JPH0239587A - High density mounting printed board - Google Patents
High density mounting printed boardInfo
- Publication number
- JPH0239587A JPH0239587A JP18813888A JP18813888A JPH0239587A JP H0239587 A JPH0239587 A JP H0239587A JP 18813888 A JP18813888 A JP 18813888A JP 18813888 A JP18813888 A JP 18813888A JP H0239587 A JPH0239587 A JP H0239587A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- fpic
- component
- board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000003780 insertion Methods 0.000 claims abstract description 30
- 230000037431 insertion Effects 0.000 claims abstract description 30
- 239000011888 foil Substances 0.000 claims description 11
- 238000005476 soldering Methods 0.000 abstract description 15
- 238000000034 method Methods 0.000 abstract description 11
- 230000002093 peripheral effect Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 11
- 229910000679 solder Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- GMYRVMSXMHEDTL-UHFFFAOYSA-M 1,1'-diethyl-2,2'-cyanine iodide Chemical compound [I-].C1=CC2=CC=CC=C2N(CC)C1=CC1=CC=C(C=CC=C2)C2=[N+]1CC GMYRVMSXMHEDTL-UHFFFAOYSA-M 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002788 crimping Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この発明は複数の電子部品を高密度で実装するプリント
板、特にフラットパッケージ部品とその他の電子部品又
はプリント基板とを立体的に重畳して主プリント基板に
実装する高密度実装プリント板に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This invention relates to a printed circuit board on which a plurality of electronic components are mounted at high density, especially a printed circuit board in which flat package components and other electronic components or printed circuit boards are superimposed three-dimensionally. This invention relates to a high-density mounting printed board mounted on a main printed board.
［従来の技術］
従来高密度プリント板実装技術に関し、フラットパッケ
ージＩＣ（以下ＦＰＩＣという）と抵抗器等のディスク
リート部品を混在させてプリント基板に実装する公知文
献としては、例えば特開昭６０−９５９９８号公報等が
ある。しかし外形寸法の異なる複数のＦＰＩＣの高密度
実装に関しては余り検討されていなかった。[Prior Art] Regarding conventional high-density printed circuit board mounting technology, a known document in which a flat package IC (hereinafter referred to as FPIC) and discrete components such as resistors are mixed and mounted on a printed circuit board includes, for example, Japanese Patent Laid-Open No. 60-95998. There are publications etc. However, little consideration has been given to high-density packaging of a plurality of FPICs having different external dimensions.
第２図は従来のＦＰＩＣのプリント板への実装例を示す
図であり、同図（ａ）は平面図、同図（ｂ）は断面図で
ある。同図において、１は第１のＦＰＩＣ，２は第１０
ＦＰＩＣＩのリード端子、３はプリント基板、４は第１
のＦＰＩＣＩのリード端子を半田付けするためのパッド
（導電箔）、６は第２のＦＰＩＣ，７は第２のＦＰ Ｉ
Ｃ６のリード端子、８は第２のＦＰＩＣ６のリード端
子を半田付けするだめのパッド（導電箔）、９は半田で
ある。FIG. 2 is a diagram showing an example of mounting a conventional FPIC on a printed circuit board, with FIG. 2(a) being a plan view and FIG. 2(b) being a sectional view. In the same figure, 1 is the first FPIC, 2 is the 10th FPIC
FPICI lead terminal, 3 is printed circuit board, 4 is first
Pads (conductive foil) for soldering the lead terminals of FPICI, 6 is the second FPIC, 7 is the second FPIC
The lead terminal of C6, 8 is a pad (conductive foil) to which the lead terminal of the second FPIC 6 is soldered, and 9 is a solder.
この第１及び第２のＦＰＩＣＩ及び６はプリント板３の
表面実装部品であるため、第１図（ａ）の平面図に示さ
れるように、プリント板３の表面にそれぞれのＦＰＩＣ
とリード端子を含む独立の占有面積を必要とした。Since the first and second FPICIs and 6 are surface-mounted parts of the printed board 3, the respective FPICIs are mounted on the surface of the printed board 3, as shown in the plan view of FIG.
It required an independent area including the lead terminals and lead terminals.
