JP2866465B2 - Electronic components - Google Patents

Electronic components

Info

Publication number
JP2866465B2
JP2866465B2 JP2271944A JP27194490A JP2866465B2 JP 2866465 B2 JP2866465 B2 JP 2866465B2 JP 2271944 A JP2271944 A JP 2271944A JP 27194490 A JP27194490 A JP 27194490A JP 2866465 B2 JP2866465 B2 JP 2866465B2
Authority
JP
Japan
Prior art keywords
leads
lead
electronic component
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2271944A
Other languages
Japanese (ja)
Other versions
JPH04147660A (en
Inventor
貴朗 沖殿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2271944A priority Critical patent/JP2866465B2/en
Publication of JPH04147660A publication Critical patent/JPH04147660A/en
Application granted granted Critical
Publication of JP2866465B2 publication Critical patent/JP2866465B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、半導体装置を実装した電子部品に関する
ものである。Description: TECHNICAL FIELD The present invention relates to an electronic component on which a semiconductor device is mounted.

〔従来の技術〕 第３図a,bは従来の表面実装型ICの外形を示す正面図
と平面図である。図において、１は表面実装型ICであ
り、２はそのリード部、３は樹脂部である。また第４図
a,bは上記表面実装型IC1をプリント配線基板４にはんだ
付けした状態を示す正面図と平面図である。[Prior Art] FIGS. 3a and 3b are a front view and a plan view showing the external shape of a conventional surface mount IC. In the figure, reference numeral 1 denotes a surface mount type IC, 2 denotes a lead portion thereof, and 3 denotes a resin portion. Fig. 4
FIGS. 4A and 4B are a front view and a plan view showing a state where the surface mount type IC 1 is soldered to the printed wiring board 4.

〔発明が解決しようとする課題〕[Problems to be solved by the invention]

従来の表面実装型ICは以上の様に構成されているが、
近年のパッケージのの軽薄短小化に伴うリードピッチの
狭小化により、はんだ付けの際、ショートが非常に発生
し易く、かつパッケージの薄型化の限界による基板への
部品実装後の厚み制限が生じるなどの問題点があった。Conventional surface mount ICs are configured as above,
Due to the narrow lead pitch associated with the recent trend toward smaller and lighter packages, short-circuiting is very likely to occur during soldering, and the thickness of the package after mounting components on the board due to the limitations of thinning the package. There was a problem.

この発明は上記のような問題点を解消するためになさ
れたもので、はんだ付け時のリード間ショートが防止で
き、かつ基板への部品実装後の厚みが薄くできるように
することを目的とする。The present invention has been made to solve the above problems, and has an object to prevent a short circuit between leads at the time of soldering, and to reduce the thickness after mounting components on a substrate. .

〔課題を解決するための手段〕[Means for solving the problem]

この発明に係る電子部品のパッケージは、２種類以上
のリード形状を有し、かつはんだ付け時のリード間ショ
ートの発生しにくいリード形状にすると共に、プリント
配線基板にザグリを設けて実装した際に厚み方向に対し
て薄型化できる構造としたものである。The package of an electronic component according to the present invention has two or more types of lead shapes, and has a lead shape in which a short circuit between leads during soldering is unlikely to occur. The structure can be made thinner in the thickness direction.

〔作用〕[Action]

この発明における電子部品のパッケージは、２種類の
リード形状を交互に配しリード間距離を大きくとるよう
にしてリード間ショートを防止し、かつリード接地高さ
をリード形状ごとに変化させ、かつ基板側にザグリを設
けることにより厚みを薄型化する。According to the electronic component package of the present invention, two types of lead shapes are alternately arranged to prevent a short between leads by increasing a distance between leads, and a grounding height of a lead is changed for each lead shape. The thickness is reduced by providing a counterbore on the side.

〔実施例〕〔Example〕

以下、この発明の一実施例を図について説明する。第
１図a,bにおいて、１は表面実装型ICであり、５はその
リード部で、5aはガルウィング型ICリード、5bはリード
加工を行わずストレートのままのICリードであって、こ
れらのリード5a,5bは交互に配設されている。また第２
図a,bは上記表面実装型ICをプリント配線板４にはんだ
付けされた状態を示すもので、６はプリント配線基板４
に設けたザグリ部を示す。An embodiment of the present invention will be described below with reference to the drawings. In FIGS. 1a and 1b, reference numeral 1 denotes a surface mount type IC, 5 denotes a lead portion thereof, 5a denotes a gull-wing type IC lead, and 5b denotes an IC lead which is not subjected to lead processing and remains straight. The leads 5a and 5b are arranged alternately. Also the second
6A and 6B show a state in which the above surface mount type IC is soldered to a printed wiring board 4.
2 shows the counterbore part provided in FIG.

〔発明の効果〕〔The invention's effect〕

以上のようにこの発明によれば、樹脂パッケージの上
面に対し平行に突設されたリードと、下方に屈曲したリ
ードとを交互に配したので、リード間距離が大きくと
れ、はんだ付け時のリード間ショートが防止できる。更
にリード加工工程が少なく安価に生産でき、実装高さを
最小に抑え得ることができる。As described above, according to the present invention, the leads protruding in parallel with the upper surface of the resin package and the leads bent downward are alternately arranged, so that the distance between the leads can be increased, and the leads at the time of soldering can be obtained. Short circuit can be prevented. Furthermore, the number of lead processing steps can be reduced and production can be performed at low cost, and the mounting height can be minimized.

