JP2599290Y2 - Hybrid IC - Google Patents

Description

[Detailed description of the invention]

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a hybrid IC using a bare IC chip.

[0002]

2. Description of the Related Art Conventional COB using a bare IC chip
(Chip on board) Hybrid I of mounting structure type
C is shown in FIGS.

The hybrid IC substrate shown in FIG. 5 includes a multilayer printed wiring board 10 and a plate-shaped dam frame 20 bonded to the entire surface of one surface 11 of the printed wiring board 10. One surface 11 of wiring board 10
A hole 12 for mounting the bare IC chip 30 is formed in the dam frame 20, and the hole 12 and one surface 11 are formed in the dam frame 20.
The hole 2 for exposing the electrode pattern 13 for wire bonding provided on the periphery of the upper hole 12 to the outside.
1 is formed. The bare IC chip 30 is fixed to the bottom surface of the hole 12 with an adhesive 32, and the electrode pads 30a of the bare IC chip 30 and the electrode patterns 13 of the printed wiring board 10 are electrically connected by bonding wires 34, Thereafter, the resin 35 is filled in the holes 12 and 21 and sealed. A solder paste 36 is printed on the land 15 on the other surface 14 side of the printed wiring board 10, and chip components 37 such as a capacitor and a resistor and a QFP
Semiconductor components 38 such as (quad flat package) and SOP (small outline package) are soldered by reflow.

In this hybrid IC, a dam frame 20 is provided on the entire surface of one side 11 of the printed wiring board 10.
Since electronic components other than the bare IC chip 30 cannot be mounted, there is a problem that electronic components cannot be mounted at a high density.

In the hybrid IC shown in FIG.
Since the dam frame 20A is provided only on the one surface 11 of the printed wiring board 10 around the hole 12, the chip component 37 and the semiconductor component 38 can be mounted on the surface 11 side. Electronic components can be mounted at a higher density than the hybrid IC shown in FIG.

However, in this structure, since the dam frame 20A protrudes from the surface 11, the solder paste 36 cannot be printed on the land 15 on the surface 11 at a time. Therefore, it is necessary to apply the paste 36 one point at a time using a dispenser.
Requires a lot of man-hours to implement. Further, when mounting the bare IC chip 30 having a large number of electrodes, if the number of electrodes corresponding to the electrodes of the IC chip 30 is provided on the periphery of the hole portion 12, the area occupied by the electrode pattern 13 becomes too large, Since the dam frame 20A also becomes large, there is a problem that the number of electronic components 37 and 38 that can be mounted on the surface 11 decreases.

[0007]

As described above, the hybrid IC shown in FIG. 5 has a problem that only a bare IC chip can be mounted on one side of the substrate. FIG.
In the hybrid IC shown in (1), the dam frame projects,
There is a problem that paste solder cannot be applied by printing to the surface of the board on which the bare IC chip is mounted.
When the number of electrodes of the bare IC chip is large, the area occupied by the electrode pattern corresponding to this electrode increases, and there is a problem that the number of other electronic components that can be mounted decreases.

The present invention has been made to solve such a conventional drawback, and an object of the present invention is to provide a hybrid IC in which electronic components can be mounted on a substrate at a high density without increasing the number of manufacturing steps. .

[0009]

A hybrid according to the present invention is provided.
De IC mainly printed wiring first one with a bottom formed on a surface of the plate of the bare IC chip mounting et al is in the hole, of the bare IC chip and the electrode group the one surface of the first In a hybrid IC in which an electrode group provided on the periphery of the hole is electrically connected by wire bonding,
The sub-printed wiring board having the second hole is positioned so as to surround the electrode group provided on the periphery of the first hole with the second hole, and is attached to the main printed wiring board. The first and second holes are electrically connected to the main printed wiring board via through holes, and the inside of the first and second holes is sealed with a resin .