第３図上記文献に示された従来のプリント基板の半田付
は方法を示す図であり、図において１〜４及び９は第２
図の機材と全く同一のものである。FIG. 3 is a diagram showing the conventional soldering method for printed circuit boards shown in the above-mentioned document, and in the figure, 1 to 4 and 9 are the second soldering method.
The equipment is exactly the same as the one shown in the figure.
５はＦＰＩＣ挿入用孔、１０は抵抗器、１１は抵抗器１
０のリード端子、１２は抵抗器１０のリード端子１１を
半田付けするためのパッドである。5 is the FPIC insertion hole, 10 is the resistor, 11 is the resistor 1
0 is a lead terminal, and 12 is a pad to which the lead terminal 11 of the resistor 10 is soldered.
第３図においては、ディスクリート部品である抵抗器１
０と表面実装部品である第１のＦＰＩＣＩとを共通にプ
リント基板の裏側へ半田付けしている。このためプリン
ト基板３に第１のＦＰ。ＩＣＩのリード端子２の中間垂
直部の輪郭で形成されるＦＰＩＧ挿入用孔５を設け、前
記ＦＰＩＣ挿入用孔５に第１のＦＰＩＣＩを裏側に反転
させ挿入し、前記ＦＰＩＣ挿入用孔５の周縁に形成され
た第１のＦＰＩＣ用バッド４に同ＦＰＩＣのリード端子
２を半田付けする。このようにして抵抗器１０と第１の
ＦＰＩＣＩとをプリント基板３の同一の面に半田付けし
て、工数の低減を計ってはいるが、高密度実装とはなっ
ていなかった。In Figure 3, resistor 1, which is a discrete component,
0 and the first FPICI, which is a surface mount component, are commonly soldered to the back side of the printed circuit board. Therefore, a first FP is installed on the printed circuit board 3. An FPIG insertion hole 5 formed by the contour of the middle vertical part of the lead terminal 2 of the ICI is provided, and the first FPICI is inserted into the FPIC insertion hole 5 by turning it upside down, and the periphery of the FPIC insertion hole 5 is inserted into the FPIC insertion hole 5. The lead terminal 2 of the FPIC is soldered to the first FPIC pad 4 formed in the FPIC. In this way, the resistor 10 and the first FPICI are soldered to the same side of the printed circuit board 3 in an attempt to reduce the number of man-hours, but high-density mounting has not been achieved.
［発明が解決しようとする課題］
上記のような従来の実装プリント板においては、電子部
品のプリント基板への占有面積が大きく、電子機器の小
形化が実現できないため、高密度実装化に十分な対応が
できないという問題点があった。[Problems to be Solved by the Invention] In the conventional mounted printed circuit board as described above, the area occupied by electronic components on the printed circuit board is large, making it impossible to miniaturize electronic devices. There was a problem that it was impossible to respond.
またフラットパッケージ部品の半田面を共通の片面とす
るためにプリント基板に設けた部品挿入孔により、プリ
ント基板の配線パターン形成面積が制限されるという問
題点があった。Furthermore, there is a problem in that the area for forming the wiring pattern on the printed circuit board is limited by the component insertion hole provided in the printed circuit board in order to make the solder surface of the flat package component one common surface.
この発明はかかる問題点を解消するためになされたもの
で、複数電子部品の高密度実装化を行い電子機器の小型
化を実現し、あわせてフラットパッケージ部品を実装し
た場合のプリント基板の配線パターン形成面積の不足を
解決できる高密度実装プリント板を得ることを目的とす
る。This invention was made to solve such problems, and it is possible to realize miniaturization of electronic devices by high-density mounting of multiple electronic components, and also to realize wiring patterns of printed circuit boards when flat package components are mounted. The purpose is to obtain a high-density mounting printed board that can solve the problem of lack of forming area.
