JPS6398678U - - Google Patents
Info
- Publication number
- JPS6398678U JPS6398678U JP19388286U JP19388286U JPS6398678U JP S6398678 U JPS6398678 U JP S6398678U JP 19388286 U JP19388286 U JP 19388286U JP 19388286 U JP19388286 U JP 19388286U JP S6398678 U JPS6398678 U JP S6398678U
- Authority
- JP
- Japan
- Prior art keywords
- electronic circuit
- circuit board
- main body
- printed circuit
- circuit device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011248 coating agent Substances 0.000 claims description 5
- 238000000576 coating method Methods 0.000 claims description 5
- 239000000088 plastic resin Substances 0.000 claims description 5
- 238000010586 diagram Methods 0.000 claims description 3
- 239000006223 plastic coating Substances 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Description
第１図は本考案の第１実施例に係る可塑性樹脂
コーテイング用電子回路装置の説明図、第２図は
第１実施例に係るプリント基板の上面図、第３図
は本考案の第２実施例に係る可塑性樹脂コーテイ
ング用電子回路装置の説明図、第４図は第２実施
例に係るプリント基板の上面図、第５図は電子回
路素子（ＩＣパツケージ）の説明図である。
１０……ＩＣ収納部、１２……リードピン、１
４……プリント基板、１６……はんだ、２０……
配置表示ペースト、１００……ＩＣパツケージ。
FIG. 1 is an explanatory diagram of an electronic circuit device for plastic resin coating according to a first embodiment of the present invention, FIG. 2 is a top view of a printed circuit board according to the first embodiment, and FIG. 3 is a second embodiment of the present invention. FIG. 4 is a top view of a printed circuit board according to a second embodiment, and FIG. 5 is an explanatory diagram of an electronic circuit element (IC package) according to an example. 10...IC storage section, 12...Lead pin, 1
4...Printed circuit board, 16...Solder, 20...
Layout display paste, 100...IC package.
Claims (1)
ーストが印刷塗布されたプリント基板と、 電子回路素子本体部とこの本体部より突出し、
プリント基板と電気的に接続されるリードピンと
からなり、本体部がプリント基板実装面に接触し
ない状態で前記プリント基板上に実装される電子
回路素子と、 を備え、プリント基板に電子回路素子を実装後可
塑性樹脂コーテイングが成される可塑性樹脂コー
テイング用電子回路装置において、 前記配置表示ペーストの厚さを、そのペースト
表面上部が前記電子回路素子本体部に密着するよ
うにプリント基板実装面と電子回路素子本体部と
の間隙長よりも厚く形成したことを特徴とする可
塑性コーテイング用電子回路装置。 (2) 実用新案登録請求の範囲(1)記載の電子回路
装置において、配置表示ペーストが、電子回路素
子本体部底面内でかつ底面の周縁全周にわたつて
密着するように形成されたことを特徴とする可塑
性樹脂コーテイング用電子回路装置。 (3) 実用新案登録請求の範囲(1)記載の電子回路
装置において、配置表示ペーストが、電子回路素
子本体部の下部側面でかつ側面全周にわたつて密
着するように形成されたことを特徴とする可塑性
樹脂コーテイング用電子回路装置。[Scope of Claim for Utility Model Registration] (1) A printed circuit board on which a layout display paste showing an element layout diagram is printed and coated on the element mounting surface, an electronic circuit element body, and a body protruding from the body,
an electronic circuit element comprising lead pins electrically connected to a printed circuit board and mounted on the printed circuit board with the main body not in contact with the mounting surface of the printed circuit board; and the electronic circuit element is mounted on the printed circuit board. In an electronic circuit device for plastic resin coating in which a post-plastic resin coating is applied, the thickness of the placement display paste is adjusted between the printed circuit board mounting surface and the electronic circuit element so that the upper part of the paste surface is in close contact with the main body of the electronic circuit element. An electronic circuit device for plastic coating, characterized in that it is formed thicker than the gap length with the main body. (2) In the electronic circuit device described in claim (1) for utility model registration, it is stated that the layout display paste is formed in the bottom surface of the electronic circuit element main body and in close contact with the entire periphery of the bottom surface. Features: Electronic circuit device for plastic resin coating. (3) The electronic circuit device according to claim (1) of the utility model registration is characterized in that the layout display paste is formed so as to be in close contact with the lower side surface of the electronic circuit element main body and over the entire circumference of the side surface. Electronic circuit device for plastic resin coating.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19388286U JPH0423343Y2 (en) | 1986-12-16 | 1986-12-16 | |
| US07/116,662 US4833570A (en) | 1986-12-16 | 1987-11-03 | Electronic circuit assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19388286U JPH0423343Y2 (en) | 1986-12-16 | 1986-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6398678U true JPS6398678U (en) | 1988-06-25 |
| JPH0423343Y2 JPH0423343Y2 (en) | 1992-05-29 |
Family
ID=31150326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19388286U Expired JPH0423343Y2 (en) | 1986-12-16 | 1986-12-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423343Y2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134945A (en) * | 2009-12-25 | 2011-07-07 | Toshiba Corp | Electronic apparatus |
| WO2020059179A1 (en) * | 2018-09-19 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | Electronic device and method for forming insulating material layer on circuit board in electronic device |
-
1986
- 1986-12-16 JP JP19388286U patent/JPH0423343Y2/ja not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011134945A (en) * | 2009-12-25 | 2011-07-07 | Toshiba Corp | Electronic apparatus |
| WO2020059179A1 (en) * | 2018-09-19 | 2020-03-26 | 日立オートモティブシステムズ株式会社 | Electronic device and method for forming insulating material layer on circuit board in electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0423343Y2 (en) | 1992-05-29 |