Further , a hybrid IC according to the second invention is provided.
Is the bottomed bottom formed on one side of the main printed wiring board.
A hybrid in which a bare IC chip is mounted in the hole 1
Sub-print in which a second hole is formed in a pad IC
A wiring board surrounds a periphery of the first hole with the second hole.
Position on the main printed wiring board
And the main print through the through hole
Electrically connected to the wiring board and in the first and second holes;
Is in a state where it does not protrude from the surface of the sub-printed wiring board.
The main printed circuit board in the sub-printed wiring board
Electronic components are on the side not bonded to the printed wiring board
Is implemented .

[0011]

According to the first aspect of the present invention, a sub-printed circuit board bonded to one surface of a main printed circuit board is used for resin-sealing a bare IC chip mounted on one surface of the main printed circuit board. Since it also serves as a dam frame, electronic components can be mounted on this sub-printed wiring board.

The hybrid IC according to the second invention mainly comprises
First bottomed hole formed on one surface of the printed wiring board
Hybrid I with bare IC chip attached inside
C, a sub-printed wiring board having a second hole formed therein
Surrounds the periphery of the first hole with the second hole.
Is attached to the main printed wiring board
And the main printed wiring board through a through hole.
The first and second holes are electrically connected to each other.
With resin without protruding from the surface of the sub printed wiring board
Since it is sealed, reflow soldering to this surface
For printing, solder paste can be applied by printing.
Work efficiency is increased. Further, the sub-printed wiring board
The surface not bonded to the main printed wiring board
Electronic components are mounted, and many components can be mounted.

[0013]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below in detail with reference to FIGS. 1 is a cross-sectional view of the hybrid IC, FIG. 2 is an enlarged plan view of a wire bonding portion of the hybrid IC of FIG. 1, and FIG. 3 is a hybrid IC of FIG.
4 is an enlarged cross-sectional view of the wire bonding portion, and FIG. 4 is a flowchart of a manufacturing process of the hybrid IC of FIG.

The hybrid IC according to this embodiment is a hybrid IC of a COB mounting structure type using a bare IC chip similarly to the conventional example, and its substrate is a multilayer main printed wiring board 50 as shown in FIG. Main printed wiring board 50
And the sub-printed wiring board 60 bonded over the entire surface of the one surface 51.

A hole 52 for mounting a bare IC chip 71 is formed on one surface 51 of the main printed wiring board 50, and an electrode pattern 53 for wire bonding is provided on the periphery of the hole 52. This electrode pattern 53
Are provided in a number corresponding to the electrodes 71a of the bare IC chip 71, and as shown in FIG.
Is a first electrode pattern 53a approaching the electrode 71a of the bare IC chip 71 (in this example, a distance of about 1.5 mm) and slightly separated from the electrode 53a of the bare IC chip (in this example, a distance of 2. (About 5 mm) and the second electrode pattern 53b.

The sub-printed wiring board 60 has a large number of through holes 62 electrically connected to lands 61 provided on the surface thereof, and a conductive adhesive 73.
The through holes 62 are electrically connected to the patterns 55 formed on one surface 51 of the main printed wiring board 50 by being bonded to the main printed wiring board 50. The sub printed wiring board 60 has a hole 64 for exposing the hole 52 and the electrode 53 of the main printed wiring board 50 to the outside. And the bare IC chip 7
1 is bonded to the bottom of the hole 52 with an insulating adhesive 75, the electrode pad 71a is electrically connected to the electrode pattern 53 by a bonding wire 77, and then the resin 78 is filled in the hole 52 and the hole 64. And bare IC chip 71
Is resin-sealed. The resin 78 is filled so that the solder paste 80 does not protrude from the surface of the sub-printed wiring board 60 so that the solder paste 80 can be printed on the surface of the sub-printed wiring board 60.

The other surface 5 of the main printed wiring board 50
The solder paste 80 is printed on the lands 57 on the sixth side and the lands 61 on the surface of the sub-printed wiring board 60, and chip components 83 such as capacitors and resistors and semiconductor components 84 such as QFP and SOP are soldered by reflow soldering. I have.