［課題を解決するだめの手段］
この発明に係る高密度実装プリント板は、フラットパッ
ケージ部品のリード端子の中間垂直部の輪郭程度の部品
挿入用孔と、該部品挿入用孔の周縁にリード端子接続用
節１の導電箔を主プリント基板に設け、前記フラットパ
ッケージ部品を裏側に反転し、前記部品挿入孔より挿入
し、前記第１の導電箔と挿入部品のリード端子を半田付
けにより主プリント基板に装着し、さらに前記フラット
パッケージ部品よりも外形寸法の大きい電子部品、又は
可撓性もしくは非可撓性プリント基板を、前記フラット
パッケージ部品と立体的に重畳して実装するための第２
の導電箔を前記主プリント基板上に設け、該第２の導電
箔に前記電子部品又番よ可撓性もしくは非可撓性プリン
ト基板の導電接合部を接続し装着させた主プリント基板
を備えたものである。[Means for Solving the Problems] A high-density mounting printed board according to the present invention has a component insertion hole that is approximately the same as the contour of the middle vertical portion of the lead terminal of a flat package component, and a lead terminal on the periphery of the component insertion hole. A conductive foil for connecting section 1 is provided on the main printed circuit board, the flat package component is turned over to the back side, inserted through the component insertion hole, and the first conductive foil and the lead terminal of the inserted component are soldered to the main printed circuit board. A second component for mounting an electronic component having a larger external dimension than the flat package component, or a flexible or non-flexible printed circuit board, in a three-dimensional manner overlapping the flat package component.
A main printed circuit board is provided, in which a conductive foil is provided on the main printed circuit board, and a conductive joint part of the electronic component or the flexible or non-flexible printed circuit board is connected and attached to the second conductive foil. It is something that
［作用］
この発明においては、フラ・ノトノ＜・ソケージ部品を
プリント板に実装する場合に、主プリント基板に設けら
れた部品挿入孔とその部品挿入孔の周縁に形成されたリ
ード端子接続用の導電箔を用０てフラットパッケージ部
品を裏側に反転して部品挿入孔に挿入した状態で主プリ
ント基板番こ装着する。[Function] In this invention, when mounting a frame component on a printed circuit board, a component insertion hole provided in the main printed circuit board and a lead terminal connection hole formed around the component insertion hole are used. Using a conductive foil, the flat package component is turned over to the back side and inserted into the component insertion hole, and then attached to the main printed circuit board board.
さらに前記フラットパ・ソケージ部品よりも外形寸法の
大きい電子部品、又は可撓性もしく（よ非可撓性プリン
ト基板を前記フラ・ントノス・ノケージ部品と立体的に
重畳して前記主プリント基板（こ取付↓す相互の電気的
接続を行う。従って少くとも２個以上の′電子部品がプ
リント基板上では１個の電子部品の占有面積で実装でき
ることになり電子機器の小形化が可能となる。Furthermore, an electronic component having an external dimension larger than the flat panel part, or a flexible or non-flexible printed circuit board is three-dimensionally overlapped with the flat panel part, and the main printed board is Therefore, at least two or more electronic components can be mounted on the printed circuit board in the area occupied by one electronic component, making it possible to downsize electronic devices.
また前記可撓性もしくは非可撓性プリント仮に必要とす
る配線パターン形成を行うことにより、主プリント板の
前記部品挿入孔に起因する配線パターン形成面積の不足
を補い、さらに多層配線と同様の機能をも有することが
できる。In addition, by forming the wiring pattern as required on the flexible or non-flexible printed circuit board, it can compensate for the lack of wiring pattern formation area caused by the component insertion hole of the main printed board, and also provide the same functionality as multilayer wiring. can also have.
［実施例］
第１図は本発明の高密度実装プリント板の第１の実施例
を示す図であり、１〜９は前記従来機材と全く同一のも
のである。[Embodiment] FIG. 1 is a diagram showing a first embodiment of a high-density mounting printed board according to the present invention, and numerals 1 to 9 are exactly the same as the conventional equipment.
第１図においては、外形寸法の異なる第１及び第２のＦ
ＰＩＣＩ及び６を立体的に重畳してプリント基板に装着
し高密度化を実現するものである。In FIG. 1, first and second F having different external dimensions are shown.
PICI and 6 are superimposed three-dimensionally and mounted on a printed circuit board to achieve high density.
