JPS6343495U - - Google Patents
Info
- Publication number
- JPS6343495U JPS6343495U JP13621486U JP13621486U JPS6343495U JP S6343495 U JPS6343495 U JP S6343495U JP 13621486 U JP13621486 U JP 13621486U JP 13621486 U JP13621486 U JP 13621486U JP S6343495 U JPS6343495 U JP S6343495U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- integrated circuit
- circuit device
- hybrid integrated
- printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図ａ，ｂは本考案の一実施例の斜視図およ
び模式的断面図である。第２図ａ，ｂは従来の混
成集積回路装置の一例の斜視図および模式的断面
図である。
１……導体、２……回路基板、３……電子部品
、４……外部リード、５……樹脂ケース、６……
封止樹脂、７……アース端子、８……導電性樹脂
、９……導電性接着剤、１０……はんだ。
FIGS. 1a and 1b are a perspective view and a schematic sectional view of an embodiment of the present invention. FIGS. 2a and 2b are a perspective view and a schematic sectional view of an example of a conventional hybrid integrated circuit device. 1... Conductor, 2... Circuit board, 3... Electronic component, 4... External lead, 5... Resin case, 6...
Sealing resin, 7... Earth terminal, 8... Conductive resin, 9... Conductive adhesive, 10... Solder.
Claims (1)
が樹脂ケースに樹脂で封止された混成集積回路装
置において、前記樹脂ケース表面に導電性樹脂が
印刷又は塗布され、該印刷又は塗布されたた導電
性樹脂が混成集積回路装置のアースラインに接続
されていることを特徴とする混成集積回路装置。 In a hybrid integrated circuit device in which a circuit board mounted with electronic components and having external leads is sealed in a resin case with a resin, a conductive resin is printed or coated on the surface of the resin case, and the printed or coated conductive resin is A hybrid integrated circuit device characterized in that a resin is connected to a ground line of the hybrid integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13621486U JPS6343495U (en) | 1986-09-04 | 1986-09-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13621486U JPS6343495U (en) | 1986-09-04 | 1986-09-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6343495U true JPS6343495U (en) | 1988-03-23 |
Family
ID=31039124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13621486U Pending JPS6343495U (en) | 1986-09-04 | 1986-09-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6343495U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0595098U (en) * | 1992-05-27 | 1993-12-24 | 株式会社船井電機研究所 | Noise shield board |
-
1986
- 1986-09-04 JP JP13621486U patent/JPS6343495U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0595098U (en) * | 1992-05-27 | 1993-12-24 | 株式会社船井電機研究所 | Noise shield board |
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