Next, a manufacturing process of the hybrid IC will be described with reference to FIG.

First, a sub-printed wiring board 60 having a hole 64 is bonded to a main printed wiring board 50 having a hole 52 with a conductive adhesive 73 and cured to form a printed wiring in which the main and sub-portions are integrally formed. A plate is formed (first step).

Next, an insulating adhesive 75 is applied to the bottom of the hole 52.
Is applied thereon, and the bare IC chip 71 is accurately mounted thereon using a die bonder (not shown), and the insulating adhesive is cured in a clean oven (not shown).
Third step).

Next, using a wire bonder (not shown), the electrode pads 71a of the bare IC chip 71 and the electrode patterns 53 on the printed wiring board are electrically connected by wires 77 (fourth step). In this case, the electrode pattern 5
As shown in FIG. 3, first, a short loop (150 μm in height) is applied to the electrode 53a using a short wire 77a for the portion where the electrodes 3 are arranged in a zigzag manner between the electrode 53a and the electrode 53b.
m or less, and then a long loop (200 μm in height) is applied to the electrode 53b using the long wire 77b.
m) for wire bonding. By separating the low-loop wire 77a and the high-loop wire 77b in this manner, even if the electrodes 53a and 53b are arranged close to each other, it is possible to eliminate a contact accident between the wires.

Next, the bare IC chip 71 and the bonding wires 77 are coated with a sealing resin 78 using a resin sealing device (not shown), and the resin is cured in a clean oven (not shown) (fifth, Sixth step). At this time, as described above, the upper surface of the sealing resin is made not to protrude from the surface of the sub-printed wiring board 60.

This completes the mounting step (COB step) of the bare IC chip 71 on the main and sub-printed wiring boards (hereinafter, referred to as a composite printed wiring board) integrally formed,
Function and performance inspection (F
/ T).

Next, the surface of the composite printed wiring board, that is, the surface of the sub-printed wiring board 60 is printed with a solder paste 80 using a solder paste printing machine (not shown), and a chip mounter (not shown) is used. Then, the chip component 83 and the semiconductor component 84 are mounted, and reflow soldering is performed (eighth to tenth steps).

Next, the back surface of the composite printed wiring board, that is, the other surface 56 of the main printed wiring board 50 is printed with a solder paste 80 using a solder paste printing machine, and a chip component 83 or a semiconductor is printed using a chip mounter. The component 84 is mounted, and reflow soldering is performed (eleventh to thirteenth steps).

Next, comprehensive function and performance inspections are performed, and C
The OB mounting structure type hybrid IC is completed.

As described above, in the hybrid IC of this embodiment, since the electronic components can be mounted on the surface on which the bare IC chip 71 is mounted, the electronic components can be mounted at a high density. In this case, since the solder paste can be applied by printing, the number of manufacturing steps does not increase. Further, even if the number of electrodes 71a of the bare IC chip 71 is large, the occupied area can be minimized by arranging the electrodes 53a and 53b on the printed wiring board side in a staggered manner, so that more electronic components can be provided. High-density mounting can be realized.

In this embodiment, a case has been described in which electronic components are mounted on the surface of the sub-printed wiring board 60 by soldering by reflow. Instead of these, electronic components that do not require heating such as a print resistor are used. Sub printed wiring board 60
If it is configured to be formed on the surface of the bare IC chip 7
Since high heat is not applied to the surface on which the IC chip 1 is mounted, it is also possible to eliminate high heat applied to the bare IC chip 71.

[0029]

[Effects of the Invention] As described above, in the first invention,
The sub-printed wiring board bonded to one side of the main printed wiring board also functions as a dam frame for resin-sealing a bare IC chip mounted on one side of the main printed wiring board. Since the electronic components can be mounted on the printed wiring board, the electronic components can be mounted at a high density. Further, when the electronic component is soldered by reflow, the solder paste can be applied to the sub-printed wiring board by printing, so that the number of work steps for mounting the electronic component can be reduced.