従って小型のＦＰＩＣのリード端子を含む外形寸法が大
型のＦＰＩＣのリード端子の中間垂直部の輪郭で形成さ
れる外形寸法より小さいことが必要条件となる。第１図
のプリント基板３には、第１のＦＰＩＣのリード端子２
の中間垂直部の輪郭で形成されるＦＰＩＣ挿入用孔５と
、該ＦＰＩＣ挿入用孔５の周縁に挿入されるＦＰＩＣの
リード端子を半田付けするためのバッド４が設けられて
いる。第１のＦＰＩＣＩは裏側に反転させてＦＰＩＣ用
挿入孔５に挿入し、同ＦＰＩＣＩのリード端子２を前記
バッド４に半田付けする。前記第１のＦＰＩＣＩより外
形寸法の大きい第２のＦＰＩＣ６は、前記プリント基板
３の第１のＦＰＩＣ用パッド４よりも外側に設けられた
第２のＦＰＩＣ用バッド８に、通常の装着法（ＦＰＩＣ
の表側を上面とする装着法）で、第２のＦＰＩＣ６のリ
ード端子７を半田付けする。このような実装法により大
型の第２のＦＰＩＣ６のプリント基板３への占有面積内
に小型の第１のＦＰ Ｉ Ｃ１が立体的に装着されるこ
とになり、プリント基板３の占有面積が低減される。Therefore, it is necessary that the external dimensions including the lead terminals of the small FPIC be smaller than the external dimensions formed by the contour of the middle vertical portion of the lead terminals of the large FPIC. The printed circuit board 3 in FIG. 1 has lead terminals 2 of the first FPIC.
An FPIC insertion hole 5 formed by the contour of the intermediate vertical portion of the FPIC insertion hole 5 and a pad 4 for soldering the lead terminal of the FPIC inserted to the periphery of the FPIC insertion hole 5 are provided. The first FPICI is turned upside down and inserted into the FPIC insertion hole 5, and the lead terminal 2 of the first FPICI is soldered to the pad 4. The second FPIC 6 having larger external dimensions than the first FPIC is mounted on the second FPIC pad 8 provided outside the first FPIC pad 4 of the printed circuit board 3 using a normal mounting method (FPIC
The lead terminals 7 of the second FPIC 6 are soldered using the mounting method in which the front side is the top surface. With this mounting method, the small first FPIC 1 is three-dimensionally mounted within the area occupied by the large second FPIC 6 on the printed circuit board 3, and the area occupied by the printed circuit board 3 is reduced. Ru.
第４図は本発明の高密度実装プリント板の第２の実施例
を示す図であり、１〜５．９は前記第１図の機材と全く
同一のものである。１３はフレキシブルプリント基板、
１４−１．１４−２は表面実装用電子部品、１５はフレ
キシブルプリント基板の半田付は用パッドである。FIG. 4 is a diagram showing a second embodiment of the high-density mounting printed board of the present invention, and the equipment 1 to 5.9 are exactly the same as the equipment shown in FIG. 1. 13 is a flexible printed circuit board,
14-1 and 14-2 are electronic components for surface mounting, and 15 is a pad for soldering a flexible printed circuit board.
第４図において、第１のＦＰＩＣＩを裏側に反転させて
ＦＰＩＣ用挿入孔５より挿入し、第１のＦＰ Ｔ ｅｌ
のリード端子２と同ＦＰＩＣ用パッド４とを半田付けす
る装着法は第１図の場合と全く同一である。相違する点
は、前記第１のＦＰＩＣｌより外形寸法の大きなフし・
キシプルプリント基板１３に表面実装用電子部品１４−
１．１４−２とを半田付けにより装着し、プリント基板
３上の前記第１のＦＰＩＣ用バッド４の外側に設けられ
たフレキシブルプリント板用バッド１５に、前記フレキ
シブルプリント基板１３の導電接続部を半田付けする実
装構造である。この第２の実施例による実装構造によれ
ば第１のＦＰＩＣの寸法よりも小さな電子部品であって
も、フレキシブルプリント基板１３を介して第１の実施
例と同様に高密度実装が可能となり、電子部品の寸法上
の制約が大巾に解除されたことになる。従ってフレキシ
ブルプリント基板１３に装着される電子部品の形状及び
外形寸法は制限されずに自由に選択が可能である。また
前記ＦＰＩＣ用挿入孔挿入孔リント基板３に設けたこと
により同プリント基板３内で一部の配線パターン形成が
不能となった場合に、前記フレキシブルプリント基板１
３はその基板内に所定の配線パターンを自由に形成でき
るので、フレキシブルプリント基板１３は、前記プリン
ト基板３の一部の形成不能となった配線パターンに代っ
て、これを補い得る構造となっている。従って前記フレ
キシブルプリント基板１３は特に電子部品を必要とせず
、何も実装されなくとも、多層配線と同様な機能を有す
る構造体となり高密度実装化が向上できる。In FIG. 4, the first FPICI is reversed and inserted through the FPIC insertion hole 5, and the first FPICI is inserted into the FPIC insertion hole 5.
