JPH03225890A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH03225890A JPH03225890A JP2129190A JP2129190A JPH03225890A JP H03225890 A JPH03225890 A JP H03225890A JP 2129190 A JP2129190 A JP 2129190A JP 2129190 A JP2129190 A JP 2129190A JP H03225890 A JPH03225890 A JP H03225890A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- holes
- printed wiring
- wiring board
- wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000919 ceramic Substances 0.000 claims abstract description 9
- 238000005476 soldering Methods 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 230000001681 protective effect Effects 0.000 abstract description 3
- 238000004806 packaging method and process Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0094—Filling or covering plated through-holes or blind plated vias, e.g. for masking or for mechanical reinforcement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は印刷配線基板に関し、特にスルーホールを有す
る印刷配線基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed wiring board, and particularly to a printed wiring board having through holes.
従来の印刷配線基板は、第３図に示すように、上面配線
４と下面配線５を電気的に接続するスルーホール２ａに
部品７のリード８を挿入し、半田９により接合していた
が、スルーホール２ａのエツジ部でメタライズ層が薄い
ため断線する危険性が高かった。In the conventional printed wiring board, as shown in FIG. 3, the lead 8 of the component 7 is inserted into the through hole 2a that electrically connects the upper surface wiring 4 and the lower surface wiring 5, and they are joined with solder 9. Since the metallized layer was thin at the edge of the through hole 2a, there was a high risk of wire breakage.
上述した従来の印刷配線基板は、上面配線と下面配線と
を電気的に接続するスルーホールのエツジ部のメタライ
ズ層が１〜２μｍと薄く、断線の危険性があるため、部
品リードを挿入し半田付しても表面と裏面の電気的な接
続に高い信頼性が得られないという欠点がある。In the conventional printed wiring board mentioned above, the metallized layer at the edge of the through hole that electrically connects the upper surface wiring and the lower surface wiring is as thin as 1 to 2 μm, and there is a risk of disconnection, so component leads are inserted and soldered. However, the disadvantage is that high reliability cannot be achieved in the electrical connection between the front and back surfaces.
本発明のスルーホール印刷配線基板は、セラミック基板
に設けたスルーホールと、前記スルーホール内に設けた
メタライズ層により前記セラミック基板の上面及び下面
に設けた配線を電気的に接続する印刷配線基板において
、前記スルーホールが電子部品を実装するために部品の
リードを挿入し半田付を行う第１のスルーホールと、前
記第１のスルーホールに隣接して設け前記第１のスルー
ホールに接続した配線と接続して上下配線の接続専用に
設けた第２のスルーホールとを有している。The through-hole printed wiring board of the present invention is a printed wiring board in which through-holes provided in a ceramic substrate and wiring provided on the upper and lower surfaces of the ceramic substrate are electrically connected by a metallized layer provided in the through-holes. , a first through hole in which the lead of the component is inserted and soldered in order for the through hole to mount an electronic component; and wiring provided adjacent to the first through hole and connected to the first through hole. It has a second through hole connected thereto and provided exclusively for connection of upper and lower wiring.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）、（ｂ）、（ｃ）は本発明の第１の実施例
を示す平面図及びＡ−Ａ’線断面図並びに底面図である
。第１図（ａ）〜（ｃ）に示すように、セラミック基板
１にスルーホール２と２ａとを隣接して設け、スルーホ
ール２，２ａの内壁にメタライズ層３を設ける。次に、
セラミック基板１の上面及び下面にスクリーン印刷法に
より夫々スルーホール２，２ａを含む上面の配線４及び
下面の配線５を夫々に設け、スルーホール２２ａを介し
て電気的に接続する０次に、スルーホール２ａや端子領
域以外の配線４．５を含む表面に選択的にガラス層等の
保護膜６を設けて印刷配線基板を構成する。FIGS. 1(a), (b), and (c) are a plan view, a sectional view taken along the line A-A', and a bottom view showing a first embodiment of the present invention. As shown in FIGS. 1A to 1C, through holes 2 and 2a are provided adjacent to each other in a ceramic substrate 1, and a metallized layer 3 is provided on the inner walls of the through holes 2 and 2a. next,
The upper surface wiring 4 and the lower surface wiring 5 including through holes 2 and 2a are respectively provided on the upper surface and lower surface of the ceramic substrate 1 by a screen printing method, and the 0-order wiring 4 and the lower surface wiring 5, which are electrically connected via the through hole 22a, are formed by a screen printing method. A printed wiring board is constructed by selectively providing a protective film 6 such as a glass layer on the surface including the wiring 4.5 other than the hole 2a and the terminal area.
部品実装時には、部品７のリード８をスルーホール２ａ
に挿入して半田９により接合する。When mounting the component, connect the lead 8 of the component 7 to the through hole 2a.
and connect with solder 9.