Further, a hybrid IC according to the second invention is provided.
According to the above, the main printed wiring board has one
A bare IC chip is mounted in the first hole at the bottom.
In an hybrid IC, a sub-punch having a second hole is formed.
A lint wiring board is provided so that the periphery of the first hole is aligned with the second hole.
The main printed wiring board is positioned in a state of being surrounded by
Bonded to each other is Rutotomoni, the main-flops via a through-hole in
Electrically connected to a lint wiring board, the first and second
The inside of the hole does not protrude from the surface of the sub-printed wiring board
Since it is sealed with resin in this state,
Printing solder paste for low soldering
Coating can be applied , which has the effect of increasing the efficiency of soldering work
be able to. Further, the main printed circuit board of the sub printed wiring board
Electronic components are on the surface that is not bonded to the lint wiring board.
There is an effect that many components can be mounted.

[Brief description of the drawings]

FIG. 1 is a sectional view of a hybrid IC according to the present invention.

FIG. 2 is an enlarged plan view of a wire bonding portion of the hybrid IC of FIG.

FIG. 3 is an enlarged sectional view of a wire bonding portion of the hybrid IC of FIG. 1;

FIG. 4 is a flowchart showing a manufacturing process of the hybrid IC of FIG. 1;

FIG. 5 is a cross-sectional view of a conventional hybrid IC.

FIG. 6 is a cross-sectional view of another conventional hybrid IC.

[Explanation of symbols]

Reference Signs List 50 main printed wiring board 52 first hole 53 electrode pattern 60 sub printed wiring board 62 through hole 64 second hole 71 bare IC chip 71a electrode pad 77 wire 78 resin

Continuation of the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) H01L 23/12 H01L 21/60 301

Claims (3)

(57) [Scope of request for utility model registration] A bare IC chip is mounted in a bottomed first hole formed in one surface of a main printed wiring board, and an electrode group of the bare IC chip and the first surface of the one surface. in the hybrid IC in which the electrode group provided in the periphery of the hole are electrically connected by wire bonding, the sub-printed circuit board second hole portion is formed, the first
Is a hole electrodes provided on the periphery of the laminated to the main printed circuit board is positioned in a state of surrounding with the second hole portion Rutotomoni, electrical to the main printed circuit board via a through hole The first and second holes are connected
Inside is a state where it does not protrude from the surface of the sub-printed wiring board
In the sub-printed wiring board
The electronic parts are on the side not bonded to the main printed wiring board.
Hybrid I characterized by having a product mounted
C. 2. A printed circuit board formed on one surface of a main printed wiring board.
A bare IC chip is mounted in the first hole having a bottom.
In the hybrid IC, the sub-printed wiring board having the second hole is formed by the first printed circuit board.
Positioned so that the periphery of the hole is surrounded by the second hole
And bonded to the main printed wiring board.
Electrically connected to the main printed wiring board through a through hole
And the inside of the first and second holes is the sub-print arrangement.
It is sealed with resin in a state where it does not protrude from the surface of the wire plate.
Affixed to the main printed wiring board in the sub-printed wiring board
Make sure that electronic parts are mounted on
And a hybrid IC. 3. A first hole surrounded by said second hole.
The bare IC chip electrode group and wire bonder
An electrode group that is electrically connected to the first hole portion is provided, and the electrode group provided on the periphery of the first hole portion includes the bare electrode.
A first electrode group disposed in close proximity to the IC chip;
Farther from the bare IC chip than the electrode group of
The first electrode is disposed close to and on the same surface so as to surround the first electrode.
The second electrode group and the bare IC chip electrode group.
The wire to be connected pneumatically is connected to the first electrode group and the bare electrode.
Than the wire that electrically connects the electrode group of the IC chip
Bonded like drawing a tall loop
The hybrid I according to claim 2, wherein
C.