The method of soldering the lead terminal 2 and the FPIC pad 4 is exactly the same as that shown in FIG. The difference is that the outer dimensions are larger than that of the first FPICl.
Electronic components for surface mounting 14- on the xypul printed circuit board 13
1.14-2 is attached by soldering, and the conductive connection portion of the flexible printed circuit board 13 is attached to the flexible printed board pad 15 provided on the outside of the first FPIC pad 4 on the printed circuit board 3. This is a mounting structure that requires soldering. According to the mounting structure according to the second embodiment, even electronic components smaller than the dimensions of the first FPIC can be mounted at high density via the flexible printed circuit board 13 as in the first embodiment. This means that dimensional restrictions on electronic components have been largely lifted. Therefore, the shape and external dimensions of the electronic components mounted on the flexible printed circuit board 13 are not limited and can be freely selected. In addition, when it becomes impossible to form a part of the wiring pattern in the printed circuit board 3 due to the provision of the FPIC insertion hole in the lint board 3, the flexible printed circuit board 1
3 can freely form a predetermined wiring pattern within the board, so the flexible printed circuit board 13 has a structure that can replace the wiring pattern that cannot be formed on a part of the printed circuit board 3. ing. Therefore, the flexible printed circuit board 13 does not particularly require any electronic components, and even if nothing is mounted thereon, it becomes a structure having a function similar to that of multilayer wiring, and high-density packaging can be improved.
またフレキシブルプリント基板１３は、該基板上に電子
部品の実装と回路パターンの形成ができ、メインのプリ
ント基板３に装着し、両プリント基板間の導電接合部の
接続（半田付のみならず圧着やコネクタ等による接続も
含む）が可能な構成であれば、特に材質や形状に制限さ
れるものではない。従ってセラミック基板やガラスエポ
キシ樹脂基板等の非可撓性の材料でもよい。In addition, the flexible printed circuit board 13 allows electronic components to be mounted and circuit patterns to be formed on the board, and is attached to the main printed circuit board 3 to connect the conductive joints between both printed circuit boards (not only by soldering but also by crimping). There are no particular limitations on the material or shape as long as the configuration allows connection (including connection by connectors, etc.). Therefore, a non-flexible material such as a ceramic substrate or a glass epoxy resin substrate may be used.
また第１の実施例において、立体的に重畳して実装する
電子部品として、大きな外形寸法を有する第２のＦＰＩ
Ｃ６について説明したが、この電子部品は特にＦＰＩＣ
に制限されるものではなく、フラットパッケージ状の他
のモジュール部品やプラスチックリード付きチップキャ
リア（一般にＰＬＣＣと呼ばれる）等でもよく、またそ
の形状も特定されるものではない。In addition, in the first embodiment, a second FPI having large external dimensions is used as an electronic component to be mounted in a three-dimensional manner.
Although we have explained C6, this electronic component is especially suitable for FPIC.
However, the present invention is not limited to this, and may be other module parts in the form of a flat package, a chip carrier with plastic leads (generally called a PLCC), or the like, and its shape is not specified.
また第１及び第２の実施例において、小形のＦＰＩＣ用
挿入孔５をプリント基板３に設けるように説明したが、
プリント基板３の厚さが十分にある場合は前記挿入孔５
に代えて部品挿入用凹部を設けるようにしてもよい。こ
の場合凹部の裏側のプリント基板３に自由に配線パター
ンが形成できる利点がある。Furthermore, in the first and second embodiments, it has been explained that the small FPIC insertion hole 5 is provided in the printed circuit board 3.
