IC.

When comparing such a hybrid IC with the hybrid IC shown in FIG. 4, the hybrid IC shown in FIG.
The electronic component 18 that was installed on the surface of the board 2 in C is installed in the through hole 24, and the area of the board 2 can be used effectively accordingly, and the mounting density of electronic components on the board 2 can be improved. .

Next, FIG. 2 shows a second method of mounting electronic components according to the present invention.
An example is shown.

As shown in FIG. 2(A), conductive patterns 4, 6, and 10 are provided on the front and back surfaces of the substrate 2, corresponding to the electronic circuits to be formed.
．． 12 is formed, and in this case, the conductor patterns 6 and IO are formed so as to overlap.

Next, as shown in FIG. 2(B), a through hole 24 is formed between the conductor patterns 6 and 10 on the front and back surfaces of the board 2 as an insertion part for inserting an electronic component, and the diameter of the through hole 24 is determined by the diameter of the conductor pattern. 6. Set the size between 10 and 10 so that the electronic components to be connected can be installed.

Next, as shown in FIG. 2(C), the conductor pattern 4.
An electronic component 16 to be connected is placed between the conductor patterns 6 and 10, and an electronic component 18 to be connected is inserted into the through hole 24 between the conductor patterns 6 and 10. Then, as shown in FIG. 2(D), each electronic component 1G, 18, 20 is fixed on the front and back surfaces of the substrate 2 or in the through hole 24 using an adhesive 38 as a fixing means.

Next, as shown in FIG.
, the electrode 30.3 of the electronic component 18 is placed on the conductor pattern 6.10.
3. Electrode 34 of electronic component 20 on conductor pattern 10.12
．． 36 are electrically connected by solder 22, respectively.

In this way, the hybrid IC shown in Fig. 4 can be used on the board 2.
The electronic component 18 that had been installed on the surface of the 6.
10 are connected, the installation area of the electronic component 18 on the board 2 can be reduced, and the electronic component 18 can form a through hole.

Next, FIG. 3 shows the third method of mounting electronic components according to the present invention.
An example is shown.

As shown in FIG. 3A, conductor patterns 4,6,7,10,12 are formed on the front and back surfaces of the substrate 2, and a recess 25 as an insertion part is formed between the conductor patterns 6,7, As shown in FIG. 3B, the electronic component 18 may be placed in the recess 25, and the electrodes 30.32 of the electronic component 18 may be connected to the conductive pattern 6.7.

In this way, if the insertion portion into which the electronic component 18 is inserted is formed by the recess 25 with one side closed, there is no need to fix the electronic component 18 before soldering, and the yield can be increased.

[Effects of the Invention] As explained above, according to the present invention, the following effects can be obtained.

(a) Since electronic components are installed and electrically connected to the insertion portion formed on the board, it is possible to improve the mounting density of electronic components on the board, and also to reduce the board area and miniaturize hybrid ICs. can be realized.

(b) An electronic component is installed in one through hole formed on the board, and the electrodes of the electronic component are connected between the conductive patterns installed on the front and back surfaces of the board, so that electronic components are connected between the conductive patterns on the front and back surfaces of the board. Electrical connections will be made through the components, allowing the electronic components installed within the board to perform the function of conventional through holes, reducing the number of through holes from the board, and making it easier to mount electronic components on the board. The effective area can be expanded.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of the electronic component mounting method of the present invention, and FIG. 2 is a diagram showing a second embodiment of the electronic component mounting method of the present invention.
FIG. 3 is a diagram showing a third embodiment of the electronic component mounting method of the present invention, and FIG. 4 is a sectional view showing a mounting form of electronic components on a board in a conventional hybrid IC. 2... Substrate 4.6.8.10.12... Conductor pattern 16.18
．． 20...Electronic component 24...Through hole (insertion part) 26.28.30.32.34.36...Electrode No.

Claims (2)

[Claims] 1. 1. A method for mounting an electronic component, comprising: forming an insertion section on a substrate into which the electronic component is inserted; and connecting electrodes of the electronic component to a conductive pattern placed on the surface of the substrate. 2. 1. The insertion portion into which the electronic component is inserted is formed by a through hole, and the electrodes of the electronic component inserted into the through hole are connected to conductor patterns installed on the front and back surfaces of the substrate. How to mount the electronic components described.