又、プリント基板に凹部を設け、この凹部の底面に下
方に屈曲したリードをハンダ付けすると共に、プリント
基板上面には、樹脂パッケージの上面に対し、平行に突
設されたリードをはんだ付けしたので、リード間ショー
トのない信頼性の高い電子部品が得られ、又、安価かつ
薄形化された電子部品が得られる。Also, a concave portion was provided in the printed circuit board, and a lead bent downward was soldered to the bottom surface of the concave portion, and a lead projecting parallel to the upper surface of the resin package was soldered to the upper surface of the printed circuit board. In addition, a highly reliable electronic component having no short circuit between leads can be obtained, and an inexpensive and thin electronic component can be obtained.

【図面の簡単な説明】[Brief description of the drawings]

第１図a,bはこの発明の一実施例による電子部品のパッ
ケージを示す正面図と平面図、第２図a,bはこの発明の
電子部品パッケージをプリント配線基板に実装した状態
を示す正面図と平面図、第３図a,bは従来の電子部品パ
ッケージ構造を示す正面図と平面図、第４図a,bは従来
の電子部品パッケージをプリント配線基板に実装した状
態を示す正面図と平面図である。 図中、１は表面実装型IC、３は樹脂部、４はプリント配
線基板、5aはガルウィング型ICリード、5bはストレート
のICリード、６はザグリ部である。 なお、図中同一符号は同一又は相当部分を示す。1A and 1B are a front view and a plan view showing a package of an electronic component according to an embodiment of the present invention, and FIGS. 2A and 2B are front views showing a state where the electronic component package of the present invention is mounted on a printed circuit board. FIGS. 3a and 3b are front and plan views showing a conventional electronic component package structure, and FIGS. 4a and 4b are front views showing a conventional electronic component package mounted on a printed wiring board. And a plan view. In the figure, 1 is a surface mount type IC, 3 is a resin part, 4 is a printed wiring board, 5a is a gull-wing type IC lead, 5b is a straight IC lead, and 6 is a counterbore part. In the drawings, the same reference numerals indicate the same or corresponding parts.

───────────────────────────────────────────────────── フロントページの続き (58)調査した分野(Int.Cl.6，ＤＢ名) H01L 23/50 H05K 1/18──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. 6 , DB name) H01L 23/50 H05K 1/18

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項１】直方体状の樹脂パッケージの側面に外部リ
ードが突設された半導体装置をプリント基板に実装した
電子部品において、上記プリント基板に凹部を設けると
共に、上記外部リードを、上記樹脂パッケージの上面に
対し平行に突設されたリードと、下方に屈曲したリード
とを交互に配し、上記凹部の底面に上記下方に屈曲した
リードをはんだ付けすると共に、上記プリント基板上面
に上記平行に突設されたリードをはんだ付けしたことを
特徴とする電子部品。An electronic component in which a semiconductor device having external leads protruding from a side surface of a rectangular parallelepiped resin package is mounted on a printed circuit board. A concave portion is provided in the printed circuit board, and the external leads are connected to the resin package. The leads projecting parallel to the upper surface and the leads bent downward are alternately arranged, and the leads bent downward are soldered to the bottom surface of the concave portion, and the leads projected parallel to the upper surface of the printed circuit board. An electronic component characterized by soldering the provided leads.
JP2271944A 1990-10-09 1990-10-09 Electronic components Expired - Fee Related JP2866465B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2271944A JP2866465B2 (en) 1990-10-09 1990-10-09 Electronic components

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2271944A JP2866465B2 (en) 1990-10-09 1990-10-09 Electronic components

Publications (2)

Publication Number Publication Date
JPH04147660A JPH04147660A (en) 1992-05-21
JP2866465B2 true JP2866465B2 (en) 1999-03-08

Family

ID=17507006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2271944A Expired - Fee Related JP2866465B2 (en) 1990-10-09 1990-10-09 Electronic components

Country Status (1)

Country Link
JP (1) JP2866465B2 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5821457A (en) * 1994-03-11 1998-10-13 The Panda Project Semiconductor die carrier having a dielectric epoxy between adjacent leads
US6339191B1 (en) 1994-03-11 2002-01-15 Silicon Bandwidth Inc. Prefabricated semiconductor chip carrier
US5824950A (en) * 1994-03-11 1998-10-20 The Panda Project Low profile semiconductor die carrier
KR100246587B1 (en) * 1997-09-19 2000-03-15 유무성 Ball grid array semiconductor package
US6141869A (en) 1998-10-26 2000-11-07 Silicon Bandwidth, Inc. Apparatus for and method of manufacturing a semiconductor die carrier

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5425463A (en) * 1977-07-29 1979-02-26 Hitachi Ltd Print substrate assembly
JPH01258453A (en) * 1988-04-08 1989-10-16 Toshiba Corp Semiconductor device

Also Published As

Publication number Publication date
JPH04147660A (en) 1992-05-21

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