If the printed circuit board 3 is sufficiently thick, the insertion hole 5
Instead, a recess for inserting components may be provided. In this case, there is an advantage that a wiring pattern can be freely formed on the printed circuit board 3 on the back side of the recess.
また立体的に重畳する電子部品のプリント基板３への半
田付は法については、融点の異なる２種類の半田を用い
て２回に分けて行う方法や、電子部品の位置合わせを行
った後に１回で行う方法等もあり製造上特に支障はない
。In addition, there are methods for soldering three-dimensionally overlapping electronic components to the printed circuit board 3, such as soldering in two steps using two types of solder with different melting points, or soldering in two steps after aligning the electronic components. There is also a method of doing it in batches, so there is no particular problem in manufacturing.
［発明の効果］
以上のようにこの発明によれば、フラットパッケージ部
品を裏側に反転させて、プリント基板上に設けられた部
品挿入孔に挿入して装着する方法により、その他の大形
の電子部品又は可撓性もしくは非可撓性プリント基板と
立体的に重畳してプリント基板に実装できるので、プリ
ント板の高密度実装が可能となり電子機器を小形化する
という効果が得られている。[Effects of the Invention] As described above, according to the present invention, by inverting the flat package component to the back side and inserting it into the component insertion hole provided on the printed circuit board, it is possible to attach the flat package component to other large electronic devices. Since it can be mounted on a printed circuit board by three-dimensionally overlapping the component or a flexible or non-flexible printed circuit board, it is possible to mount the printed circuit board at a high density, thereby achieving the effect of downsizing the electronic device.
第１図は本発明の高密度実装プリント板の第１の実施例
を示す図、第２図は従来のＦＰＩＣのプリント板への実
装例を示す図、第３図は従来のプリント基板の半田付は
方法を示す図、第４図は本発明の高密度実装プリント板
の第２の実施例を示す図である。
図において、１は第１のＦＰＩＣ，２は第１のＦＰＩＣ
のリード端子、３はプリント基板、４は第１のＦＰＩＣ
用パッド、５はＦＰＩＣ用挿入孔挿入孔第２のＦＰＩＣ
，７は第２のＦＰＩＣのリード端子、８は第２のＦＰＩ
Ｃ用パッド、９は半田、１０は抵抗器、１１は抵抗器１
０のリード端子、１２は抵抗器１０用パツド、１３はフ
レキシブルプリント基板、１４−Ｌ １４−２は電子部
品、１５はフレキシブルプリント基板用パッドである。
１：第１のＦＰＩＣ
６′第２のＦＰＩＣ
５：ＦＰＩＣ挿入用孔
本発明の高密度実装ブリ）ト板Ｏ第１の実施例を示す図
第１図
従来のブリ）ト基板の半田付は方法右示寸図第３図
１３：フレキシブルプリント基板
本発明の高＠度実枝プリ）ト板の嶌２の実施例を示す図
第４図FIG. 1 is a diagram showing a first embodiment of a high-density mounting printed board of the present invention, FIG. 2 is a diagram showing an example of mounting a conventional FPIC on a printed board, and FIG. 3 is a diagram showing a conventional soldering of a printed circuit board. The attached figure is a diagram showing the method, and FIG. 4 is a diagram showing a second embodiment of the high-density mounting printed board of the present invention. In the figure, 1 is the first FPIC, 2 is the first FPIC
3 is the printed circuit board, 4 is the first FPIC
pad, 5 is the insertion hole for the FPIC, the second FPIC
, 7 is the lead terminal of the second FPIC, 8 is the second FPI
C pad, 9 is solder, 10 is resistor, 11 is resistor 1
0 is a lead terminal, 12 is a pad for the resistor 10, 13 is a flexible printed circuit board, 14-L 14-2 is an electronic component, and 15 is a pad for a flexible printed circuit board. 1: First FPIC 6' Second FPIC 5: FPIC insertion hole Diagram showing the first embodiment of the high-density mounting bulletin board of the present invention Figure 1 Soldering of the conventional bulletin board 13: Flexible printed circuit board Figure 4 is a diagram showing an embodiment of the high-density printed board of the present invention.