ここで、スルーホール２ａ内のメタライズ層３が断線し
てもスルーホール２で配線４．５の接続が維持されてお
り、断線事故の発生を防止できる。Here, even if the metallized layer 3 in the through hole 2a is disconnected, the connection of the wiring 4.5 is maintained in the through hole 2, and the occurrence of a disconnection accident can be prevented.
第２図は本発明の第２の実施例の断面図である。FIG. 2 is a sectional view of a second embodiment of the invention.
第２図に示すように、スルーホール２ａの領域に上面の
配線４を設けず下面の配線５のみ設けている以外は第１
の実施例と同じ構成を有しており、部品のリードはスル
ーホール２ａに接合し、第１の実施例と同様の効果を有
する。As shown in FIG. 2, the first wire is the same except that the upper surface wiring 4 is not provided in the area of the through hole 2a, and only the lower surface wiring 5 is provided.
This embodiment has the same structure as the first embodiment, the leads of the components are connected to the through holes 2a, and the same effects as the first embodiment are obtained.
以上説明したように本発明は、部品のリードを挿入し半
田付を行うスルーホールと、上下配線の接続専用のスル
ーホールを同一配線に接続して設けることにより、部品
リードを挿入し半田付しても表面と裏面の電気的な接続
は完全に保てるので高い信頼性でリード付部品を搭載で
きる。As explained above, the present invention enables insertion and soldering of component leads by providing through-holes for inserting and soldering component leads and through-holes dedicated to connecting upper and lower wiring connected to the same wiring. Since the electrical connection between the front and back surfaces can be maintained perfectly even when using a wafer, leaded components can be mounted with high reliability.
第１図（ａ）、’（ｂ）、（ｃ）は本発明の第１の実施
例を示す平面図、及びＡ−Ａ’線断面図並びに底面図、
第２図は本発明の第２の実施例の断面図、第３図は従来
の印刷配線基板の断面図である。
１・・・セラミック基板、２，２ａ・・・スルーホール
、３・・・メタライズ層、４．５・・・配線、６・・・
保護膜、７・・・部品、８・・・リード、９・・・半田
。FIGS. 1(a), 1'(b), and 1(c) are a plan view, a sectional view taken along the line A-A', and a bottom view showing the first embodiment of the present invention,
FIG. 2 is a sectional view of a second embodiment of the present invention, and FIG. 3 is a sectional view of a conventional printed wiring board. DESCRIPTION OF SYMBOLS 1... Ceramic board, 2, 2a... Through hole, 3... Metallized layer, 4.5... Wiring, 6...
Protective film, 7...Components, 8...Leads, 9...Solder.
Claims (1)
ホール内に設けたメタライズ層により前記セラミック基
板の上面及び下面に設けた配線を電気的に接続する印刷
配線基板において、前記スルーホールが電子部品を実装
するために部品のリードを挿入し半田付を行う第１のス
ルーホールと、前記第１のスルーホールに隣接して設け
前記第１のスルーホールに接続した配線と接続して上下
配線の接続専用に設けた第２のスルーホールとを有する
ことを特徴とする印刷配線基板。In a printed wiring board that electrically connects wiring provided on the upper and lower surfaces of the ceramic substrate through a through hole provided in a ceramic substrate and a metallized layer provided in the through hole, the through hole mounts an electronic component. A first through-hole is provided adjacent to the first through-hole for inserting and soldering component leads, and is used exclusively for connecting upper and lower wiring by connecting with the wiring connected to the first through-hole. A printed wiring board characterized by having a second through hole provided therein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2129190A JPH03225890A (en) | 1990-01-30 | 1990-01-30 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2129190A JPH03225890A (en) | 1990-01-30 | 1990-01-30 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03225890A true JPH03225890A (en) | 1991-10-04 |
Family
ID=12051036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2129190A Pending JPH03225890A (en) | 1990-01-30 | 1990-01-30 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03225890A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5734560A (en) * | 1994-12-01 | 1998-03-31 | International Business Machines Corporation | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap |
| JP2007109836A (en) * | 2005-10-13 | 2007-04-26 | Fuji Electric Holdings Co Ltd | Printed wiring board |
| JP2007220915A (en) * | 2006-02-16 | 2007-08-30 | Denso Corp | Pin connecting structure of printed board |
-
1990
- 1990-01-30 JP JP2129190A patent/JPH03225890A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5734560A (en) * | 1994-12-01 | 1998-03-31 | International Business Machines Corporation | Cap providing flat surface for DCA and solder ball attach and for sealing plated through holes, multi-layer electronic sturctures including the cap |
| JP2007109836A (en) * | 2005-10-13 | 2007-04-26 | Fuji Electric Holdings Co Ltd | Printed wiring board |
| JP2007220915A (en) * | 2006-02-16 | 2007-08-30 | Denso Corp | Pin connecting structure of printed board |
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