Claims (1)
て、 フラットパッケージ部品のリード端子の中間垂直部の輪
郭程度の部品挿入用孔と、該部品挿入用孔の周縁にリー
ド端子接続用第１の導電箔を主プリント基板に設け、前
記フラットパッケージ部品を裏側に反転し、前記部品挿
入孔より挿入し、前記第１の導電箔と挿入部品のリード
端子を半田付けにより主プリント基板に装着し、 さらに前記フラットパッケージ部品よりも外形寸法の大
きい電子部品、又は可撓性もしくは非可撓性プリント基
板を、前記フラットパッケージ部品と立体的に重畳して
実装するための第２の導電箔を前記主プリント基板上に
設け、該第２の導電箔に前記電子部品又は可撓性もしく
は非可撓性プリント基板の導電接合部を接続し装着させ
た主プリント基板を備えたことを特徴とする高密度実装
プリント板。[Claims] In a printed circuit board on which a plurality of electronic components are mounted at high density, a component insertion hole is provided which is approximately the same as the contour of the middle vertical part of the lead terminal of a flat package component, and a lead terminal is provided around the periphery of the component insertion hole. A first conductive foil for connection is provided on the main printed circuit board, the flat package component is turned over to the back side, inserted through the component insertion hole, and the first conductive foil and the lead terminal of the inserted component are soldered to the main printed circuit board. a second electronic component mounted on the board, and for mounting an electronic component having a larger external dimension than the flat package component, or a flexible or non-flexible printed circuit board, three-dimensionally overlapping the flat package component; A main printed circuit board is provided, in which a conductive foil is provided on the main printed circuit board, and the electronic component or the conductive joint part of the flexible or non-flexible printed circuit board is connected and attached to the second conductive foil. Features a high-density mounting printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18813888A JPH0239587A (en) | 1988-07-29 | 1988-07-29 | High density mounting printed board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18813888A JPH0239587A (en) | 1988-07-29 | 1988-07-29 | High density mounting printed board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0239587A true JPH0239587A (en) | 1990-02-08 |
Family
ID=16218406
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18813888A Pending JPH0239587A (en) | 1988-07-29 | 1988-07-29 | High density mounting printed board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0239587A (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03273919A (en) * | 1990-03-23 | 1991-12-05 | Nissan Shatai Co Ltd | Vehicle floor height adjusting device |
| JPH03120019U (en) * | 1990-03-23 | 1991-12-10 | ||
| JPH0432565U (en) * | 1990-07-11 | 1992-03-17 | ||
| US5386343A (en) * | 1993-11-12 | 1995-01-31 | Ford Motor Company | Double surface mount technology for electronic packaging |
| JPH09199824A (en) * | 1995-11-16 | 1997-07-31 | Matsushita Electric Ind Co Ltd | Printed wiring board and its mounting body |
| EP0774888A3 (en) * | 1995-11-16 | 1998-10-07 | Matsushita Electric Industrial Co., Ltd | Printing wiring board and assembly of the same |
| EP1701599A1 (en) * | 2005-03-10 | 2006-09-13 | Optium Care International Tech. Inc. | Circuit board for hiding electronic components |
-
1988
- 1988-07-29 JP JP18813888A patent/JPH0239587A/en active Pending
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03273919A (en) * | 1990-03-23 | 1991-12-05 | Nissan Shatai Co Ltd | Vehicle floor height adjusting device |
| JPH03120019U (en) * | 1990-03-23 | 1991-12-10 | ||
| JPH0432565U (en) * | 1990-07-11 | 1992-03-17 | ||
| US5386343A (en) * | 1993-11-12 | 1995-01-31 | Ford Motor Company | Double surface mount technology for electronic packaging |
| JPH09199824A (en) * | 1995-11-16 | 1997-07-31 | Matsushita Electric Ind Co Ltd | Printed wiring board and its mounting body |
| EP0774888A3 (en) * | 1995-11-16 | 1998-10-07 | Matsushita Electric Industrial Co., Ltd | Printing wiring board and assembly of the same |
| US6324067B1 (en) | 1995-11-16 | 2001-11-27 | Matsushita Electric Industrial Co., Ltd. | Printed wiring board and assembly of the same |
| EP1701599A1 (en) * | 2005-03-10 | 2006-09-13 | Optium Care International Tech. Inc. | Circuit board for hiding electronic components |
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